TO tube socket for high-power laser

Abstract

The utility model discloses a TO tube socket for a high-power laser, which relates to the technical field of semiconductors, and comprises a bottom plate, a metal radiating element, a sealing part and a lead, the metal radiating element is fixed on the bottom plate, the bottom plate is provided with a through hole for the lead to pass through, the sealing part is sleeved on the periphery of the lead, and the sealing part is fixed in the through hole. The LED lamp is fast in heat dissipation, good in heat dissipation effect, small in size and easy to package.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a TO tube socket used for high-power lasers. Background Art

[0002] Semiconductor devices generate a lot of heat when working. If the heat cannot be dissipated in time, the temperature of the semiconductor device will be too high, which not only causes inconvenience in use, but also affects the performance and life of the semiconductor device, and limits the further improvement of performance. Therefore, in the design of semiconductor devices, a heat dissipation part is usually designed to ensure the stable operation of the device.

[0003] In the prior art, various heat sinks are made of materials with good thermal conductivity (such as oxygen-free copper materials) to freely dissipate heat in still air. Although they are easy to use, they have slow heat dissipation, insufficient heat dissipation, cannot meet heat dissipation requirements, and are too large. Utility Model Content

[0004] The utility model aims to provide a TO tube holder for high-power lasers to solve the problems existing in the prior art, with fast heat dissipation, good heat dissipation effect, small size and easy packaging.

[0005] To achieve the above purpose, the utility model provides the following solutions:

[0006] The utility model provides a TO tube holder for a high-power laser, comprising a base plate, a metal heat dissipation element, a sealing portion and a lead wire, wherein the metal heat dissipation element is fixed on the base plate, and a through hole is provided on the base plate for the lead wire to pass through, the sealing portion is sleeved on the outer periphery of the lead wire, and the sealing portion is fixed in the through hole.

[0007] Preferably, the metal heat dissipation element comprises a metal block, a groove is formed on one side of the base plate, the groove is located above the through hole, one end of the metal block is fixed in the groove, and the other end of the metal block extends away from the base plate.

[0008] Preferably, the cross section of the groove is semicircular, and the cross section of the metal block is semicircular.

[0009] Preferably, the metal block is fixed in the groove by silver brazing.

[0010] Preferably, the metal heat dissipation element further comprises a metal base, the metal base is fixed to a side of the bottom plate opposite to the groove, and a hole for the lead to pass through is also provided at a position of the metal base corresponding to the through hole.

[0011] Preferably, the metal substrate is fixed to one side of the bottom plate by silver brazing, and the metal substrate has the same shape as the bottom plate.

[0012] Preferably, the sealing portion is sealed in the through hole by high-temperature sintering.

[0013] Compared with the prior art, the utility model has achieved the following technical effects:

[0014] The utility model provides a TO tube holder for high-power lasers, wherein the metal heat dissipation element is fixed on the bottom plate, and the semiconductor device is dissipated by the metal heat dissipation element, and the heat dissipation block increases the overall heat dissipation area and improves the heat dissipation effect. The bottom plate is provided with a through hole for the lead to pass through, and the sealing part is sleeved on the outer periphery of the lead, and the sealing part is fixed in the through hole, and the overall air tightness is improved by the sealing part. Through the above arrangement, the problems of slow heat dissipation and insufficient heat dissipation are solved, and the metal heat dissipation element is directly fixed on the TO tube holder for high-power lasers, and the overall volume is small, does not affect the packaging, and is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0016] Figure 1 A front view of a TO tube holder for a high-power laser provided in Example 1;

[0017] Figure 2 for Figure 1 Full section left view;

[0018] Figure 3 for Figure 1 A full cross-sectional bottom view of

[0019] Figure 4 A front view of a TO tube holder for a high-power laser provided in Example 2;

[0020] Figure 5 for Figure 4 Full section left view;

[0021] Figure 6 for Figure 4 A full cross-sectional bottom view of

[0022] In the figure: 1-base plate, 2-metal block, 3-metal base, 4-sealing part, 5-lead. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] The utility model aims to provide a TO tube holder for high-power lasers to solve the problems existing in the prior art, with fast heat dissipation, good heat dissipation effect, small size and easy packaging.

[0025] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] Embodiment 1

[0027] like Figure 1-Figure 3 As shown, this embodiment provides a TO tube holder for high-power lasers, including a base plate 1, a metal heat dissipation element, a sealing part 4 and a lead 5. The metal heat dissipation element is fixed on the base plate 1, and the semiconductor device is dissipated by the metal heat dissipation element, and the heat dissipation block increases the overall heat dissipation area and improves the heat dissipation effect. The base plate 1 is provided with a through hole for the lead 5 to pass through, and the sealing part 4 is sleeved on the outer periphery of the lead 5. The sealing part 4 is fixed in the through hole, and the overall airtightness is improved by the sealing part 4. Through the above arrangement, the problems of slow heat dissipation and insufficient heat dissipation are solved, and the metal heat dissipation element is directly fixed on the TO tube holder for high-power lasers, the overall volume is small, does not affect the packaging, and is easy to use.

[0028] Specifically, the metal heat dissipation element includes a metal block 2. A groove is provided on one side of the base plate 1, and the groove is located above the through hole. One end of the metal block 2 is fixed in the groove, and the other end of the metal block 2 extends away from the base plate 1. The metal block 2 is fixed in the groove by silver brazing, which improves the connection stability between the metal block 2 and the base plate 1, thereby helping to achieve better heat dissipation effect.

[0029] The cross section of the groove is semicircular, and the cross section of the metal block 2 is semicircular. While achieving stable fixation of the metal block 2, the metal block 2 is set away from the lead 5 to avoid affecting the overall package and to a certain extent avoid being too large in size.

[0030] The sealing part 4 is sealed in the through hole by high-temperature sintering, and the sealing and fixing connection mode can improve the overall airtightness.

[0031] Embodiment 2

[0032] like Figure 4-Figure 6As shown, this embodiment provides a TO tube holder for a high-power laser. The difference between this embodiment and the first embodiment is that the metal heat dissipation element also includes a metal base 3, and the metal base 3 is fixed on the side of the bottom plate 1 opposite to the groove, so as to increase the heat dissipation area and improve the heat dissipation effect. A hole for the lead 5 to pass through is also provided at the position corresponding to the through hole on the metal base 3, so as to avoid affecting the connection of the lead 5.

[0033] Specifically, the metal substrate 3 is fixed to one side of the base plate 1 by silver brazing, and the metal substrate 3 is consistent in shape with the base plate 1, so that the heat can be dissipated on the back side of the base plate 1, and the heat dissipation effect is good.

[0034] Embodiment 3

[0035] This embodiment provides a method for manufacturing a TO tube socket for a high-power laser in Embodiment 1, comprising the following steps:

[0036] S1. A groove and a through hole are opened on the bottom plate 1, and the shape of the groove is consistent with the shape of the metal block 2, thereby facilitating the fixing of the metal block 2;

[0037] S2. The metal block 2 is embedded in the groove and fixed by silver brazing. The use of silver brazing can improve the connection stability;

[0038] S3. The sealing part 4 is sleeved on the outer periphery of the lead 5, and the lead 5 passes through the through hole, and the sealing part 4 is located in the through hole. The sealing part 4 is sealed by high-temperature sintering, and then the lead 5 is fixed in the through hole. At the same time, the sealing and fixing can improve the airtightness.

[0039] Embodiment 4

[0040] This embodiment provides a method for manufacturing a TO tube socket for a high-power laser in the second embodiment. The difference between this embodiment and the third embodiment is that S2 also includes: fixing the metal substrate 3 to the side of the bottom plate 1 opposite to the groove by silver brazing, using the metal substrate 3 and the metal block 2 to jointly dissipate heat, thereby increasing the heat dissipation area and thus improving the heat dissipation efficiency.

[0041] The utility model uses specific examples to illustrate the principle and implementation of the utility model. The above examples are only used to help understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, according to the idea of ​​the utility model, there will be changes in the specific implementation and application scope. In summary, the content of this specification should not be understood as limiting the utility model.

Claims

1. A TO tube holder for high-power lasers, characterized in that: It includes a base plate, a metal heat dissipation element, a sealing part and a lead. The metal heat dissipation element is fixed on the base plate, and the base plate is provided with a through hole for the lead to pass through. The sealing part is sleeved on the outer periphery of the lead and fixed in the through hole.

2. The TO tube holder for high-power laser according to claim 1, characterized in that: The metal heat dissipation element comprises a metal block. A groove is formed on one side of the base plate. The groove is located above the through hole. One end of the metal block is fixed in the groove, and the other end of the metal block extends away from the base plate.

3. The TO tube holder for high-power laser according to claim 2, characterized in that: The cross section of the groove is semicircular, and the cross section of the metal block is semicircular.

4. The TO tube holder for high-power laser according to claim 2, characterized in that: The metal block is fixed in the groove by silver brazing.

5. The TO tube holder for high-power laser according to claim 2, characterized in that: The metal heat dissipation element further comprises a metal base, which is fixed on a side of the bottom plate opposite to the groove, and a hole for the lead to pass through is also provided at a position corresponding to the through hole on the metal base.

6. The TO tube holder for high-power laser according to claim 5, characterized in that: The metal substrate is fixed to one side of the bottom plate by silver brazing, and the metal substrate has the same shape as the bottom plate.

7. The TO tube holder for high-power laser according to claim 1, characterized in that: The sealing portion is sealed in the through hole by high-temperature sintering.

Images