Airflow distribution assembly and semiconductor equipment

Abstract

The utility model provides an airflow distribution assembly and a semiconductor device, the airflow distribution assembly comprises an airflow distribution plate and an adjusting hole arranged in a preset area on the airflow distribution plate, the airflow distribution plate comprises a plurality of through holes to distribute airflow flowing above the airflow distribution plate, the adjusting holes are used for making the airflow density of the preset area higher than the airflow density of other areas of the airflow distribution plate. According to the airflow distribution assembly, the structure allowing airflow to pass through in the preset area of the airflow distribution plate is improved (the adjusting holes are formed), so that the requirement that the airflow density of the preset area needs to be higher than that of other areas in part of application scenes is met; the size of the opening allowing the airflow to pass through in the hole can be adjusted so that the airflow density in the preset area can be flexibly adjusted, and the application flexibility of the airflow distribution assembly in different scenes is improved. The semiconductor equipment is provided with the airflow distribution assembly, so that the process yield and the product yield can be improved.

Description

Technical Field

[0001] The utility model belongs to the field of integrated circuit production and equipment, and relates to an airflow distribution component and semiconductor equipment. Background Art

[0002] When the semiconductor process technology develops to the 28nm node and below, an epitaxial growth (EPI) process is required for deposition to make the source and drain. The so-called EPI process refers to the deposition of silicon germanium boron, silicon phosphorus, etc. on the surface of the wafer by reduced pressure chemical vapor deposition to produce a film structure with a certain concentration of holes and electron carriers. Subsequent devices work based on the migration of holes and electron carriers. During the EPI process, gas sources such as Si source, germanium pills, HCl, etc. need to be introduced and thin film deposition is performed on the wafer at a higher temperature.

[0003] Because an oxide layer may naturally grow on the surface of the wafer due to long-term exposure before the epitaxial growth process, the presence of the oxide layer will affect the epitaxial growth of thin films such as silicon germanium or silicon phosphorus. Therefore, in the process of dispatching, the EPI machine usually needs to transfer the wafer to be epitaxially grown to the semiconductor cleaning chamber (SICONI chamber) to etch and clean the oxide layer on the surface of the wafer, and then transfer the etched and cleaned wafer to the epitaxial growth chamber for epitaxial growth of the film layer. When the wafer is placed in a semiconductor cleaning chamber, etching gases such as NF3, NH3, and He are introduced from the top of the chamber. These etching gases then generate plasma under the action of a radio frequency power supply (RPU), wherein NF3 reacts with NH3 to generate NH4F and NH4F·HF. NH4F and NH4F·HF pass through the through holes in the air flow distribution assembly in the chamber cover in turn and evenly reach the wafer surface in the chamber, reacting with silicon oxide grown on the wafer surface to generate solid byproducts ((NH4)2SiF6) that volatilize under high temperature conditions to achieve etching of the oxide layer. Based on the above process, it can be seen that during the oxide layer etching process on the wafer surface in the semiconductor cleaning chamber, the etching uniformity or consistency of the wafer surface is crucial to the quality of the final product.

[0004] However, in actual practice, it is found that although the currently designed semiconductor cleaning chamber has very good distribution uniformity for etching gas (achieved by the gas flow distribution component set inside it), the etching uniformity of the oxide layer on the surface of the wafer flowing out of the semiconductor cleaning chamber is not ideal. For details, please refer to Figure 1 , which is a schematic diagram showing the etching effect on the wafer surface after an oxide layer etching process is performed in a semiconductor cleaning chamber. In a local area of ​​the wafer (e.g., Figure 1There are cold spots with low etching amount (the average etching amount is 16.029, and the etching amount in the cold spot area is between 14.33 and 15.10) in the wafer edge area (shown by the dotted box in the middle), which makes the overall uniformity or consistency of the wafer surface poor, thus affecting the product quality and yield.

[0005] Therefore, how to provide an air flow distribution component and semiconductor equipment to improve the etching consistency of the surface oxide layer of the wafer in the semiconductor cleaning chamber has become an important technical problem that needs to be solved urgently by those skilled in the art.

[0006] It should be noted that the above introduction to the technical background is only for the convenience of providing a clear and complete description of the technical solutions of the present application and for the convenience of understanding by those skilled in the art. It cannot be considered that the above technical solutions are well known to those skilled in the art simply because they are described in the background technology section of the present application. Utility Model Content

[0007] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide an airflow distribution component and a semiconductor device for solving the problem in the prior art that the etching consistency of the semiconductor cleaning chamber after performing the wafer surface oxide layer etching process needs to be improved.

[0008] In order to achieve the above-mentioned purpose and other related purposes, the utility model provides an air flow distribution component, including:

[0009] An air flow distribution plate, comprising a plurality of through holes, wherein the air flow distribution plate distributes the air flow flowing into the upper part of the air flow distribution plate based on the through holes;

[0010] The regulating hole is arranged in a preset area of ​​the air flow distribution plate, and the regulating hole is used to make the air flow density of the preset area higher than the air flow density of other areas of the air flow distribution plate.

[0011] Optionally, the air flow distribution plate includes a central area and a peripheral area surrounding the central area, and the plurality of through holes are distributed in the central area; the adjustment hole is located in the central area, and / or the adjustment hole extends from the central area into the peripheral area in the width direction.

[0012] Optionally, the plurality of through holes are distributed in a plurality of concentric circles, and the adjustment hole comprises an arc-shaped hole.

[0013] Optionally, the length of the adjustment hole is 1 / 4 to 1 / 2 of the circumference of the air distribution plate.

[0014] Optionally, the airflow distribution assembly further comprises an adjusting member for adjusting the size of an opening in the adjusting hole for allowing airflow to pass therethrough, and the adjusting member is movably disposed above the adjusting hole, below the adjusting hole or embedded in the adjusting hole in a horizontal direction.

[0015] Optionally, the air flow distribution plate includes at least one of a baffle plate and a shower head, and the adjustment hole is arranged in the baffle plate and / or the shower head.

[0016] Optionally, when the air flow distribution plate includes both the baffle plate and the shower head, the shower head is disposed below the baffle plate, wherein the baffle plate includes a plurality of first through holes, and the baffle plate pre-distributes the airflow flowing into the top of the baffle plate based on the first through holes; the shower head includes a plurality of second through holes, and the second through holes are connected to the first through holes, and the shower head redistributes the airflow flowing into between the shower head and the baffle plate through the first through holes based on the second through holes.

[0017] The utility model also provides a semiconductor device, in which the airflow distribution component as described above is arranged.

[0018] Optionally, the semiconductor device includes a cavity, a wafer stage arranged in the cavity, and a pump ring arranged on the wafer stage and surrounding at least a portion of the wafer stage, the pump ring is provided with a wafer inlet and outlet for transferring wafers to the wafer stage, the airflow distribution assembly is arranged above the wafer stage and the preset area is located above a side of the wafer stage facing the wafer inlet and outlet.

[0019] Optionally, the semiconductor equipment includes at least one of an epitaxial growth equipment and an etching equipment.

[0020] As described above, the airflow distribution component of the utility model is improved by the structure that allows airflow to pass through in the preset area of ​​the airflow distribution plate (i.e., setting an adjustment hole) to meet the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios. Further adding an adjustment member can adjust the size of the opening in the hole that allows airflow to pass through, thereby achieving flexible adjustment of the airflow density in the preset area, and improving the application flexibility of the airflow distribution component in different scenarios. Since the semiconductor device of the utility model is provided with the above-mentioned airflow distribution component, it can meet the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios, which is conducive to improving the process yield and product yield of the process performed by the semiconductor device. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1A schematic diagram showing the etching effect on the wafer surface after an oxide layer etching process is performed in a semiconductor cleaning chamber.

[0022] Figure 2 A simplified schematic diagram of a pump ring structure surrounding a wafer carrier in a semiconductor cleaning chamber is shown.

[0023] Figure 3 It is a partial cross-sectional schematic diagram showing the airflow distribution assembly of the present invention including a blocking plate and a shower head.

[0024] Figure 4 Display as Figure 3 A simplified schematic diagram of the structure shown from above.

[0025] Figure 5 A schematic top view of a blocking plate without adjustment holes in the airflow distribution assembly of the utility model is shown.

[0026] Figure 6 A schematic top view of a shower head without adjustment holes in the air flow distribution assembly of the utility model is shown.

[0027] Figure 7 It is a top view schematic diagram showing that the adjustment hole in the air flow distribution assembly of the present invention is arranged in the first central area of ​​the blocking plate.

[0028] Figure 8 The diagram is a top view of the air flow distribution assembly of the present invention when the adjustment hole spans between the second central area and the second peripheral area of ​​the shower head.

[0029] Fig. 9 The diagram is a top view of the airflow distribution assembly of the present invention when the adjustment hole spans between the first central area and the first peripheral area of ​​the blocking plate.

[0030] Fig.10 The diagram shows a top view of the airflow distribution assembly of the present invention when the adjustment hole is in an arc shape.

[0031] Fig.11 It is a top view schematic diagram showing that the airflow distribution assembly of the utility model is also provided with an adjustment member.

[0032] Fig.12 It is a simplified schematic diagram showing the adjustment member in the air flow distribution assembly of the present invention adjusting the opening size of the adjustment hole.

[0033] Fig.13 Displayed as Fig.11 A top view schematic diagram of the structure shown after the size of the opening is increased by adjusting the member.

[0034] Fig.14The diagram shows a top view of the airflow distribution assembly of the present invention when the regulating member is connected to the driving member.

[0035] Fig.15 It is a cross-sectional schematic diagram showing the adjustment member in the air flow distribution assembly of the present invention when it is arranged above the adjustment hole.

[0036] Fig.16 It is a cross-sectional schematic diagram showing the adjustment member in the air flow distribution assembly of the present invention when it is arranged below the adjustment hole.

[0037] Fig.17 It is a cross-sectional schematic diagram showing the adjusting member in the air flow distribution assembly of the present invention when it is embedded in the adjusting hole.

[0038] Fig.18 It is a simplified structural schematic diagram of the semiconductor device of the present invention.

[0039] Fig.19 Shown is a partial cross-sectional schematic diagram of a semiconductor device of the present invention.

[0040] Description of Reference Numerals

[0041] 10 Air flow distribution assembly

[0042] 11 Blocking plate

[0043] 111 First through hole

[0044] 11a First Central Area

[0045] 11b First peripheral area

[0046] 12 Sprinklers

[0047] 121 Second through hole

[0048] 12a Second Central Area

[0049] 12b Second peripheral area

[0050] 13 Adjustment hole

[0051] 14 Adjustment parts

[0052] 15 Drive element

[0053] 20 Cavity

[0054] 30 Wafer stage

[0055] 40 Pump ring

[0056] 41 Wafer import and export

[0057] 42 Exhaust Hole

[0058] 43 Exhaust port

[0059] 50 Cavity cover

[0060] 51 Air flow distribution assembly

[0061] 511 Blocking Plate

[0062] 512 Sprinkler

[0063] 52 Top Plate

[0064] 60 RF source DETAILED DESCRIPTION

[0065] The following is an explanation of the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention.

[0066] See also Figures 2 to 19 It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the utility model, and the drawings only show the components related to the utility model rather than the number, shape and size of the components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0067] After multiple verifications of the technical problems mentioned in the background technology, it is found that the gas distribution assembly set in the semiconductor cleaning chamber can achieve uniform distribution of etching gas so that the amount of etching gas reaching the surface of the wafer to be etched is consistent, but the reason why the cold spot area of ​​etching amount is still generated is: please refer to Figure 2 , which is a simplified schematic diagram of a pump ring structure surrounding a wafer carrier in a semiconductor cleaning chamber (see Fig.18The pump ring 40 includes a wafer inlet and outlet 41 and an air extraction port 42 which are arranged relatively to each other, wherein the wafer inlet and outlet 41 is used to transfer the wafer on the wafer carrier, and the air extraction port 42 is used to cooperate with a plurality of exhaust holes 43 which are arranged circumferentially along the pump ring 40 (the exhaust holes 43 are connected with the air extraction port 42 inside the pump ring 40) to volatilize the solid by-products of etching in the area surrounded by the pump ring 40 at high temperature and then extract them out of the cavity to avoid adverse effects on the etching process, because the volatile gas of the etching by-products can still have a certain etching effect on the wafer surface. Therefore, when using the pump ring 40 for exhaust, it is necessary to ensure that the residual amount of etching byproduct gas in the area near the inner wall of the pump ring 40 is consistent to ensure the etching uniformity of the wafer surface. Taking into account the difference in extraction force at different distances from the exhaust port 42 (the farther the distance, the lower the extraction force, and the less gas is extracted), the design manufacturer will set the aperture of the exhaust hole 43 at the position opposite to the exhaust port 42 (that is, above the wafer inlet and outlet 41) to be relatively large when designing the pump ring structure, and the aperture of the exhaust holes at other positions to be relatively small (that is, Figure 2 However, after practice, it was found that the wafers flowing out of the semiconductor cleaning chamber had an etching amount cold spot at the position corresponding to the wafer inlet and outlet 41, which indicated that the diameter of the exhaust hole 43 opened above the wafer inlet and outlet 41 was designed to be too large, resulting in an unexpected situation that the machine design and the process did not match.

[0068] Based on the above analysis, the inventors have summarized the following technical solutions to compensate for the problem of wafer surface etching consistency caused by insufficient machine design, thereby improving process stability and product yield.

[0069] Embodiment 1

[0070] This embodiment provides an air flow distribution component, please refer to Figures 3 to 10 The air flow distribution component 10 includes an air flow distribution plate and an adjustment hole 13 .

[0071] Specifically, Figures 3 to 10 As shown, the air flow distribution plate includes a plurality of through holes, and the air flow distribution plate distributes the air flow flowing into the upper part of the air flow distribution plate based on the through holes; Figure 5 and Figure 6 As shown, the adjustment hole 13 is arranged in a preset area of ​​the air flow distribution plate, and the adjustment hole 13 is used to make the air flow density in the preset area higher than the air flow density in other areas of the air flow distribution plate ("other areas" refer to the areas in the air flow distribution plate excluding the preset area).

[0072] As an example, Figures 3 to 10 As shown, the air flow distribution plate includes at least one of a blocking plate 11 and a shower head 12, and the adjustment hole 13 is arranged in the blocking plate 11 and / or the shower head 12. Figure 7 , showing a top view schematic diagram when the blocking plate is provided with the adjustment hole, the air flow distribution assembly 10 only includes the blocking plate 11 and uses the blocking plate 11 as the air flow distribution plate to distribute the air flow (in this case, the adjustment hole 13 is only provided in the blocking plate 12), or, please refer to Figure 8 , showing a top view of a shower head provided with the adjustment hole, the air flow distribution assembly 10 only includes the shower head 12 and uses the shower head 12 to distribute the air flow (in this case, the adjustment hole 13 is only provided in the shower head 12), or, please refer to Figure 3 , Figure 7 and Figure 8 The airflow distribution assembly 10 includes both a baffle plate 11 and a shower head 12 (at this time, either or both of them are provided with the adjustment hole 13) and uses both of them to perform multiple airflow distribution. When the airflow distribution plate includes only one of the baffle plate and the shower head, it is equivalent to the included structural member acting as a single airflow distribution plate in the airflow distribution assembly to perform primary airflow distribution. When the airflow distribution plate includes both the baffle plate and the shower head, it is equivalent to the two structural members acting as a double airflow distribution plate in the airflow distribution assembly to perform two-stage airflow distribution.

[0073] Furthermore, if Figure 3 and Figure 4 As shown, Figure 3 A cross-sectional schematic diagram showing an air flow distribution assembly when the air flow distribution plate includes both a baffle plate and a spray plate. Figure 4 Display as Figure 3 The simplified schematic diagram of the top view of the structure shown is that when the airflow distribution plate includes the baffle plate 11 and the spray head 12 at the same time, the spray head 12 is arranged below the baffle plate 11, wherein the baffle plate 11 includes a plurality of first through holes 111, and the baffle plate 11 pre-distributes the airflow flowing into the top of the baffle plate 11 based on the first through holes 111; the spray head 12 includes a plurality of second through holes 121, and the second through holes 121 are connected to the first through holes 111, and the spray head 12 redistributes the airflow flowing into between the spray head 12 and the baffle plate 11 through the first through holes 111 based on the second through holes 121.

[0074] As an example, Figures 5 to 9 As shown, the air flow distribution plate includes a central area and a peripheral area surrounding the central area, and a plurality of through holes are distributed in the central area. Figure 5 and Figure 7 As shown, the blocking plate 11 includes a first central area 11a where a plurality of first through holes 111 are distributed and a first peripheral area 11b surrounding the first central area 11a, and / or, as shown Figure 6 and Figure 8As shown, the shower head 12 includes a second central area 12a in which a plurality of second through holes 121 are distributed and a second peripheral area 12b surrounding the second central area 12a.

[0075] Furthermore, if Figure 7 As shown, the adjustment hole 13 is located in the central area, and / or Figure 8 and Fig. 9 As shown in FIG. 1 , the adjustment hole 13 extends from the central area to the peripheral area in the width direction. That is, when the adjustment hole 13 is provided on the blocking plate 11, the adjustment hole 13 may be located only in the first central area 11a (eg, Figure 7 ), or may span between the first central region 11a and the first peripheral region 11b in the width direction (as shown in FIG. Fig. 9 Similarly, when the adjustment hole 13 is provided on the shower head 12, the adjustment hole 13 may be located only in the second central area 12a (see Figure 7 The second central region 12a and the second peripheral region 12b may also be spanned in the width direction (e.g. Figure 8 In this embodiment, the position of the adjustment hole is preferably the former, which can avoid the waste of airflow passing through the portion of the adjustment hole located in the peripheral area.

[0076] As an example, Figures 7 to 9 As shown, the plurality of through holes are distributed in a plurality of concentric circles, and the adjusting hole 13 includes an arc-shaped hole. The arc-shaped adjusting hole 13 can be consistent with the distribution trend of the plurality of through holes, so that the airflow passing through the preset area at least covers the original airflow distribution when the adjusting hole 13 is not set. Of course, the plurality of through holes may be distributed in other forms according to different actual application occasions and functions, for example, distributed in a plurality of polygons with overlapping centers but different side lengths, and the shape of the adjusting hole may also need to be modified accordingly.

[0077] As an example, see Fig.10 , showing a schematic top view of the adjustment hole in an arc shape, the length of the adjustment hole 13 ( Fig.10 L in the figure) is 1 / 4 to 1 / 2 of the circumference of the air distribution plate, including but not limited to 1 / 4, 3 / 8 and 1 / 2. It should be noted that when the adjustment hole is arc-shaped, the length direction of the adjustment hole corresponds to the circumferential direction, and the width direction of the adjustment hole corresponds to the radial direction.

[0078] In a specific example, the width of the adjustment hole 13 ( Fig.10 W in the figure) is in the range of 10 to 25 mm, including but not limited to 10 mm, 15 mm, 20 mm and 25 mm, and the length of the adjustment hole 13 ( Fig.10The range of the adjustment hole (shown in L) is 400 to 500 mm, including but not limited to 400 mm, 425 mm, 450 mm, 475 mm and 500 mm. It should be noted that although the width of the adjustment hole shown in the figure is much larger than the diameter of the through hole, the width of the adjustment hole can be equal to or even smaller than the diameter of the through hole, provided that the airflow density in the preset area is higher than that in other areas. The specific size parameters of the adjustment hole are adjusted based on the scenario in which the airflow distribution component is applied.

[0079] Specifically, the airflow distribution assembly is mainly used in certain applications where it is necessary to increase the airflow density in a local area. For example, in the semiconductor cleaning chamber mentioned above, due to the arrangement of other structural parts in the chamber, the etching gas that evenly reaches the surface of the wafer carried on the wafer stage will cause the etching degree of the local area of ​​the wafer surface to be different from that of other areas, resulting in an unexpected situation in which the product does not meet the requirements. Figure 5 and Figure 6 As shown, in the original air flow distribution plate structure, the through holes distributed in the preset area are consistent with other areas or meet the requirements that the air flow reaches the area below the air flow distribution plate in a preset manner and finally reaches the wafer surface evenly for etching reaction. However, in practice, it is found that the etching amount of the part of the wafer located below the preset area is lower than that of the part located below other areas. At this time, while keeping other parameters or structures the same, it can be regarded that the through holes distributed in the preset area of ​​the original air flow distribution plate do not meet the air flow density requirements through the area. Therefore, it is necessary to increase the number of through holes passing through the preset area. Based on this, the setting of the adjustment hole is equivalent to improving the structure of the preset area of ​​the airflow distribution plate that allows the airflow to pass through (adjusting the preset number of through holes to the adjustment hole), so as to reasonably expand the area of ​​the area that allows the airflow to pass through, thereby meeting the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios, thereby improving the consistency and uniformity of the overall etching amount on the wafer surface, improving the product yield, and there is no need to adjust the components and design of other more complex structures in the chamber. Only the baffle plate and / or the shower head need to be adjusted, which will not increase the cost of equipment modification. Although the airflow distribution component is mainly used in semiconductor cleaning chambers to distribute etching gases when oxide etching is performed on the surface of the wafer to be cleaned, this does not mean that the airflow distribution component of the present application can only be used in semiconductor cleaning chambers. In fact, it can also be used in other equipment with similar improvement needs.

[0080] The airflow distribution assembly of this embodiment is improved by a structure that allows airflow to pass through a preset area of ​​the airflow distribution plate (i.e., setting an adjustment hole) to meet the requirement that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios.

[0081] Embodiment 2

[0082] This embodiment provides an air flow distribution assembly. The difference between this embodiment and the first embodiment is that the air flow distribution assembly of this embodiment is further provided with an adjustment member for adjusting the opening size of the adjustment hole, while the air flow distribution assembly in the first embodiment is not provided with the adjustment member. Figures 11 to 13 The air flow distribution component 10 includes an air flow distribution plate and an adjustment hole 13 .

[0083] For details, please refer to Fig.11 , showing a top view schematic diagram when the blocking plate is used as the airflow distribution plate in the airflow distribution assembly, the airflow distribution plate includes a plurality of through holes, and the airflow distribution plate distributes the airflow flowing into the top of the airflow distribution plate based on the through holes; the adjustment hole 13 is arranged in a preset area of ​​the airflow distribution plate, and the adjustment hole 13 is used to make the airflow density of the preset area higher than the airflow density of other areas of the airflow distribution plate.

[0084] As an example, see Figures 11 to 13 ,in, Fig.12 It is a simplified schematic diagram showing the adjustment member adjusting the size of the above opening. Fig.13 Displayed as Fig.11 The structure shown in FIG. 1 is a top view of the structure after the opening size is increased by the adjusting member. The airflow distribution assembly 10 further includes an adjusting member 14 for adjusting the opening size of the adjusting hole 13 for airflow to pass through. In actual application, the opening size can be adjusted to a required value by the adjusting member before the process starts, and then the process steps are started.

[0085] Furthermore, when the adjustment hole 13 is arc-shaped, the adjustment member 14 is arc-shaped on one side toward the center of the airflow distribution plate to match the shape of the adjustment hole 13. When moving to adjust the size of the opening in the arc-shaped hole that allows airflow to pass through, the uniformity of gas distribution at the opening is ensured to avoid differences when flowing through the opening to the lower area, thereby ensuring product yield.

[0086] As an example, see Figures 15 to 17 , which are cross-sectional diagrams showing the adjustment member in three different positions (which can be regarded as Fig.11 The adjustment member 14 is movably disposed above the adjustment hole 13 in the horizontal direction (such as Fig.15 As shown), below the adjustment hole 13 (as shown Fig.16 as shown) or embedded in the adjustment hole 13 (as shown Fig.17As shown), that is, the position of the adjusting member 14 can be flexibly set under the condition that the above-mentioned opening size of the adjusting hole 13 can be flexibly adjusted, and it can just cover the upper surface or lower surface of the part of the adjusting member 14 where the adjusting hole 13 is set, or it can be directly embedded in the adjusting member 14. For example, when the adjusting hole is set in the shower head and the adjusting member is set above the adjusting hole, the adjusting member can directly partially cover the adjusting hole and directly contact with the side of the shower head facing the baffle plate, or be provided with a small gap (the small gap needs to ensure that it will not cause obvious diversion of the outgoing airflow and affect the amount of extended airflow reaching the lower area) to avoid direct contact and cause adverse effects caused by friction when the adjusting member is repeatedly adjusted for different application scenarios. When the adjusting hole is set in the baffle plate, a horizontally extending groove (the groove will penetrate the side wall of the adjusting hole) can be formed in the part of the baffle plate where the adjusting hole is set to accommodate the adjusting member and allow the adjusting member to move in the groove to adjust the size of the above-mentioned opening. Such settings are all possible.

[0087] As an example, the material of the adjusting member 14 includes stainless steel or other suitable materials, and the adjusting member 14 is preferably made of a material that is resistant to high temperatures (resistant to 200°C and above) and has a certain rigidity and chemical stability, so as to ensure the service life and reliability of the adjusting member.

[0088] As an example, Figures 14 to 17 As shown, Fig.14 The schematic diagram is a top view of the adjusting member connected to the driving member. The air flow distribution assembly 10 further includes a driving member 15, which is connected to the adjusting member 14 to drive the adjusting member 14 to move relative to the adjusting hole 13 to achieve flexible adjustment of the above-mentioned opening. At the same time, the active connection of the driving member 15 with other structural members can also relatively ensure the position stability of the adjusting member 14 relative to the adjusting hole 13, thereby avoiding the position of the adjusting member 14 from being unexpectedly offset during use and causing interference. For example, when the adjusting hole 13 is located in the blocking plate 11 and the adjusting member 14 adjusts the opening from below the adjusting hole 13, the driving member 15 can be vertically extended to the spray head 12 and movably connected to the spray head 12 while being connected to the adjusting member 14. Further, the driving member 15 can be driven manually or automatically (a driving mechanism is provided to connect the driving member), which is not mandatory here.

[0089] It should be noted that although the relevant drawings of this embodiment all show the baffle plate as the airflow distribution plate, in fact, the airflow distribution plate can be played by a sprinkler head or a combination of a sprinkler head and a baffle plate. To avoid redundancy, they are not shown and explained one by one here.

[0090] The airflow distribution component of this embodiment, based on the structure of the first embodiment, further adds an adjustment member to adjust the size of the opening in the hole that allows airflow to pass through, thereby achieving flexible adjustment of the airflow density in the preset area, thereby improving the application flexibility of the airflow distribution component in different scenarios.

[0091] Embodiment 3

[0092] The utility model also provides a semiconductor device, please refer to Fig.18 and Fig.19 ,in, Fig.18 Shown is a simplified schematic diagram of the semiconductor device. Fig.19 It is a partial cross-sectional schematic diagram of the semiconductor device, in which the airflow distribution assembly as described in the above embodiment 1 and / or embodiment 2 is arranged.

[0093] As an example, the semiconductor device includes a cavity 20, a wafer stage 30 disposed in the cavity 20, and a pump ring 40 disposed on the wafer stage 30 and surrounding at least a portion of the wafer stage 30, the pump ring 40 is provided with a wafer inlet and outlet 41 for transferring wafers to the wafer stage 30, the airflow distribution component 51 is disposed above the wafer stage 30 and the preset area is located above the side of the wafer stage 30 facing the wafer inlet and outlet 41, as shown in FIG. Fig.19 As shown, in this embodiment, the air flow distribution assembly 51 includes a blocking plate 511 and a spray head 512 which are combined to serve as an air flow distribution plate.

[0094] As an example, Fig.19 As shown, the semiconductor device further includes a chamber cover 50 , wherein the chamber cover 50 is disposed on the top of the chamber body 20 , and the airflow distribution assembly 51 is disposed in the chamber cover 50 .

[0095] As an example, the semiconductor device also includes a RF source 60, and the chamber cover 50 is also provided with a top plate 52. The RF source 60 is arranged above the chamber cover 50, and the top plate 52 is arranged above the airflow distribution component 51. The plasma etching gas emitted by the RF source 60 sequentially passes through the airflow channel in the top plate 52, the through holes in the airflow distribution plate in the airflow distribution component 51 (for example, the first through hole in the blocking plate 511 and / or the second through hole in the shower head 512) and the adjustment hole to reach the surface of the wafer carried on the wafer carrier 30.

[0096] As an example, the semiconductor device includes at least one of an epitaxial growth device and an etching device. Of course, the semiconductor device also includes other devices provided with a semiconductor cleaning chamber.

[0097] Since the semiconductor device of this embodiment is provided with the above-mentioned airflow distribution component, it can meet the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios, which is beneficial to improving the process yield and product yield of the process performed by the semiconductor device.

[0098] In summary, the airflow distribution component of the utility model is improved by the structure that allows airflow to pass through in the preset area of ​​the airflow distribution plate (i.e., setting an adjustment hole) to meet the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios. Further adding an adjustment member can achieve the size of the opening in the adjustment hole that allows airflow to pass through, thereby achieving flexible adjustment of the airflow density in the preset area, and improving the application flexibility of the airflow distribution component in different scenarios. Since the semiconductor device of the utility model is provided with the above-mentioned airflow distribution component, it can meet the demand that the airflow density in the preset area needs to be higher than the airflow density in other areas in some application scenarios, which is conducive to improving the process yield and product yield based on the process performed by the semiconductor device. Therefore, the utility model effectively overcomes the various shortcomings in the prior art and has a high industrial utilization value.

[0099] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

Claims

1. An air flow distribution component, characterized in that: include: An air flow distribution plate, comprising a plurality of through holes, wherein the air flow distribution plate distributes the air flow flowing into the upper part of the air flow distribution plate based on the through holes; The regulating hole is arranged in a preset area of ​​the air flow distribution plate, and the regulating hole is used to make the air flow density of the preset area higher than the air flow density of other areas of the air flow distribution plate.

2. The air flow distribution assembly according to claim 1, characterized in that: The air flow distribution plate includes a central area and a peripheral area surrounding the central area, and a plurality of through holes are distributed in the central area; the adjustment hole is located in the central area, and / or the adjustment hole extends from the central area to the peripheral area in the width direction.

3. The air flow distribution assembly according to claim 1, characterized in that: The plurality of through holes are distributed in a plurality of concentric circles, and the adjustment hole comprises an arc-shaped hole.

4. The air flow distribution assembly according to claim 1, characterized in that: The length of the adjustment hole is 1 / 4 to 1 / 2 of the circumference of the air flow distribution plate.

5. The air flow distribution assembly according to claim 1, characterized in that: The airflow distribution assembly also includes an adjusting member for adjusting the size of an opening in the adjusting hole for allowing airflow to pass through, and the adjusting member is movably arranged above the adjusting hole, below the adjusting hole, or embedded in the adjusting hole in a horizontal direction.

6. The air flow distribution assembly according to claim 1, characterized in that: The air flow distribution plate includes at least one of a blocking plate and a shower head, and the adjustment hole is arranged in the blocking plate and / or the shower head.

7. The air flow distribution assembly according to claim 6, characterized in that: When the air flow distribution plate includes the baffle plate and the spray head at the same time, the spray head is arranged below the baffle plate, wherein the baffle plate includes a plurality of first through holes, and the baffle plate pre-distributes the airflow flowing into the top of the baffle plate based on the first through holes; the spray head includes a plurality of second through holes, and the second through holes are connected to the first through holes, and the spray head redistributes the airflow flowing into between the spray head and the baffle plate through the first through holes based on the second through holes.

8. A semiconductor device, characterized in that: The semiconductor device is provided with an air flow distribution assembly as described in any one of claims 1 to 7.

9. The semiconductor device according to claim 8, wherein: The semiconductor device includes a cavity, a wafer stage arranged in the cavity, and a pump ring arranged on the wafer stage and surrounding at least a portion of the wafer stage, the pump ring is provided with a wafer inlet and outlet for transferring wafers onto the wafer stage, the airflow distribution component is arranged above the wafer stage and the preset area is located above a side of the wafer stage facing the wafer inlet and outlet.

10. The semiconductor device according to claim 8, wherein: The semiconductor equipment includes at least one of an epitaxial growth equipment and an etching equipment.

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