Splitting film for gold-plated wafer and splitting assembly
By using an acrylic adhesive layer to bond the gold-plated surface in the lobe film for gold-plated wafers, and using the base layer to support the bottom, the problems of glue residue and peeling force are solved, and efficient single-piece collection and yield improvement are achieved.
Patent Information
- Application Number
- CN202323194167.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-11-27
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2033-11-27
AI Technical Summary
After the existing lobe film is in the gold-plated wafer lobe, the glue remains on the gold-plated surface, resulting in poor peeling force, resulting in misalignment or drop of single-pieces, affecting efficient batch collection.
A lobe film for gold-plated wafers including a base material layer, an acrylic adhesive layer and a release layer is used. The acrylic adhesive layer is bonded to the gold-plated surface, and the base material layer supports the bottom to avoid glue residue, and reduce pressure through a buffer pad to increase peeling force.
It effectively avoids glue residue, maintains the purity of the single-piece gold-plated surface, improves the yield of the lobe, and reduces the impact on the wafer through the buffer glue pad, ensuring efficient single-piece collection.
Smart Images
Figure CN222562668U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer splitting, in particular to a splitting film and a splitting component for a gold-plated wafer. Background Art
[0002] Gold-plated wafers are made by coating the surface of silicon wafers or other semiconductor materials with a thin layer of gold or platinum. This layer of gold or platinum can protect the surface of the wafer and also improve its conductivity and stability, so it is widely used in various microelectronic devices.
[0003] With the current splitting film, after the gold-plated wafer is split, the glue on the splitting film will remain on the gold-plated surface of the gold-plated wafer, causing defects. The specific manifestation of the glue residue is fogging of the gold-plated surface. At the same time, the peeling force of the current splitting film is unstable or not suitable for the splitting of gold-plated wafers. The adhesion between the single wafer formed after the wafer is split and the split film is insufficient, which causes the single wafer to be misaligned or even fall off, which is not conducive to the efficient collection of single wafers in batches.
[0004] In view of this, there is an urgent need to provide a gold-plated wafer splitting film and a splitting assembly to overcome the above-mentioned defects. Summary of the invention
[0005] In order to solve the above technical problems, the purpose of the utility model is to disclose a splitting film and a splitting assembly for gold-plated wafers, which are bonded to the gold-plated surface of the gold-plated wafer through an acrylic adhesive layer. After splitting, no glue will remain on the gold-plated surface.
[0006] The first invention objective of the utility model is to provide a splitting film for gold-plated wafers.
[0007] The second invention objective of the utility model is to provide a gold-plated wafer splitting component.
[0008] To achieve the above-mentioned first invention purpose, the utility model provides a splitting film for gold-plated wafers, comprising a substrate layer, an acrylic adhesive layer and a release layer, wherein the substrate layer has a thickness of 50 μm-100 μm, and the acrylic adhesive layer has a thickness of 5 μm-25 μm.
[0009] To achieve the above-mentioned first invention purpose, the utility model also provides a splitting film for gold-plated wafers, comprising a substrate layer, an acrylic adhesive layer and a release layer, wherein the substrate layer has a thickness of 50 μm-70 μm, and the acrylic adhesive layer has a thickness of 5 μm-10 μm.
[0010] Preferably, the substrate layer is a PET layer.
[0011] Preferably, the peeling force between the acrylic adhesive layer and the gold-plated surface of the gold-plated wafer is 30 gf / inch-40 gf / inch.
[0012] Preferably, the release layer has a thickness of 10 μm-50 μm.
[0013] Based on the same inventive principle, in order to achieve the above second inventive object, the utility model provides a gold-plated wafer splitting assembly, which includes, from bottom to top, the gold-plated wafer splitting film, the gold-plated wafer and the buffer rubber pad described in the first invention;
[0014] The gold-plated surface of the gold-plated wafer faces the gold-plated wafer splitting film described in the first invention.
[0015] Preferably, a pressing mechanism is arranged above the buffer rubber pad.
[0016] Preferably, the thickness of the buffer rubber pad is 1mm-5mm.
[0017] Preferably, the area of the buffer rubber pad is larger than the area of the gold-plated wafer.
[0018] Compared with the prior art, the technical effects of the utility model are as follows:
[0019] (1) When using the splitting film, tear off the release layer, and the acrylic adhesive layer is bonded to the gold-plated surface of the gold-plated wafer. The substrate layer plays a supporting role. After splitting, the acrylic adhesive will not remain on the gold-plated surface, thereby maintaining the purity of the gold-plated surface of the single wafer after splitting and improving the splitting yield.
[0020] (2) The impact force of the pressure mechanism on the gold-plated wafer is reduced by using a buffer rubber pad, thereby improving the chipping yield. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0022] Figure 1 The utility model is a schematic cross-sectional view of a split film for gold-plated wafers.
[0023] Figure 2 The utility model is a cross-sectional schematic diagram of a gold-plated wafer splitting component.
[0024] Among them, 1. substrate layer; 2. acrylic adhesive layer; 3. release layer; 4. gold-plated wafer; 41. gold-plated surface; 5. cushioning rubber pad; 6. pressing mechanism. DETAILED DESCRIPTION
[0025] The present invention is described in detail below in conjunction with the various embodiments shown in the accompanying drawings, but it should be noted that these embodiments are not limitations of the present invention, and any equivalent transformations or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these embodiments are all within the scope of protection of the present invention.
[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.
[0027] Example 1
[0028] Ginseng Figure 1 As shown, this embodiment discloses a specific implementation of a splitting film for gold-plated wafers.
[0029] Gold-plated wafer split film, reference Figure 1 As shown, it includes a substrate layer 1, an acrylic adhesive layer 2 and a release layer 3, wherein the substrate layer 1 has a thickness of 50 μm-100 μm, and the acrylic adhesive layer 2 has a thickness of 5 μm-25 μm.
[0030] Specifically, the substrate layer 1 is preferably a PET layer, the thickness of the substrate layer 1 is 50μm-100μm, and the thickness of the substrate layer 1 is preferably 50μm, 60μm, 70μm, 80μm and 90μm. The substrate layer 1 needs to have a certain stiffness and thickness so that it can serve as a supporting layer for several single pieces after splitting; the acrylic adhesive layer 2 and the gold-plated surface of the wafer have the characteristics of adhesion but no residue, so that the gold-plated surface of the single piece after splitting maintains purity and does not cause a decrease in yield due to residual glue; the thickness of the acrylic adhesive layer 2 is 5μm-25μm, and the thickness of the acrylic adhesive layer 2 is preferably 7μm, 10μm, 13μm, 14μm, 16μm and 21μm. If the thickness of the acrylic adhesive layer 2 is too thin, the adhesion will not be good. The thickness of the acrylic adhesive layer 2 is preferably 5 μm-25 μm. The peeling force between the acrylic adhesive layer 2 and the gold-plated surface of the gold-plated wafer is 30 gf / inch-40 gf / inch. After the splitting is completed, the peeling force in this range can prevent the single piece from being misplaced or falling off, resulting in a decrease in yield, and at the same time, the single piece is kept in a complete arrangement state under the supporting effect of the substrate layer 1, which is convenient for efficiently collecting the single piece. The thickness of the release layer 3 is 10 μm-50 μm. When using the splitting film, the release layer 3 is torn off and the acrylic adhesive layer 2 is exposed. The thickness of the release layer 3 is preferably 20 μm, 30 μm or 40 μm.
[0031] Through this embodiment, when the splitting film is used, the release layer 3 is torn off, the acrylic adhesive layer 2 is bonded to the gold-plated surface of the gold-plated wafer, and the substrate layer 1 plays a bottom supporting role. After splitting, the acrylic glue will not remain on the gold-plated surface, thereby maintaining the purity of the single gold-plated surface after splitting and improving the splitting yield.
[0032] Example 2
[0033] Ginseng Figure 2 As shown, this embodiment discloses a specific implementation of a gold-plated wafer splitting component.
[0034] Gold plated wafer split components, see Figure 2 , from bottom to top, it includes the gold-plated wafer splitting film, the gold-plated wafer 4 and the buffer rubber pad 5 described in Example 1, and the surface of the gold-plated wafer 4 is provided with a gold-plated surface 41; the gold-plated surface 41 of the gold-plated wafer 4 faces the acrylic adhesive layer 2 of the gold-plated wafer splitting film described in Example 1; the buffer rubber pad 5 has a thickness of 1mm-5mm, preferably 2mm, and the area of the buffer rubber pad 5 is larger than the area of the gold-plated wafer 4; a pressing mechanism 6 is provided above the buffer rubber pad 5.
[0035] Specifically, the gold-plated wafer 4 splitting includes the following steps: the first step is to scribe lines on the surface of the gold-plated wafer 4 to show several single pieces; the second step is to tear off the release layer 3 and bond the gold-plated surface 41 of the gold-plated wafer 4 to the acrylic adhesive layer 2; the third step is to place a buffer pad 5 on the gold-plated wafer 4; the fourth step is to start the pressing mechanism 6, and the pressing mechanism 6 applies a vertical downward pressure to the buffer pad 5, and the pressing direction is shown in FIG. Figure 2 As shown by the arrow, the pressing force is 1kg / cm 2 -10kg / cm 2 , the pressing time is 1s-3s; Step 5, after the splitting is completed, a number of single wafers are collected in batches. It should be noted that the pressing surface of the pressing mechanism 6 is not less than the area of the gold-plated wafer 4, and the specific structure of the pressing mechanism 6 can be driven by hydraulic or cylinder to drive the pressing plate to move vertically up and down. The implementation structure can be easily obtained by those skilled in the art and will not be described in detail.
[0036] The gold-plated wafer splitting assembly disclosed in Example 2 has the same technical solution as that in Example 1. Please refer to the description in Example 1 and will not be repeated here.
Claims
1. A split film for gold-plated wafers, characterized in that: It comprises a substrate layer, an acrylic adhesive layer and a release layer, wherein the substrate layer has a thickness of 50 μm-100 μm, and the acrylic adhesive layer has a thickness of 5 μm-25 μm; The substrate layer is a PET layer.
2. The gold-plated wafer splitting film according to claim 1, wherein: The peeling force between the acrylic adhesive layer and the gold-plated surface of the gold-plated wafer is 30 gf / inch-40 gf / inch.
3. The gold-plated wafer splitting film according to claim 1, wherein: The release layer has a thickness of 10 μm-50 μm.
4. A split film for gold-plated wafers, characterized in that: It comprises a substrate layer, an acrylic adhesive layer and a release layer, wherein the substrate layer has a thickness of 50 μm-70 μm, and the acrylic adhesive layer has a thickness of 5 μm-10 μm; The substrate layer is a PET layer.
5. The gold-plated wafer splitting film according to claim 4, characterized in that: The peeling force between the acrylic adhesive layer and the gold-plated surface of the gold-plated wafer is 30 gf / inch-40 gf / inch.
6. The gold-plated wafer splitting film according to claim 4, wherein: The release layer has a thickness of 10 μm-50 μm.
7. A gold-plated wafer splitter assembly, characterized in that: The invention comprises, from bottom to top, a gold-plated wafer splitting film, a gold-plated wafer and a buffer rubber pad according to any one of claims 1 to 6; The gold-plated surface of the gold-plated wafer faces the gold-plated wafer splitting film according to any one of claims 1-6.
8. The gold-plated wafer splitting assembly according to claim 7, wherein: A pressing mechanism is arranged above the buffer rubber pad.
9. The gold-plated wafer splitting assembly according to claim 8, characterized in that: The thickness of the buffer rubber pad is 1mm-5mm.
10. The gold-plated wafer splitting assembly according to claim 9, characterized in that: The area of the buffer rubber pad is larger than the area of the gold-plated wafer.