Spray head and UV curing equipment

Abstract

The utility model provides a spray header and UV curing equipment, the spray header comprises an outer ring area and an inner ring area enclosed by the outer ring area, and the thickness of the inner ring area is gradually increased from the circle center of the inner ring area to the edge of the inner ring area. According to the utility model, the light intensity of the inner ring curing area, close to the circle center of the wafer, of the wafer is weakened through the dispersion effect of the inner ring area on light rays, so that the non-uniformity of light intensity distribution caused by a UV light source in the UV curing process is improved or eliminated; therefore, the difference between the curing thickness of the film inner ring curing area and the curing thickness of the film outer ring curing area is reduced or eliminated, and the uniformity of the thickness of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a shower head and UV curing equipment. Background Art

[0002] In the semiconductor manufacturing process, UV curing process is a commonly used curing method for curing thin films. Under the irradiation of ultraviolet (UV) light source, the chemical bonds in the film are broken, thereby achieving the curing effect of the film.

[0003] like Figures 1 to 3 As shown, due to the characteristics of light, the UV curing equipment in the prior art often has the following problems during the UV curing process of wafer thin film: (1) the closer the wafer 10 is to the UV light source 20, the stronger the light intensity; (2) no matter how the UV light source 20 rotates, the light intensity at the center position 101 of the wafer 10 is always the highest; (3) during the rotation of the UV light source 20, the thin film at the center position 101 of the wafer 10 will be repeatedly cured; (4) the UV curing equipment is generally equipped with two UV light sources 20, which will cause the center position 101 of the wafer 10 to overlap with the light.

[0004] However, the uneven light intensity distribution caused by the UV light source during the UV curing process will cause the thickness loss of the inner circle curing area near the center of the wafer to be greater than the thickness loss of the outer circle curing area near the edge of the wafer, ultimately making the cured thickness of the film inconsistent, that is, the thickness of the inner circle curing area near the center of the wafer is thinner, and the thickness of the outer circle curing area near the edge of the wafer is thicker, which will affect the performance and reliability of the chip.

[0005] Therefore, it is necessary to provide a novel shower head and UV curing equipment to solve the above problems existing in the prior art. Utility Model Content

[0006] The utility model aims to provide a shower head and UV curing equipment, which can reduce the light intensity of the inner ring curing area of ​​the wafer close to the center of the wafer by dispersing the light in the inner ring area, thereby improving or eliminating the uneven distribution of light intensity caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0007] To achieve the above object, the shower head of the utility model comprises an outer ring area and an inner ring area surrounded by the outer ring area, and the thickness of the inner ring area gradually increases from the center of the inner ring area to the edge of the inner ring area.

[0008] The beneficial effect of the shower head of the utility model is that the thickness of the inner circle area gradually increases from the center of the inner circle area to the edge of the inner circle area, that is, by utilizing the concave lens principle, a dispersion effect can be played on the light passing through the inner circle area of ​​the shower head, so that the light intensity reaching the inner circle curing area close to the center of the wafer is weakened to slow down the curing effect of the film in the inner circle curing area, that is, the light intensity of the inner circle curing area of ​​the wafer is weakened by the dispersion effect of the inner circle area on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in the curing thickness between the inner circle curing area and the outer circle curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0009] Preferably, the ratio of the radius of the inner ring area to the radius of the shower head is 1 / 4 to 3 / 4. Its beneficial effect is that: since the UV light source causes the light intensity of the inner ring curing area with a radius of 1 / 4 to 3 / 4 of the wafer radius to be greater, the inner ring area of ​​the shower head is made to correspond to the inner ring curing area of ​​the wafer, so that the light intensity of the inner ring curing area of ​​the wafer can be weakened by the dispersion effect of the inner ring area on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, so as to reduce or eliminate the difference in the curing thickness of the inner ring curing area and the outer ring curing area of ​​the film, and improve the uniformity of the wafer thickness.

[0010] Preferably, the thickness of the outer ring area is greater than that of the inner ring area, and the ratio of the maximum thickness of the outer ring area to the minimum thickness of the inner ring area is 2 to 3. The beneficial effect is that it is helpful to improve or eliminate the unevenness of light intensity distribution caused by the UV light source during UV curing, so as to reduce or eliminate the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improve the uniformity of wafer thickness.

[0011] Preferably, the inner ring region includes a first upper surface and a first lower surface that are arranged opposite to each other, and along the direction from the center of the inner ring region toward the edge of the inner ring region, the first upper surface is gradually arranged away from the radial center axis of the shower head, and / or the first lower surface is gradually arranged away from the radial center axis of the shower head. The beneficial effect is that the inner ring region is a plano-concave structure or a double-concave structure, so that the inner ring region can use the concave lens principle to disperse the light passing through the inner ring region of the shower head, so as to weaken the light intensity reaching the inner ring curing area of ​​the wafer close to the center of the wafer.

[0012] Preferably, the outer ring region includes a second upper surface and a second lower surface that are arranged opposite to each other, and along the direction from the inner edge of the outer ring region to the outer edge of the outer ring region, the distance between the second upper surface and the radial center axis of the shower head remains unchanged, and the distance between the second lower surface and the radial center axis of the shower head remains unchanged. The beneficial effect is that the outer ring region maintains its original thickness to avoid affecting the light intensity reaching the outer ring curing area close to the wafer edge.

[0013] Preferably, the diameter of the shower head is 150 mm to 400 mm. The beneficial effect is that a shower head of a suitable size can be selected according to the size of the wafer to be cured, and the shower head has strong versatility and can be applied to cure wafers of different sizes.

[0014] Preferably, the shower head is an integrally formed structure.

[0015] In the second aspect, the UV curing equipment of the utility model includes a vacuum window, a UV light source, a heating base and the spray head, the wafer is placed on the heating base, the spray head is arranged between the vacuum window and the heating base, the UV light source is arranged above the vacuum window, and the light emitted by the UV light source passes through the vacuum window and the spray head in sequence to cure the wafer film.

[0016] The beneficial effect of the UV curing equipment of the utility model is that by arranging the shower head between the vacuum window and the heating base, the light intensity of the inner ring curing area of ​​the wafer can be weakened by the dispersion effect of the inner ring area on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0017] Preferably, there are a plurality of the shower heads, and the plurality of the shower heads are arranged in parallel from bottom to top in a direction perpendicular to the wafer surface. The beneficial effect is that a plurality of shower heads can be arranged according to the actual light intensity reaching the wafer film, so as to improve or eliminate the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in the curing thickness between the inner ring curing area of ​​the film and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0018] Preferably, the thickness of the shower head is 2 to 10 mm. The beneficial effect is that a shower head of suitable thickness is selected according to the actual light intensity reaching the wafer film and the number of shower heads, so that the shower head can be installed in the limited space between the vacuum window and the heating base to avoid the shower head interfering with other components of the UV curing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 Schematic diagram of the light distribution of the rotating UV light source in the UV curing equipment of the prior art Figure 1 ;

[0020] Figure 2 Schematic diagram of the light distribution of the rotating UV light source in the UV curing equipment of the prior art Figure 2 ;

[0021] Figure 3 Schematic diagram of the light distribution of the rotating UV light source in the UV curing equipment of the prior art Figure 3 ;

[0022] Figure 4 This is a schematic structural diagram of a shower head according to the first embodiment of the utility model;

[0023] Figure 5 For light to pass through Figure 4 The diagram shows the distribution of light reaching the wafer surface from the shower head;

[0024] Figure 6 This is a schematic diagram of the structure of a shower head according to a second embodiment of the utility model;

[0025] Figure 7 This is a schematic diagram of the structure of the UV curing equipment of the present utility model;

[0026] Figures 1 to 7 The reference numerals in the figures are:

[0027] 10. Wafer; 101. Center position;

[0028] 20. UV light source; 30. Vacuum window; 40. Heating base;

[0029] 1. Sprinkler head; 11. Outer ring area; 12. Inner ring area; 13. Radial center axis;

[0030] 111. Second upper surface; 112. Second lower surface; 121. First upper surface; 122. First lower surface. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the utility model belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0032] In order to overcome the problems existing in the prior art, the embodiments of the utility model provide a spray head and UV curing equipment, which disperses light through the inner ring area to weaken the light intensity of the inner ring curing area of ​​the wafer close to the center of the wafer, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0033] Figure 4 This is a schematic structural diagram of a shower head according to the first embodiment of the utility model; Figure 5 For light to pass through Figure 4 The diagram shows the distribution of light reaching the wafer surface from the shower head; Figure 6 This is a schematic structural diagram of a shower head according to a second embodiment of the present invention.

[0034] In some embodiments of the present invention, reference Figures 4 to 6 The shower head 1 includes an outer ring area 11 and an inner ring area 12 surrounded by the outer ring area 11 , and the thickness of the inner ring area 12 gradually increases from the center of the inner ring area 12 to the edge of the inner ring area 12 .

[0035] Specifically, the thickness of the inner circle area 12 gradually increases from the center of the inner circle area 12 to the edge of the inner circle area 12, that is, by utilizing the principle of concave lens, the light passing through the inner circle area 12 of the shower head can be dispersed, so that the light intensity reaching the inner circle curing area of ​​the wafer 10 close to the center of the wafer is weakened to slow down the curing effect of the film in the inner circle curing area, that is, the light intensity of the inner circle curing area of ​​the wafer 10 is weakened by the dispersion effect of the inner circle area 12 on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source 20 during the UV curing process, thereby reducing or eliminating the difference in curing thickness between the inner circle curing area and the outer circle curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0036] In some embodiments of the present invention, the projection of the shower head on the horizontal plane is a circular structure.

[0037] In some embodiments of the present invention, the shower head is provided with a plurality of through holes.

[0038] In some embodiments of the present invention, the shower head is made of acrylic material.

[0039] In some embodiments of the present invention, reference Figure 4 and Figure 6 , the inner ring area 12 includes a first upper surface 121 and a first lower surface 122 that are arranged opposite to each other, and along the direction from the center of the inner ring area 12 toward the edge of the inner ring area 12, the first upper surface 121 is gradually arranged away from the radial center axis 13 of the shower head 1, and / or the first lower surface 122 is gradually arranged away from the radial center axis 13 of the shower head 1. That is, the distance between the first upper surface 121 and the radial center axis 13 of the shower head 1 gradually increases from the center of the inner ring area 12 toward the edge of the inner ring area 12, and / or the distance between the first lower surface 122 and the radial center axis 13 of the shower head 1 gradually increases from the center of the inner ring area 12 toward the edge of the inner ring area 12. The inner ring area 12 is made into a flat concave structure or a double concave structure, so that the inner ring area 12 can use the concave lens principle to disperse the light passing through the inner ring area of ​​the shower head, so as to weaken the light intensity reaching the inner ring curing area of ​​the wafer close to the center of the wafer.

[0040] In some specific embodiments of the present utility model, reference Figure 4, along the direction from the center of the inner circle area 12 toward the edge of the inner circle area 12, the first upper surface 121 and the first lower surface 122 are both gradually arranged away from the radial center axis 13 of the shower head 1, that is, the distance between the first upper surface 121 and the radial center axis 13 of the shower head 1 gradually increases from the center of the inner circle area 12 toward the edge of the inner circle area 12, and the distance between the first lower surface 122 and the radial center axis 13 of the shower head 1 gradually increases from the center of the inner circle area 12 toward the edge of the inner circle area 12, as shown in FIG. Figure 4 As shown, both the first upper surface 121 and the first lower surface 122 are concavely arranged toward the radial center axis 13 of the shower head 1 , so that the inner ring area 12 is a double concave structure.

[0041] In some other specific embodiments of the present invention, reference is made to Figure 6 , along the direction from the center of the inner circle area 12 toward the edge of the inner circle area 12, the first upper surface 121 is gradually arranged away from the radial center axis 13 of the shower head 1, that is, the distance between the first upper surface 121 and the radial center axis 13 of the shower head 1 gradually increases from the center of the inner circle area 12 toward the edge of the inner circle area 12, and the distance between each part of the first lower surface 122 and the radial center axis 13 of the shower head 1 is equal, as shown in FIG. Figure 6 As shown, the first upper surface 121 is concavely disposed toward the radial center axis 13 of the shower head 1 , and the first lower surface 122 is disposed parallel to the radial center axis 13 of the shower head 1 , so that the inner ring area 12 is a flat concave structure.

[0042] In some embodiments of the present invention, reference Figure 4 and Figure 6 The outer ring area 11 includes a second upper surface 111 and a second lower surface 112 that are arranged opposite to each other, and along the direction from the inner edge of the outer ring area 11 toward the outer edge of the outer ring area 11, the distance between the second upper surface 111 and the radial central axis 13 of the shower head 1 remains unchanged, and the distance between the second lower surface 112 and the radial central axis 13 of the shower head 1 remains unchanged, that is, the distance between each part of the second upper surface 111 and the radial central axis 13 of the shower head 1 is equal, and the distance between each part of the second lower surface 112 and the radial central axis 13 of the shower head 1 is equal, so that the outer ring area 11 maintains its original thickness to avoid affecting the light intensity reaching the outer ring curing area close to the wafer edge of the wafer.

[0043] In some embodiments of the present invention, reference Figures 4 to 6, the ratio of the radius of the inner ring area 12 to the radius of the shower head 1 is 1 / 4 to 3 / 4. Since the UV light source causes the light intensity of the inner ring curing area with a radius of 1 / 4 to 3 / 4 of the wafer radius to be relatively large, the inner ring area 12 of the shower head 1 is made to correspond to the inner ring curing area of ​​the wafer, so that the light intensity of the inner ring curing area of ​​the wafer can be weakened by the dispersion effect of the inner ring area 12 on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in the curing thickness of the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0044] In some specific embodiments of the present invention, the ratio of the radius of the inner circle area to the radius of the sprinkler head is any one of 1 / 4, 5 / 16, 3 / 8, 7 / 16, 1 / 2, 9 / 16, 5 / 8, 11 / 16 and 3 / 4.

[0045] In some embodiments of the present invention, reference Figures 4 to 6 , the thickness of the outer ring area 11 is greater than the thickness of the inner ring area 12, and the ratio of the maximum thickness of the outer ring area 11 to the minimum thickness of the inner ring area 12 is 2 to 3. This is beneficial to improve or eliminate the unevenness of light intensity distribution caused by the UV light source during UV curing, thereby reducing or eliminating the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of wafer thickness.

[0046] In the embodiment of the utility model, the maximum thickness of the outer circle area 11 is the thickness at each location of the outer circle area 11 , and the minimum thickness of the inner circle area 12 is the thickness at the center of the inner circle area 12 .

[0047] In some specific embodiments of the present invention, the ratio of the maximum thickness of the outer ring area 11 to the minimum thickness of the inner ring area 12 is any one of 2, 2.1, 2.3, 2.5, 2.6, 2.8, 2.9 and 3.

[0048] In some embodiments of the utility model, the diameter of the shower head is 150 mm to 400 mm, so that a shower head of a suitable size can be selected according to the size of the wafer to be cured. The shower head has strong versatility and can be applied to curing wafers of different sizes.

[0049] In some specific embodiments of the present invention, the wafer is a 6-inch wafer, the diameter of the wafer is 150 mm, and the diameter of the shower head is 188 mm.

[0050] In some other specific embodiments of the present invention, the wafer is an 8-inch wafer, the diameter of the wafer is 200 mm, and the diameter of the shower head is 250 mm.

[0051] In some specific embodiments of the present invention, the wafer is a 12-inch wafer, the diameter of the wafer is 300 mm, and the diameter of the shower head is 375 mm.

[0052] In some embodiments of the present invention, the shower head is an integrally formed structure.

[0053] Figure 7 It is a schematic structural diagram of the UV curing equipment of the present utility model.

[0054] In some embodiments of the present invention, reference Figure 7 The UV curing equipment includes the spray head 1, a UV light source 20, a vacuum window 30 and a heating base 40. The wafer 10 is placed on the heating base 40. The spray head 1 is arranged between the vacuum window 30 and the heating base 40. The UV light source 20 is arranged above the vacuum window 30. The light emitted by the UV light source 20 sequentially passes through the vacuum window 30 and the spray head 1 to cure the thin film of the wafer 10.

[0055] Specifically, by arranging the shower head 1 between the vacuum window 30 and the heating base 40, the light intensity of the inner ring curing area of ​​the wafer 10 can be weakened by the dispersion effect of the inner ring area 12 on the light, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source 20 during the UV curing process, thereby reducing or eliminating the difference in curing thickness between the inner ring curing area and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0056] In some embodiments of the utility model, the shower heads are provided in multiple numbers, and the shower heads are arranged in parallel from bottom to top in a direction perpendicular to the wafer surface. Therefore, multiple shower heads can be arranged according to the actual light intensity reaching the wafer film, so as to improve or eliminate the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, thereby reducing or eliminating the difference in the curing thickness between the inner ring curing area of ​​the film and the outer ring curing area of ​​the film, and improving the uniformity of the wafer thickness.

[0057] In some embodiments of the utility model, the shower head includes a first shower head and a second shower head. The first shower head includes a first inner ring area and a first outer ring area, the thickness of the first inner ring area gradually increases from the center of the first inner ring area to the edge of the first inner ring area, and the thickness of each part of the first outer ring area is equal. The second shower head includes a second inner ring area and a second outer ring area, the thickness of the second inner ring area gradually increases from the center of the second inner ring area to the edge of the second inner ring area, and the thickness of each part of the second outer ring area is equal. The light emitted by the UV light source is diverged for the first time after passing through the first inner ring area, and is diverged for the second time after passing through the second inner ring area. After the light is diverged twice, the light intensity reaching the inner ring curing area of ​​the wafer close to the center of the wafer can be effectively weakened to slow down the curing effect of the film in the inner ring curing area, thereby improving or eliminating the unevenness of the light intensity distribution caused by the UV light source during the UV curing process, so as to reduce or eliminate the difference in the curing thickness of the inner ring curing area and the outer ring curing area of ​​the film, and improve the uniformity of the wafer thickness.

[0058] In some embodiments of the utility model, the thickness of the shower head is 2 to 10 mm. According to the actual light intensity reaching the wafer film and the number of shower heads, a shower head of appropriate thickness is selected to install the shower head in the limited space between the vacuum window and the heating base to avoid the shower head interfering with other components of the UV curing equipment.

[0059] In some embodiments of the present invention, the thickness of the shower head is any one of 2 mm, 2.5 mm, 3 mm, 5 mm, 6 mm, 7.5 mm, 9 mm and 10 mm.

[0060] In some embodiments of the present invention, the UV light source includes one or more.

[0061] In some embodiments of the present invention, the UV light source may be a lamp, an LED emitter or other UV emitters.

[0062] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A shower head, characterized in that: It comprises an outer circle area and an inner circle area surrounded by the outer circle area, and the thickness of the inner circle area gradually increases from the center of the inner circle area to the edge of the inner circle area.

2. The shower head according to claim 1, characterized in that: The ratio of the radius of the inner circle area to the radius of the shower head is 1 / 4 to 3 / 4.

3. The shower head according to claim 1, characterized in that: The thickness of the outer ring region is greater than the thickness of the inner ring region, and the ratio of the maximum thickness of the outer ring region to the minimum thickness of the inner ring region is 2-3.

4. The shower head according to claim 1, characterized in that: The inner circle area includes a first upper surface and a first lower surface that are arranged opposite to each other, and along the direction from the center of the inner circle area toward the edge of the inner circle area, the first upper surface is gradually arranged away from the radial center axis of the spray head, and / or the first lower surface is gradually arranged away from the radial center axis of the spray head.

5. The shower head according to claim 1, characterized in that: The outer ring area includes a second upper surface and a second lower surface that are arranged opposite to each other, and along the direction from the inner edge of the outer ring area toward the outer edge of the outer ring area, the distance between the second upper surface and the radial center axis of the spray head remains unchanged, and the distance between the second lower surface and the radial center axis of the spray head remains unchanged.

6. The shower head according to claim 1, characterized in that: The diameter of the spray head is 150 mm to 400 mm.

7. The shower head according to claim 1, characterized in that: The spray head is an integrally formed structure.

8. A UV curing device, characterized in that: It comprises a vacuum window, a UV light source, a heating base and a shower head as described in any one of claims 1 to 7, wherein a wafer is placed on the heating base, the shower head is arranged between the vacuum window and the heating base, the UV light source is arranged above the vacuum window, and the light emitted by the UV light source sequentially passes through the vacuum window and the shower head to cure the wafer film.

9. The UV curing device according to claim 8, characterized in that: There are a plurality of shower heads, and the plurality of shower heads are arranged in parallel from bottom to top in a direction perpendicular to the surface of the wafer.

10. The UV curing device according to claim 9, characterized in that: The thickness of the spray head is 2-10 mm.

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