Grinding machine for crystal processing

Abstract

The grinding machine comprises a base, a workbench assembly, a crystal orientation detection mechanism, a grinding assembly and a size detection assembly, the base is provided with a first guide rail and a second guide rail, the workbench assembly comprises a workbench base, a headstock and a tailstock, the workbench base is provided with a third guide rail, and the headstock or the tailstock is slidably connected to the third guide rail; the crystal orientation detection mechanism comprises a crystal orientation detection base and a crystal orientation detection assembly, the crystal orientation detection base is slidably connected to the second guide rail, the crystal orientation detection base is provided with a fourth guide rail, and the crystal orientation detection assembly is slidably connected to the fourth guide rail; the size detection assembly comprises a first detection mechanism and a second detection mechanism, the first detection mechanism is fixedly arranged relative to the crystal orientation detection assembly, and the second detection mechanism is fixedly arranged relative to the second grinding mechanism. According to the arrangement, a plurality of functional parts are integrated on the base, the transfer frequency in the crystal machining process is reduced, and the machining precision and the machining quality are improved.

Description

Technical Field

[0001] The invention relates to the field of crystal processing equipment, in particular to a grinding machine for crystal processing. Background Art

[0002] With the rapid development of semiconductors and advanced manufacturing technologies, the demand for silicon carbide crystals is growing. Silicon carbide crystal materials are widely used in electronics, communications, aerospace and other fields, which place extremely high demands on the precision and quality of crystal processing. However, traditional crystal processing equipment and methods often have problems such as low processing accuracy, low efficiency, and difficulty in quality monitoring.

[0003] In the processing of silicon carbide crystals, traditional equipment and methods often require different grinding steps to be dispersed on multiple independent devices, such as outer cylindrical rolling, OF surface grinding of 6-inch crystals, and V-Notch groove grinding of 8-inch crystals. This not only increases the number of transfers and fixations of the crystal during the processing process, but may also lead to a decrease in processing accuracy and efficiency. In addition, traditional equipment often lacks integrated crystal orientation detection, diameter detection, OF surface and V-Notch groove depth measurement functions, making quality monitoring and adjustment during the processing difficult. In addition, the size detection component is not sensitive enough to accurately detect the size changes of the crystal. Utility Model Content

[0004] In order to solve the above technical problems, the present application provides a grinding machine for crystal processing, which has stronger processing capabilities and can reduce the number of transfers and fixations during the crystal processing process.

[0005] To achieve the above objectives, this application adopts the following technical solutions:

[0006] A grinding machine for crystal processing, the grinding machine comprising: a base, a first guide rail extending along a first direction and a second guide rail extending along the first direction are provided on the base, and the first guide rail is parallel to the second guide rail; a workbench assembly, the workbench assembly comprises a workbench base, a headstock and a tailstock, the workbench base is slidably connected to the first guide rail, the headstock and the tailstock are connected to the workbench base, and the headstock and the tailstock cooperate with each other to fix the crystal; a third guide rail extending along the first direction is provided on the workbench base, and at least one of the headstock or the tailstock is slidably connected to the third guide rail; a crystal direction detection assembly, the crystal direction detection assembly is arranged on one side of the workbench assembly, and the crystal direction detection assembly comprises a crystal direction detection base and a crystal direction detection Mechanism, the crystal direction detection base is slidably connected to the second guide rail, the crystal direction detection base is provided with a fourth guide rail extending along the second direction, and the crystal direction detection mechanism is slidably connected to the fourth guide rail; a grinding assembly, the grinding assembly is connected to the base, the grinding assembly is arranged on one side of the workbench assembly, the grinding assembly includes a first grinding mechanism and a second grinding mechanism, the first grinding mechanism and the second grinding mechanism are used for grinding the crystal; a size detection assembly, the size detection assembly includes a first detection mechanism for detecting the size of the crystal before processing and a second detection mechanism for detecting the size of the crystal after processing, the first detection mechanism is fixedly arranged relative to the crystal direction detection mechanism, and the second detection mechanism is fixedly arranged relative to the second grinding mechanism.

[0007] Furthermore, the second direction and the first direction are arranged perpendicular to each other.

[0008] Furthermore, the crystal orientation detection assembly and the second grinding mechanism are respectively arranged on two sides of the workbench assembly.

[0009] Furthermore, in the grinding assembly, the first grinding mechanism and the second grinding mechanism are arranged on the same side of the workbench assembly.

[0010] Furthermore, the crystal direction detection mechanism includes a detection feed module slidably connected to the fourth guide rail and a crystal direction detector connected to the detection feed module, the detection feed module drives the crystal direction detector to move along the fourth guide rail, and the first detection mechanism is connected to the detection feed module or the crystal direction detector.

[0011] Furthermore, the first detection mechanism includes a first mounting frame and a dimension detector connected to the first mounting frame, and the first mounting frame is connected to the detection feeding module or the crystal direction detector.

[0012] Furthermore, the second grinding mechanism includes a second feeding module and a second grinding module connected to the second feeding module, the second feeding module drives the second grinding mechanism to move along the second direction, and the second detection mechanism is connected to the second feeding module or the second grinding module.

[0013] Furthermore, the second detection mechanism includes a second mounting frame and a dimension detector connected to the second mounting frame, and the second mounting frame is connected to the second feeding module or the second grinding module.

[0014] Furthermore, the dimension detector includes a measuring head, a sensor, a fifth guide rail and a driving member, the fifth guide rail is arranged on the first mounting frame or the second mounting frame, the measuring head is slidably connected to the fifth guide rail, the driving member is connected to the measuring head and drives the measuring head to move along the fifth guide rail, and the sensor is electrically connected to the measuring head.

[0015] Furthermore, the driving member includes one of a cylinder drive, a hydraulic drive or an electric push rod.

[0016] The grinder in the above configuration integrates the crystal orientation detection component, grinding component, and size detection component on the workbench component, reducing the number of transfers and fixations of the crystal during processing, thereby ensuring the processing accuracy of the crystal. In addition, the integration of multiple functional components makes the overall structure of the grinder more compact and reduces the cost of the grinder. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a grinder from a first perspective in an embodiment of the present application;

[0018] Figure 2 A schematic diagram of a second viewing angle of a grinding machine in an embodiment of the present application;

[0019] Figure 3 In the implementation mode of this application Figure 1 A partial enlarged view of the middle A;

[0020] Figure 4 A partial schematic diagram of a grinding machine in an embodiment of the present application;

[0021] Figure 5 A schematic diagram of a first viewing angle of a first detection mechanism in an embodiment of the present application;

[0022] Figure 6 It is a schematic diagram of a second viewing angle of the first detection mechanism in an embodiment of the present application. DETAILED DESCRIPTION

[0023] In order to make the technical scheme of the present application better understood by the persons skilled in the art, the technical scheme in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0024] The terms used in this application are for the purpose of describing specific embodiments only and are not intended to limit this application. "First", "second", "third", "fourth" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one of the features. The singular forms "a", "said", and "the" used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0025] like Figure 1 As shown, the present application provides a grinding machine 100 for crystal processing, which includes a base 10, a worktable assembly 20, a crystal orientation detection assembly 30, a grinding assembly 40 and a size detection assembly 50. The base 10 is used as the main body of the grinding machine 100 to support the worktable assembly 20, the crystal orientation detection assembly 30, the grinding assembly 40 and the size detection assembly 50. The base 10 is provided with a first guide rail 11 extending along a first direction and a second guide rail 12 extending along the first direction, and the first guide rail 11 is parallel to the second guide rail 12. In order to clearly illustrate the technical solution of the present application, Figure 1 The figure also shows the up-down, left-right, and front-back directions of the grinding machine 100. It should be noted that the first direction is substantially parallel to the left-right direction of the grinding machine 100.

[0026] like Figure 1 As shown, as an implementation, the workbench assembly 20 includes a workbench base 21, a headstock 22 and a tailstock 23. The workbench base 21 is mounted on the base 10, and is used to support the headstock 22 and the tailstock 23. The workbench base 21 is slidably connected to the first guide rail 11, and the first guide rail 11 is provided on the upper side end surface of the base 10, so that the workbench base 21 can slide on the first guide rail 11 along the first direction, so that the crystal has the freedom to move along the first direction.

[0027] Specifically, the headstock 22 is installed at the front of the workbench base 21, and the tailstock 23 is installed at the rear of the workbench base 21. There is an adjustable gap between the headstock 22 and the tailstock 23, and the headstock 22 and the tailstock 23 cooperate with each other to fix the crystal.

[0028] Furthermore, a third guide rail 24 extending along the first direction is provided on the workbench base 21, and at least one of the headstock 22 or the tailstock 23 is slidably connected to the third guide rail 24. Thus, the gap between the headstock 22 and the tailstock 23 can be adjusted.

[0029] like Figure 1As shown, as an implementation, the crystal direction detection component 30 is disposed on one side of the workbench component 20. In the example of the present application, the crystal direction detection component 30 is at least partially disposed on the front side of the workbench component 20. The crystal direction detection component 30 is used to detect the crystal direction of the crystal, wherein the crystal direction refers to a basic feature of the crystal that it has directionality, and the crystal properties are different along different directions of the lattice.

[0030] Specifically, the crystal direction detection assembly 30 includes a crystal direction detection base 31 and a crystal direction detection mechanism 32. The crystal direction detection base 31 is slidably connected to the second guide rail 12. In the example of the present application, the second guide rail 12 is arranged on the front end surface of the base 10 to avoid mutual interference between the crystal direction detection assembly 30 and the workbench assembly 20 during movement.

[0031] Furthermore, a fourth guide rail 33 extending along a second direction is provided on the crystal direction detection base 31, wherein the second direction is substantially parallel to the front-rear direction of the grinder 100, and the crystal direction detection mechanism 32 is slidably connected to the fourth guide rail 33 so that the crystal direction detection mechanism 32 has freedom of movement along the second direction.

[0032] The second direction and the first direction are arranged perpendicular to each other.

[0033] like Figure 2 As shown, in the embodiment of the present application, the crystal direction detection mechanism 32 includes a detection feed module 321 and a crystal direction detector 322. The detection feed module 321 is slidably connected to the fourth guide rail 33, and the crystal direction detector 322 is connected to the detection feed module 321, so that the crystal direction detector 322 is driven to slide along the fourth guide rail 33 through the detection feed module 321.

[0034] As an implementation, the grinding assembly 40 is connected to the base 10, and the grinding assembly 40 is arranged on one side of the workbench assembly 20. In the example of the present application, the grinding assembly 40 is arranged on the rear side of the workbench assembly 20 to avoid interference between the grinding assembly 40 and the crystal direction detection assembly 30 during movement.

[0035] Specifically, the grinding assembly 40 includes a first grinding mechanism 41 and a second grinding mechanism 42 . The first grinding mechanism 41 and the second grinding mechanism 42 are disposed on the same side of the workbench assembly 20 . The first grinding mechanism 41 and the second grinding mechanism 42 are both used for grinding crystals.

[0036] Exemplarily, the first grinding mechanism 41 is used for rolling the outer edge of the crystal. The crystal before rolling by the first grinding mechanism 41 is basically cylindrical. Before grinding the crystal, the crystal is installed between the headstock 22 and the tailstock 23 along the first direction, and the crystal is clamped by the headstock 22 and the tailstock 23. The headstock 22 and / or the tailstock 23 are driven to rotate, and the crystal is driven to rotate at a high speed. In the example of the present application, the rotation speed of the crystal can reach at least 12000rpm, thereby improving the grinding efficiency. The crystal after rolling by the first grinding mechanism 41 is cylindrical and has a smooth outer peripheral surface.

[0037] In some examples, the first grinding mechanism 41 is also used to perform OF surface grinding on the tumbled crystal of a specific size.

[0038] like Figure 2 and 3 As shown, in the embodiment of the present application, the first grinding mechanism 41 includes a first feeding module 411 and a first grinding module 412, the first grinding module 412 is connected to the first feeding module 411, and the first feeding module 411 is used to drive the first grinding module 412 to move along the second direction. Among them, the first feeding module 411 at least includes a guide rail extending along the second direction and a driving motor driving the first grinding module 412 to move along the guide rail, the first grinding module 412 is connected to the driving motor, and at least one of the driving motor or the first grinding module 412 is slidably connected to the guide rail.

[0039] Exemplarily, the second grinding mechanism 42 is used to process a V-Notch groove on a crystal of a specific size. The crystal rolled by the first grinding mechanism 41 is rolled by the second grinding mechanism 42 to form a processed crystal. The second grinding mechanism 42 and the crystal direction detection assembly 30 are respectively arranged on both sides of the workbench assembly 20.

[0040] In the embodiment of the present application, the second grinding mechanism 42 includes a second feeding module 421 and a second grinding module 422, the second grinding module 422 is connected to the second feeding module 421, and the second feeding module 421 is used to drive the second grinding module 422 to move along the second direction. The second feeding module 421 and the second grinding module 422 are substantially the same in structure as the first feeding module 411 and the first grinding module 412, respectively, and are not described in detail here.

[0041] It should be noted that the first grinding module 412 and the second grinding module 422 can both be configured as grinding wheels, and the size of the grinding wheels can be adjusted according to the grinding process, the part to be processed, the processing shape, etc., and is not limited here.

[0042] like Figure 4As shown, as an implementation method, the size detection component 50 includes a first detection mechanism 51 and a second detection mechanism (not shown in the figure), wherein the first detection mechanism 51 is used to detect the size of the crystal before processing, and the first detection mechanism 51 is fixed relative to the crystal direction detection mechanism 32, and the second detection mechanism is used to detect the size of the crystal after processing, and the second detection mechanism is fixed relative to the second grinding mechanism 42.

[0043] Exemplarily, the first detection mechanism 51 is connected to the crystal direction detection mechanism 32, wherein the first detection mechanism 51 can be kept relatively fixed with the crystal direction detection mechanism 32 directly or indirectly, so that the crystal direction detection mechanism 32 drives the first detection mechanism 51 to move. The second detection mechanism 52 is connected to the second grinding mechanism 42, wherein the second detection mechanism can be kept relatively fixed with the second grinding mechanism 42 directly or indirectly, so that the second grinding mechanism 42 drives the second detection mechanism 52 to move.

[0044] Specifically, the first detection mechanism 51 is connected to the detection feed module 321 or the crystal direction detector 322, so that when the crystal direction detection component 30 moves, the first detection mechanism 51 is driven to move synchronously, and the size of the crystal before processing can be detected while the crystal direction is detected. Compared with the related art, the overall structure of the grinder 100 provided in the present application is more compact and requires fewer drive mechanisms, thereby reducing the cost of the grinder 100.

[0045] like Figure 5 As shown, illustratively, the first detection mechanism 51 includes a first mounting frame 511 and a dimension detector 512 , the dimension detector 512 is connected to the first mounting frame 511 , and the first mounting frame 511 is connected to the detection feeding module 321 or the crystal orientation detector 322 .

[0046] In some examples, the dimension detector 512 includes a measuring head 5121, a sensor 5122, a fifth guide rail 5123 and a driving member 5124, wherein the fifth guide rail 5123 is disposed on the first mounting frame 511, the measuring head 5121 is slidably connected to the fifth guide rail 5123, the driving member 5124 is connected to the measuring head 5121 and drives the measuring head 5121 to move along the fifth guide rail 5123, and the sensor 5122 is electrically connected to the measuring head 5121.

[0047] In the example of the present application, the driving member 5124 includes one of a cylinder drive, a hydraulic drive, or an electric push rod.

[0048] In order to clearly illustrate the technical solution of the present application, the working method of the size detector 512 is described below, which specifically includes the following steps:

[0049] S1. During measurement, the driving member 5124 first pushes the measuring head 5121 to the limit position.

[0050] When the driving member 5124 pushes the measuring head 5121 to the limit position, the measuring head 5121 is not in contact with the crystal yet.

[0051] S2. The detection feeding module 321 in the crystal direction detection mechanism 32 drives the first detection mechanism 51 to continue to move backward. After the measuring head 5121 contacts the crystal, the sensor 5122 is compressed, thereby measuring the diameter of the crystal.

[0052] Furthermore, the second detection mechanism is connected to the second feeding module 421 or the second grinding module 422, so that when the second grinding mechanism 42 moves, the second detection mechanism is driven to move synchronously, and after the grinding is completed, the second grinding mechanism 42 drives the second detection mechanism to move, so as to detect the size of the processed crystal. Compared with the related art, the overall structure of the grinder 100 provided in the present application is more compact and requires fewer drive mechanisms, thereby reducing the cost of the grinder 100.

[0053] Exemplarily, the second detection mechanism includes a second mounting frame and a dimension detector 512 connected to the second mounting frame, and the second mounting frame is connected to the second feeding module 421 or the second grinding mechanism 42 .

[0054] It should be noted that the size detector 512 included in the second detection mechanism is basically the same in structure as the size detector 512 included in the first detection mechanism 51, and the second detection mechanism is arranged on the second mounting frame through its fifth guide rail, which will not be elaborated here.

[0055] In summary, the grinding machine 100 provided by the present application integrates the crystal orientation detection component 30, the grinding component 40, and the size detection component 50 on the workbench component 20, reducing the number of transfers and fixations of the crystal during the processing, thereby ensuring the processing accuracy of the crystal. In addition, the integration of multiple functional components makes the overall structure of the grinding machine 100 more compact and reduces the cost of the grinding machine 100.

[0056] It should be understood that the above description of the disclosed embodiments enables professionals and technicians in the field to implement or use the present application. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A grinding machine for crystal processing, characterized in that: The grinding machine comprises: A base, wherein a first guide rail extending along a first direction and a second guide rail extending along the first direction are provided on the base, and the first guide rail is parallel to the second guide rail; A workbench assembly, the workbench assembly comprising a workbench base, a headstock and a tailstock, the workbench base being slidably connected to the first guide rail, the headstock and the tailstock being connected to the workbench base, the headstock and the tailstock being used to fix the crystal after cooperating with each other; a third guide rail extending along the first direction is provided on the workbench base, at least one of the headstock or the tailstock being slidably connected to the third guide rail; A crystal direction detection component, the crystal direction detection component is arranged on one side of the workbench component, the crystal direction detection component comprises a crystal direction detection base and a crystal direction detection mechanism, the crystal direction detection base is slidably connected to the second guide rail, a fourth guide rail extending along the second direction is arranged on the crystal direction detection base, and the crystal direction detection mechanism is slidably connected to the fourth guide rail; A grinding assembly, the grinding assembly is connected to the base, the grinding assembly is disposed on one side of the workbench assembly, the grinding assembly comprises a first grinding mechanism and a second grinding mechanism, the first grinding mechanism and the second grinding mechanism are used to grind the crystal; and A size detection component includes a first detection mechanism for detecting the size of the crystal before processing and a second detection mechanism for detecting the size of the crystal after processing. The first detection mechanism is fixedly arranged relative to the crystal orientation detection mechanism, and the second detection mechanism is fixedly arranged relative to the second grinding mechanism.

2. The grinding machine according to claim 1, characterized in that: The second direction and the first direction are arranged perpendicular to each other.

3. The grinding machine according to claim 1, characterized in that: The crystal direction detection component and the second grinding mechanism are respectively arranged on two sides of the workbench component.

4. The grinding machine according to claim 1, characterized in that: In the grinding assembly, the first grinding mechanism and the second grinding mechanism are arranged on the same side of the workbench assembly.

5. The grinding machine according to claim 1, characterized in that: The crystal direction detection mechanism includes a detection feed module slidably connected to the fourth guide rail and a crystal direction detector connected to the detection feed module. The detection feed module drives the crystal direction detector to move along the fourth guide rail. The first detection mechanism is connected to the detection feed module or the crystal direction detector.

6. The grinding machine according to claim 5, characterized in that: The first detection mechanism includes a first mounting frame and a dimension detector connected to the first mounting frame, and the first mounting frame is connected to the detection feeding module or the crystal direction detector.

7. The grinding machine according to claim 6, characterized in that: The second grinding mechanism includes a second feeding module and a second grinding module connected to the second feeding module, the second feeding module drives the second grinding mechanism to move along the second direction, and the second detection mechanism is connected to the second feeding module or the second grinding module.

8. The grinding machine according to claim 7, characterized in that: The second detection mechanism includes a second mounting frame and a dimension detector connected to the second mounting frame, and the second mounting frame is connected to the second feeding module or the second grinding module.

9. The grinding machine according to claim 8, characterized in that: The dimension detector includes a measuring head, a sensor, a fifth guide rail and a driving member. The fifth guide rail is arranged on the first mounting frame or the second mounting frame. The measuring head is slidably connected to the fifth guide rail. The driving member is connected to the measuring head and drives the measuring head to move along the fifth guide rail. The sensor is electrically connected to the measuring head.

10. The grinding machine according to claim 9, characterized in that: The driving member includes one of a cylinder driver, a hydraulic driver or an electric push rod.

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