Semiconductor plastic package mold

Abstract

The utility model discloses a semiconductor plastic package mold which comprises an upper mold base, and an upper mold is arranged on the upper mold base. A lower die is arranged on the lower die base, and a cooling fin positioning groove is formed in the bottom wall of a forming cavity of the lower die; the pressing mechanism is arranged in the forming cavity of the upper mold and is used for pressing a semiconductor to be plastically packaged; the ejection mechanism comprises a second groove formed in the lower die base, a second sliding plate is arranged in the second groove in a sliding fit mode, an ejection column and an iron block are installed on the upper surface and the lower surface of the second sliding plate respectively, an electromagnet is arranged on the bottom wall of the second groove, and the ejection column is used for ejecting the semiconductor cooling fins out of the cooling fin positioning groove. And a second spring is arranged between the top wall of the second groove and the second sliding plate. According to the utility model, the iron block is attracted by the electromagnet, so that the top end of the support pillar leaves the radiating fin positioning groove, and the radiating fin of a semiconductor to be plastically packaged can be conveniently placed in the radiating fin positioning groove; and after the upper mold and the lower mold are closed, the electromagnet is powered off, and the ejection column can automatically eject the semiconductor out under the reset action of the second spring.

Description

Technical Field

[0001] The utility model relates to the technical field of mold design, in particular to a semiconductor plastic packaging mold. Background Art

[0002] When some semiconductor products are plastic-encapsulated, the liquid encapsulation plastic will flow between the heat sink and the bottom surface of the lower mold cavity, causing the outer surface of the heat sink to be adhered with resin. If the heat sink is wrapped by the overflowing resin, it will block the heat dissipation channel, affect the heat dissipation, and cause the heat inside the chip to rise, thus affecting the product life. If the heat sink is also used as the GND level, the resin will also affect the conductivity of the heat sink and affect the electrical performance.

[0003] At present, the prior art defines the placement position of the semiconductor by providing a positioning groove in the lower mold cavity of the semiconductor plastic encapsulation mold, and at the same time, provides a clamping mechanism in the upper mold cavity of the semiconductor plastic encapsulation mold, so that during the plastic encapsulation process, the clamping mechanism tightly fits the heat sink of the semiconductor to the bottom surface of the lower mold, so as to prevent the resin from flowing between the heat sink and the bottom surface of the lower mold cavity during the plastic encapsulation process; and in order to facilitate the removal of the encapsulated semiconductor, an ejection mechanism is provided on the bottom wall of the positioning groove, but the ejection mechanism generally realizes the ejection function through the reset action of a spring, such as Chinese patent publication No. CN 208801544U discloses a semiconductor plastic encapsulation mold that can prevent the heat sink from being offset, by providing an ejector assembly in the lower mold cavity, and ejecting the encapsulated semiconductor through the ejector assembly, but the ejection block of the ejector assembly will hinder the semiconductor from being placed in the heat sink limiting structure of the lower mold cavity when the spring is free; therefore, we propose a semiconductor plastic encapsulation mold to improve this. Utility Model Content

[0004] The purpose of the utility model is to improve and innovate the shortcomings and problems existing in the background technology, and to provide a semiconductor plastic packaging mold to prevent resin from flowing between the heat sink and the bottom surface of the lower mold cavity during the plastic packaging process, while facilitating the removal and placement of semiconductors with heat sinks.

[0005] A semiconductor plastic packaging mold, comprising:

[0006] An upper die base, wherein an upper die is arranged on the lower surface of the upper die base;

[0007] A lower die seat, wherein a lower die is arranged on the upper surface of the lower die seat, and a heat sink positioning groove is arranged on the bottom wall of the molding cavity of the lower die;

[0008] A lifting mechanism, the lifting mechanism is used to drive the upper die base to move closer to or away from the lower die base;

[0009] A pressing mechanism, which is disposed in the molding cavity of the upper mold and is used to press the semiconductor to be encapsulated so that the heat sink of the semiconductor is closely fitted with the bottom surface of the heat sink positioning groove;

[0010] An ejection mechanism is arranged on the lower mold base, and the ejection mechanism includes a second groove opened in the lower mold base, a second slide plate is slidably fitted in the second groove, a ejection column and an iron block are respectively installed on the upper surface and the lower surface of the second slide plate, an electromagnet is arranged on the bottom wall of the second groove, the ejection column is used to eject the heat sink of the semiconductor out of the heat sink positioning groove, and a second spring is arranged between the top wall of the second groove and the second slide plate.

[0011] A further solution is that the pressing mechanism includes a fixed cylinder installed on the molding cavity of the upper mold, and the fixed cylinder is slidably fitted with a pressure column by opening a first groove, and a first slide is installed on the pressure column. The side wall of the first groove is provided with a sliding groove that slidably fits with the first slide, and a first spring is arranged between the first slide and the top wall of the first groove.

[0012] A further solution is that a bottom plate is arranged directly below the lower die seat, a guide column is fixedly connected to the upper surface of the bottom plate, and a top plate is fixedly connected to the top end of the guide column.

[0013] A further solution is that the lifting mechanism is arranged on the top plate, and the lifting mechanism includes a hydraulic cylinder installed on the top plate, the telescopic end of the hydraulic cylinder is fixedly connected to the upper mold base, and the two ends of the upper mold base are slidably matched with the guide column by opening a through hole.

[0014] A further solution is that a buffer mechanism is provided between the lower die base and the base plate, the buffer mechanism includes a fixed block installed on the lower die base, the fixed block is rotatably connected to a connecting rod, the other end of the connecting rod is rotatably connected to a sliding block, the sliding block is slidably connected to the sliding rod, the sliding rod is installed on the base plate through a support plate, and a third spring is provided between the support plate and the sliding block.

[0015] A further solution is that a cavity is provided inside the lower die base.

[0016] A further solution is that a rubber pad is provided at the bottom end of the pressure column.

[0017] Compared with the prior art, the utility model has the following beneficial effects: the utility model uses the electromagnet to absorb the iron block so that the top of the push column leaves the heat sink positioning groove, thereby facilitating the placement of the heat sink of the semiconductor to be encapsulated in the heat sink positioning groove; and when the upper mold and the lower mold are closed, the electromagnet is powered off so that the electromagnet no longer absorbs the iron block, so that after demolding, the push column can eject the semiconductor under the resetting action of the second spring; in addition, through the mutual cooperation of the fixed cylinder, the first groove, the slide groove, the first spring, the first slide plate, the pressure column and the rubber pad, it is convenient to press the heat sink against the bottom surface of the molding cavity of the lower mold, thereby ensuring that during the plastic encapsulation process, the heat sink can always be tightly and stably fitted with the bottom surface of the molding cavity of the lower mold, and there will be no glue overflow. Moreover, under the buffering action of the first spring and the rubber pad, it can prevent the pressure column from excessively pressing the semiconductor product and causing damage to the semiconductor product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of the front structure of the device provided by an embodiment of the utility model;

[0020] Figure 2 A schematic cross-sectional structure diagram of a pressing mechanism provided in an embodiment of the utility model;

[0021] Figure 3 This is a schematic cross-sectional structure diagram of the lower die base provided in an embodiment of the utility model.

[0022] Figure numerals: upper mold 1, lower mold 2, pressing mechanism 3, fixed cylinder 31, first groove 32, slide groove 33, first spring 34, first slide plate 35, pressure column 36, rubber pad 37, heat sink positioning groove 4, ejection mechanism 5, second groove 51, electromagnet 52, iron block 53, second slide plate 54, second spring 55, ejector column 56, lower mold base 6, cavity 61, limit block 7, guide column 8, top plate 9, hydraulic cylinder 10, upper mold base 11, bottom plate 12, buffer mechanism 13, fixed block 131, connecting rod 132, sliding block 133, sliding rod 134, third spring 135. DETAILED DESCRIPTION

[0023] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0024] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element at the same time.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific implementations and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0026] See also Figure 1-Figure 3 The utility model provides a semiconductor plastic encapsulation mold, including a bottom plate 12, four guide columns 8 are fixedly connected to the upper surface of the bottom plate 12, and a top plate 9 is fixedly connected to the top of the guide column 8. A lifting mechanism is arranged on the lower surface of the top plate 9, and the lifting mechanism includes a hydraulic cylinder 10, and the telescopic end of the hydraulic cylinder 10 is fixedly connected to the upper die seat 11, and the two ends of the upper die seat 11 are slidably matched with the guide columns 8 by opening through holes. An upper die 1 is arranged on the lower surface of the upper die seat 11; a lower die seat 6 is arranged oppositely directly below the upper die seat 11, and a lower die 2 is arranged on the upper surface of the lower die seat 6, and the two ends of the lower die seat 6 are slidably matched with the guide columns 8 by setting limit blocks 7. A buffer mechanism 13 is provided between the lower die base 6 and the bottom plate 12, and the buffer mechanism 13 includes a fixed block 131 installed on the lower surface of the lower die base 6, a connecting rod 132 is rotatably connected to the fixed block 131, and a sliding block 133 is rotatably connected to the other end of the connecting rod 132, and the sliding block 133 is slidably connected to a sliding rod 134, and the sliding rod 134 is installed on the bottom plate 12 through a supporting plate, and a third spring 135 is provided between the supporting plate and the sliding block 133. By providing the buffer mechanism 13, a buffering effect can be played when the mold is closed to avoid damage to the mold due to excessive speed.

[0027] The bottom wall of the molding cavity of the lower mold 2 is provided with a heat sink positioning groove 4; the lower mold base 6 is provided with an ejection mechanism 5, which includes a second groove 51 provided in the lower mold base 6, a second slide plate 54 is slidably fitted in the second groove 51, a top column 56 and an iron block 53 are respectively installed on the upper and lower surfaces of the second slide plate 54, an electromagnet 52 is provided on the bottom wall of the second groove 51, and the top column 56 is used to eject the heat sink of the semiconductor out of the heat sink positioning groove 4. A second spring 55 is provided between the top wall of the second groove 51 and the second slide plate 54, and the second spring 55 is sleeved on the top column 56. It can be understood that the heat sink positioning groove 4 can limit the position of the semiconductor during the mold closing process to prevent it from moving; during the mold closing process, the electromagnet 52 adsorbs the iron block 53 so that the top of the top column 56 leaves the heat sink positioning groove 4, so that the top column 56 will not hinder the heat sink of the semiconductor to be encapsulated from being placed in the heat sink positioning groove 4; and when the upper mold 1 and the lower mold 2 are closed, the electromagnet 52 is powered off so that the electromagnet 52 no longer adsorbs the iron block 53, so that after demolding, the top column 56 ejects the semiconductor under the resetting action of the second spring 55.

[0028] A pressing mechanism 3 is provided in the molding cavity of the upper mold 1, and the pressing mechanism 3 is used to press the semiconductor to be encapsulated so that the heat sink of the semiconductor is tightly fitted with the bottom surface of the heat sink positioning groove 4; ensuring that during the encapsulation process, the heat sink can always be tightly and stably fitted with the bottom surface of the molding cavity of the lower mold 2 without glue overflow.

[0029] Specifically, the pressing mechanism 3 includes a fixed cylinder 31 installed on the molding cavity of the upper mold 1, and a pressure column 36 is slidably matched with the fixed cylinder 31 by opening a first groove 32, and a first slide plate 35 is installed on the pressure column 36. The side wall of the first groove 32 is provided with a slide groove 33 that slides with the first slide plate 35, and a first spring 34 is arranged between the first slide plate 35 and the top wall of the first groove 32. A rubber pad 37 is arranged at the bottom end of the pressure column 36. It can be understood that through the mutual cooperation of the fixed cylinder 31, the first groove 32, the slide groove 33, the first spring 34, the first slide plate 35, the pressure column 36 and the rubber pad 37, it is convenient to press the heat sink on the bottom surface of the molding cavity of the lower mold 2, so as to ensure that during the plastic packaging process, the heat sink can always be tightly and stably fitted with the bottom surface of the molding cavity of the lower mold 2, and there will be no glue overflow; and under the buffering effect of the first spring 34 and the rubber pad 37, it can prevent the pressure column 36 from excessively pressing the semiconductor product and causing damage to the semiconductor product.

[0030] Optionally, a cavity 61 is provided inside the lower mold base 6, and the cavity 61 can reduce the weight of the mold.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the utility model.

[0032] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example.

[0033] Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Mentioning "embodiment" in this article means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present embodiment application. The appearance of this phrase in various positions in the specification is not necessarily the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It can be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0034] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A semiconductor plastic packaging mold, characterized in that: include: An upper die base (11), wherein an upper die (1) is arranged on a lower surface of the upper die base (11); A lower die base (6), wherein a lower die (2) is arranged on the upper surface of the lower die base (6), and a heat sink positioning groove (4) is provided on the bottom wall of the molding cavity of the lower die (2); A lifting mechanism, the lifting mechanism being used to drive the upper die base (11) to move closer to or away from the lower die base (6); A pressing mechanism (3), the pressing mechanism (3) being arranged in the molding cavity of the upper mold (1), the pressing mechanism (3) being used to press the semiconductor to be encapsulated so that the heat sink of the semiconductor is closely fitted to the bottom surface of the heat sink positioning groove (4); An ejection mechanism (5), the ejection mechanism (5) being arranged on the lower die base (6), the ejection mechanism (5) comprising a second groove (51) opened in the lower die base (6), a second slide plate (54) being slidably fitted in the second groove (51), a push column (56) and an iron block (53) being respectively mounted on the upper and lower surfaces of the second slide plate (54), an electromagnet (52) being arranged on the bottom wall of the second groove (51), the push column (56) being used to eject the heat sink of the semiconductor from the heat sink positioning groove (4), and a second spring (55) being arranged between the top wall of the second groove (51) and the second slide plate (54).

2. The semiconductor plastic packaging mold according to claim 1, characterized in that: The pressing mechanism (3) comprises a fixed cylinder (31) mounted on the molding cavity of the upper mold (1); a pressing column (36) is slidably matched with the fixed cylinder (31) by opening a first groove (32); a first slide plate (35) is installed on the pressing column (36); a sliding groove (33) slidably matched with the first slide plate (35) is opened on the side wall of the first groove (32); and a first spring (34) is arranged between the first slide plate (35) and the top wall of the first groove (32).

3. The semiconductor plastic packaging mold according to claim 1, characterized in that: A bottom plate (12) is arranged directly below the lower die base (6); a guide column (8) is fixedly connected to the upper surface of the bottom plate (12); and a top plate (9) is fixedly connected to the top of the guide column (8).

4. A semiconductor plastic packaging mold according to claim 3, characterized in that: The lifting mechanism is arranged on the top plate (9), and comprises a hydraulic cylinder (10) mounted on the top plate (9), the telescopic end of the hydraulic cylinder (10) is fixedly connected to the upper die seat (11), and the two ends of the upper die seat (11) are slidably matched with the guide column (8) by opening a through hole.

5. The semiconductor plastic packaging mold according to claim 3, characterized in that: A buffer mechanism (13) is provided between the lower die base (6) and the bottom plate (12), the buffer mechanism (13) comprising a fixed block (131) mounted on the lower die base (6), a connecting rod (132) being rotatably connected to the fixed block (131), a sliding block (133) being rotatably connected to the other end of the connecting rod (132), the sliding block (133) being slidably connected to a sliding rod (134), the sliding rod (134) being mounted on the bottom plate (12) via a support plate, and a third spring (135) being provided between the support plate and the sliding block (133).

6. The semiconductor plastic packaging mold according to claim 1, characterized in that: A cavity (61) is provided inside the lower die base (6).

7. The semiconductor plastic packaging mold according to claim 2, characterized in that: A rubber pad (37) is provided at the bottom end of the pressure column (36).

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