Multi-channel LoRa communication gateway

Abstract

The utility model relates to the technical field of communication gateways, and specifically discloses a multichannel Lora communication gateway comprising a gateway lower housing, the bottom of the gateway lower housing is fixedly connected with a placing plate, two sides of the back surface of the placing plate are provided with plugging holes, the inner walls of the two plugging holes are plugged with lap joint plates, and the lap joint plates are connected with the bottom of the gateway lower housing. A heat dissipation baffle is fixedly connected to one side of the back face of the lap joint plate, a plurality of sets of heat dissipation holes are formed in one side of the surface of the heat dissipation baffle, and a plurality of fixing bolts are in threaded connection with the top of the back face of the heat dissipation baffle. According to the utility model, through the arrangement of the placing plate, the heat dissipation baffle plate and the fixing bolts, during use, the gateway main body is conveniently placed on a platform through the placing plate, heat dissipation of the back surface of the gateway main body is facilitated through the heat dissipation holes of the heat dissipation baffle plate, and the lap joint plate is installed on a wall surface through the fixing bolts at the top of the heat dissipation baffle plate. Therefore, the placing plate can be conveniently pulled out of or sleeved with the surface of the lapping plate, so that the effect of conveniently placing, disassembling and assembling the gateway main body is achieved.

Description

Technical Field

[0001] The utility model belongs to the technical field of communication gateways, and specifically relates to a multi-channel LoRa communication gateway. Background Art

[0002] LoRa is a long-distance radio. Its biggest feature is that it can transmit farther than other wireless methods under the same power consumption conditions, achieving the unity of low power consumption and long distance. It can extend the communication distance by three to five times that of traditional wireless radio frequency under the same power consumption, and the existing LoRa communication gateway has multi-channel use to provide multi-functional use.

[0003] Existing multi-channel LoRa communication gateways are mostly placed on a platform when in use, which makes it difficult to easily install on the wall. In addition, the LoRa communication gateway installed on the wall is difficult to easily remove, making the installation of the device relatively simple and inconvenient, so it needs to be improved by staff. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-channel LoRa communication gateway to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A multi-channel LoRa communication gateway, comprising:

[0007] Gateway lower housing;

[0008] A placement plate is fixedly connected to the bottom of the lower shell of the gateway, and plug holes are provided on both sides of the back of the placement plate, and the inner walls of the two plug holes are plugged with lap plates;

[0009] A heat dissipation baffle is fixedly connected to one side of the back side of the lap plate, a plurality of heat dissipation holes are provided on one side of the surface of the heat dissipation baffle, and a plurality of fixing bolts are threadedly connected to the top of the back side of the heat dissipation baffle.

[0010] Preferably, a socket box is fixedly connected to the bottom of one side of the lower shell of the gateway, a damping rotating rod is rotatably connected to the middle of the inner wall of the socket box, a connecting wire is wrapped around the surface of the damping rotating rod, and a front end of the connecting wire is fixedly connected to a side of the socket box close to the lower shell of the gateway, and a tail end of the connecting wire is plugged into the outside of the socket box.

[0011] Preferably, the top of the gateway lower shell is fixedly connected to the gateway upper shell, and the inner bottom wall of the gateway lower shell is fixedly connected to the mainboard.

[0012] Preferably, an indicator light board is fixedly connected to the top of the main board, and the top of the indicator light board is overlapped with the inner top wall of the gateway upper shell, and an NFC interface is fixedly connected to one side of the top of the gateway upper shell.

[0013] Preferably, a CPU module is provided on one side of the top of the mainboard, a storage module is electrically connected to the other side of the top of the mainboard, and an RS interface module, a ROLA interface module, a CAN interface module, and a network port module are provided on the top of the mainboard.

[0014] Preferably, the CPU module adopts a NUC chip, the storage module adopts a WNGVZEIG flash memory chip, and the RS interface module adopts a SITESA chip.

[0015] Preferably, the NFC interface uses a FMNTC chip.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] (1) By setting the placement plate, the plug hole, the overlap plate, the heat dissipation baffle and the fixing bolts, when in use, the gateway body can be placed on the platform by the placement plate, and the heat dissipation holes of the heat dissipation baffle can be used to dissipate heat from the back of the gateway body. The overlap plate is installed on the wall at the top of the heat dissipation baffle by the fixing bolts, so that the placement plate can be easily pulled out or sleeved from the surface of the overlap plate, thereby achieving the effect of convenient placement and disassembly of the gateway body and facilitating the operation of the staff.

[0018] (2) By setting up the socket box, the damping rotating rod and the connecting wire, the connecting wire is wound around the damping rotating rod, so that the connecting wire can drive the damping rotating rod to rotate and stretch, thereby extending the length of the connecting wire, and the front end of the connecting wire is fixed to the inside of the lower shell of the gateway and the shell, thereby preventing the front end of the connecting wire from being disconnected from the main board, thereby achieving the effect of extending the line of the connecting wire of the gateway body and facilitating mechanical contraction. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a disassembled stereogram of the utility model;

[0020] Figure 2 It is a three-dimensional diagram of the utility model;

[0021] Figure 3 It is a three-dimensional diagram of the damping rotating rod of the utility model;

[0022] Figure 4 It is a three-dimensional diagram of the lap plate of the utility model;

[0023] In the figure: 1. Gateway lower shell; 2. Placement plate; 3. Plug hole; 4. Lap plate; 5. Heat dissipation baffle; 6. Fixing bolts; 7. Socket box; 8. Damping rod; 9. Connecting wires; 10. Gateway upper shell; 11. Mainboard; 12. Indicator light board; 13. NFC interface. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] Embodiment 1:

[0026] See also Figures 1 to 4 As shown, a multi-channel LoRa communication gateway includes:

[0027] Gateway lower housing 1;

[0028] A placement plate 2 is fixedly connected to the bottom of the gateway lower shell 1, and the gateway body is conveniently placed on the platform through the placement plate 2. Both sides of the back of the placement plate 2 are provided with plug-in holes 3, and the inner walls of the two plug-in holes 3 are plugged with lap plates 4, so that the placement plate 2 can be easily pulled out or sleeved from the surface of the lap plate 4;

[0029] A heat dissipation baffle 5 is fixedly connected to one side of the back of the lap plate 4. The heat dissipation holes of the heat dissipation baffle 5 are used to facilitate heat dissipation on the back of the gateway body. Multiple groups of heat dissipation holes are opened on one side of the surface of the heat dissipation baffle 5. Multiple fixing bolts 6 are threadedly connected to the top of the back of the heat dissipation baffle 5. The lap plate 4 is installed on the wall at the top of the heat dissipation baffle 5 through the fixing bolts 6.

[0030] A socket box 7 is fixedly connected to the bottom of one side of the lower shell 1 of the gateway, and a damping rotating rod 8 is rotatably connected to the middle of the inner wall of the socket box 7. The connecting wire 9 is wound around the damping rotating rod 8, and the surface of the damping rotating rod 8 is wound around the connecting wire 9. The connecting wire 9 can drive the damping rotating rod 8 to rotate and stretch, which can extend the length of the connecting wire 9, and the front end of the connecting wire 9 is fixedly connected to the side of the socket box 7 close to the lower shell 1 of the gateway, which can prevent the front end of the connecting wire 9 from being disconnected from the mainboard 11, and the tail end of the connecting wire 9 is plugged into the outside of the socket box 7.

[0031] The top of the gateway lower shell 1 is fixedly connected to the gateway upper shell 10, the inner bottom wall of the gateway lower shell 1 is fixedly connected to the mainboard 11, the top of the mainboard 11 is fixedly connected to the indicator light board 12, and the top of the indicator light board 12 is overlapped on the inner top wall of the gateway upper shell 10, one side of the top of the gateway upper shell 10 is fixedly connected to the NFC interface 13, a CPU module is provided on one side of the top of the mainboard 11, and a storage module is electrically connected to the other side of the top of the mainboard 11, and an RS485 interface module, a ROLA interface module, a CAN interface module, and a network port module are provided on the top of the mainboard 11. The CPU module adopts the NUC980 chip, the storage module adopts the W25N01GVZEIG flash memory chip, the RS485 interface module adopts the SIT3485ESA chip, and the NFC interface 13 adopts the FM11NT082C chip.

[0032] Working principle: The placing plate 2 is used to facilitate placing the gateway body on the platform, and plug holes 3 are provided on both sides of the back of the placing plate 2, and the inner walls of the plug holes 3 are plugged with lap plates 4. The heat dissipation holes of the heat dissipation baffle 5 are used to facilitate heat dissipation on the back of the gateway body, and the lap plate 4 is installed on the wall through the fixing bolts 6 on the top of the heat dissipation baffle 5, thereby making it convenient to pull out or sleeve the placing plate 2 from the surface of the lap plate 4, and wrap the connecting wire 9 through the damping rotating rod 8, thereby the connecting wire 9 can drive the damping rotating rod 8 to rotate and stretch, and the length of the connecting wire 9 can be extended, and the front end of the connecting wire 9 is fixed to the inside and the shell of the gateway lower shell 1, thereby preventing the front end of the connecting wire 9 from being disconnected from the mainboard 11.

[0033] The standard parts used in this utility model can be purchased from the market, and the special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt the conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here. The contents not described in detail in this specification belong to the prior art known to professional and technical personnel in this field.

[0034] In the description of the present utility model, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. The meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0038] In the drawings of the embodiments disclosed in the present utility model, only the structures related to the embodiments disclosed in the present utility model are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present utility model can be combined with each other.

[0039] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A multi-channel LoRa communication gateway, characterized in that: include: Gateway lower housing (1); A placement plate (2) is fixedly connected to the bottom of the gateway lower shell (1), plug holes (3) are provided on both sides of the back of the placement plate (2), and the inner walls of the two plug holes (3) are plugged with lap plates (4); A heat dissipation baffle (5) is fixedly connected to one side of the back side of the lap plate (4), a plurality of heat dissipation holes are provided on one side of the surface of the heat dissipation baffle (5), and a plurality of fixing bolts (6) are threadedly connected to the top of the back side of the heat dissipation baffle (5).

2. A multi-channel LoRa communication gateway according to claim 1, characterized in that: A socket box (7) is fixedly connected to the bottom of one side of the lower shell (1) of the gateway, a damping rotating rod (8) is rotatably connected to the middle of the inner wall of the socket box (7), a connecting wire (9) is wound around the surface of the damping rotating rod (8), and the front end of the connecting wire (9) is fixedly connected to a side of the socket box (7) close to the lower shell (1) of the gateway, and the rear end of the connecting wire (9) is plugged into the outer side of the socket box (7).

3. A multi-channel LoRa communication gateway according to claim 1, characterized in that: The top of the gateway lower shell (1) is fixedly connected to the gateway upper shell (10), and the inner bottom wall of the gateway lower shell (1) is fixedly connected to the mainboard (11).

4. A multi-channel LoRa communication gateway according to claim 3, characterized in that: An indicator light board (12) is fixedly connected to the top of the main board (11), and the top of the indicator light board (12) is overlapped with the inner top wall of the gateway upper shell (10), and an NFC interface (13) is fixedly connected to one side of the top of the gateway upper shell (10).

5. A multi-channel LoRa communication gateway according to claim 3, characterized in that: A CPU module is arranged on one side of the top of the main board (11), a storage module is electrically connected to the other side of the top of the main board (11), and an RS485 interface module, a ROLA interface module, a CAN interface module, and a network port module are arranged on the top of the main board (11).

6. A multi-channel LoRa communication gateway according to claim 5, characterized in that: The CPU module adopts NUC980 chip, the storage module adopts W25N01 GVZEIG flash memory chip, and the RS485 interface module adopts SIT3485ESA chip.

7. A multi-channel LoRa communication gateway according to claim 4, characterized in that: The NFC interface (13) uses an FM11 NT082C chip.

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