Wafer cleaning auxiliary mounting mechanism

Abstract

The utility model discloses an auxiliary mounting mechanism for wafer cleaning. Comprising a first support, a second support arranged opposite to the first support, a driving mechanism arranged on the first support, a rotating mechanism connected with the driving mechanism, a connecting support arranged between the first support and the second support, a wafer box arranged on the connecting support, and a plurality of wafers arranged on the wafer box. The first support is fixedly connected with the second support, the first support and the second support are fixedly connected with the connecting support, the driving mechanism is fixedly installed on the first support, and the rotating mechanism is connected with the connecting support. The wafer cleaning machine has the advantages that 8-inch wafers and 6-inch wafers can be cleaned at the same time, the problems that the surfaces of part of wafers in a wafer box installed on the cleaning machine are shielded, and ultrasonic megasonic waves cannot clean the wafers can be solved, the use effect is good, and the wafer cleaning machine is convenient to popularize and use for enterprises.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer cleaning, in particular to a wafer cleaning auxiliary installation mechanism. Background Art

[0002] During the production process of wafers, the wafers need to be cleaned. At present, the cleaning of wafers is mostly done by spraying cleaning liquid onto the surface of the wafer using a shower head to clean the wafer.

[0003] However, the cleaning liquid will drift into the surrounding environment during the spraying process of the shower head, and a certain degree of sputtering will occur when the cleaning liquid contacts the wafer, so that the splashing cleaning liquid will pollute the working space to varying degrees;

[0004] There is also a mechanism in the prior art for installing the wafer in a wafer box to clean the wafer. However, when the 6-inch wafer and the 8-inch wafer are installed and cleaned at the same time, the fixed base of the wafer box will block the 8-inch wafer, so that the wafer cannot be fully cleaned.

[0005] Therefore, there is an urgent need to provide a wafer cleaning device to solve the problems existing in the prior art to a certain extent. Utility Model Content

[0006] The utility model aims to solve the above problems and designs a wafer cleaning auxiliary installation mechanism.

[0007] To achieve the above-mentioned purpose, the technical solution of the utility model is a wafer cleaning auxiliary installation mechanism, including a first bracket, a second bracket arranged opposite to the first bracket, a driving mechanism arranged on the first bracket, a rotating mechanism connected to the driving mechanism, a connecting bracket arranged between the first bracket and the second bracket, a film box arranged on the connecting bracket, and a plurality of wafers arranged on the film box, the first bracket is fixedly connected to the second bracket, the first bracket, the second bracket and the connecting bracket are fixedly connected, the driving mechanism is fixedly installed on the first bracket, and the rotating mechanism is connected to the connecting bracket.

[0008] As a further supplement to the technical solution, the driving mechanism is a motor.

[0009] As a further supplement to the present technical solution, the rotating mechanism includes a first bevel gear connected to the driving mechanism, a second bevel gear meshing with the first bevel gear, a first transmission shaft connected to the second bevel gear, a third bevel gear connected to the first transmission shaft, a fourth bevel gear meshing with the third bevel gear, and a second transmission shaft connected to the fourth bevel gear. The second bevel gear and the third bevel gear are respectively installed at both ends of the first transmission shaft, the fourth bevel gear is installed at one end of the second transmission shaft, and the second transmission shaft is rotatably installed on a connecting bracket.

[0010] As a further supplement to the technical solution, the surface of one end of the outer circumference of the second transmission shaft is rectangular.

[0011] To further supplement the technical solution, a plurality of wafer mounting grooves are provided on the front and rear sides of the chip box, and a plurality of wafers are respectively installed in the wafer mounting grooves. The upper and lower ends of the chip box are provided with openings to facilitate the installation of wafers therein and to facilitate the contact between the second transmission shaft and the wafers.

[0012] To further supplement the present technical solution, the connecting bracket includes a first connecting plate and a second connecting plate, the first connecting plate and the second connecting plate are fixedly connected to the first bracket and the second bracket respectively, and the second transmission shaft is arranged between the first connecting plate and the second connecting plate and is connected to the first connecting plate and the second connecting plate respectively.

[0013] As a further supplement to the technical solution, the second transmission shaft is arranged at the center axis position on the first connecting plate and the second connecting plate.

[0014] Its beneficial effect is that it can clean 8-inch wafers and 6-inch wafers at the same time, and can solve the problem that the surface of some wafers in the wafer box installed in the cleaning machine is blocked and cannot be cleaned by ultrasonic megasonic waves. It has good use effect and is easy to promote and use by enterprises. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the overall assembly structure of a 6-inch wafer box and an 8-inch wafer box of the utility model;

[0016] Figure 2 This is a schematic diagram of the overall structure of the utility model installed with a 6-inch wafer box from the first angle;

[0017] Figure 3 This is a second angle overall structural diagram of the utility model for installing a 6-inch wafer box;

[0018] Figure 4 This is a schematic diagram of the structure of the utility model without the film box installed;

[0019] In the figure, 1, first bracket; 2, second bracket; 3, driving mechanism; 4, rotating mechanism; 41, first bevel gear; 42, second bevel gear; 43, first transmission shaft; 44, third bevel gear; 45, fourth bevel gear; 46, second transmission shaft; 5, connecting bracket; 51, first connecting plate; 52, second connecting plate; 6, wafer box; 7, wafer mounting groove. DETAILED DESCRIPTION

[0020] In order to make the technical solution more clear to those skilled in the art, Figure 1 -4 Detailed description of the technical solution of the utility model:

[0021] This technical solution is mainly used to solve the problem that some wafers are not completely cleaned due to shielding when cleaning 8-inch wafers and 6-inch wafers at the same time. Based on this, a wafer cleaning auxiliary installation mechanism is provided, which will be described in detail below:

[0022] A wafer cleaning auxiliary installation mechanism comprises a first bracket 1, a second bracket 2 arranged opposite to the first bracket 1, a driving mechanism 3 arranged on the first bracket 1, a rotating mechanism 4 connected to the driving mechanism 3, a connecting bracket 5 arranged between the first bracket 1 and the second bracket 2, a film box 6 arranged on the connecting bracket 5, and a plurality of wafers arranged on the film box 6, wherein the first bracket 1 is fixedly connected to the second bracket 2, the first bracket 1 and the second bracket 2 are fixedly connected to the connecting bracket 5, the driving mechanism 3 is fixedly installed on the first bracket 1, the rotating mechanism 4 is connected to the connecting bracket 5, the device is installed in a semiconductor tank cleaning machine through the first bracket 1 and the second bracket 2, the connecting bracket 5 can support the film box 6, the film box comprises a 6-inch wafer box and an 8-inch wafer box, when working, the 6-inch wafer box is installed in the 8-wafer box, the connecting bracket can support the film box as a whole, the driving mechanism 3 and the rotating mechanism 4 cooperate to rotate the wafers in the film box, so as to facilitate more comprehensive cleaning of the wafers, and the use effect is good.

[0023] The driving mechanism 3 is a motor, wherein the rotating mechanism 4 includes a first bevel gear 41 connected to the driving mechanism 3, a second bevel gear 42 meshing with the first bevel gear 41, a first transmission shaft 43 connected to the second bevel gear 42, a third bevel gear 44 connected to the first transmission shaft 43, a fourth bevel gear 45 meshing with the third bevel gear 44, and a second transmission shaft 46 connected to the fourth bevel gear 45, the second bevel gear 42 and the third bevel gear 44 are respectively mounted at both ends of the first transmission shaft 43, the fourth bevel gear 45 is mounted at one end of the second transmission shaft 46, and the second transmission shaft 46 is rotatably mounted on the connecting support On the frame 5, the driving mechanism 3 can drive the first bevel gear 41 to rotate, the rotation of the first bevel gear 41 can drive the second bevel gear 42 to rotate, the rotation of the second bevel gear 42 can drive the first transmission shaft 43 to rotate, the rotation of the first transmission shaft 43 can drive the third bevel gear 44 to rotate, the rotation of the third bevel gear 44 can drive the fourth bevel gear 45 to rotate, the rotation of the fourth bevel gear 45 can drive the second transmission shaft 46 to rotate, thereby driving the wafer in the wafer box to rotate through the second transmission shaft 46, which is convenient for more comprehensive cleaning operations on the wafers; preferably, the outer circumference of the second transmission shaft 46 One end surface is rectangular, which is convenient for driving the wafer to rotate.

[0024] In detail, a plurality of wafer mounting grooves 7 are provided on the front and rear sides of the chip box 6, and a plurality of wafers are respectively installed in the wafer mounting grooves 7. The upper and lower ends of the chip box 6 are provided with openings to facilitate the installation of wafers therein and to facilitate the contact between the second transmission shaft 46 and the wafers.

[0025] Among them, the connecting bracket 5 includes a first connecting plate 51 and a second connecting plate 52, the first connecting plate 51 and the second connecting plate 52 are fixedly connected to the first bracket 1 and the second bracket 2 respectively, the second transmission shaft 46 is arranged between the first connecting plate 51 and the second connecting plate 52 and is respectively connected to the first connecting plate 51 and the second connecting plate 52, more preferably, the second transmission shaft 46 is arranged at the center axis position on the first connecting plate 51 and the second connecting plate 52.

[0026] The above technical solutions only reflect the preferred technical solutions of the technical solutions of the utility model. Some changes that may be made to certain parts thereof by technicians in this technical field all reflect the principles of the utility model and fall within the protection scope of the utility model.

Claims

1. A wafer cleaning auxiliary installation mechanism, characterized in that: The invention comprises a first bracket (1), a second bracket (2) arranged opposite to the first bracket (1), a driving mechanism (3) arranged on the first bracket (1), a rotating mechanism (4) connected to the driving mechanism (3), a connecting bracket (5) arranged between the first bracket (1) and the second bracket (2), a wafer box (6) arranged on the connecting bracket (5), and a plurality of wafers arranged on the wafer box (6), wherein the first bracket (1) is fixedly connected to the second bracket (2), and the first bracket (1), the second bracket (2) and the connecting bracket (5) are fixedly connected. The driving mechanism (3) is fixedly mounted on the first bracket (1), and the rotating mechanism (4) is connected to the connecting bracket (5).

2. A wafer cleaning auxiliary installation mechanism according to claim 1, characterized in that: The driving mechanism (3) is a motor.

3. A wafer cleaning auxiliary installation mechanism according to claim 2, characterized in that: The rotating mechanism (4) comprises a first bevel gear (41) connected to the driving mechanism (3), a second bevel gear (42) meshingly connected to the first bevel gear (41), a first transmission shaft (43) connected to the second bevel gear (42), a third bevel gear (44) connected to the first transmission shaft (43), a fourth bevel gear (45) meshingly connected to the third bevel gear (44), and a second transmission shaft (46) connected to the fourth bevel gear (45), wherein the second bevel gear (42) and the third bevel gear (44) are respectively mounted on two ends of the first transmission shaft (43), the fourth bevel gear (45) is mounted on one end of the second transmission shaft (46), and the second transmission shaft (46) is rotatably mounted on the connecting bracket (5).

4. A wafer cleaning auxiliary installation mechanism according to claim 3, characterized in that: The outer circumferential end surface of the second transmission shaft (46) is rectangular.

5. The wafer cleaning auxiliary installation mechanism according to claim 4, characterized in that: A plurality of wafer mounting grooves (7) are provided on the front and rear sides of the wafer box (6), and a plurality of wafers are respectively mounted in the wafer mounting grooves (7). The upper and lower ends of the wafer box (6) are provided with openings for facilitating the wafers to be mounted therein and for facilitating the second transmission shaft (46) to contact the wafers.

6. The wafer cleaning auxiliary installation mechanism according to claim 5, characterized in that: The connecting bracket (5) comprises a first connecting plate (51) and a second connecting plate (52); the first connecting plate (51) and the second connecting plate (52) are fixedly connected to the first bracket (1) and the second bracket (2), respectively; the second transmission shaft (46) is arranged between the first connecting plate (51) and the second connecting plate (52) and is connected to the first connecting plate (51) and the second connecting plate (52), respectively.

7. The wafer cleaning auxiliary installation mechanism according to claim 6, characterized in that: The second transmission shaft (46) is arranged at a central axis position on the first connecting plate (51) and the second connecting plate (52).

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