Optical module

Abstract

An optical transceiver module is arranged in an upper cavity on the front side of the base and limited in the upper cavity through an upper cover fixed to the base, an unlocking mechanism is fixed to the optical port end of the base, label grooves are formed in the back side of the base and the surface of the upper cover, and labels are pasted in the label grooves. The wall surface of the label groove close to the golden finger in the optical transceiver module is an inclined surface. The beneficial effects are that the wall surface, close to the golden finger of the optical transceiver module, of the label groove is the inclined surface which can be used as a guide surface, so that the use of label dismounting tools such as tweezers is facilitated, and the damage probability of the label is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of optical modules, in particular to an optical module. Background Art

[0002] The traditional optical module includes: a base, an optical transceiver module is arranged in the upper cavity on the front of the base, the optical transceiver module is restricted in the upper cavity by an upper cover fixed to the base, an unlocking mechanism is fixed at the optical port end of the base, and a label slot is arranged on the back of the base, and a label is attached to the label slot. This type of optical module has the following defects:

[0003] 1) The four sides of the conventional label slot are vertical surfaces, which are easy to be damaged during label installation or repair;

[0004] 2) The specific assembly relationship between the unlocking mechanism and the base is as follows: a convex block is provided on the front of the base in the gap between the two LC optical ports in the upper cavity for accommodating the optical transceiver module, and an assembly hole extending into the convex block is provided in the lower cavity for accommodating the unlocking block in the unlocking mechanism on the back of the base. The reset spring in the unlocking mechanism provided on the base is in the assembly hole. Due to the limitation that the two LC optical ports are of standard size, the thickness of the convex block cannot be increased, that is, the corresponding reset spring size cannot be increased. After pulling the pull ring many times, the reset spring is prone to fatigue or failure, resulting in the pull ring not rebounding, affecting the normal unlocking function of the module. The convex block cannot be eliminated in this type of optical module. If the optical port end of the optical module is designed to be fully open, the limit of the LC plug will be shortened, affecting the docking performance of the connector;

[0005] 3) The existing optical module optical port EMC (electromagnetic compatibility) design mainly achieves conductive continuous sealing by applying conductive glue and using conductive sponge to press. This solution is suitable for the combination of T0 device + FPC. For COB optical modules, pressing and sealing will cause the optical path to deviate, affecting the module performance. Utility Model Content

[0006] The technical problem to be solved by the utility model is to provide an optical module and an optical module to overcome the deficiencies in the above-mentioned prior art.

[0007] The utility model solves the above-mentioned technical problem with the following technical solution: an optical module, comprising: a base, an optical transceiver module is arranged in an upper cavity on the front side of the base, the optical transceiver module is restricted in the upper cavity via an upper cover fixed to the base, an optical port end of the base is fixed with an unlocking mechanism, label grooves are arranged on the back side of the base and on the surface of the upper cover, labels are affixed to the label grooves, and the wall surface of the label groove close to the gold finger in the optical transceiver module is an inclined surface.

[0008] The beneficial effect of the utility model is that the wall surface of the label slot close to the gold finger of the optical transceiver module is set as an inclined surface, which can be used as a guide surface, thereby facilitating the use of tweezers and other label disassembly tools to reduce the probability of label damage.

[0009] On the basis of the above technical solution, the present invention can also be improved as follows.

[0010] Furthermore, a protrusion is provided in the upper cavity of the base at the gap between the two LC optical ports of the optical transceiver module, and an assembly hole extending into the protrusion is provided in the lower cavity on the back of the base for accommodating the unlocking block in the unlocking mechanism. The reset spring in the unlocking mechanism is located in the assembly hole, and the assembly hole passes through the two side surfaces of the protrusion close to the LC optical port.

[0011] The above further beneficial effect is that the assembly hole passes through the two side surfaces of the protrusion close to the LC optical port, that is, the broken-hole design. When the thickness of the protrusion remains unchanged, the inner diameter of the assembly hole can be larger than that of the assembly hole not passing through the two side surfaces of the protrusion close to the LC optical port. Then the diameter of the reset spring that can be accommodated will also be larger, so that a large-size reset spring with better fatigue resistance can be used. When the pull ring in the unlocking mechanism is pulled out multiple times, the reset spring is not easy to fatigue or fail, so that the pull ring rebounds normally, thereby ensuring the reliability of the module unlocking function.

[0012] Furthermore, the unlocking mechanism includes: an unlocking block, which is restricted in the lower cavity on the back of the base by a pressure cover fixed to the base, a pull ring is arranged between the unlocking block and the base, and the assembly hole is located above the lock head of the unlocking block; a return spring is arranged in the assembly hole, one end of which is against the bottom of the hole and the other end is against the lock head of the unlocking block.

[0013] Furthermore, the gland is fixed to the base via screws.

[0014] Furthermore, the upper cover is fixed to the base via screws.

[0015] A further beneficial effect of adopting the above method is that during repair, the optical transceiver module can be repaired by only removing the screws, which greatly improves production efficiency.

[0016] Furthermore, a first conductive sheet is commonly sleeved on the two LC optical ports of the optical transceiver module to achieve conductive continuous sealing, and an absorbing sheet sleeved on the two LC optical ports of the optical transceiver module is arranged outside the first conductive sheet, and the outer surface of the absorbing sheet is covered with a conductive layer.

[0017] The further beneficial effect of adopting the above is: instead of using the conventional compression sealing idea, a first layer of conductive continuous sealing is achieved by adding a first conductive sheet to the two LC optical ports, and an absorbing sheet is added on the outside to achieve the second layer of electromagnetic wave absorption, and the absorbing sheet is covered with a conductive layer on the outside to achieve the third layer of electromagnetic wave isolation. This solution is suitable for COB optical modules, and has a good electromagnetic shielding effect. At the same time, it will not cause optical path deviation, thereby not affecting the module performance.

[0018] Furthermore, the first conductive sheet is made of CNT material with a thickness of 0.3 mm to 0.5 mm; the thickness of the absorbing sheet is 0.3 mm to 0.5 mm; and the conductive layer is conductive cloth.

[0019] Furthermore, the two LC optical ports of the optical transceiver module are provided with annular shoulders, the first conductive sheet and the absorbing sheet are respectively located inside and outside the annular shoulders, two through holes adapted to the LC optical ports are provided at positions corresponding to the two LC optical ports on the first conductive sheet, and an opening slit connected to the through hole is provided at each through hole on the first conductive sheet.

[0020] Furthermore, a second conductive sheet is arranged on the TOP side of the PCB board in the optical transceiver module, the upper end of the second conductive sheet is fixed to the upper cover, and the lower end of the second conductive sheet is overlapped with the PCB board to achieve conductive sealing.

[0021] The above further beneficial effect is: the upper end of the second conductive sheet is fixed to the upper cover, and then the lower end of the second conductive sheet is overlapped with the PCB board to achieve conductive sealing without press fitting, thereby reducing the impact on the integrity of high-speed signals.

[0022] Furthermore, the second conductive sheet is made of CNT material, and its thickness is 0.3 mm to 0.5 mm; the upper end of the second conductive sheet is attached to the inner side of the upper cover. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a front view of the optical module in the utility model;

[0024] Figure 2 This is a rear view of the optical module in the utility model;

[0025] Figure 3 It is a cross-sectional view of the optical module in the utility model;

[0026] Figure 4 This is a structural diagram of the optical module of the utility model after removing the upper cover;

[0027] Figure 5 This is a structural diagram of the optical module of the utility model after removing the pressure cover in the unlocking mechanism;

[0028] Figure 6 for Figure 5 The structure diagram after removing the unlock block;

[0029] Figure 7 for Figure 6 The structural diagram after removing the return spring;

[0030] Figure 8 A diagram showing the coordination of an optical transceiver module, a first conductive sheet, an absorbing sheet, a conductive layer, and a second conductive sheet;

[0031] Fig. 9 This is a structural diagram of the first conductive sheet.

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] 1. Base, 110. Upper cavity, 120. Assembly hole, 130. Bump, 140. Lower cavity, 2. Optical transceiver module, 210. LC optical port, 220. PCB board, 3. Upper cover, 4. Unlocking mechanism, 410. Unlocking block, 420. Reset spring, 430. Pressing cover, 440. Pull ring, 5. Label, 6. First conductive sheet, 610. Through hole, 620. Opening seam, 7. Absorbing sheet, 8. Conductive layer, 9. Second conductive sheet, 10. Label slot. DETAILED DESCRIPTION

[0034] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0035] Example 1

[0036] like Figure 1 , Figure 2 As shown, an optical module comprises: a base 1, an optical transceiver module 2 is arranged in an upper cavity 110 on the front of the base 1, the optical transceiver module 2 is restricted in the upper cavity 110 by an upper cover 3 fixed to the base 1, and an unlocking mechanism 4 is fixed at the optical port end of the base 1;

[0037] A label slot 10 is provided on the back of the base 1 and the surface of the upper cover 3, and a label 5 is attached to the label slot 10. The wall surface of the label slot 10 close to the gold finger in the optical transceiver module 2 is an inclined surface. At present, the four sides of the conventional label slot 10 are vertical surfaces, which are easy to be damaged during the label attachment or rework process. In this solution, the wall surface of the label slot 10 close to the gold finger of the optical transceiver module 2 is set as an inclined surface, which can be used as a guide surface, thereby facilitating the use of tweezers and other label disassembly tools to reduce the chance of label damage.

[0038] Example 2

[0039] like Figure 3 to Figure 7 As shown, this embodiment is a further improvement on the basis of embodiment 1, and the details are as follows:

[0040] The base 1 is provided with a protrusion 130 in the gap between the two LC optical ports 210 of the optical transceiver module 2 in the upper cavity 110. Since the two LC optical ports 210 are of standard size, the thickness of the protrusion 130 cannot be increased due to the limitation of the standard size of the LC optical ports 210.

[0041] A lower cavity 140 is provided on the back of the base 1, wherein the lower cavity 140 is used to accommodate the unlocking block 410 in the unlocking mechanism 4. An assembly hole 120 extending into the protrusion 130 is provided on the back of the base 1 in the lower cavity 140 for accommodating the unlocking block 410 in the unlocking mechanism 4. The reset spring 420 in the unlocking mechanism 4 is located in the assembly hole 120. The assembly hole 120 penetrates the two side surfaces of the protrusion 130 close to the LC optical port 210, that is, a hollow design. When the thickness of the protrusion 130 remains unchanged, the inner diameter of the assembly hole 120 can be larger than that of the assembly hole 120 that does not penetrate the two side surfaces of the protrusion 130 close to the LC optical port 210. Then, the diameter of the reset spring 420 that can be accommodated will also be larger, so that a large-size reset spring 420 with better fatigue resistance can be used. When the pull ring 440 in the unlocking mechanism 4 is pulled out multiple times, the reset spring 420 is not easy to fatigue or fail, so that the pull ring 440 rebounds normally to ensure the reliability of the module unlocking function.

[0042] Example 3

[0043] like Figure 1 , Figure 2 , Figure 3 As shown, this embodiment is a further improvement on the basis of embodiment 2, and the details are as follows:

[0044] The unlocking mechanism 4 includes: an unlocking block 410, which is restricted in the lower cavity 140 by a pressure cover 430 fixed to the base 1, a pull ring 440 is arranged between the unlocking block 410 and the base 1, and the assembly hole 120 is located above the lock head of the unlocking block 410;

[0045] A return spring 420 is arranged in the assembly hole 120, and one end of the return spring 420 is against the bottom of the assembly hole 120, and the other end of the return spring 420 is against the lock head of the unlocking block 410. Pulling the pull ring 440 will drive the middle part of the unlocking block 410 to rotate, so that the lock head of the unlocking block 410 presses the return spring 420, and the return spring 420 is compressed to achieve unlocking.

[0046] The pressure cover 430 is preferably fixed to the base 1 via screws, and the number of screws may be 2.

[0047] In addition, the upper cover 3 is also fixed to the base 1 by screws, and the number of screws may be 1. When rework is performed, the optical transceiver module 2 can be repaired by removing only 1 screw, which greatly improves production efficiency.

[0048] Example 4

[0049] like Figure 3 , Figure 4 , Figure 8 As shown, this embodiment is a further improvement on any one of Embodiments 1 to 3, and the details are as follows:

[0050] The optical path of the optical transceiver module 2 adopts the COB solution. The two LC optical ports 210 of the optical transceiver module 2 are jointly sleeved with a first conductive sheet 6 for realizing conductive continuous sealing. The outer side of the first conductive sheet 6 is arranged with an absorbing sheet 7 sleeved on the two LC optical ports 210 of the optical transceiver module 2. The absorbing sheet 7 is used to absorb electromagnetic waves. The outer side of the absorbing sheet 7 is covered with a conductive layer 8, and the conductive layer 8 is used to achieve electromagnetic wave isolation.

[0051] The utility model no longer uses the conventional compression sealing method, but instead implements the first layer of conductive continuous sealing by adding a first conductive sheet 6 on the two LC optical ports 210, and then adds an absorbing sheet 7 on the outside to implement the second layer of electromagnetic wave absorption, and the absorbing sheet 7 is covered with a conductive layer 8 on the outside to implement the third layer of electromagnetic wave isolation. This solution is suitable for COB optical modules, and has a good electromagnetic shielding effect, and will not cause optical path deviation, thereby not affecting module performance.

[0052] Furthermore, the first conductive sheet 6 can be made of flexible conductive material, such as CNT material, with a thickness of 0.3mm to 0.5mm; the absorbing sheet 7 selects corresponding absorbing material according to the radiation frequency, with a thickness of 0.3mm to 0.5mm; the conductive layer 8 is preferably conductive cloth.

[0053] Example 5

[0054] like Figure 3 , Figure 4 , Fig. 9 As shown, this embodiment is a further improvement on the basis of embodiment 4, and the details are as follows:

[0055] The two LC optical ports 210 of the optical transceiver module 2 are both provided with an annular shoulder, and the first conductive sheet 6 and the absorbing sheet 7 are respectively located on the inner and outer sides of the annular shoulder. Two through holes 610 adapted to the LC optical ports 210 are provided on the first conductive sheet 6 at positions corresponding to the two LC optical ports 210, and an opening slit 620 connected to the through hole 610 is provided on each through hole 610 on the first conductive sheet 6. The opening slit 620 facilitates the first conductive sheet 6 to be put on the LC optical port 210 and to be located on the inner side of the annular shoulder.

[0056] Example 6

[0057] like Figure 3 , Figure 4 , Figure 8 As shown, this embodiment is a further improvement on the basis of Embodiment 4 or 5, and the details are as follows:

[0058] A second conductive sheet 9 is arranged on the TOP side of the PCB board 220 in the optical transceiver module 2, the upper end of the second conductive sheet 9 is fixed to the upper cover 3, and the lower end of the second conductive sheet 9 is overlapped with the PCB board 220 to achieve conductive sealing;

[0059] The conventional solution is: stick conductive materials on the upper and lower sides of the gold finger, and press them tightly with the upper cover 3 to achieve conductive continuous sealing. The conductive material is tightly pressed with the high-speed signal on the TOP side of the PCB board, which has a great impact on the integrity of the high-speed signal and is prone to cause bit errors in the module.

[0060] In this solution, the upper end of the second conductive sheet 9 is fixed to the upper cover 3, and then the lower end of the second conductive sheet 9 is overlapped with the PCB board 220 to achieve conductive sealing without press fitting, thereby reducing the impact on the integrity of the high-speed signal.

[0061] The second conductive sheet 9 can be made of a flexible conductive material, such as CNT material, with a thickness of 0.3 mm to 0.5 mm. The upper end of the second conductive sheet 9 is preferably attached to the inner side of the upper cover 3 .

[0062] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An optical module, comprising: A base (1), wherein an optical transceiver module (2) is arranged in an upper cavity (110) on the front side of the base (1), and the optical transceiver module (2) is restricted in the upper cavity (110) via an upper cover (3) fixed to the base (1), an unlocking mechanism (4) is fixed to the optical port end of the base (1), and a label slot (10) is provided on the back side of the base (1) and the surface of the upper cover (3), and a label (5) is attached to the label slot (10), characterized in that the wall surface of the label slot (10) close to the gold finger in the optical transceiver module (2) is an inclined surface.

2. An optical module according to claim 1, characterized in that: The base (1) is provided with a protrusion (130) in the gap between two LC optical ports (210) of the optical transceiver module (2) in the upper cavity (110); the back of the base (1) is provided with an assembly hole (120) extending into the protrusion (130) in the lower cavity (140) for accommodating an unlocking block (410) in the unlocking mechanism (4); the return spring (420) in the unlocking mechanism (4) is located in the assembly hole (120); and the assembly hole (120) passes through two side surfaces of the protrusion (130) close to the LC optical port (210).

3. An optical module according to claim 2, characterized in that: The unlocking mechanism (4) comprises: an unlocking block (410), the unlocking block (410) being restricted in a lower cavity (140) on the back side of the base (1) via a pressure cover (430) fixed to the base (1), a pull ring (440) being arranged between the unlocking block (410) and the base (1), the assembly hole (120) being located above the lock head of the unlocking block (410); and a return spring (420) being arranged in the assembly hole (120), one end of the return spring being against the bottom of the hole and the other end being against the lock head of the unlocking block (410).

4. An optical module according to claim 3, characterized in that: The pressure cover (430) is fixed to the base (1) via screws.

5. The optical module according to claim 1, characterized in that: The upper cover (3) is fixed to the base (1) via screws.

6. The optical module according to claim 1, characterized in that: A first conductive sheet (6) is sleeved on the two LC optical ports (210) of the optical transceiver module (2) to achieve conductive continuous sealing, an absorbing sheet (7) sleeved on the two LC optical ports (210) of the optical transceiver module (2) is arranged outside the first conductive sheet (6), and the absorbing sheet (7) is covered on the outer side of the absorbing sheet (7), and a conductive layer (8) is covered on the outer side of the absorbing sheet (7).

7. An optical module according to claim 6, characterized in that: The first conductive sheet (6) is made of CNT material and has a thickness of 0.3 mm to 0.5 mm; the absorbing sheet (7) has a thickness of 0.3 mm to 0.5 mm; and the conductive layer (8) is conductive cloth.

8. An optical module according to claim 6, characterized in that: The two LC optical ports (210) of the optical transceiver module (2) are provided with an annular shoulder, the first conductive sheet (6) and the wave-absorbing sheet (7) are respectively located inside and outside the annular shoulder, two through holes (610) adapted to the LC optical ports (210) are provided on the first conductive sheet (6) at positions corresponding to the two LC optical ports (210), and an opening slit (620) connected to the through hole (610) is provided on each through hole (610) on the first conductive sheet (6).

9. The optical module according to claim 1, characterized in that: A second conductive sheet (9) is arranged on the TOP side of the PCB board (220) in the optical transceiver module (2); the upper end of the second conductive sheet (9) is fixed to the upper cover (3); and the lower end of the second conductive sheet (9) and the PCB board (220) are overlapped to achieve conductive sealing.

10. An optical module according to claim 9, characterized in that: The second conductive sheet (9) is made of CNT material and has a thickness of 0.3 mm to 0.5 mm; the upper end of the second conductive sheet (9) is attached to the inner side of the upper cover (3).

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