Non-contact stress connection structure

Abstract

The utility model relates to the technical field of thermoelectric conduction of electronic devices, in particular to a non-contact stress connection structure. A non-contact stress connecting structure comprises an upper contact piece, a lower contact piece and a connecting piece connecting the upper contact piece and the lower contact piece, and the connecting piece is connected to the side edge of the upper contact piece and the side edge of the lower contact piece so that the distance between the upper contact piece and the lower contact piece can be telescopically adjusted. A pre-filling layer which is elastically supported between the upper contact piece and the lower contact piece is arranged between the upper contact piece and the lower contact piece, a separation layer is wrapped outside the pre-filling layer, and the separation layer is connected with an extraction piece which can extract the separation layer and the pre-filling layer from the space between the upper contact piece and the lower contact piece. After installation is completed, the internal pre-filling layer can be taken down together with the separation layer through the extraction sheet, the filling material is removed, the installation contact pressure is released, and the situation that chips or circuit boards, electronic devices and the like are crushed due to too large pressure is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of thermal and electrical conduction of electronic devices, in particular to a contact-free stress connection structure. Background Art

[0002] As the chip operating efficiency of electronic devices becomes higher and higher, the heat generated is also increasing, which puts forward higher heat dissipation requirements for electronic devices. At the same time, the high integration of products leads to increasingly serious electromagnetic interference between them. In order to meet the heat dissipation requirements and electromagnetic compatibility of electronic devices and ensure their normal operation, thermal conductive structures such as thermal conductive sheets and conductive fabrics are used in chip heat dissipation and electromagnetic compatibility design of electronic devices.

[0003] In general scenarios, in order to ensure good thermal and electrical conductivity, thermal and electrical conductive components need to be pressed onto chips and other devices through screws, springs, shrapnel and other structures to ensure good contact between the thermal and electrical conductive components and the devices, such as common computer CPU heat sinks. However, such structures have large contact stress and can easily cause deformation of the substrate. Some devices cannot withstand high pressure. For example, the screen is prone to water ripples or even black lines when squeezed. Utility Model Content

[0004] The utility model aims to overcome the above-mentioned shortcomings and provide a technical solution that can solve the above-mentioned problems.

[0005] A contact stress-free connection structure comprises an upper contact sheet, a lower contact sheet and a connector connecting the upper contact sheet and the lower contact sheet, wherein the connector is connected to the sides of the upper contact sheet and the lower contact sheet so that the distance between the upper contact sheet and the lower contact sheet can be telescopically adjusted, and a pre-filling layer elastically supported between the upper contact sheet and the lower contact sheet is provided between the upper contact sheet and the lower contact sheet, and a separation layer is wrapped outside the pre-filling layer, and the separation layer is connected to an extraction sheet which can extract the separation layer and the pre-filling layer from between the upper contact sheet and the lower contact sheet.

[0006] Furthermore, a filling layer is provided on the top surface of the upper contact sheet and the bottom surface of the lower contact sheet respectively.

[0007] Optionally, the pre-filled layer is elastic foam.

[0008] Optionally, the pre-filled layer is a capsule filled with gas.

[0009] Optionally, the pre-filled layer is a material with a large thermal expansion coefficient.

[0010] Furthermore, the upper contact sheet and the lower contact sheet are respectively adhesive layers with adhesive strength, and the connecting member is one of copper foil, aluminum foil, graphite copper, conductive graphite cloth or a composite film thereof.

[0011] Optionally, the upper contact sheet, the lower contact sheet, and the connecting piece are all made of thermally and electrically conductive materials.

[0012] Optionally, the upper contact sheet and the lower contact sheet are made of thermally conductive insulating material, and the surface of the connector is covered with an insulating film.

[0013] Compared with the prior art, the beneficial effects achieved by the utility model are as follows: the utility model provides a contact-free stress connection structure, which can maintain a certain pressure during installation to ensure that the upper contact sheet and the lower contact sheet can be in good contact with the heat dissipation structure or the heat source, and after the installation is completed, the internal pre-filled layer can be removed together with the separation layer through the extraction sheet to remove the filling material and release the installation contact pressure, thereby avoiding the situation where chips or circuit boards, electronic devices, etc. are crushed due to excessive pressure.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0016] Figure 1 It is a structural schematic diagram of the utility model.

[0017] Figure 2 It is a structural schematic diagram of the connecting piece in the utility model.

[0018] Figure 3 It is a schematic diagram of the installation structure of the utility model. DETAILED DESCRIPTION

[0019] The technical solutions in the embodiments of the present utility model are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present utility model, not all of them. Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present utility model.

[0020] See also Figure 1~2A contact-free stress connection structure comprises an upper contact sheet 1, a lower contact sheet 2 and a connector 3 connecting the upper contact sheet 1 and the lower contact sheet 2, the connector 3 is connected to the sides of the upper contact sheet 1 and the lower contact sheet 2 so that the distance between the upper contact sheet 1 and the lower contact sheet 2 can be adjusted telescopically, a pre-filling layer 4 elastically supported between the upper contact sheet 1 and the lower contact sheet 2 is arranged, the pre-filling layer 4 is wrapped with a separation layer 5, and the separation layer 5 is connected with an extraction sheet 6 that can extract the separation layer 5 and the pre-filling layer 4 from between the upper contact sheet 1 and the lower contact sheet 2. The utility model provides a contact-free stress connection structure, which can maintain a certain pressure during installation to ensure that the upper contact sheet 1 and the lower contact sheet 2 can be in good contact with the heat dissipation structure or the heat source, and after the installation is completed, the internal pre-filling layer 4 can be removed together with the separation layer 5 through the extraction sheet 6, the filling material is removed, and the installation contact pressure is released to avoid the situation where the chip or circuit board, electronic device, etc. are crushed due to excessive pressure.

[0021] Furthermore, the top surface of the upper contact sheet 1 and the bottom surface of the lower contact sheet 2 are respectively provided with a gap filling layer 7. Specifically, the gap filling layer 7 can be made of thermal conductive silicone grease, thermal conductive adhesive and other materials to fill the gap between the upper contact sheet 1, the lower contact sheet 2 and the device, thereby reducing the contact thermal resistance.

[0022] Furthermore, the upper contact sheet 1 and the lower contact sheet 2 are respectively adhesive layers with adhesive strength, and the connecting member 3 is one of copper foil, aluminum foil, graphite copper, conductive graphite cloth or a composite film thereof.

[0023] Optionally, the upper contact piece 1, the lower contact piece 2, and the connector 3 are all made of thermally conductive and electrically conductive materials. This design is suitable for scenarios where both thermal and electrical connections are required between the two connected surfaces, such as the contact connection and heat dissipation structure between the screen and motherboard of a children's watch.

[0024] Optionally, the upper contact sheet 1 and the lower contact sheet 2 are made of heat-conducting insulating materials, and the surface of the connector 3 is covered with an insulating film. This design is suitable for scenarios where only thermal connection but no electrical connection is required between the two connected surfaces, such as the heat-conducting structure between a chip and a heat sink.

[0025] Specifically, the installation structure of the contact stress-free connection structure of the utility model is as follows: Figure 3As shown, it includes a substrate 01, a second device 02, a second device 03 and a mounting backplane 04, the second device 02 is welded on the substrate 01, a pillar 05 is arranged around the second device 02 and a corresponding hole is opened on the substrate 01, the bottom end of the pillar 05 passes through the substrate 01 and is threadedly connected to the mounting backplane 04 on the back of the substrate 01, the second device 03 is assumed to be at the top of the pillar 05 and fixed by screws, wherein the upper contact piece 1 of the contact-free stress connection structure of the utility model abuts against the second device 03, and the lower contact piece abuts against the second device 02, and after the installation is completed, the pre-filled layer 4 is pulled out from between the upper contact piece 1 and the lower contact piece 2 through the separation layer 5.

[0026] The utility model provides a contact stress-free connection structure, which has the following implementation modes according to different materials of the pre-filled layer 4:

[0027] [Example 1]

[0028] Optionally, the pre-filled layer 4 is an elastic foam. In this embodiment, the pre-filled layer 4 can also be made of other materials that have a certain amount of compression and can provide elastic support, such as soft silicone pads. When installing the thermoelectric connection structure, the upper contact sheet 1 and the lower contact sheet 2 are in contact with the device respectively, and the pre-filled layer 4 provides support to ensure good contact between the upper contact sheet 1 and the lower contact sheet 2 and the device. After installation, the pre-filled layer 4 can be extracted through the extraction sheet 6 to remove the residual stress after connection.

[0029] [Example 2]

[0030] Optionally, the pre-filled layer 4 is a capsule filled with gas. In this embodiment, the gas can be filled in a sealed capsule as the pre-filled layer 4. During installation, the capsule is squeezed and provides a force to make the upper contact sheet 1, the lower contact sheet 2 and the device in good contact. After installation, a blade or a spike can be used to break the capsule to discharge the air inside. The volume of the capsule shrinks and it can be easily taken out.

[0031] [Example 3]

[0032] Optionally, the pre-filled layer 4 is a material with a large thermal expansion coefficient. In this embodiment, the pre-filled layer 4 can be made of a material with a large thermal expansion coefficient such as epoxy resin, chloroprene rubber, etc., and is made into a block and filled between the upper contact sheet 1 and the lower contact sheet 2. Before installing the thermoelectric connection structure, the pre-filled layer 4 is heated to expand it to provide support for the upper contact sheet 1 and the lower contact. After the installation is completed, it is allowed to cool naturally or cooled by blowing cold air to shrink the pre-filled layer 4, which is convenient for extraction and removes the residual stress after the connection.

[0033] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

Claims

1. A contact stress-free connection structure, comprising an upper contact sheet, a lower contact sheet, and a connector connecting the upper contact sheet and the lower contact sheet, characterized in that: The connecting piece is connected to the sides of the upper contact sheet and the lower contact sheet so that the distance between the upper contact sheet and the lower contact sheet can be telescopically adjusted. A pre-filling layer elastically supported between the upper contact sheet and the lower contact sheet is provided between the two sheets. The pre-filling layer is wrapped with a separation layer. The separation layer is connected to a withdrawal sheet that can be used to pull the separation layer and the pre-filling layer out from between the upper contact sheet and the lower contact sheet.

2. A contact-free stress connection structure according to claim 1, characterized in that: The top surface of the upper contact sheet and the bottom surface of the lower contact sheet are respectively provided with gap filling layers.

3. A contact-free stress connection structure according to claim 1 or 2, characterized in that: The pre-filled layer is elastic foam.

4. A contact-free stress connection structure according to claim 1 or 2, characterized in that: The pre-filled layer is a capsule filled with gas.

5. A contact-free stress connection structure according to claim 1 or 2, characterized in that: The pre-filling layer is made of a material with a large thermal expansion coefficient.

6. A contact-free stress connection structure according to claim 1 or 2, characterized in that: The upper contact sheet and the lower contact sheet are respectively adhesive layers with adhesive force, and the connecting piece is one of copper foil, aluminum foil, graphite copper, conductive graphite cloth or their composite film.

7. A contact-free stress connection structure according to claim 6, characterized in that: The upper contact piece, the lower contact piece and the connecting piece are all made of heat-conducting and electrically-conducting materials.

8. A contact-free stress connection structure according to claim 6, characterized in that: The upper contact piece and the lower contact piece are made of heat-conducting insulating material, and the surface of the connecting piece is covered with an insulating film.

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