Multilayer impedance plate controlled by characteristic impedance

Abstract

The utility model is applicable to the field of impedance plates, and provides a characteristic impedance controlled multilayer impedance plate, which comprises an impedance plate main body and a mounting hole arranged on the impedance plate main body, and a support sleeve is arranged on the lower surface of the impedance plate main body at the mounting hole. According to the impedance plate, the supporting sleeve and the buffering assembly are used for supporting and lifting the impedance plate body, so that a gap exists below the impedance plate body after the impedance plate body is installed, the impedance plate can rapidly dissipate heat during use, the buffering assembly plays a buffering role and is used in cooperation with the protection assembly, and when the impedance plate body is installed through screws, the protection assembly can be used for protecting the impedance plate body. According to the impedance plate, the protection sleeve is arranged on the impedance plate body, the buffering protection effect can be achieved, irreversible damage to the impedance plate body caused by too large force is prevented, the installation stability of the impedance plate body can be guaranteed, the integrity of the impedance plate body is guaranteed, the protection sleeve and the supporting sleeve are integrally arranged, it can be guaranteed that the impedance plate cannot fall off during protection, and the use stability is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the field of impedance plates, and in particular relates to a multi-layer impedance plate with controlled characteristic impedance. Background Art

[0002] Impedance board is a type of circuit board, also called multi-layer impedance board, which is characterized by the precise control of the characteristic impedance of the printed circuit board by designing its stacked structure. This structure makes the routing of the impedance board form an easily controllable and predictable transmission line structure.

[0003] The existing patent number is: CN217336003U, which discloses "A multi-layer impedance board that is easy to dissipate heat". In this patent, by setting up connecting heat-conducting strips and detachable heat sinks, the heat dissipation effect of the multi-layer impedance board can be improved, so that the multi-layer impedance board is not easy to generate heat accumulation, and finally the service life of the multi-layer impedance board is improved. However, in the above patent, no protective structure is set at the corners of the impedance board, and the corners of the impedance board cannot be effectively protected. At the same time, the impedance board is installed in a conventional installation method of screw fixing. During the installation process, if too much force is applied, the screws will damage the impedance board, and in severe cases, the impedance board will be broken and cannot be used. Utility Model Content

[0004] The embodiment of the utility model provides a multilayer impedance board with characteristic impedance control, aiming to solve the problem that when one or more harness bodies of the existing automobile harness are damaged, the entire harness body and the wiring terminals at both ends need to be replaced, resulting in excessively high maintenance costs.

[0005] An embodiment of the utility model provides a multilayer impedance board with characteristic impedance control, which includes an impedance board main body and a mounting hole opened on the impedance board main body, a support sleeve is provided on the lower surface of the impedance board main body at the mounting hole, and a buffer component is connected to the lower end of the support sleeve, a protective component is provided in the mounting hole on the impedance board main body, and the protective component is connected to the support sleeve.

[0006] Furthermore, the mounting holes are provided at the corners of the impedance board body, and the mounting holes are symmetrically arranged on the impedance board body.

[0007] Furthermore, a protective sleeve is connected to the supporting sleeve, and the protective sleeve and the supporting sleeve are formed in one piece, a clamping groove is provided on the protective sleeve, and the protective sleeve is connected to the corner of the impedance plate body through the clamping groove.

[0008] Furthermore, a threaded hole is provided on the support sleeve, and a slot is provided at the lower end of the support sleeve, the slot is connected to the threaded hole, and the slot, the threaded hole and the mounting hole are aligned.

[0009] Furthermore, the buffer assembly includes a buffer sleeve, a plug connector, a through hole and a deformation hole. The buffer sleeve is fixedly connected to the plug connector, and the plug connector is clamped together with a slot at the lower end of the support sleeve.

[0010] Furthermore, the through hole is opened through the buffer sleeve and the plug connector, the deformation holes are opened on the buffer sleeve, and the deformation holes are distributed in a ring array on the buffer sleeve.

[0011] Furthermore, the protection component includes a rubber pad, a threaded joint and a round hole, the rubber pad is fixedly connected to the threaded joint, and the rubber pad contacts the upper surface of the impedance plate body, and the threaded joint passes through the mounting hole.

[0012] Furthermore, the circular hole is formed on the rubber pad and the threaded joint, and the threaded joint is threadedly connected to the threaded hole on the support sleeve.

[0013] Compared with the prior art, the characteristic impedance controlled multilayer impedance board in the utility model is provided with a support sleeve, a protective sleeve, a buffer assembly and a protective assembly at the position of the mounting hole on the impedance board body. When the entire multilayer impedance board is installed, the support sleeve and the buffer assembly are used to support and lift the impedance board body, so that there is a gap below the impedance board body after installation, so that the impedance board can quickly dissipate heat when in use. The buffer assembly plays a buffering role and is used in conjunction with the protective assembly. When the impedance board body is installed with screws, it can play a buffering and protective role to prevent irreversible damage to the impedance board body due to excessive force. It can ensure the installation stability of the impedance board body and the integrity of the impedance board body. The protective sleeve and the support sleeve are arranged as one body to ensure that they will not fall off during protection, thereby ensuring stability in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of a multilayer impedance board with characteristic impedance control provided by an embodiment of the utility model;

[0015] Figure 2 The utility model provides a multi-layer impedance board with characteristic impedance control. Figure 1 The enlarged view of point A in the middle;

[0016] Figure 3 It is a structural schematic diagram of a supporting sleeve of a multi-layer impedance board with characteristic impedance control provided by an embodiment of the utility model;

[0017] Figure 4 It is a structural schematic diagram of a characteristic impedance controlled multi-layer impedance plate protection component provided by an embodiment of the utility model.

[0018] Among them, 1. impedance board body; 2. mounting hole; 3. support sleeve; 4. protective sleeve; 5. buffer assembly; 501. buffer sleeve; 502. plug connector; 503. through hole; 504. deformation hole; 6. protective assembly; 601. rubber pad; 602. threaded connector; 603. round hole; 7. threaded hole; 8. slot; 9. clamping groove. DETAILED DESCRIPTION

[0019] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0021] When used herein, it should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, components, parts or combinations thereof. At the same time, the terms used in this specification include any and all combinations of the relevant listed items.

[0022] The utility model embodiment provides a multilayer impedance board with characteristic impedance control, combined with Figures 1 to 4 As shown, it includes an impedance plate body 1 and a mounting hole 2 opened on the impedance plate body 1, a support sleeve 3 is provided on the lower surface of the impedance plate body 1 at the mounting hole 2, and a buffer component 5 is connected to the lower end of the support sleeve 3, a protective component 6 is provided in the mounting hole 2 on the impedance plate body 1, and the protective component 6 is connected to the support sleeve 3, the mounting hole 2 is opened at the corner position of the impedance plate body 1, and the mounting hole 2 is symmetrically arranged on the impedance plate body 1, a protective sleeve 4 is connected to the support sleeve 3, and the protective sleeve 4 and the support sleeve 3 are integrally formed, a clamping groove 9 is provided on the protective sleeve 4, and the protective sleeve 4 is connected to the corner of the impedance plate body 1 through the clamping groove 9, a threaded hole 7 is opened on the support sleeve 3, and a slot 8 is provided at the lower end of the support sleeve 3, the slot 8 is connected to the threaded hole 7, and the slot 8 and the threaded hole 7 are aligned with the mounting hole 2.

[0023] Specifically, by arranging the support sleeve 3, the protective sleeve 4, the buffer component 5 and the protective component 6 at the position of the mounting hole 2 on the impedance board main body 1, when installing the entire multi-layer impedance board, the support sleeve 3 and the buffer component 5 are used to support and lift the impedance board main body 1, so that there is a gap below the impedance board main body 1 after installation, so that the impedance board can quickly dissipate heat when in use. The buffer component 5 plays a buffering role, and when used in conjunction with the protective component 6, when the impedance board main body 1 is installed with screws, it can play a buffering protection role to prevent irreversible damage to the impedance board main body 1 due to excessive force, which can not only ensure the installation stability of the impedance board main body 1, but also ensure the integrity of the impedance board main body 1. The protective sleeve 3 and the support sleeve 4 are arranged as a whole to ensure that they will not fall off during protection, thereby ensuring stability in use.

[0024] When installing the support sleeve 3 and the protective sleeve 4, the clamping groove 9 is used to connect the protective sleeve 4 to the corners of the impedance board body 1. After the installation is completed, the threaded hole 7 on the support sleeve 3 is aligned with the mounting hole 2, the buffer component 5 is installed to the lower end of the support sleeve 3, and the protective component 6 is installed into the mounting hole 2, so that the protective component 6 and the support sleeve 3 are connected together, and then the multi-layer impedance board is installed. The impedance board body 1 is placed at the installation position using the support sleeve 3 and the buffer component 5, and the screws are passed through the protective component 6, the mounting hole 2, the support sleeve 3 and the buffer component 5, so that the ends of the screws are screwed into the screw holes at the installation position, thereby fixing the impedance board body 1. In this process, the protective component 6 and the buffer component 5 play a protective role of blocking and buffering to avoid damage to the impedance board body 1 caused by excessive force. The multi-layer impedance board can be used after installation.

[0025] Through the above embodiment, the buffer component 5 includes a buffer sleeve 501, a plug connector 502, a through hole 503 and a deformation hole 504, the buffer sleeve 501 is fixedly connected to the plug connector 502, and the plug connector 502 is clamped together with the slot 8 at the lower end of the support sleeve 3, the through hole 503 is opened through the buffer sleeve 501 and the plug connector 502, the deformation hole 504 is opened on the buffer sleeve 501, and the deformation holes 504 are distributed in a circular array on the buffer sleeve 501, the protective component 6 includes a rubber pad 601, a threaded joint 602 and a circular hole 603, the rubber pad 601 is fixedly connected to the threaded joint 602, and the rubber pad 601 contacts the upper surface of the impedance plate body 1, the threaded joint 602 passes through the mounting hole 2, the circular hole 603 is opened on the rubber pad 601 and the threaded joint 602, and the threaded joint 602 is threadedly connected to the threaded hole 7 on the support sleeve 3.

[0026] When installing the buffer component 5 and the protective component 6, the plug connector 502 in the buffer component 5 is directly inserted into the slot 8 at the lower end of the support sleeve 3, and the threaded connector 602 in the protective component 6 passes through the mounting hole 2 and is connected to the threaded hole 7 until the rubber pad 601 abuts against the impedance plate body 1. At this time, the protective component 6 is fixed together with the support sleeve 3.

[0027] Specifically, waist-shaped deformation holes 504 are provided in a circular array on the buffer sleeve 501. During the installation of the impedance plate body 1, if too much force is applied, the buffer sleeve 501 can be deformed to form a buffer, thereby protecting the integrity of the impedance plate body 1. At the same time, the buffer sleeve 501 is installed in the slot 8 through the plug connector 502, which is convenient for installation and disassembly.

[0028] Specifically, the rubber pad 601 acts as a barrier to the screws when the impedance plate body 1 is installed, thereby preventing the screws from directly contacting the impedance plate body 1 and ensuring the integrity of the surface of the impedance plate body 1. The threaded joint 602 in the protective component 6 is threadedly connected to the threaded hole 7 on the support sleeve 3, thereby ensuring the installation stability of the protective component 6 and the support sleeve 3.

[0029] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0030] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0031] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A multilayer impedance board with characteristic impedance control, characterized in that: The characteristic impedance controlled multilayer impedance board includes an impedance board body and a mounting hole opened on the impedance board body, a support sleeve is provided on the lower surface of the impedance board body at the mounting hole, and a buffer component is connected to the lower end of the support sleeve, a protective component is provided in the mounting hole on the impedance board body, and the protective component is connected to the support sleeve.

2. The characteristic impedance controlled multilayer impedance board according to claim 1, characterized in that: The mounting holes are arranged at the corners of the impedance plate body, and the mounting holes are symmetrically arranged on the impedance plate body.

3. The characteristic impedance controlled multilayer impedance board according to claim 2, characterized in that: The supporting sleeve is connected with a protective sleeve, and the protective sleeve and the supporting sleeve are formed in one piece. A clamping groove is provided on the protective sleeve, and the protective sleeve is connected to the corner of the impedance plate body through the clamping groove.

4. The characteristic impedance controlled multilayer impedance board according to claim 3, characterized in that: The support sleeve is provided with a threaded hole, and a slot is provided at the lower end of the support sleeve. The slot is connected with the threaded hole, and the slot, the threaded hole and the mounting hole are aligned.

5. The characteristic impedance controlled multilayer impedance board according to claim 4, characterized in that: The buffer assembly comprises a buffer sleeve, a plug connector, a through hole and a deformation hole. The buffer sleeve is fixedly connected to the plug connector, and the plug connector is clamped together with a slot at the lower end of the support sleeve.

6. The characteristic impedance controlled multilayer impedance board according to claim 5, characterized in that: The through hole is opened through the buffer sleeve and the plug connector, the deformation holes are opened on the buffer sleeve, and the deformation holes are distributed in a ring array on the buffer sleeve.

7. The characteristic impedance controlled multilayer impedance board according to claim 6, characterized in that: The protective component comprises a rubber pad, a threaded joint and a round hole. The rubber pad is fixedly connected to the threaded joint, and the rubber pad contacts the upper surface of the impedance plate body. The threaded joint passes through the mounting hole.

8. The characteristic impedance controlled multilayer impedance board according to claim 7, characterized in that: The circular hole is formed on the rubber pad and the threaded joint, and the threaded joint is threadedly connected to the threaded hole on the supporting sleeve.

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