Manipulator execution part

Abstract

The utility model discloses a manipulator executive component which comprises a base, a pressing mechanism and a sheet grabbing mechanism. Wherein the wafer grabbing mechanism is connected to the base and used for grabbing a wafer in a first form, and the base is provided with a bearing part used for abutting against at least one part of the lower end face of a wafer in a second form. And the pressing mechanism is connected to the base and is used for acting to press the upper end surface of the second-form wafer so as to press the second-form wafer on the bearing part. According to the utility model, both the first-form wafer and the second-form wafer can be grabbed, the first-form wafer and the second-form wafer can be grabbed at the same time, and the use is more convenient.

Description

Technical Field

[0001] The utility model relates to a manipulator execution component. Background Art

[0002] At present, the production process of wafers is relatively complicated. During the manufacturing process, wafers need to go through multiple processes such as blue film pasting and dicing, which require the use of multiple devices to complete in coordination. Wafers need to be transferred inside the equipment and between different equipment by a robot. The end of the robot is connected to an end effector, which is used to grab the wafer, and then the robot drives the grabbed wafer to move to achieve the transfer of the wafer. Among them, wafer (first form wafer) and framewafer (second form wafer) are different states of the wafer in the production process. The first form wafer is the state of the wafer before the dicing process, and the second form wafer is the state of the wafer during the dicing process. The second form wafer is the state where a blue film is pasted on the surface of the first form wafer and the outer periphery of the blue film is connected to the patch ring. The patch ring is used to tension the blue film. The patch ring is also called a wafer ring, a wafer patch ring, a silicon wafer blue film fixing ring, and a ring ring.

[0003] At present, since the equipment used in the semiconductor field and the cost of the production workshop are very expensive, many detection equipment used in the research and development stage need to detect both the first-form wafer and the second-form wafer. Therefore, the manipulator in such equipment needs to meet the transmission requirements of the first-form wafer and the second-form wafer at the same time. Therefore, the end effector on such manipulator needs to take into account the grasping of the first-form wafer and the second-form wafer. However, the existing end effector can usually only grasp the first-form wafer or only grasp the second-form wafer, and cannot take into account the grasping of the first-form wafer and the second-form wafer. For example, a Chinese patent with publication number CN115122369B discloses an end effector, which can only grasp the first-form wafer but not the second-form wafer, and cannot take into account the grasping of the first-form wafer and the second-form wafer, and has great limitations in use. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the defects of the prior art and provide a robot execution component, which can grasp both the first form wafer and the second form wafer, and can take into account the grasping of the first form wafer and the second form wafer, and is more convenient to use.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: a manipulator execution component, which includes a base, a pressing mechanism and a grabbing mechanism;

[0006] The grabbing mechanism is connected to the base and is used to grab the first-shaped wafer;

[0007] The base is provided with a supporting portion for abutting against at least a portion of the lower end surface of the second-form wafer;

[0008] The pressing mechanism is connected to the base and is used to press the upper end surface of the second-shaped wafer to press the second-shaped wafer onto the supporting portion.

[0009] A specific structure of the clamping mechanism is further provided, wherein the clamping mechanism comprises a driving mechanism and at least one pressing plate;

[0010] The pressing plate is hinged on the base;

[0011] The driving mechanism is connected to the base and to the pressing plate and is used for driving the pressing plate to rotate so that the pressing plate presses the second-shaped wafer onto the supporting portion.

[0012] A specific structure of the driving mechanism is further provided, wherein the driving mechanism comprises a driving slider, a power assembly and a roller corresponding to the pressing plate;

[0013] The middle part of the pressing plate is hinged on the base, the front end of the pressing plate extends above the supporting part, and the roller is rotatably connected to the rear end of the pressing plate;

[0014] The driving slider is slidably connected to the base in the front-rear direction, and a wedge-shaped portion corresponding to the roller is provided on the driving slider, and the wedge-shaped portion is used to abut against the corresponding roller;

[0015] The power assembly is connected to the base and to the driving slider, and is used to drive the driving slider to move forward so that the wedge-shaped portion presses against the roller and drives the roller to move upward, thereby driving the pressure plate to rotate so that the front end of the pressure plate presses the second-shaped wafer against the supporting portion; the power assembly is also used to drive the driving slider to move backward so that the wedge-shaped portion and the roller are disengaged.

[0016] Furthermore, the robot execution component also includes a first elastic member corresponding to the pressure plate, which is respectively connected to the base and the corresponding pressure plate and is used to drive the pressure plate to rotate to release the second-form wafer after the wedge-shaped portion and the roller are disengaged.

[0017] A specific structure of the power assembly is further provided, wherein the power assembly includes a driving cylinder and at least one second elastic member;

[0018] The driving slider is provided with an abutment portion;

[0019] The driving cylinder is connected to the base, and the piston rod of the driving cylinder is used to abut against the rear end surface of the abutment portion. The driving cylinder is used to drive the abutment portion to drive the driving slider to move forward when extending.

[0020] One end of the second elastic member is connected to the base, and the other end of the second elastic member is connected to the driving slider. The second elastic member is used to drive the driving slider to move backward and reset when the driving cylinder retracts.

[0021] In order to further position the second-type wafer, the base is provided with a positioning portion for abutting against the outer periphery of the second-type wafer to position the second-type wafer.

[0022] A specific structure of the grabbing mechanism is further provided, wherein the grabbing mechanism grabs the first-shaped wafer by vacuum adsorption, and the grabbing mechanism includes an adsorption substrate;

[0023] The adsorption substrate is connected to the base, and the adsorption substrate is provided with a supporting portion for supporting the wafer of the first form;

[0024] At least one adsorption hole for connecting negative pressure to adsorb the first-shaped wafer onto the supporting piece is provided on the end surface of the supporting piece facing the first-shaped wafer.

[0025] In order to further position the first-shaped wafer, the adsorption substrate is provided with a limiting step portion located on one side of the supporting portion and used to abut against the side edge of the first-shaped wafer.

[0026] A specific structure of the adsorption substrate is further provided, wherein the adsorption substrate is further provided with a negative pressure flow channel and a negative pressure interface;

[0027] The adsorption hole is communicated with the negative pressure flow channel, the negative pressure flow channel is communicated with the negative pressure interface, and the negative pressure interface is used to directly or indirectly connect to a negative pressure source.

[0028] Furthermore, an avoidance groove is provided on the front end of the adsorption substrate;

[0029] The negative pressure flow channel includes a U-shaped channel and a connecting channel;

[0030] The U-shaped channel is arranged along the edge of the avoidance groove;

[0031] The front end of the connecting channel is in communication with the middle part of the U-shaped channel, and the rear end of the connecting channel is in communication with the negative pressure interface;

[0032] There are three adsorption holes, one end of the U-shaped channel is connected to the first adsorption hole, the other end of the U-shaped channel is connected to the second adsorption hole, and the connection between the U-shaped channel and the connecting channel is connected to the third adsorption hole.

[0033] After adopting the above technical solution, the first-form wafer can be grasped by the grasping mechanism, and the second-form wafer can be grasped by pressing the second-form wafer on the supporting part through the clamping mechanism, so that the grasping of the first-form wafer and the second-form wafer can be taken into account, and it is more convenient to use. Among them, the base can be directly or indirectly connected to an external manipulator. When the grasping mechanism grasps the first-form wafer, the manipulator can drive the base to move and then drive the grasped first-form wafer to move to achieve the transmission of the first-form wafer; when the clamping mechanism presses the second-form wafer on the supporting part, the manipulator can drive the base to move and then drive the clamped second-form wafer to move to achieve the transmission of the second-form wafer. Therefore, after the manipulator execution component of the embodiment of the present application is installed on the manipulator, the manipulator can transmit both the first-form wafer and the second-form wafer. The manipulator takes into account the transmission requirements of the first-form wafer and the second-form wafer, and improves the transmission capacity of the manipulator. In addition, compared with the prior art of using two robots to transfer first-form wafers and second-form wafers respectively, after installing the robot execution component of the embodiment of the present application, both types of wafers, namely, first-form wafers and second-form wafers, can be transferred by one robot, which can save manufacturing costs and improve equipment space utilization. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of the structure of the robot execution component of the utility model when grabbing a first-form wafer;

[0035] Figure 2 It is a schematic diagram of the structure of the robot execution component of the utility model when grabbing the second-form wafer;

[0036] Figure 3 It is a structural schematic diagram of the manipulator execution component of the utility model;

[0037] Figure 4 It is an exploded view of the assembly of the robot execution component of the utility model;

[0038] Figure 5 It is a cross-sectional view of the clamping mechanism of the utility model;

[0039] Figure 6 It is a structural schematic diagram of the adsorption substrate of the utility model. DETAILED DESCRIPTION

[0040] In order to make the content of the utility model more clearly understood, the utility model is further described in detail below based on specific embodiments and in conjunction with the accompanying drawings.

[0041] like Figures 1 to 6 As shown, a robot execution component includes a base 1, a pressing mechanism 100 and a sheet grabbing mechanism 200;

[0042] The grabbing mechanism 200 is connected to the base 1 and is used to grab the first-shaped wafer 300;

[0043] The base 1 is provided with a supporting portion 2 for abutting against at least a portion of the lower end surface of the second-form wafer 400;

[0044] The clamping mechanism 100 is connected to the base 1 and is used to move to clamp the upper end surface of the second-form wafer 400 to clamp the second-form wafer 400 on the supporting portion 2. Specifically, the first-form wafer 300 can be grasped by the grasping mechanism 200, and the second-form wafer 400 is clamped on the supporting portion 2 by the clamping mechanism 100 to grasp the second-form wafer 400, so that the grasping of the first-form wafer 300 and the second-form wafer 400 can be taken into account, and the use is more convenient. More specifically, the base 1 can be directly or indirectly connected to an external manipulator. When the grabbing mechanism 200 grabs the first-form wafer 300, the manipulator can drive the base 1 to move and then drive the grabbed first-form wafer 300 to move to achieve the transmission of the first-form wafer 300; when the clamping mechanism 100 presses the second-form wafer 400 on the supporting part 2, the manipulator can drive the base 1 to move and then drive the clamped second-form wafer 400 to move to achieve the transmission of the second-form wafer 400. Therefore, after the manipulator execution component of the embodiment of the present application is installed on the manipulator, the manipulator can not only transmit the first-form wafer 300, but also the second-form wafer 400. The manipulator takes into account the transmission requirements of the first-form wafer 300 and the second-form wafer 400, thereby improving the transmission capacity of the manipulator. In addition, compared with the prior art that uses two robots to respectively transfer the first form wafer 300 and the second form wafer 400, after installing the robot execution component of the embodiment of the present application, both types of wafers, the first form wafer 300 and the second form wafer 400, can be transferred by one robot, which can save manufacturing costs and improve equipment space utilization.

[0045] like Figures 1 to 5 As shown, the clamping mechanism 100 may include a driving mechanism and at least one pressing plate 3;

[0046] The pressing plate 3 is hinged on the base 1;

[0047] The driving mechanism is connected to the base 1 and to the pressing plate 3 and is used for driving the pressing plate 3 to rotate so that the pressing plate 3 presses the second-shaped wafer 400 onto the supporting portion 2 .

[0048] like Figures 1 to 5 As shown, the driving mechanism may include a driving slider 4, a power assembly and a roller 5 corresponding to the pressing plate 3;

[0049] The middle part of the pressing plate 3 is hinged on the base 1, the front end of the pressing plate 3 extends above the supporting part 2, and the roller 5 is rotatably connected to the rear end of the pressing plate 3;

[0050] The driving slider 4 is slidably connected to the base 1 along the front-rear direction, and a wedge-shaped portion 6 corresponding to the roller 5 is provided on the driving slider 4, and the wedge-shaped portion 6 is used to abut against the corresponding roller 5;

[0051] The power assembly is connected to the base 1 and to the driving slider 4, and the power assembly is used to drive the driving slider 4 to move forward so that the wedge-shaped portion 6 presses against the roller 5 and drives the roller 5 to move upward, thereby driving the pressure plate 3 to rotate so that the front end of the pressure plate 3 presses the second-form wafer 400 against the supporting portion 2; the power assembly is also used to drive the driving slider 4 to move backward so that the wedge-shaped portion 6 and the roller 5 are disengaged, thereby causing the pressure plate 3 to release the second-form wafer 400.

[0052] like Figures 1 to 5 As shown, the robot execution component may also include a first elastic member 7 corresponding to the pressure plate 3, the first elastic member 7 is respectively connected to the base 1 and the corresponding pressure plate 3 and is used to drive the pressure plate 3 to rotate after the wedge portion 6 and the roller 5 are disengaged to release the second-form wafer 400; in this embodiment, the first elastic member 7 is compressed and installed between the base 1 and the corresponding pressure plate 3.

[0053] like Figures 1 to 6 As shown, the power assembly may include a driving cylinder 8 and at least one second elastic member 9;

[0054] The driving slider 4 is provided with an abutment portion 10;

[0055] The driving cylinder 8 is connected to the base 1, and the piston rod of the driving cylinder 8 is used to abut against the rear end surface of the abutment portion 10. The driving cylinder 8 is used to drive the abutment portion 10 to drive the driving slider 4 to move forward when extending.

[0056] One end of the second elastic member 9 is connected to the base 1, and the other end of the second elastic member 9 is connected to the driving slider 4. The second elastic member 9 is used to drive the driving slider 4 to move backward and reset when the driving cylinder 8 is retracted. Specifically, when the driving cylinder 8 is extended, the piston rod of the driving cylinder 8 abuts against the rear end surface of the abutting portion 10 and drives the abutting portion 10 to move forward, thereby driving the driving slider 4 to slide forward, thereby causing the wedge-shaped portion 6 on the driving slider 4 to abut against the roller 5 and drive the roller 5 to move upward, thereby driving the pressing plate 3 to rotate so that the front end of the pressing plate 3 presses the second-form wafer 400 against the supporting portion 2, thereby achieving the grasping of the second-form wafer 400. More specifically, when the driving cylinder 8 retracts, the piston rod of the driving cylinder 8 disengages from the abutment portion 10. At this time, the second elastic member 9 drives the driving slider 4 to move backward and reset, thereby causing the wedge-shaped portion 6 to disengage from the abutment with the roller 5. At this time, the first elastic member 7 drives the pressure plate 3 to rotate through elastic force to release the second-form wafer 400.

[0057] In this embodiment, the driving cylinder 8 is connected to the base 1 via a bracket 11, the second elastic member 9 and the base 1 as well as the second elastic member 9 and the driving slider 4 are connected via a connecting column 12, and the driving cylinder 8 can be a needle-type cylinder.

[0058] Specifically, in some embodiments, the power assembly may also be a telescopic cylinder, which is connected to the base 1, and whose piston rod is fixedly connected to the driving slider 4, and the telescopic cylinder can drive the driving slider 4 to move forward and backward. Of course, in other embodiments, an electric push rod, an electric cylinder, or a linear module may be used instead of the telescopic cylinder.

[0059] Specifically, in this embodiment, two pressing plates 3 are provided, and two supporting parts 2 are also provided and correspond one-to-one with the pressing plates 3. The pressing plates 3 are used to press the second-form wafer 400 onto the corresponding supporting parts 2. In this embodiment, the rollers 5 correspond one-to-one with the pressing plates 3, the wedge-shaped parts 6 correspond one-to-one with the rollers 5, the first elastic members 7 correspond one-to-one with the pressing plates 3, and two second elastic members 9 may be provided, and both the first elastic members 7 and the second elastic members 9 may be springs.

[0060] More specifically, the base 1 is provided with a front limit portion 13 and a rear limit portion 14 for limiting the travel of the driving slider 4. When the driving slider 4 moves forward to the limit position, the front limit portion 13 abuts against the front end of the driving slider 4, and when the driving slider 4 moves backward to the limit position, the rear limit portion 14 abuts against the rear end of the driving slider 4. The base 1 is provided with a slide groove 15, and the driving slider 4 is slidably connected in the slide groove 15. Of course, in some embodiments, the driving slider 4 can also be slidably connected to the base 1 through a linear guide rail, and the linear guide rail can be a cross roller guide rail.

[0061] like Figures 1 to 5 As shown, the base 1 is provided with a positioning portion 16 for abutting against the outer periphery of the second-form wafer 400 to position the second-form wafer 400; specifically, the second-form wafer 400 is in a state where a blue film 17 is attached to the surface of the first-form wafer 300 and the outer periphery of the blue film 17 is connected to a patch ring 18, the patch ring 18 is used to tension the blue film 17, the pressing plate 3 in the clamping mechanism 100 is used to press the patch ring 18 in the second-form wafer 400 onto the supporting portion 2, the positioning portion 16 is located on one side of the supporting portion 2, and the positioning portion 16 is used to abut against the outer periphery of the patch ring 18 to play a positioning role. Among them, the specific structures of the first-form wafer 300 and the second-form wafer 400 are both prior arts well known to those skilled in the art, and will not be described in detail in this embodiment.

[0062] like Figure 1 , 3 As shown in , 4 and 6, the grabbing mechanism 200 can grab the first-shaped wafer 300 by vacuum adsorption, and the grabbing mechanism 200 can include an adsorption substrate 19;

[0063] The adsorption substrate 19 is connected to the base 1 , and the adsorption substrate 19 is provided with a supporting portion 20 for supporting the first-shaped wafer 300 ;

[0064] At least one adsorption hole 21 is provided on the end surface of the supporting portion 20 facing the first-form wafer 300, which is used to connect negative pressure so as to adsorb the first-form wafer 300 on the supporting portion 20 through the negative pressure; specifically, after the supporting portion 20 supports the first-form wafer 300, the negative pressure in the adsorption hole 21 sucks the first-form wafer 300 tightly, thereby achieving the grasping of the first-form wafer 300.

[0065] like Figure 1 , 3As shown in FIGS. 4 and 6 , the adsorption substrate 19 may be provided with a limiting step portion 22 which is located on one side of the supporting portion 20 and is used to abut against the side edge of the first-form wafer 300 so as to position the first-form wafer 300 through the limiting step portion 22 ; specifically, a corner clearing groove 23 is provided between the limiting step portion 22 and the supporting portion 20 .

[0066] like Figure 6 As shown, the adsorption substrate 19 is also provided with a negative pressure channel 24 and a negative pressure interface 25;

[0067] The adsorption hole 21 is connected to the negative pressure channel 24, and the negative pressure channel 24 is connected to the negative pressure interface 25. The negative pressure interface 25 is used to directly or indirectly connect to a negative pressure source so as to transmit the negative pressure suction force to the adsorption hole 21 through the negative pressure interface 25 and the negative pressure channel 24.

[0068] like Figure 6 As shown, a avoidance groove 26 is provided on the front end of the adsorption substrate 19;

[0069] The negative pressure channel 24 may include a U-shaped channel 27 and a connecting channel 28;

[0070] The U-shaped channel 27 is arranged along the edge of the avoidance groove 26;

[0071] The front end of the connecting channel 28 is connected to the middle part of the U-shaped channel 27, and the rear end of the connecting channel 28 is connected to the negative pressure interface 25;

[0072] There are three adsorption holes 21 , one end of the U-shaped channel 27 is connected to the first adsorption hole 21 , the other end of the U-shaped channel 27 is connected to the second adsorption hole 21 , and the connection between the U-shaped channel 27 and the connecting channel 28 is connected to the third adsorption hole 21 .

[0073] In summary, the first-form wafer 300 can be grasped by the grasping mechanism 200, and the second-form wafer 400 is pressed on the supporting part 2 by the pressing mechanism 100 to realize the grasping of the second-form wafer 400, so that the grasping of the first-form wafer 300 and the second-form wafer 400 can be taken into account, and it is more convenient to use. Among them, the base 1 can be directly or indirectly connected to an external manipulator. When the grasping mechanism 200 grasps the first-form wafer 300, the manipulator can drive the base 1 to move and then drive the grasped first-form wafer 300 to move to realize the transmission of the first-form wafer 300; when the pressing mechanism 100 presses the second-form wafer 400 on the supporting part 2, the manipulator can drive the base 1 to move and then drive the pressed second-form wafer 400 to move to realize the transmission of the second-form wafer 400. Therefore, after the robot execution component of the embodiment of the present application is installed on the robot, the robot can transmit both the first-form wafer 300 and the second-form wafer 400. The robot takes into account the transmission requirements of the first-form wafer 300 and the second-form wafer 400, and improves the transmission capacity of the robot. In addition, compared with the prior art that uses two robots to transmit the first-form wafer 300 and the second-form wafer 400 respectively, after the robot execution component of the embodiment of the present application is installed, the first-form wafer 300 and the second-form wafer 400 can be transmitted by one robot, which can save manufacturing costs and improve equipment space utilization.

[0074] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A robot execution component, characterized in that: It comprises a base (1), a pressing mechanism (100) and a sheet grabbing mechanism (200); The gripping mechanism (200) is connected to the base (1) and is used to grip a wafer (300) of a first form; The base (1) is provided with a supporting portion (2) for abutting against at least a portion of the lower end surface of the second-form wafer (400); The pressing mechanism (100) is connected to the base (1) and is used to move to press the upper end surface of the second-form wafer (400) so as to press the second-form wafer (400) onto the supporting portion (2).

2. The robot actuator according to claim 1, characterized in that: The pressing mechanism (100) comprises a driving mechanism and at least one pressing plate (3); The pressing plate (3) is hinged on the base (1); The driving mechanism is connected to the base (1) and to the pressing plate (3) and is used to drive the pressing plate (3) to rotate so that the pressing plate (3) presses the second-shaped wafer (400) onto the supporting portion (2).

3. The robot actuator according to claim 2, characterized in that: The driving mechanism comprises a driving slider (4), a power assembly and a roller (5) corresponding to the pressing plate (3); The middle part of the pressing plate (3) is hinged on the base (1), the front end of the pressing plate (3) extends above the supporting part (2), and the roller (5) is rotatably connected to the rear end of the pressing plate (3); The driving slider (4) is slidably connected to the base (1) along the front-rear direction, and a wedge-shaped portion (6) corresponding to the roller (5) is provided on the driving slider (4), and the wedge-shaped portion (6) is used to abut against the corresponding roller (5); The power assembly is connected to the base (1) and connected to the driving slider (4), and the power assembly is used to drive the driving slider (4) to move forward so that the wedge-shaped portion (6) abuts against the roller (5) and drives the roller (5) to move upward, thereby driving the pressure plate (3) to rotate so that the front end of the pressure plate (3) presses the second-form wafer (400) against the supporting portion (2); the power assembly is also used to drive the driving slider (4) to move backward so that the wedge-shaped portion (6) and the roller (5) are separated.

4. The robot actuator according to claim 3, characterized in that: It also includes a first elastic member (7) corresponding to the pressure plate (3), wherein the first elastic member (7) is respectively connected to the base (1) and the corresponding pressure plate (3) and is used to drive the pressure plate (3) to rotate after the wedge-shaped portion (6) and the roller (5) are disengaged to release the second-shaped wafer (400).

5. The robot actuator according to claim 3, characterized in that: The power assembly comprises a driving cylinder (8) and at least one second elastic member (9); The driving slider (4) is provided with an abutment portion (10); The driving cylinder (8) is connected to the base (1); the piston rod of the driving cylinder (8) is used to abut against the rear end surface of the abutting portion (10); the driving cylinder (8) is used to drive the abutting portion (10) to drive the driving slider (4) to move forward when extending; One end of the second elastic member (9) is connected to the base (1), and the other end of the second elastic member (9) is connected to the driving slider (4). The second elastic member (9) is used to drive the driving slider (4) to move backward and reset when the driving cylinder (8) retracts.

6. The robot actuator according to claim 1, characterized in that: The base (1) is provided with a positioning portion (16) for abutting against the outer periphery of the second-shaped wafer (400) to position the second-shaped wafer (400).

7. The robot actuator according to claim 1, characterized in that: The grabbing mechanism (200) grabs the first-shaped wafer (300) by vacuum adsorption, and the grabbing mechanism (200) comprises an adsorption substrate (19); The adsorption substrate (19) is connected to the base (1), and the adsorption substrate (19) is provided with a supporting portion (20) for supporting the first-shaped wafer (300); At least one adsorption hole (21) for connecting negative pressure to adsorb the first-shaped wafer (300) onto the supporting plate (20) is provided on the end surface of the supporting plate (20) facing the first-shaped wafer (300).

8. The robot actuator according to claim 7, characterized in that: The adsorption substrate (19) is provided with a limiting step portion (22) located on one side of the supporting portion (20) and used to abut against the side edge of the first-shaped wafer (300).

9. The robot actuator according to claim 7, characterized in that: The adsorption substrate (19) is also provided with a negative pressure flow channel (24) and a negative pressure interface (25); The adsorption hole (21) is in communication with the negative pressure channel (24), the negative pressure channel (24) is in communication with the negative pressure interface (25), and the negative pressure interface (25) is used to directly or indirectly connect to a negative pressure source.

10. The robot actuator according to claim 9, characterized in that: An avoidance groove (26) is provided on the front end portion of the adsorption substrate (19); The negative pressure flow channel (24) comprises a U-shaped channel (27) and a connecting channel (28); The U-shaped channel (27) is arranged along the edge of the avoidance groove (26); The front end of the connecting channel (28) is in communication with the middle portion of the U-shaped channel (27), and the rear end of the connecting channel (28) is in communication with the negative pressure interface (25); Three adsorption holes (21) are provided, one end of the U-shaped channel (27) is connected to the first adsorption hole (21), the other end of the U-shaped channel (27) is connected to the second adsorption hole (21), and the connection point between the U-shaped channel (27) and the connecting channel (28) is connected to the third adsorption hole (21).

Images