Inverter

Abstract

The utility model relates to an inverter which comprises a shell, a first circuit board and a power tube are arranged in the shell, the power tube is arranged on the first circuit board, and a heat conduction gel layer is arranged between the first circuit board and the shell; one side of the first circuit board is attached to the power tube, and the other side of the first circuit board is attached to the heat conduction gel layer. The heat dissipation capability of the power tube is improved mainly through the first circuit board, the power tube is connected to the shell through the first circuit board to form an effective heat conduction path, and heat is conducted to the first circuit board from the power tube, then conducted to the heat conduction gel layer through the first circuit board, conducted to the shell and finally dissipated out; as the first circuit board and the heat-conducting gel layer have good heat-conducting performance, heat generated by the power tube can be quickly conducted to the shell, the heat dissipation surface area of the power tube is enlarged, and the heat can be more sufficiently dissipated to the surrounding environment through the larger surface area of the first circuit board, so that the heat dissipation problem of the power tube is solved, and the service life of the power tube is prolonged. And the overall heat dissipation effect of the inverter is improved, so that the stability and the reliability of the inverter are ensured.

Description

Technical Field

[0001] The present application relates to the field of inverter technology, and in particular to an inverter. Background Art

[0002] An inverter is an electronic device used to convert DC power into AC power. A microinverter is a special type of inverter that is mainly used in solar photovoltaic power generation systems. It is usually installed near each solar panel to convert the DC power generated by each solar panel into AC power.

[0003] The power tube is an important component in the micro-inverter, and its heat dissipation directly affects the performance and life of the micro-inverter. The power tube will generate a certain amount of heat when working. If the heat cannot be effectively dissipated, the temperature will rise, which will affect the performance and reliability of the power tube. At present, the power tube in the existing micro-inverter is located on the upper surface of the PCBA board, and its heat is transferred to the cover through the bottom thermal conductive gel and the upper potting glue, and then the cover conducts heat. Under this design, the heat conduction effect of using thermal conductive gel and potting glue is better, but the amount of potting glue is large, which increases the manufacturing cost, and it is necessary to ensure that the circuit board will not be damaged during the potting process; another solution is to use copper and vias around the power tube to directly transfer the heat to the main shell, but since the temperature around the power tube is maintained above 140 degrees for a long time, it may affect the life of the power switch tube element, so this design requires better heat dissipation measures to ensure that the temperature around the power tube is not too high; so it is urgent to develop an inverter that can effectively solve the heat dissipation problem of the power tube. Utility Model Content

[0004] In order to develop an inverter that can effectively solve the heat dissipation problem of power tubes, the present application provides an inverter.

[0005] The inverter provided in this application adopts the following technical solution:

[0006] An inverter comprises a shell, wherein a first circuit board and a power tube are arranged in the shell, the power tube is arranged on the first circuit board, and a thermal conductive gel layer is arranged between the first circuit board and the shell; one side of the first circuit board is bonded to the power tube, and the other side is bonded to the thermal conductive gel layer.

[0007] By adopting the above technical solution, the present application mainly improves the heat dissipation capacity of the power tube through the first circuit board. The power tube is connected to the shell through the first circuit board, forming an effective heat conduction path. The heat is conducted from the power tube to the first circuit board, and then conducted to the thermally conductive gel layer through the first circuit board and then to the shell, and finally dissipated. In this process, on the one hand, since the first circuit board and the thermally conductive gel layer have good thermal conductivity, the heat generated by the power tube can be quickly and effectively conducted to the shell. Compared with directly connecting the power tube to the shell, the heat can be more effectively dispersed and conducted through the intermediary of the first circuit board, thereby improving the heat dissipation efficiency. On the other hand, the power tube is installed on the first circuit board and the thermal conductivity of the thermally conductive gel layer is used to expand the heat dissipation surface area of ​​the power tube. Through the large surface area of ​​the first circuit board, the heat can be more fully dissipated to the surrounding environment, effectively solving the heat dissipation problem of the power tube, and improving the overall heat dissipation effect of the inverter, thereby ensuring the stability and reliability of the inverter.

[0008] In a specific embodiment, the thickness of the thermally conductive gel layer is 0.2-0.3 mm.

[0009] By adopting the above technical solution and using the above parameter settings, it is possible to ensure that the thermally conductive gel layer has enough material to fill the small gap between the first circuit board and the shell, thereby improving the heat conduction efficiency and maintaining sufficient mechanical connection strength while providing good heat conduction, thereby ensuring a stable connection between the first circuit board and the shell; by controlling the thickness of the thermally conductive gel layer, it is also possible to save materials and reduce production costs, while ensuring that the appropriate thickness is sufficient to meet the heat dissipation requirements.

[0010] In a specific possible implementation manner, a second circuit board is disposed in the housing, the second circuit board is located on a side of the first circuit board close to the power tube, and the second circuit board is provided with a heat dissipation window corresponding to the power tube.

[0011] By adopting the above technical solution, a heat dissipation window corresponding to the power tube is opened on the second circuit board, so that the heat generated by the power tube can be conducted to the upper part of the shell through the heat dissipation window. The upper part of the shell usually has a larger heat dissipation area, so that the heat can be effectively dissipated to the surrounding environment by radiation heat dissipation, thereby improving the heat dissipation efficiency; and this design method forms a zoned heat dissipation with the heat dissipation of the first circuit board, so that the heat dissipation resources of different parts can be more effectively utilized, thereby improving the overall heat dissipation efficiency.

[0012] In a specific possible implementation manner, a gap is left between the second circuit board and the first circuit board.

[0013] By adopting the above technical solution and utilizing the existence of the gap, the air flow around the second circuit board and the power tube can be promoted, which helps to remove the heat more effectively, reduce the accumulation of heat in local areas, and improve the heat dissipation efficiency.

[0014] In a specific implementation manner, the height of the gap is greater than the height of the power tube.

[0015] In a specific implementation manner, the first circuit board is provided with a pin header, and the first circuit board is electrically connected to the second circuit board via the pin header.

[0016] By adopting the above technical solution and using the pin header as the medium for electrical connection, a certain electrical isolation is achieved between the first circuit board and the second circuit board, interference in the circuit is reduced, and a stable connection is provided between the first circuit board and the second circuit board; and the pin header connection makes the connection between the first circuit board and the second circuit board easier to disassemble and install, and is convenient for maintenance and repair.

[0017] In a specific possible implementation manner, a mounting post is provided in the housing, the second circuit board abuts against the mounting post, and the second circuit board is fixed to the mounting post via a mounting member.

[0018] By adopting the above technical solution, the mounting column provides a stable supporting point, so that the second circuit board can be stably mounted inside the housing and is not prone to loosening or vibration, thereby improving the reliability of the entire inverter system.

[0019] In a specific possible implementation scheme, the mounting member includes a mounting screw, a mounting hole provided on the mounting column, and a through hole provided on the second circuit board, the mounting hole is arranged corresponding to and connected to the through hole, and the mounting screw passes through the through hole and is then inserted into the mounting hole.

[0020] By adopting the above technical solution, the mounting screw passes through the through hole on the second circuit board and is inserted into the mounting hole on the mounting column. This fixing method is firm and reliable, and can prevent the second circuit board from loosening or falling off during vibration or transportation; and the installation process is simple, and the second circuit board can be fixed by simply inserting the mounting screw into the through hole and tightening it, thereby saving installation time and labor costs.

[0021] In a specific possible implementation manner, a heat dissipation tooth structure is provided on the outer side of the shell, and the heat dissipation tooth structure is arranged corresponding to the first circuit board.

[0022] By adopting the above technical solution and utilizing the design of the heat dissipation tooth structure, the heat dissipation surface area of ​​the shell can be increased and air circulation can be promoted, thereby optimizing the heat conduction path, and allowing the heat generated by the power tube to be conducted from the first circuit board to the shell surface more quickly and dissipated through the heat dissipation tooth structure, thereby improving the heat dissipation performance and stability of the inverter.

[0023] In a specific possible implementation manner, the shell includes a bottom shell and a cover plate, one side of the bottom shell is provided with an opening, the cover plate is sealed on the opening, and the cover plate is connected to the bottom shell by fixing screws.

[0024] By adopting the above technical solution, the design scheme in which the bottom shell and the cover plate are connected by fixing screws has the advantages of easy maintenance, simple installation, good sealing and stable structure, and is suitable for the shell structure design of electronic equipment such as inverters.

[0025] In summary, the present application includes at least one of the following beneficial technical effects:

[0026] 1. The present application mainly improves the heat dissipation capacity of the power tube through the first circuit board. The power tube is connected to the housing through the first circuit board, forming an effective heat conduction path. The heat can be more effectively dispersed and conducted through the first circuit board and the thermally conductive gel layer. The first circuit board expands the heat dissipation surface area of ​​the power tube. Through the large surface area of ​​the first circuit board, the heat can be more fully dissipated to the surrounding environment, thereby effectively solving the heat dissipation problem of the power tube and improving the overall heat dissipation effect of the inverter, thereby ensuring the stability and reliability of the inverter;

[0027] 2. The present application uses a heat dissipation window corresponding to the power tube on the second circuit board, so that the heat generated by the power tube can be conducted to the upper part of the shell through the heat dissipation window. The upper part of the shell usually has a larger heat dissipation area, and the heat can be dissipated to the surrounding environment by radiation heat dissipation, thereby improving the heat dissipation efficiency; and this design method forms a zoned heat dissipation with the heat dissipation of the first circuit board, which can more effectively utilize the heat dissipation resources of different parts and improve the overall heat dissipation efficiency;

[0028] 3. The present application utilizes the design of the heat dissipation tooth structure to increase the heat dissipation surface area of ​​the shell and promote air circulation, optimize the heat conduction path, and enable the heat generated by the power tube to be conducted from the first circuit board to the shell surface more quickly and dissipated through the heat dissipation tooth structure, thereby improving the heat dissipation performance and stability of the inverter. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a structural schematic diagram of an inverter according to an embodiment of the present application.

[0030] Figure 2 It is a cross-sectional view for showing the first circuit board, the power tube, and the thermal conductive gel layer.

[0031] Figure 3 It is an exploded view for showing the first circuit board and the second circuit board.

[0032] Explanation of the reference numerals: 1. shell; 11. bottom shell; 111. opening; 12. cover plate; 2. first circuit board; 21. pin header; 3. power tube; 4. thermal conductive gel layer; 5. second circuit board; 51. heat dissipation window; 6. gap; 7. mounting column; 8. mounting piece; 81. mounting screw; 9. heat dissipation tooth structure; 10. fixing screw. DETAILED DESCRIPTION

[0033] The following is combined with Figure 1-3 This application is described in further detail.

[0034] Reference Figure 1 and Figure 2 , the embodiment of the present application discloses an inverter, including a housing 1. In the present embodiment, the structure of the housing 1 is a metal housing 1, and the metal housing 1 includes but is not limited to an aluminum housing 1;

[0035] A first circuit board 2 and a power tube 3 are provided in the housing 1. The power tube 3 is provided on the first circuit board 2. The first circuit board 2 includes but is not limited to an aluminum-based circuit board, a copper-based circuit board, a magnesium-based circuit board, a tungsten-based circuit board, and an iron-based circuit board. In this embodiment, the first circuit board 2 is an aluminum-based circuit board, and the power tube 3 includes but is not limited to a MOS tube.

[0036] A thermally conductive gel layer 4 is provided between the first circuit board 2 and the inner bottom wall of the housing 1. One side of the thermally conductive gel layer 4 is bonded to the first circuit board 2, and the other side is bonded to the inner bottom wall of the housing 1. In this embodiment, the material of the thermally conductive gel layer 4 includes but is not limited to silica gel, silicone grease, and metal powder thermally conductive glue, and the thickness of the thermally conductive gel layer 4 is 0.2-0.3 mm. The thermally conductive gel layer 4 can fill the small gap between the first circuit board 2 and the housing 1, improve the heat conduction efficiency, and thus effectively transfer the heat generated on the first circuit board 2 to the housing 1, and accelerate the heat dissipation, thereby optimizing the heat dissipation performance of the inverter. In this process, by controlling the thickness of the thermally conductive gel layer 4, materials can be saved and production costs can be reduced, while ensuring that the appropriate thickness is sufficient to meet the heat dissipation requirements.

[0037] One side of the first circuit board 2 is bonded to the power tube 3, and the other side is bonded to the thermally conductive gel layer 4. In this embodiment, the housing 1 is provided with a heat dissipation area, and the first circuit board 2 is provided in the heat dissipation area and covers the heat dissipation area and is bonded to the inner bottom wall of the housing 1 in the heat dissipation area. In this embodiment, the power tube 3 is connected to the housing 1 through the first circuit board 2, and the first circuit board 2 is used to improve the heat dissipation effect of the power tube 3. According to the measured data, the local temperature around the power tube 3 can be effectively reduced to ensure that the surrounding temperature is stable at 65°C and avoid performance degradation;

[0038] In this embodiment, the power tube 3 is connected to the housing 1 through the first circuit board 2, forming an effective heat conduction path, and the heat is conducted from the power tube 3 to the first circuit board 2, and then to the housing 1 through the first circuit board 2, and finally dissipated. In this process, on the one hand, since the first circuit board 2 and the thermally conductive gel layer 4 have good thermal conductivity, the heat generated by the power tube 3 can be quickly and effectively conducted to the housing 1. Compared with directly connecting the power tube 3 to the housing 1, the heat can be more effectively dispersed and conducted through the intermediary of the first circuit board 2, thereby improving the heat dissipation efficiency. On the other hand, the power tube 3 is installed on the first circuit board 2, which expands the heat dissipation surface area of ​​the power tube 3. Through the larger surface area of ​​the first circuit board 2, the heat can be more fully dissipated to the surrounding environment, thereby improving the overall heat dissipation effect, thereby ensuring the stability and reliability of the inverter.

[0039] Reference Figure 2 and Figure 3 A second circuit board 5 is provided in the housing 1. In this embodiment, the second circuit board 5 is integrated with electronic components constituting an inverter circuit. The second circuit board 5 is located on a side of the first circuit board 2 close to the power tube 3. The second circuit board 5 is provided with a heat dissipation window 51 corresponding to the power tube 3. In this embodiment, the cross-sectional area of ​​the heat dissipation window 51 is greater than or equal to the cross-sectional area of ​​the power tube 3, thereby accelerating the conduction of heat to the upper part of the housing 1 through the heat dissipation window 51 and dissipating it to the external environment by means of radiation heat dissipation;

[0040] During operation, the heat generated by the power tube 3 can be conducted to the upper part of the shell 1 through the heat dissipation window 51. The upper part of the shell 1 usually has a larger heat dissipation area, so that the heat can be effectively dissipated to the surrounding environment by radiation heat dissipation, thereby improving the heat dissipation efficiency. Moreover, this design method forms a zoned heat dissipation with the heat dissipation of the first circuit board 2, which can more effectively utilize the heat dissipation resources of different parts and improve the overall heat dissipation efficiency.

[0041] Reference Figure 2 and Figure 3A gap 6 is left between the second circuit board 5 and the first circuit board 2, and the height of the gap 6 is greater than the height of the power tube 3. In this embodiment, a gap 6 is left between the second circuit board 5, the first circuit board 2 and the upper part of the shell 1; the design of the gap 6 can promote the air flow around the second circuit board 5 and the power tube 3, which helps to take away the heat more effectively, reduce the accumulation of heat in the local area, and improve the heat dissipation efficiency; and the design of the gap 6 can also isolate the electromagnetic interference and interference between the second circuit board 5 and the power tube 3 to a certain extent, ensuring the stability and reliability of the circuit.

[0042] Reference Figure 2 and Figure 3 A pin header 21 is provided on the first circuit board 2, and the first circuit board 2 is electrically connected to the second circuit board 5 through the pin header 21. The pin header 21 serves as an electrical connection medium, so that a certain electrical isolation is achieved between the first circuit board 2 and the second circuit board 5, interference in the circuit is reduced, and a stable connection is provided between the first circuit board 2 and the second circuit board 5; in this embodiment, the pin header 21 includes but is not limited to being welded on the first circuit board 2, and the other side of the pin header 21 and the second circuit board 5 include but are not limited to being electrically connected through plug-in fitting; the connection between the pin header 21 and the first circuit board 2 has high firmness and stability, and can withstand certain mechanical pressure and vibration; the pin header 21 and the second circuit board 5 are plug-in fitting, which can be easily disassembled and replaced, and is convenient for maintenance and repair; this connection method is more flexible than direct welding, and the connection line or component can be replaced at any time as needed, thereby improving the flexibility and maintainability of the inverter system.

[0043] Reference Figure 2 and Figure 3 A mounting post 7 is provided in the housing 1, and the second circuit board 5 abuts against the mounting post 7. In this embodiment, the design position of the mounting post 7 avoids the position of the electronic components on the second circuit board 5, and the second circuit board 5 is fixed to the mounting post 7 by a mounting member 8; the mounting member 8 includes a mounting screw 81, a mounting hole provided on the mounting post 7, and a through hole provided on the second circuit board 5, the mounting hole and the through hole are correspondingly arranged and connected, and the mounting screw 81 passes through the through hole and is then inserted into the mounting hole;

[0044] The mounting screw 81 passes through the through hole on the second circuit board 5 and is inserted into the mounting hole on the mounting column 7. The mounting column 7 provides a stable support point. This fixing method is firm and reliable, and can prevent the second circuit board 5 from loosening or falling off during vibration or transportation. In addition, the installation process is simple. The second circuit board 5 can be fixed by simply inserting the mounting screw 81 into the through hole and tightening it, thereby saving installation time and labor costs.

[0045] Reference Figure 2A heat dissipation tooth structure 9 is provided on the outer side wall of the shell 1, and the heat dissipation tooth structure 9 is arranged corresponding to the first circuit board 2. In this embodiment, the heat dissipation tooth structure 9 is arranged on the outer bottom wall of the shell 1, and the heat dissipation tooth structure 9 includes a plurality of heat dissipation fins, and the heat dissipation fins are evenly distributed along the circumference of the shell 1; the design of the heat dissipation tooth structure 9 can increase the heat dissipation surface area of ​​the shell 1 and promote air circulation, optimize the heat conduction path, and make the heat generated by the power tube 3 be conducted from the first circuit board 2 to the surface of the shell 1 faster, and dissipated through the heat dissipation tooth structure 9, thereby improving the heat dissipation performance and stability of the inverter.

[0046] Reference Figure 2 The shell 1 includes a bottom shell 11 and a cover plate 12. An opening 111 is opened on one side of the bottom shell 11. The cover plate 12 blocks the opening 111. The cover plate 12 is connected to the bottom shell 11 by fixing screws 10. During installation, the cover plate 12 is aligned with the opening 111 of the bottom shell 11 so that it can completely cover and block the opening 111. The fixing screws 10 pass through the cover plate 12 and match with the threaded holes of the bottom shell 11 to firmly fix the cover plate 12 on the bottom shell 11. The design scheme in which the bottom shell 11 and the cover plate 12 are connected by fixing screws 10 has the advantages of easy maintenance, simple installation, good sealing and stable structure, and is suitable for the shell 1 structure design of electronic equipment such as inverters.

[0047] The implementation principle of an inverter in the embodiment of the present application is as follows: the present application mainly improves the heat dissipation capacity of the power tube 3 through the first circuit board 2. The power tube 3 is connected to the housing 1 through the first circuit board 2, forming an effective heat conduction path, effectively solving the heat dissipation problem of the power tube 3, and improving the overall heat dissipation effect of the inverter;

[0048] Before work, a heat-conducting gel layer 4 is arranged on the heat-dissipating area in the housing 1, and the first circuit board 2 is placed on the heat-dissipating area so that it fits with the heat-conducting gel layer 4; then the second circuit board 5 is placed on the mounting column 7 so that the through hole of the second circuit board 5 corresponds to and is connected with the mounting hole of the mounting column 7, and then the mounting screw 81 is passed through the through hole and matched with the threaded connection of the mounting hole to complete the installation of the second circuit board 5. In this process, the pin header 21 on the first circuit board 2 is plugged and matched with the second circuit board 5 to achieve electrical connection; finally, the cover plate 12 is aligned with the opening 111 of the bottom shell 11 so that it can completely cover and block the opening 111, and the cover plate 12 is firmly fixed on the bottom shell 11 by passing the fixing screw 10 through the cover plate 12 and matching with the threaded hole of the bottom shell 11 to complete the assembly of the entire inverter;

[0049] During heat dissipation, on the one hand, heat is directly conducted from the power tube 3 to the first circuit board 2, and then directly conducted to the housing 1 through the first circuit board 2, and dissipated through the heat dissipation tooth structure 9 of the housing 1. In this process, the first circuit board 2 can quickly and effectively conduct the heat generated by the power tube 3 to the housing 1. Compared with directly connecting the power tube 3 to the housing 1, the heat can be more effectively dispersed and conducted through the intermediary of the first circuit board 2. The first circuit board 2 expands the heat dissipation surface area of ​​the power tube 3. Through the larger surface area of ​​the first circuit board 2, the heat can be more fully dissipated to the surrounding environment, thereby improving the overall heat dissipation effect, thereby ensuring the stability and reliability of the inverter;

[0050] On the other hand, the heat generated by the power tube 3 can also be conducted to the upper part of the shell 1 through the heat dissipation window 51. The upper part of the shell 1 usually has a larger heat dissipation area, so that the heat can be effectively dissipated to the surrounding environment by radiation heat dissipation, thereby improving the heat dissipation efficiency. The design of the heat dissipation window 51 on the second circuit board 5 and the heat dissipation of the first circuit board 2 form a zoned heat dissipation, which can more effectively utilize the heat dissipation resources of different parts and improve the overall heat dissipation efficiency.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An inverter, characterized in that: It comprises a shell, in which a first circuit board and a power tube are arranged, the power tube is arranged on the first circuit board, and a thermal conductive gel layer is arranged between the first circuit board and the shell; one side of the first circuit board is bonded to the power tube, and the other side is bonded to the thermal conductive gel layer.

2. The inverter according to claim 1, characterized in that: The thickness of the thermal conductive gel layer is 0.2-0.3 mm.

3. The inverter according to claim 1, characterized in that: A second circuit board is arranged in the shell, and the second circuit board is located at a side of the first circuit board close to the power tube. The second circuit board is provided with a heat dissipation window corresponding to the power tube.

4. The inverter according to claim 3, characterized in that: A gap is left between the second circuit board and the first circuit board.

5. The inverter according to claim 4, characterized in that: The height of the gap is greater than the height of the power tube.

6. The inverter according to claim 3, characterized in that: The first circuit board is provided with a pin header, and the first circuit board is electrically connected to the second circuit board through the pin header.

7. The inverter according to claim 3, characterized in that: A mounting post is provided in the housing, the second circuit board abuts against the mounting post, and the second circuit board is fixed to the mounting post via a mounting member.

8. The inverter according to claim 7, characterized in that: The mounting member includes a mounting screw, a mounting hole provided on the mounting column and a through hole provided on the second circuit board. The mounting hole is arranged corresponding to and connected with the through hole. The mounting screw passes through the through hole and is then inserted into the mounting hole.

9. The inverter according to claim 1, characterized in that: A heat dissipation tooth structure is disposed on the outer side of the shell, and the heat dissipation tooth structure is disposed corresponding to the first circuit board.

10. The inverter according to claim 1, characterized in that: The housing comprises a bottom shell and a cover plate. An opening is formed on one side of the bottom shell. The cover plate is sealed on the opening. The cover plate is connected to the bottom shell by fixing screws.

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