Dustproof notebook computer heat dissipation module

Abstract

The utility model discloses a dustproof notebook computer heat dissipation module which comprises a notebook computer, a cavity for installing a computer mainboard is formed in the notebook computer, the computer mainboard is fixedly arranged in the cavity, and a plurality of cooling fins are fixedly arranged in a heating area at the bottom of the computer mainboard. A plurality of heat pipes used for heat dissipation are fixedly arranged in the cooling fins, a partition plate is fixedly arranged in the position, close to the rear end of the notebook computer, of the interior of the cavity and divides the cavity into a heat dissipation cavity and a closed heat conduction cavity, the heat dissipation ends of the heat pipes penetrate through the partition plate and stretch into the heat dissipation cavity, and a refrigeration mechanism assisting in cooling of the heat dissipation ends of the heat pipes is arranged in the heat dissipation cavity. Compared with the prior art, the notebook computer radiator has the advantages that hot air in the radiating cavity can be quickly and efficiently discharged through the structural arrangement, so that heat can be quickly transferred and radiated, the stable working temperature of a notebook computer is kept, the service life of the notebook computer is prolonged, and the overall performance is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of notebook computer devices, in particular to a dustproof notebook computer heat dissipation module. Background Art

[0002] As a lightweight and portable personal computer equipment, laptops have the advantages of strong portability and stable performance, and are widely used in daily use. However, since the core components such as the computer motherboard and CPU generate a lot of heat during operation, it is necessary to dissipate heat in a timely and effective manner to maintain a stable working state. The traditional notebook heat dissipation method mainly relies on the fan and heat sink structure, and the fan discharges the hot air to achieve the purpose of heat dissipation.

[0003] However, the traditional fan cooling method has some defects. First, since the fan cooling needs to discharge the internal hot air to the external environment, the inner cavity needs to be connected to the external environment, which means that it is easy to introduce particles such as dust and impurities into the notebook, causing the electrical components to be contaminated and affected, reducing the overall performance and life of the computer. Second, the traditional cooling method often faces the problem of untimely cooling and low efficiency under high load operation, which can easily cause the computer to overheat and affect stability. Utility Model Content

[0004] In order to solve the above-mentioned problems, the utility model provides a dustproof notebook computer heat dissipation module.

[0005] In order to solve the above technical problems, the technical solution of the utility model is: a dustproof laptop computer heat dissipation module, including a laptop computer, a cavity for installing a computer motherboard is provided inside the laptop computer, the computer motherboard is fixed inside the cavity, a plurality of heat sinks are fixedly provided in the heating area at the bottom of the computer motherboard, a plurality of heat pipes for heat dissipation are fixedly provided inside the heat sink, a partition is fixedly provided inside the cavity near the rear end of the laptop computer to divide the cavity into a heat dissipation cavity and a closed heat conduction cavity, the heat dissipation end of the heat pipe passes through the partition and extends into the heat dissipation cavity, and a refrigeration mechanism is provided inside the heat dissipation cavity to assist the heat dissipation end of the heat pipe in cooling down.

[0006] Furthermore, the refrigeration mechanism includes an intake fan and an exhaust fan respectively fixed at the left and right ends of the heat dissipation cavity, and the air blowing directions of the intake fan and the exhaust fan are the same.

[0007] Furthermore, a refrigeration fin is fixedly provided on the side of the heat dissipation cavity, the heat absorption surface of the refrigeration fin extends into the heat dissipation cavity, and the heat dissipation surface of the refrigeration fin extends to the outside of the heat dissipation cavity.

[0008] Furthermore, the cooling fin is fixedly arranged between the air intake fan and the heat dissipation end of the heat pipe.

[0009] Furthermore, the heating area at the bottom of the computer motherboard, the heat sink and the heat absorbing end of the heat pipe are all located in the heat conduction cavity.

[0010] Compared with the prior art, the utility model has the following advantages:

[0011] 1. Partitions separate cavities: By setting up partitions, the internal cavity of the laptop is divided into a heat dissipation cavity and a closed heat conduction cavity, which effectively isolates the internal and external environments of the heat conduction cavity, prevents dust, impurities and other external particles from entering the heat conduction cavity, reduces pollution and impact on electrical components, and improves the overall performance and stability of the computer.

[0012] 2. Refrigeration mechanism design: The heat dissipation module is equipped with components such as intake fan, exhaust fan and cooling fins. The fans of the refrigeration mechanism work in a coordinated manner, effectively improving the heat dissipation efficiency. The intake fan is responsible for introducing fresh air into the heat dissipation cavity, the exhaust fan quickly discharges the hot air, and the cooling fins further help improve the heat dissipation efficiency.

[0013] 3. Fast and efficient heat dissipation: The heat pipe is built into the heat sink to effectively conduct heat, and a cooling mechanism is set in the heat dissipation cavity to assist the heat pipe in cooling, making the overall heat dissipation process faster and more efficient. At the same time, the design of the fan and cooling fins in the cooling mechanism cooperate with each other to ensure that the heat is quickly discharged, thereby preventing the computer from overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional structure diagram of a dustproof notebook computer heat dissipation module of the utility model. Figure 1 .

[0015] Figure 2 This is a three-dimensional structure diagram of a dustproof notebook computer heat dissipation module of the utility model. Figure 2 .

[0016] Figure 3 This is a schematic diagram of the cross-sectional structure of a dustproof notebook computer heat dissipation module of the utility model. Figure 1 .

[0017] Figure 4 This is a schematic diagram of the cross-sectional structure of a dustproof notebook computer heat dissipation module of the utility model. Figure 2 .

[0018] As shown in the figure: 1. Laptop computer; 2. Cavity; 3. Computer motherboard; 4. Heat sink; 5. Heat pipe; 6. Partition; 7. Heat conduction cavity; 8. Heat dissipation cavity; 9. Intake fan; 10. Exhaust fan; 11. Refrigeration plate. DETAILED DESCRIPTION

[0019] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", "center", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction structure and operation. Therefore, they should not be understood as limitations on the present invention.

[0020] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "provided with", "installed", "connected", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0022] Combined with Figure 1 To Attachment Figure 4 A dustproof notebook computer heat dissipation module comprises a notebook computer 1, wherein a cavity 2 for installing a computer motherboard is provided inside the notebook computer 1, a computer motherboard 3 is fixedly provided inside the cavity 2, a plurality of heat sinks 4 are fixedly provided at the heating zone at the bottom of the computer motherboard 3, a plurality of heat pipes 5 for heat dissipation are fixedly provided inside the heat sink 4, a partition 6 is fixedly provided inside the cavity 2 near the rear end of the notebook computer 1 to divide the cavity 2 into a heat dissipation cavity 8 and a closed heat conduction cavity 7, the heating zone at the bottom of the computer motherboard 3, the heat sink 4 and the heat absorbing end of the heat pipe 5 are all located in the heat conduction cavity 7, the heat dissipation end of the heat pipe 5 passes through the partition 6 and extends into the heat dissipation cavity 8, and a refrigeration mechanism for assisting the heat dissipation end of the heat pipe 5 in cooling down is provided inside the heat dissipation cavity 8.

[0023] In this embodiment, the refrigeration mechanism includes an intake fan 9 and an exhaust fan 10 respectively fixed at the left and right ends of the heat dissipation cavity 8. The blowing directions of the intake fan 9 and the exhaust fan 10 are the same. A cooling fin 11 is fixedly provided on the side of the heat dissipation cavity 8. The heat absorption surface of the cooling fin 11 extends into the heat dissipation cavity 8, and the heat dissipation surface of the cooling fin 11 extends to the outside of the heat dissipation cavity 8. The cooling fin 11 is fixedly arranged between the intake fan 9 and the heat dissipation end of the heat pipe 5.

[0024] Specific implementation method of the utility model: Before using the utility model, first connect the external power supply, the specific working principle is as follows:

[0025] Internal cavity structure: A cavity 2 for installing a computer motherboard is provided inside the laptop, and a computer motherboard 3 is fixed inside the cavity. Several heat sinks 4 are fixedly provided at the heating area at the bottom of the computer motherboard, and heat pipes 5 are fixedly provided inside the heat sinks.

[0026] Partitions separate the cavities: A partition 6 is fixedly provided inside the cavity 2 near the rear end of the laptop computer, dividing the cavity 2 into a heat dissipation cavity 8 and a sealed heat conduction cavity 7 to prevent particles such as dust from entering the heat conduction cavity 7.

[0027] Heat dissipation principle: The heat from the heating area at the bottom of the laptop motherboard is conducted to the heat pipe 5 of the heat sink 4. The working fluid in the heat pipe 5 evaporates due to the heat, and the heat is absorbed by the heat sink and transferred to the other end of the heat pipe, and then released into the heat dissipation cavity 8.

[0028] Refrigeration mechanism: An intake fan 9 and an exhaust fan 10 are provided in the heat dissipation chamber 8. The intake fan 9 is responsible for introducing fresh air into the heat dissipation chamber, and the exhaust fan 10 is responsible for rapidly exhausting hot air. At the same time, a cooling fin 11 is fixedly provided on the side of the heat dissipation chamber 8, and the heat absorption surface of the cooling fin extends into the heat dissipation chamber to cool the newly introduced air, thereby further dissipating heat.

[0029] In general, with this setup, the hot air in the heat dissipation cavity can be discharged quickly and efficiently, allowing the heat to be quickly transferred and dissipated, thereby maintaining a stable operating temperature of the laptop, extending the life of the computer and improving overall performance.

[0030] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A dustproof notebook computer heat dissipation module, comprising a notebook computer (1), wherein a cavity (2) for mounting a computer motherboard is provided inside the notebook computer (1), a computer motherboard (3) is fixedly provided inside the cavity (2), and a plurality of heat sinks (4) are fixedly provided at a heating area at the bottom of the computer motherboard (3), wherein: A plurality of heat pipes (5) for heat dissipation are fixedly arranged inside the heat sink (4); a partition (6) is fixedly arranged inside the cavity (2) near the rear end of the laptop computer (1) to divide the cavity (2) into a heat dissipation cavity (8) and a sealed heat conduction cavity (7); the heat dissipation end of the heat pipe (5) passes through the partition (6) and extends into the heat dissipation cavity (8); a refrigeration mechanism is arranged inside the heat dissipation cavity (8) to assist in cooling the heat dissipation end of the heat pipe (5).

2. The dustproof notebook computer heat dissipation module according to claim 1, characterized in that: The refrigeration mechanism comprises an air intake fan (9) and an exhaust fan (10) respectively fixed at the left and right ends of the heat dissipation cavity (8); the air intake fan (9) and the exhaust fan (10) have the same blowing direction.

3. The dustproof notebook computer heat dissipation module according to claim 2, characterized in that: A refrigeration fin (11) is fixedly provided on the side of the heat dissipation cavity (8); a heat absorption surface of the refrigeration fin (11) extends into the heat dissipation cavity (8), and a heat dissipation surface of the refrigeration fin (11) extends to the outside of the heat dissipation cavity (8).

4. The dustproof notebook computer heat dissipation module according to claim 3, characterized in that: The cooling fin (11) is fixedly arranged between the air intake fan (9) and the heat dissipation end of the heat pipe (5).

5. The dustproof notebook computer heat dissipation module according to claim 1, characterized in that: The heating area at the bottom of the computer mainboard (3), the heat sink (4) and the heat absorbing end of the heat pipe (5) are all located in the heat conduction cavity (7).

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