Detection device

Abstract

The utility model discloses detection equipment. The detection equipment comprises a transfer assembly, a first placing station, a second placing station, a third placing station, a fourth placing station, a first detection assembly, a second detection assembly, a third detection assembly, a fourth detection assembly, a first rotating assembly, a second rotating assembly and a third rotating assembly. The transfer assembly is used for transferring a chip among the assemblies, the first detection assembly is used for detecting the first face of the chip, the second detection assembly is used for detecting the second face of the chip, the third detection assembly is used for detecting the third face of the chip, and the fourth detection assembly is used for detecting the fourth face of the chip. The first rotating assembly, the second rotating assembly and the third rotating assembly are used for rotating the chip. The detection equipment provided by the utility model can be used for detecting the side surface of the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of detection device equipment, in particular to a detection device. Background Art

[0002] In the related art, after the chip is manufactured, it needs to be inspected to determine whether there are defects on the surface of the chip to ensure that the yield of the chip is high. Among them, the existing inspection equipment will inspect the back and front of the chip when inspecting the chip, so as to ensure that the yield of the front and back of the chip is high. However, since the inspection equipment can only detect the front and back of the chip, when there are defects on the side of the chip, the inspection equipment cannot detect the defect of the chip, which will cause the yield of the chip to be too low. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a detection device capable of detecting the side of a chip.

[0004] According to an embodiment of the present utility model, a detection device is used to detect a chip, wherein the side surface of the chip includes a first surface, a second surface, a third surface and a fourth surface, wherein the first surface is arranged opposite to the third surface, and the second surface is arranged opposite to the fourth surface, and the detection device includes:

[0005] Transfer components;

[0006] A first placement station, used for placing the chip;

[0007] A second placement station is used to place the chip;

[0008] A third placement station is used to place the chip;

[0009] A fourth placement station, used for placing the chip;

[0010] A first detection component, used for detecting the first surface of the chip placed on the first placement station;

[0011] A second detection component, used for detecting the second surface of the chip placed on the second placement station;

[0012] A third detection component, used for detecting the third surface of the chip placed on the third placement station;

[0013] A fourth detection component, used for detecting the fourth surface of the chip placed on the fourth placement station;

[0014] A first rotating component, used for rotating the chip;

[0015] A second rotating assembly, used for rotating the chip;

[0016] A third rotating assembly, used for rotating the chip;

[0017] Wherein, the first rotating assembly is located between the first placement station and the second placement station, the second rotating assembly is located between the second placement station and the third placement station, and the third rotating assembly is located between the third placement station and the fourth placement station;

[0018] The transfer assembly is used to transfer the chip on the first placement station to the first rotating assembly, and the transfer assembly is also used to transfer the chip on the first rotating assembly to the second placement station;

[0019] The transfer assembly is also used to transfer the chip on the second placement station to the second rotation assembly, and the transfer assembly is also used to transfer the chip on the second rotation assembly to the third placement station;

[0020] The transfer component is also used to transfer the chip on the third placement station to the third rotation component, and the transfer component is also used to transfer the chip on the third rotation component to the fourth placement station.

[0021] According to the detection device of the embodiment of the utility model, at least the following beneficial effects are achieved: after the chip is placed at the first placement station, the first detection component can detect the first side of the chip on the first placement station, then the transfer component transfers the chip to the first rotating component, the first rotating component rotates the chip, then the transfer component places the chip on the second placement station, the second detection component can detect the second side of the chip on the second placement station, then the transfer component transfers the chip to the second rotating component, the second rotating component rotates the chip, then the transfer component places the chip on the third placement station, the third detection component can detect the third side of the chip on the third placement station, then the transfer component transfers the chip to the third rotating component, the third rotating component rotates the chip, then the transfer component places the chip on the fourth placement station, and the fourth detection component can detect the fourth side of the chip on the fourth placement station. In this way, through the cooperation of the transfer component, the first detection component, the second detection component, the third detection component, the fourth detection component, the first rotating component, the second rotating component and the third rotating component, the detection device can detect each side of the chip. Specifically, the detection device can detect the side of the chip.

[0022] According to the detection device of some embodiments of the present invention, the detection device further includes a flipping component, and the flipping component is used to flip the chip.

[0023] According to the detection equipment of some embodiments of the utility model, the flip assembly includes a first driving member, a flip member, a first protective member, a second protective member, a rotating member and a fixed member, the first driving member is connected to the flip member and the rotating member, the flip member is provided with a placement through hole, the first protective member and the second protective member are both slidably connected to the fixed member, and the first protective member and the second protective member are both connected to the rotating member, wherein the first driving member can drive the flip member to rotate, the first driving member can simultaneously drive the rotating member to rotate, the rotating member rotates and drives the first protective member and the second protective member to move relative to the fixed member, so that the first protective member and the The second protective member switches between a first state, a second state and a third state; when the first protective member and the second protective member are in the first state, the first protective member covers one end of the placement through hole to form a placement groove, the placement groove is used to place the chip, and the second protective member leaks out of the other end of the placement through hole; when the first protective member and the second protective member are in the second state, the second protective member covers one end of the placement through hole to form the placement groove, and the first protective member leaks out of the other end of the placement through hole; when the first protective member and the second protective member are in the third state, the first protective member and the second protective member respectively cover the two ends of the placement through hole.

[0024] According to the detection equipment of some embodiments of the utility model, the rotating member is provided with a moving groove, the first protective member has a first moving part, the second protective member has a second moving part, the first moving part and the second moving part are both slidably arranged in the moving groove, the groove wall of the moving groove includes a first straight part, two second straight parts and two curved parts, the two ends of the first straight part are respectively connected to the two curved parts, the two second straight parts are respectively connected to the two curved parts, the first straight part and the second straight part both extend along the circumferential direction of the rotating member, and along the axial direction of the rotating member, the first straight part and the second straight part are spaced apart, and when the rotating member rotates, the first moving part and the second moving part can both slide between the first straight part and the second straight part.

[0025] According to some embodiments of the detection equipment of the present utility model, the first rotating component includes a positioning member and a second driving member, the positioning member is provided with a positioning groove, the positioning groove is used to place the chip, the second driving member is connected to the positioning member, and the second driving member is used to drive the positioning member to rotate.

[0026] According to the detection equipment of some embodiments of the utility model, the first rotating component also includes a supporting member and a third driving member, the supporting member is arranged in the positioning groove, the third driving member is connected to the supporting member, and the third driving member is used to drive the supporting member to rise and fall relative to the positioning member.

[0027] According to the detection equipment of some embodiments of the utility model, the transfer assembly includes a turret, a suction member and a fourth driving member, the suction member is connected to the turret, the suction member is used to suck the chip, the turret is connected to the fourth driving member, and the fourth driving member is used to drive the turret to rotate, so that the turret drives the suction member to rotate.

[0028] According to the detection equipment of some embodiments of the present utility model, a plurality of the suction members are provided, and the plurality of the suction members are circumferentially arranged around the center of the turret.

[0029] According to the detection equipment of some embodiments of the present invention, the first detection component includes a camera and a bracket, and the camera is connected to the bracket.

[0030] According to the detection equipment of some embodiments of the present utility model, the camera is slidably connected to the bracket.

[0031] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0033] Figure 1 It is a schematic diagram of the detection equipment of some embodiments of the utility model;

[0034] Figure 2 It is a schematic diagram of a flip assembly in a detection device of some embodiments of the utility model;

[0035] Figure 3 It is a partial schematic diagram of the flip assembly in the detection device of the first embodiment of the utility model;

[0036] Figure 4 It is a partial schematic diagram of a flip assembly in a detection device according to a second embodiment of the utility model;

[0037] Figure 5 It is a partial schematic diagram of a flip assembly in a detection device according to a third embodiment of the utility model;

[0038] Figure 6 It is a partial schematic diagram of a flip assembly in a detection device according to a fourth embodiment of the utility model;

[0039] Figure 7 It is a partial schematic diagram of a flip assembly in a detection device according to a fifth embodiment of the utility model;

[0040] Figure 8 It is a partial schematic diagram of a flip assembly in a detection device according to a sixth embodiment of the utility model;

[0041] Fig. 9 It is a partial schematic diagram of a flip assembly in a detection device according to a seventh embodiment of the utility model;

[0042] Fig.10 It is a partial schematic diagram of a flip assembly in a detection device according to an eighth embodiment of the present utility model;

[0043] Fig.11 It is a partial schematic diagram of a flip assembly in a detection device according to a ninth embodiment of the utility model;

[0044] Fig.12 It is a schematic diagram of a first rotating assembly in a detection device of some embodiments of the utility model;

[0045] Fig.13 It is a partial schematic diagram of a first rotating assembly in a detection device of a first embodiment of the utility model;

[0046] Fig.14 It is a partial schematic diagram of a first rotating assembly in a detection device according to a second embodiment of the utility model;

[0047] Fig.15 It is a schematic diagram of a transfer component in a detection device of some embodiments of the utility model;

[0048] Fig.16 It is a schematic diagram of a first detection component in a detection device according to some embodiments of the present utility model.

[0049] Reference numerals:

[0050] Detection device 10, transfer assembly 100, turret 110, suction member 120, first placement station 200, second placement station 300, third placement station 400, fourth placement station 500, first detection assembly 600, camera 610, bracket 620, second detection assembly 700, third detection assembly 800, fourth detection assembly 900, first rotating assembly 1000, positioning member 1010, positioning groove 1020, abutting member 1030, second driving member 1040, third driving member 1050, The second rotating component 1100, the third rotating component 1200, the flipping component 1300, the first driving component 1310, the flipping component 1320, the placement through hole 1321, the placement groove 1322, the rotating component 1330, the movement groove 1331, the first straight portion 1332, the second straight portion 1333, the curved portion 1334, the first protective component 1340, the first moving portion 1341, the second protective component 1350, the second moving portion 1351, the fixing component 1360, the loading component 1400, and the unloading component 1500. DETAILED DESCRIPTION

[0051] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0052] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0053] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0054] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0055] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0056] Please refer to Figure 1 In some embodiments, the detection device 10 is used to detect the chip, and the shape of the chip can be a cuboid or a cube. The side of the chip includes a first side, a second side, a third side and a fourth side, the first side is arranged opposite to the third side, and the second side is arranged opposite to the fourth side. The detection device 10 includes: a transfer component 100, a first placement station 200, a second placement station 300, a third placement station 400, a fourth placement station 500, a first detection component 600, a second detection component 700, a third detection component 800, a fourth detection component 900, a first rotation component 1000, a second rotation component 1100 and a third rotation component 1200. Among them, the first placement station 200 is used to place the chip. The first placement station 200 can be a plane, and the chip can be placed on the plane, and then the first detection component 600 can be convenient for detection. The first placement station 200 can be a groove, wherein the side wall of the groove has an opening, and the opening can be used for the first side of the chip to leak out so as to facilitate the detection of the first detection component 600. The second placement station 300 is used to place the chip. The second placement station 300 can be a plane, and the chip can be placed on the plane, and then it is convenient for the second detection component 700 to detect. The second placement station 300 can be a groove, wherein the side wall of the groove has an opening, and the opening can be used for the second side of the chip to leak out, thereby facilitating the detection of the second detection component 700. The third placement station 400 is used to place the chip. The third placement station 400 can be a plane, and the chip can be placed on the plane, and then it is convenient for the third detection component 800 to detect. The third placement station 400 can be a groove, wherein the side wall of the groove has an opening, and the opening can be used for the third side of the chip to leak out, thereby facilitating the detection of the third detection component 800. The fourth placement station 500 is used to place the chip. The fourth placement station 500 can be a plane, and the chip can be placed on the plane, and then it is convenient for the fourth detection component 900 to detect. The fourth placement station 500 can be a groove, wherein the side wall of the groove has an opening, and the opening can be used for the fourth side of the chip to leak out, thereby facilitating the detection of the fourth detection component 900.

[0057] The above describes the placement station where chips can be placed. Please continue to refer to Figure 1, the following describes the detection component for detecting the chip. The first detection component 600 is used to detect the first side of the chip placed on the first placement station 200. The first detection component 600 detects the first side of the chip by capturing the image of the first side of the chip through the camera 610, and then comparing the actual image of the first side with the image of the qualified chip, so as to determine whether the first side is qualified. The second detection component 700 is used to detect the second side of the chip placed on the second placement station 300. The second detection component 700 detects the second side of the chip by capturing the image of the second side of the chip through the camera 610, and then comparing the actual image of the second side with the image of the qualified chip, so as to determine whether the second side is qualified. The third detection component 800 is used to detect the third side of the chip placed on the third placement station 400. The third detection component 800 detects the third side of the chip by capturing the image of the third side of the chip through the camera 610, and then comparing the actual image of the third side with the image of the qualified chip, so as to determine whether the third side is qualified. The fourth detection component 900 is used to detect the fourth side of the chip placed on the fourth placement station 500. The fourth detection component 900 detects the fourth side of the chip by capturing an image of the fourth side of the chip through the camera 610, and then compares the actual image of the fourth side with the image of a qualified chip to determine whether the fourth side is qualified.

[0058] In order to detect each side of the chip, such as the first side, the second side and the third side, the chip can be rotated. Specifically, for example, after rotating the chip 90 degrees, the chip can be changed from the first side facing the detection component to the second side facing the detection component. The chip rotation can be achieved by a rotating component. Specifically, the first rotating component 1000 is used to rotate the chip. The second rotating component 1100 is used to rotate the chip. The third rotating component 1200 is used to rotate the chip.

[0059] For further information, please refer to Figure 1 , the first rotating assembly 1000 is located between the first placement station 200 and the second placement station 300, the second rotating assembly 1100 is located between the second placement station 300 and the third placement station 400, and the third rotating assembly 1200 is located between the third placement station 400 and the fourth placement station 500. In this way, after the first side of the chip is detected by the first detection assembly 600, the chip can be rotated by the first rotating assembly 1000, so as to facilitate the second detection assembly 700 to detect the second side of the chip. Similarly, after the second side of the chip is detected by the second detection assembly 700, the chip can be rotated by the second rotating assembly 1100, so as to facilitate the third detection assembly 800 to detect the third side of the chip. After the third side of the chip is detected by the third detection assembly 800, the chip can be rotated by the third rotating assembly 1200, so as to facilitate the fourth detection assembly 900 to detect the fourth side of the chip.

[0060] The transfer assembly 100 is used to transfer the chip on the first placement station 200 to the first rotating assembly 1000, and the transfer assembly 100 is also used to transfer the chip on the first rotating assembly 1000 to the second placement station 300. The transfer assembly 100 is also used to transfer the chip on the second placement station 300 to the second rotating assembly 1100, and the transfer assembly 100 is also used to transfer the chip on the second rotating assembly 1100 to the third placement station 400. The transfer assembly 100 is also used to transfer the chip on the third placement station 400 to the third rotating assembly 1200, and the transfer assembly 100 is also used to transfer the chip on the third rotating assembly 1200 to the fourth placement station 500. The transfer assembly 100 can realize the transfer of chips between various components, thereby completing the detection of chips.

[0061] Specifically, after the first placement station 200 places the chip, the first detection component 600 can detect the first side of the chip on the first placement station 200, and then the transfer component 100 transfers the chip to the first rotation component 1000, and the first rotation component 1000 rotates the chip, and then the transfer component 100 places the chip on the second placement station 300, and the second detection component 700 can detect the second side of the chip on the second placement station 300, and then the transfer component 100 transfers the chip to the second rotation component 1100. On the chip, the second rotating assembly 1100 rotates the chip, and then the transfer assembly 100 places the chip on the third placement station 400, and the third detection assembly 800 can detect the third surface of the chip on the third placement station 400, and then the transfer assembly 100 transfers the chip to the third rotating assembly 1200, and the third rotating assembly 1200 rotates the chip, and then the transfer assembly 100 places the chip on the fourth placement station 500, and the fourth detection assembly 900 can detect the fourth surface of the chip on the fourth placement station 500. In this way, through the cooperation of the transfer assembly 100, the first detection assembly 600, the second detection assembly 700, the third detection assembly 800, the fourth detection assembly 900, the first rotating assembly 1000, the second rotating assembly 1100 and the third rotating assembly 1200, the detection device 10 can detect each side of the chip. Specifically, the detection device 10 can detect the side of the chip.

[0062] For further information, please refer to Figure 2In some embodiments, the detection device 10 further includes a flipping component 1300, and the flipping component 1300 is used to flip the chip. Specifically, the chip has a first side, a second side, a third side, and a fourth side. The chip also includes a fifth side and a sixth side relative to each other. That is, the front and back sides of the chip. Among them, the chip can be flipped from the front side facing up to the back side facing up by the flipping component 1300, or the chip can be flipped from the back side facing up to the front side facing up. It can be imagined that after the detection device 10 has detected the side of the chip, it can facilitate the chip to enter the next process directly for processing by flipping the front and back sides of the chip, which can save work efficiency.

[0063] Further, the specific structure of the flip assembly 1300 is described below. Figures 2 to 11 In some embodiments, the flip assembly 1300 includes a first driving member 1310, a flip member 1320, a first protection member 1340, a second protection member 1350, a rotating member 1330 and a fixing member 1360. The first driving member 1310 is connected to the flip member 1320 and the rotating member 1330. The flip member 1320 is provided with a placement through hole 1321 (for details, please refer to Figure 3 , Figure 3The first protective member 1340 and the second protective member 1350 do not yet cover the placement through hole 1321). The size of the placement through hole 1321 can be consistent with the size of the chip. The first protective member 1340 and the second protective member 1350 are both slidably connected to the fixed member 1360, and the first protective member 1340 and the second protective member 1350 are both connected to the rotating member 1330. Among them, the first driving member 1310 can drive the flip member 1320 to rotate, and the first driving member 1310 can simultaneously drive the rotating member 1330 to rotate, and the rotating member 1330 rotates and drives the first protective member 1340 and the second protective member 1350 to move relative to the fixed member 1360, so that the first protective member 1340 and the second protective member 1350 switch between the first state, the second state and the third state. When the first protective member 1340 and the second protective member 1350 are in the first state, the first protective member 1340 covers one end of the placement through hole 1321 to form a placement groove 1322, and the placement groove 1322 is used to place the chip, and the second protective member 1350 is exposed to the other end of the placement through hole 1321. When the first protective member 1340 and the second protective member 1350 are in the second state, the second protective member 1350 covers one end of the placement through hole 1321 to form the placement groove 1322, and the first protective member 1340 is exposed to the other end of the placement through hole 1321. When the first protective member 1340 and the second protective member 1350 are in the third state, the first protective member 1340 and the second protective member 1350 cover the two ends of the placement through hole 1321 respectively. Specifically, the first driving member 1310 can be a motor, and when the rotating member 1330 is driven by the motor to rotate, the rotating member 1330 can drive the first protective member 1340 and the second protective member 1350 to move. The motor can also drive the flip member 1320 to move, so that the flip member 1320 flips 180 degrees or 360 degrees. When the motor flips the flip member 1320, the motor can rotate forward and reverse to achieve the flip member 1320 flipping 180 degrees. Figure 5), the first protective member 1340 covers one end of the placement through hole 1321 to form a placement groove 1322, and the placement groove 1322 is used to place the chip, and the second protective member 1350 leaks out of the other end of the placement through hole 1321. In this case, the chip can be placed into the placement groove 1322 from the opening of the placement groove 1322. At this time, the front side of the chip faces up. Afterwards, the first driving member 1310 drives the flipping member 1320 and the rotating member 1330 to move, so that the first protective member 1340 and the second protective member 1350 are in the third state. In this case, the first protective member 1340 and the second protective member 1350 respectively cover the two ends of the placement through hole 1321, which can prevent the chip from falling out of the placement groove 1322 and being damaged. At this time, the flipping member 1320 continues to flip so that the back side of the chip faces up. After the flipping member 1320 flips over, the first protective member 1340 and the second protective member 1350 are in the second state (for details, please refer to Figure 4 ), the second protective member 1350 covers one end of the placement through hole 1321 to form a placement groove 1322, and the first protective member 1340 leaks out of the other end of the placement through hole 1321. At this time, the opening of the placement groove 1322 leaks out, showing that the back of the chip is facing up. In this way, the chip is placed in the placement groove 1322, and then the chip is turned over and exposed to facilitate the removal of the chip. That is, in the first state and the second state, the chip can be easily placed and removed, and in the third state, the chip can be protected from falling during the flipping process.

[0064] Furthermore, the flip member 1320 performs a circular motion under the action of the first driving member 1310, and the first protective member 1340 and the second protective member 1350 convert the rotation of the first driving member 1310 into a linear motion under the action of the first driving member 1310, so that the first protective member 1340 and the second protective member 1350 can cover or expose the placement through hole 1321. The following describes how the first protective member 1340 and the second protective member 1350 cooperate with the rotating member 1330 to achieve linear motion. Please refer to Figures 3 to 11 ,in, Figure 4 and Figure 5 The first protection member 1340 and the second protection member 1350 are shown to perform linear motion relative to the flip member 1320. As for how the first protection member 1340 and the second protection member 1350 perform linear motion when the rotating member 1330 rotates, please refer to Figures 6 to 11 In some embodiments, the rotating member 1330 is provided with a moving groove 1331, the first protective member 1340 has a first moving portion 1341, and the second protective member 1350 has a second moving portion 1351. The first moving portion 1341 and the second moving portion 1351 are both slidably disposed in the moving groove 1331. For details, please refer to Fig. 9That is, after the first moving portion 1341 slides in the moving groove 1331, the first protection member 1340 will also move, and after the second moving portion 1351 slides in the moving groove 1331, the second protection member 1350 will also move. The groove wall of the moving groove 1331 includes a first straight portion 1332, two second straight portions 1333 and two curved portions 1334. The two ends of the first straight portion 1332 are respectively connected to the two curved portions 1334, and the two second straight portions 1333 are respectively connected to the two curved portions 1334. The first straight portion 1332 and the second straight portion 1333 both extend along the circumferential direction of the rotating member 1330. Along the axial direction of the rotating member 1330, the first straight portion 1332 and the second straight portion 1333 are spaced apart (for details, please refer to Figure 7 and Figure 8 ). When the rotating member 1330 rotates, the first moving part 1341 and the second moving part 1351 can both slide between the first straight part 1332 and the second straight part 1333. Specifically, when the rotating member 1330 has not started to rotate, the first moving part 1341 and the second moving part 1351 are located in the first straight part 1332. After that, the rotating member 1330 starts to rotate, and the first moving part 1341 moves along the curved part 1334 to the second straight part 1333, and the second moving part 1351 moves from one end of the first straight part 1332 to the other end of the first straight part 1332. At this time, the first protective member 1340 leaves the placement through hole 1321, and the second protective member 1350 and the placement through hole 1321 form a placement groove 1322. The opening of the placement groove 1322 leaks out for the chip to enter. For details, please refer to Fig.10 Afterwards, the rotating member 1330 rotates in the opposite direction, the first moving portion 1341 moves from the second straight portion 1333 to the first straight portion 1332, and the second moving portion 1351 moves from one end of the first straight portion 1332 to the other end of the first straight portion 1332. At this time, the first protective member 1340 covers the placement through hole 1321, and the second protective member 1350 covers the placement through hole 1321, so that the first protective member 1340 and the second protective member 1350 protect the chip from being exposed and falling. Afterwards, the rotating member 1330 continues to rotate, the first moving portion 1341 moves from one end of the first straight portion 1332 to the other end of the first straight portion 1332, and the second moving portion 1351 moves from the curved portion 1334 to the second straight portion 1333. At this time, the second protective member 1350 leaves the placement through hole 1321, and the first protective member 1340 and the placement through hole 1321 form a placement groove 1322. The opening of the placement groove 1322 leaks out for the chip to be taken out. For details, please refer to Fig.11 .

[0065] Further, the specific structure of the first rotating assembly 1000 is described below. Figure 12 to Figure 14In some embodiments, the first rotating assembly 1000 includes a positioning member 1010 and a second driving member 1040. The positioning member 1010 is provided with a positioning groove 1020, and the positioning groove 1020 is used to place the chip. The second driving member 1040 is connected to the positioning member 1010, and the second driving member 1040 is used to drive the positioning member 1010 to rotate. The second driving member 1040 can be a motor. After the motor is connected to the positioning member 1010, the chip is placed in the positioning groove 1020. After clicking and rotating, the positioning member 1010 can be driven to rotate, thereby driving the chip to rotate, which can make each side of the chip rotate, so that the second side is detected by the second detection assembly 700, the third side is detected by the third detection assembly 800, and the fourth side is detected by the fourth detection assembly 900. Among them, the second driving member 1040 can be connected to the positioning member 1010 specifically by the motor being connected to the positioning member 1010 through a belt, and the positioning member 1010 is driven to rotate through the belt transmission.

[0066] Furthermore, it is conceivable that after the chip is placed in the positioning groove 1020, the groove wall of the positioning groove 1020 will prevent the chip from sliding out, but this will also limit the transfer component 100 from taking the chip out of the positioning groove 1020. That is, it is difficult for the transfer component 100 to take the chip out of the positioning groove 1020. In order to facilitate the transfer component 100 to take the chip out of the positioning groove 1020, the chip can be abutted against the chip by the abutting member 1030 to make the chip leave the positioning groove 1020. For details, please refer to Figure 13 to Figure 14 In some embodiments, the first rotating assembly 1000 further includes a resisting member 1030 and a third driving member 1050. The resisting member 1030 is disposed in the positioning groove 1020, and the third driving member 1050 is connected to the resisting member 1030. The third driving member 1050 is used to drive the resisting member 1030 to rise and fall relative to the positioning member 1010. Specifically, the third driving member 1050 can be a linear motor. After the linear motor is connected to the resisting member 1030, the resisting member 1030 protrudes from the center of the positioning groove 1020, which can lift the chip, thereby facilitating the transfer assembly 100 to transfer the chip. The protrusion of the resisting member 1030 can refer to Fig.14 , the abutment member 1030 is not protruding, and can be referred to Fig.13 In addition, the third driving member 1050 may be connected to the abutting member 1030 in a specific manner such that the third driving member 1050 is a rotating motor, and a cam is provided on the rotating motor. When the motor rotates, the cam may indirectly abut against the abutting member, thereby causing the abutting member to rise and fall. It should be noted that the specific structures of the second rotating assembly 1100 and the third rotating assembly 1200 may be consistent with the structure of the first rotating assembly 1000.

[0067] Further, the specific structure of the transfer assembly 100 is described below. Fig.15In some embodiments, the transfer assembly 100 includes a turret 110, a suction member 120, and a fourth driving member. The suction member 120 is connected to the turret 110, and the suction member 120 is used to suck the chip. The turret 110 is connected to the fourth driving member, and the fourth driving member is used to drive the turret 110 to rotate, so that the turret 110 drives the suction member 120 to rotate. The shape of the turret 110 is a circle, and the first placement station 200, the first detection assembly 600, the first rotation assembly 1000, the second placement station 300, the second detection assembly 700, the second rotation assembly 1100, the third placement station 400, the third detection assembly 800, the third rotation assembly 1200, the fourth placement station 500, and the fourth detection assembly 900 are sequentially arranged around the center of the turret 110. In this way, when the turret 110 is driven to rotate by the fourth driving member, the turret 110 can drive the suction member 120 to sequentially pass through the first placement station 200, the first detection component 600, the first rotation component 1000, the second placement station 300, the second detection component 700, the second rotation component 1100, the third placement station 400, the third detection component 800, the third rotation component 1200, the fourth placement station 500, and the fourth detection component 900. It can be imagined that after the suction member 120 absorbs the chip, the chip can sequentially pass through the first placement station 200, the first detection component 600, the first rotation component 1000, the second placement station 300, the second detection component 700, the second rotation component 1100, the third placement station 400, the third detection component 800, the third rotation component 1200, the fourth placement station 500, and the fourth detection component 900. In this way, the chip is aligned with the detection device 10 to complete the detection of each side. The suction member 120 can suck the chip by suction, thereby transferring the chip.

[0068] For further information, please refer to Fig.15In some embodiments, a plurality of suction members 120 are provided, and the plurality of suction members 120 are circumferentially arranged around the center of the turret 110. Among them, there can be one suction member 120, and after one suction member 120 is connected to the turret 110, the turret 110 can drive one suction member 120 to sequentially pass through the first placement station 200, the first detection component 600, the first rotation component 1000, the second placement station 300, the second detection component 700, the second rotation component 1100, the third placement station 400, the third detection component 800, the third rotation component 1200, the fourth placement station 500 and the fourth detection component 900, thereby completing the detection of the chip. In order to improve the detection efficiency, the detection device 10 can detect multiple chips at the same time, that is, multiple chips are sucked by multiple suction members 120, and then the multiple chips are detected. Specifically, assuming that there are four chips, one chip can be located at the first placement station 200 for detection, one chip can be located at the second placement station 300 for detection, one chip can be located at the third placement station 400 for detection, and one chip can be located at the third placement station 400 for detection, wherein the turret 110 rotates in conjunction with the suction piece 120 to transfer the chips, so that the new chip in the loading assembly 1400 is transferred to the first placement station 200 for detection, the chip on the first placement station 200 is transferred to the second placement station 300 for detection, the chip on the second placement station 300 is transferred to the third placement station 400 for detection, and the chip on the fourth placement station 500 is transferred to the unloading assembly 1500. In this way, by setting up multiple suction pieces 120, the detection device 10 can detect multiple chips at the same time, thereby improving the detection efficiency.

[0069] Further, the structure of the first detection component 600 is described below, please refer to Fig.16 In some embodiments, the first detection component 600 includes a camera 610 and a bracket 620, and the camera 610 is connected to the bracket 620. Specifically, the camera 610 can obtain an image of the chip, and the image of the chip obtained by the camera 610 can be transmitted to a computer for processing, so as to determine whether each side of the chip is qualified. This part belongs to the prior art and will not be further introduced here. After the bracket 620 is connected to the camera 610, the bracket 620 can play a role in supporting the camera 610. Among them, the bracket 620 can be set next to the first placement station 200. After the camera 610 is connected to the bracket 620, the angle between the camera 610 and the horizontal plane can be 60 degrees. It should be noted that the specific structures of the second detection component 700, the third detection component 800 and the fourth detection component 900 can be consistent with the structure of the first detection component 600.

[0070] For further information, please refer to Fig.16In some embodiments, the camera 610 is slidably connected to the bracket 620. A slide rail may be provided on the bracket 620, and a slider may be provided on the camera 610, and the camera 610 is slidably connected to the bracket 620 through the slider. The way in which the camera 610 slides on the bracket 620 can facilitate the staff to adjust the distance between the camera 610 and the chip, so that the camera 610 can capture a clearer image of the chip.

[0071] For further information, please refer to Figure 1 , the detection device 10 also includes a loading component 1400 and a unloading component 1500, the loading component 1400 is used to load the chip onto the first placement station 200, and the unloading component 1500 is used to unload the chip on the fourth placement station 500 or the flip component 1300. Specifically, the specific process of the detection device 10 detecting the chip can be that the basket is loaded, and then the chip is placed on the first placement station 200 through the clamping claw. The chip can be positioned and determined by the camera 610 during the placement process to ensure that the chip is placed correctly. Afterwards, the first detection component 600 detects the first side of the chip on the first placement station 200. After the detection, the transfer component 100 transfers the chip to the first rotating component 1000, the first rotating component 1000 rotates the chip 90 degrees, and then the transfer component 100 transfers the chip from the first rotating component 1000 to the second placement station 300, and the second detection component 700 detects the second side of the chip on the second placement station 300. After the detection, the transfer component 100 transfers the chip to the second rotating component 1100, the second rotating component 1100 rotates the chip 90 degrees, and then the transfer component 100 transfers the chip from the second rotating component 1100 to the third placement station 400, and the third detection component 800 detects the third side of the chip on the third placement station 400. After the detection, the transfer component 100 transfers the chip to the third rotating component 1200, the third rotating component 1200 rotates the chip 90 degrees, and then the transfer component 100 transfers the chip from the third rotating component 1200 to the fourth placement station 500, and the fourth detection component 900 detects the fourth side of the chip on the fourth placement station 500. After the detection is completed, the transfer component 100 can transfer the chip to the flip component 1300, and flip the chip by the flip component 1300. Among them, when unqualified chips are detected, the transfer component 100 can put the unqualified chips into the basket for classification. Finally, the qualified chips that have been inspected can be placed in the blanking assembly 1500 for storage, and the chips are waiting to be transferred to the next step for processing.

[0072] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A detection device for detecting a chip, wherein the side surfaces of the chip include a first surface, a second surface, a third surface and a fourth surface, wherein the first surface is arranged opposite to the third surface, and the second surface is arranged opposite to the fourth surface, and wherein: The detection equipment comprises: Transfer components; A first placement station, used for placing the chip; A second placement station is used to place the chip; A third placement station is used to place the chip; A fourth placement station, used for placing the chip; A first detection component, used for detecting the first surface of the chip placed on the first placement station; A second detection component, used for detecting the second surface of the chip placed on the second placement station; A third detection component, used for detecting the third surface of the chip placed on the third placement station; A fourth detection component, used for detecting the fourth surface of the chip placed on the fourth placement station; A first rotating component, used for rotating the chip; A second rotating assembly, used for rotating the chip; A third rotating assembly, used for rotating the chip; Wherein, the first rotating assembly is located between the first placement station and the second placement station, the second rotating assembly is located between the second placement station and the third placement station, and the third rotating assembly is located between the third placement station and the fourth placement station; The transfer assembly is used to transfer the chip on the first placement station to the first rotating assembly, and the transfer assembly is also used to transfer the chip on the first rotating assembly to the second placement station; The transfer assembly is also used to transfer the chip on the second placement station to the second rotation assembly, and the transfer assembly is also used to transfer the chip on the second rotation assembly to the third placement station; The transfer component is also used to transfer the chip on the third placement station to the third rotation component, and the transfer component is also used to transfer the chip on the third rotation component to the fourth placement station.

2. The detection device according to claim 1, characterized in that: The detection device further comprises a flipping component, and the flipping component is used for flipping the chip.

3. The detection device according to claim 2, characterized in that: The flip assembly includes a first driving member, a flip member, a first protective member, a second protective member, a rotating member and a fixed member, wherein the first driving member is connected to the flip member and the rotating member, the flip member is provided with a placement through hole, the first protective member and the second protective member are both slidably connected to the fixed member, and the first protective member and the second protective member are both connected to the rotating member, wherein the first driving member can drive the flip member to rotate, the first driving member can simultaneously drive the rotating member to rotate, the rotating member rotates and drives the first protective member and the second protective member to move relative to the fixed member, so that the first protective member and the second protective member are in the first state , switching between the second state and the third state; when the first protective member and the second protective member are in the first state, the first protective member covers one end of the placement through hole to form a placement groove, the placement groove is used to place the chip, and the second protective member leaks out of the other end of the placement through hole; when the first protective member and the second protective member are in the second state, the second protective member covers one end of the placement through hole to form the placement groove, and the first protective member leaks out of the other end of the placement through hole; when the first protective member and the second protective member are in the third state, the first protective member and the second protective member respectively cover the two ends of the placement through hole.

4. The detection device according to claim 3, characterized in that: The rotating member is provided with a moving groove, the first protective member has a first moving part, and the second protective member has a second moving part, the first moving part and the second moving part are both slidably arranged in the moving groove, the groove wall of the moving groove includes a first straight part, two second straight parts and two curved parts, the two ends of the first straight part are respectively connected to the two curved parts, and the two second straight parts are respectively connected to the two curved parts, the first straight part and the second straight part both extend along the circumferential direction of the rotating member, and along the axial direction of the rotating member, the first straight part and the second straight part are spaced apart, and when the rotating member rotates, the first moving part and the second moving part can both slide between the first straight part and the second straight part.

5. The detection device according to claim 1, characterized in that: The first rotating component includes a positioning member and a second driving member. The positioning member is provided with a positioning groove for placing the chip. The second driving member is connected to the positioning member and is used to drive the positioning member to rotate.

6. The detection device according to claim 5, characterized in that: The first rotating assembly further includes a supporting member and a third driving member, wherein the supporting member is disposed in the positioning groove, and the third driving member is connected to the supporting member, and the third driving member is used to drive the supporting member to rise and fall relative to the positioning member.

7. The detection device according to claim 1, characterized in that: The transfer assembly includes a turret, a suction member and a fourth driving member, wherein the suction member is connected to the turret and used to suck the chip, and the turret is connected to the fourth driving member and the fourth driving member is used to drive the turret to rotate so that the turret drives the suction member to rotate.

8. The detection device according to claim 7, characterized in that: A plurality of the suction members are provided, and the plurality of the suction members are circumferentially arranged around the center of the turret.

9. The detection device according to claim 1, characterized in that: The first detection component includes a camera and a bracket, and the camera is connected to the bracket.

10. The detection device according to claim 9, characterized in that: The camera is slidably connected to the bracket.

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