Semiconductor wafer quartz boat

By designing structures such as limit frames and limit rings in semiconductor wafer quartz boats, combined with downward springs and rubber pads, the problems of wafer position instability and dust adhesion are solved, and higher position stability and cleaning are achieved.

CN222581122UActive Publication Date: 2025-03-07LIANYUNGANG SHUANGSHI SPECIAL GLASS CO LTD
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Patent Information

Application Number
CN202421320228.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-11
Publication Date
2025-03-07
Estimated Expiration
2034-06-11

AI Technical Summary

Technical Problem

The existing semiconductor wafer quartz boats can easily lead to unstable wafer position during movement, and the open structure can easily cause dust to adhere to the wafer surface.

Method used

A semiconductor wafer quartz boat is designed, adopting structures such as limit frames and limit rings. Through components such as downward springs and rubber pads, effective restrictions and protection of wafer positions are achieved to prevent dust from entering.

Benefits of technology

It effectively avoids the problem of unstable position of the wafer during movement, and prevents dust from adhering to the wafer surface, improving the convenience and cleanliness of the wafer.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of wafer storage, and discloses a semiconductor wafer quartz boat. The semiconductor wafer quartz boat comprises a limiting frame, the outer side of the limiting frame is fixedly provided with a limiting ring, the front side of the limiting frame is fixedly provided with a handle, the limiting frame is internally and fixedly provided with a limiting block, the surface of the limiting block is fixedly provided with a rubber pad, the limiting frame is internally and movably provided with a limiting plate, and the limiting plate is fixedly connected with the limiting ring. When a wafer is placed above the supporting columns, the wafer is supported by the supporting columns, meanwhile, the two sides of the wafer are located in the grooves of the limiting columns, when the top cover is installed above the limiting frame in a penetrating and inserting mode, the grooves of the downward pressing columns make contact with the wafer, the positions of the connecting blocks are limited by the wafer, and when the top cover moves downwards to make contact with the limiting rings, the connecting blocks are separated from the grooves of the downward pressing columns. When the wafer moves, the pressing spring shrinks under the support of the wafer and the gravity effect of the top cover, and the position of the wafer is limited through the counter-acting force generated when the pressing spring shrinks, so that the wafer is prevented from moving up and down in the moving process.
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Description

Technical Field

[0001] The utility model relates to the technical field of wafer storage, in particular to a semiconductor wafer quartz boat. Background Art

[0002] Quartz boat is also known as quartz glass. Quartz glass is made of silicon dioxide-containing materials such as crystal, silica, and silicon tetroxide by high-temperature melting. Its silicon dioxide content is much higher than that of ordinary glass. Generally, the silicon dioxide content of quartz glass is 99.999%. Quartz glass has excellent optical properties. It not only has excellent visible light transmittance, but also transmits ultraviolet rays and infrared rays. Quartz glass is a good acid-resistant material.

[0003] The existing Chinese utility model patent with reference announcement number CN214099605U discloses a semiconductor wafer quartz boat, including a bottom plate and a semiconductor wafer quartz boat body, the top surface of the bottom plate is provided with two symmetrically distributed slide grooves, two sliders are slidably connected in the slide grooves, the top surfaces of the two adjacent sliders are fixedly connected with a mounting plate slidably connected to the top surface of the bottom plate, the top surface of the mounting plate is provided with a positioning mechanism and a tightening mechanism, the semiconductor wafer quartz boat body is placed on the tightening mechanism, and symmetrically distributed telescopic rods are fixedly connected at both ends of the top surface of the bottom plate. The utility model, the device can use the positioning mechanism and the tightening mechanism to tighten the semiconductor wafer quartz boat body on the carrier plate, and use a rotating motor to rotate it, so as to cooperate with the sponge block to scrape and clean the inner wall of the semiconductor wafer quartz boat body, which is more convenient, thereby bringing certain convenience to the use of the semiconductor wafer quartz boat body.

[0004] The existing wafer quartz boat generally has four fixed slotted quartz columns to limit the position of the wafer. This method can only support the wafer. During the movement, the wafer may be thrown out of the groove of the quartz column. At the same time, the existing wafer quartz boat has an open structure, and dust in the air may adhere to the surface of the wafer. Utility Model Content

[0005] 1. Technical issues to be resolved

[0006] In view of the deficiencies in the prior art, the utility model provides a semiconductor wafer quartz boat, which has the advantages of preventing dust from adhering to the surface of the wafer and being able to limit the position of the wafer during movement, thereby solving the above-mentioned technical problems.

[0007] (II) Technical solution

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor wafer quartz boat, comprising: a limit frame, a limit ring is fixedly installed on the outer side of the limit frame, a handle is fixedly installed on the front side of the limit frame, a limit block is fixedly installed on the inside of the limit frame, a rubber pad is fixedly installed on the surface of the limit block, a limit plate is movably installed on the inside of the limit frame, a limit column is inserted through the upper part of the limit plate, a support column is inserted through the lower part of the limit plate, a top cover is embeddedly installed on the upper part of the limit frame, a connecting column is inserted through the upper part of the top cover, a downward pressure spring is inserted through the outer side of the connecting column, a connecting block is fixedly installed on the lower end of the connecting column, and a downward pressure column is inserted through the inside of the connecting block; the limit frame can protect the wafer.

[0009] As a preferred technical solution of the utility model, the limit ring is fixedly installed above the outer facade of the limit frame, the top surface of the limit ring contacts the bottom surface of the top cover, and the handle is installed at the center of the front and rear facades of the limit frame in a front and rear mirror-symmetrical manner with the center of the limit frame as a reference; the limit ring can support the top cover.

[0010] As a preferred technical solution of the utility model, the upper end of the rear side facade of the limit block is a slope structure, the rubber pad is fixedly installed on the slope structure of the limit block and the outer side of the rear side facade, and the limit block is installed on the bottom surface of the inner cavity of the limit frame in a front-to-back mirror-symmetrical manner with the center of the limit frame as the reference; the limit block can limit the position of the limit plate.

[0011] As a preferred technical solution of the utility model, the limit plate is symmetrically installed on the front and rear ends of the limit column with the center of the limit column as the reference, the limit plate is in contact with the rubber pad, and the limit column is symmetrically installed on the left and right sides of the upper end of the limit plate with the center of the limit plate as the reference; the limit plate can limit the position of the limit column and the support column.

[0012] As a preferred technical solution of the utility model, the groove structures of the limit columns on the left and right sides of the limit plate are opposite, and the support column is symmetrically installed on the lower end of the limit plate with the center of the limit plate as the reference, and the groove structure of the support column points to the center of the limit plate; the support column can support the wafer.

[0013] As a preferred technical solution of the utility model, a sliding connection is formed between the top cover and the limit frame, and the connecting column is symmetrically installed on the front and rear sides of the top cover with the center of the top cover as a reference, and the connecting column forms a sliding connection between the top cover; the connecting column can limit the position of the downward pressure spring.

[0014] As the preferred technical solution of the utility model, the pressure column is installed symmetrically on the left and right sides of the connecting block with the center of the connecting block as the reference, and the groove structure of the pressure column points to the center of the limiting plate; the pressure column can limit the position of the wafer.

[0015] Compared with the prior art, the utility model provides a semiconductor wafer quartz boat, which has the following beneficial effects:

[0016] 1. The utility model sets a downward pressure spring, which is inserted and installed on the outside of the connecting column. The upper end of the downward pressure spring is in contact with the top surface of the inner cavity of the top cover, and the lower end of the downward pressure spring is in contact with the connecting block. When the wafer is placed on the supporting column, the wafer will be supported by the supporting column, and at the same time, both sides of the wafer will be located in the groove of the limiting column. When the top cover is inserted and installed above the limiting frame, the groove of the downward pressure column will contact the wafer, and the position of the connecting block will be limited by the wafer. When the top cover moves downward and contacts the limiting ring, the downward pressure spring will contract under the support of the wafer and the gravity of the top cover, and the position of the wafer will be limited by the reaction force of the downward pressure spring when it contracts, thereby preventing the wafer from moving up and down during the movement.

[0017] 2. The utility model sets a limit frame, and the limit blocks are installed in the limit frame in a front-back mirror-symmetrical manner with the center of the limit frame as a reference. The limit columns and the support columns can limit the position of the limit plate so that the limit plate is located between the limit blocks. At the same time, the top cover is embedded in the top of the limit frame. In this way, the wafer can be located inside the limit frame after being limited above the support columns. At the same time, the top cover can block external dust from entering the interior of the limit frame to avoid dust adhering to the surface of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0019] Figure 2 This is a schematic diagram of the connection structure between the limit frame and the limit plate of the utility model;

[0020] Figure 3 This is a schematic diagram of the connection structure between the limit frame and the top cover of the utility model;

[0021] Figure 4 This is a schematic diagram of the connection structure between the lower pressure column and the top cover of the utility model;

[0022] Among them: 1. limit frame; 11. limit ring; 12. handle; 13. limit block; 14. rubber pad; 15. limit plate; 16. limit column; 17. support column; 2. top cover; 21. connecting column; 22. downward pressure spring; 23. connecting block; 24. downward pressure column. DETAILED DESCRIPTION

[0023] The following is a further detailed description of the implementation of the present utility model in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present utility model, but cannot be used to limit the scope of the present utility model.

[0024] In the description of the present invention, unless otherwise specified, "multiple" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer", "front end", "rear end", "head", "tail" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", "third" and the like are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0025] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0026] See also Figure 1 - Figure 4 In the present embodiment, a semiconductor wafer quartz boat includes: a limit frame 1, a limit ring 11 is fixedly installed on the outer side of the limit frame 1, a handle 12 is fixedly installed on the front side of the limit frame 1, a limit block 13 is fixedly installed inside the limit frame 1, a rubber pad 14 is fixedly installed on the surface of the limit block 13, a limit plate 15 is movably installed inside the limit frame 1, a limit column 16 is inserted above the limit plate 15, and a support column 17 is inserted below the limit plate 15.

[0027] The limiting ring 11 is fixedly installed above the outer facade of the limiting frame 1, and the top surface of the limiting ring 11 contacts the bottom surface of the top cover 2. The handle 12 is installed at the center of the front and rear facades of the limiting frame 1 in a mirror-symmetrical manner with the center of the limiting frame 1 as the reference.

[0028] The upper end of the rear side facade of the limit block 13 is a slope structure, and the rubber pad 14 is fixedly installed on the slope structure of the limit block 13 and the outer side of the rear side facade. The limit block 13 is installed on the bottom surface of the inner cavity of the limit frame 1 in a front-to-back mirror-symmetrical manner with the center of the limit frame 1 as the reference.

[0029] The limit plate 15 is installed symmetrically at the front and rear ends of the limit column 16 with the center of the limit column 16 as the reference. The limit plate 15 contacts the rubber pad 14. The limit column 16 is installed symmetrically at the left and right sides of the upper end of the limit plate 15 with the center of the limit plate 15 as the reference.

[0030] The groove structures of the limiting columns 16 on the left and right sides of the limiting plate 15 are opposite, and the support column 17 is installed symmetrically at the lower end of the limiting plate 15 with the center of the limiting plate 15 as the reference, and the groove structure of the support column 17 points to the center of the limiting plate 15.

[0031] Specifically, the limit frame 1 can protect the wafer, the limit ring 11 can support the top cover 2, the handle 12 can facilitate the movement of the limit frame 1, the limit block 13 can limit the position of the limit plate 15, the rubber pad 14 can increase the relative friction between the limit block 13 and the limit plate 15, the limit plate 15 can limit the position of the limit column 16 and the support column 17, the limit column 16 can limit the position of the wafer, and the support column 17 can support the wafer.

[0032] A top cover 2 is installed on the top of the limit frame 1, a connecting column 21 is installed on the top of the top cover 2, a downward pressure spring 22 is installed on the outer side of the connecting column 21, a connecting block 23 is fixedly installed on the lower end of the connecting column 21, and a downward pressure column 24 is installed inside the connecting block 23.

[0033] The top cover 2 and the limiting frame 1 are slidably connected. The connecting column 21 is symmetrically installed on the front and rear sides of the top cover 2 with the center of the top cover 2 as a reference. The connecting column 21 and the top cover 2 are slidably connected.

[0034] The pressing column 24 is installed symmetrically on the left and right sides of the connecting block 23 with the center of the connecting block 23 as a reference, and the groove structure of the pressing column 24 points to the center of the limiting plate 15 .

[0035] Specifically, the top cover 2 can limit the position of the connecting block 23, the connecting column 21 can limit the position of the downward pressure spring 22, and form a movable connection between the connecting block 23 and the top cover 2, the connecting block 23 can limit the position of the downward pressure column 24, and the downward pressure column 24 can limit the position of the wafer.

[0036] When in use, the downward pressure spring 22 is inserted and installed on the outer side of the connecting column 21, and the upper end of the downward pressure spring 22 is in contact with the top surface of the inner cavity of the top cover 2, and the lower end of the downward pressure spring 22 is in contact with the connecting block 23. When the wafer is placed on the support column 17, the wafer will be supported by the support column 17, and the two sides of the wafer will be located in the groove of the limiting column 16. When the top cover 2 is inserted and installed above the limiting frame 1, the groove of the downward pressure column 24 will contact the wafer, and the position of the connecting block 23 will be limited by the wafer. When the top cover 2 moves downward and contacts the limiting ring 11, the downward pressure spring 22 will shrink under the support of the wafer and the gravity of the top cover 2. The position of the wafer is limited by the reaction force of the downward pressure spring 22 when it contracts, so as to prevent the wafer from moving up and down during the movement. The limit blocks 13 are installed in the interior of the limit frame 1 in a front-to-back mirror-symmetrical manner with the center of the limit frame 1 as the reference. The limit columns 16 and the support columns 17 can limit the position of the limit plate 15, so that the limit plate 15 is located between the limit blocks 13. At the same time, the top cover 2 is embedded and installed on the top of the limit frame 1. In this way, the wafer can be located inside the limit frame 1 after being limited above the support columns 17. At the same time, the top cover 2 can prevent external dust from entering the interior of the limit frame 1 to prevent dust from adhering to the surface of the wafer.

[0037] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor wafer quartz boat, characterized in that: include: A limit frame (1), wherein a limit ring (11) is fixedly mounted on the outer side of the limit frame (1), a handle (12) is fixedly mounted on the front side of the limit frame (1), a limit block (13) is fixedly mounted on the inner side of the limit frame (1), a rubber pad (14) is fixedly mounted on the surface of the limit block (13), a limit plate (15) is movably mounted on the inner side of the limit frame (1), a limit column (16) is inserted and mounted above the limit plate (15), a support column (17) is inserted and mounted below the limit plate (15), a top cover (2) is embedded and mounted above the limit frame (1), a connecting column (21) is inserted and mounted above the top cover (2), a downward pressure spring (22) is inserted and mounted on the outer side of the connecting column (21), a connecting block (23) is fixedly mounted on the lower end of the connecting column (21), and a downward pressure column (24) is inserted and mounted inside the connecting block (23).

2. The semiconductor wafer quartz boat according to claim 1, characterized in that: The limiting ring (11) is fixedly mounted above the outer facade of the limiting frame (1), the top surface of the limiting ring (11) contacts the bottom surface of the top cover (2), and the handle (12) is mounted at the center of the front and rear facades of the limiting frame (1) in a mirror-symmetrical manner with the center of the limiting frame (1) as a reference.

3. The semiconductor wafer quartz boat according to claim 1, characterized in that: The upper end of the rear side elevation of the limit block (13) is a slope structure, the rubber pad (14) is fixedly mounted on the slope structure of the limit block (13) and the outer side of the rear side elevation, and the limit block (13) is mounted on the bottom surface of the inner cavity of the limit frame (1) in a front-to-back mirror-symmetrical manner with the center of the limit frame (1) as a reference.

4. The semiconductor wafer quartz boat according to claim 1, characterized in that: The limit plate (15) is symmetrically mounted on the front and rear ends of the limit column (16) with the center of the limit column (16) as a reference, the limit plate (15) is in contact with the rubber pad (14), and the limit column (16) is symmetrically mounted on the left and right sides of the upper end of the limit plate (15) with the center of the limit plate (15) as a reference.

5. The semiconductor wafer quartz boat according to claim 1, characterized in that: The groove structures of the limiting columns (16) on the left and right sides of the limiting plate (15) are opposite to each other, and the support column (17) is symmetrically installed on the lower end of the limiting plate (15) with the center of the limiting plate (15) as a reference, and the groove structure of the support column (17) points to the center of the limiting plate (15).

6. The semiconductor wafer quartz boat according to claim 1, characterized in that: The top cover (2) and the limiting frame (1) are slidably connected, and the connecting column (21) is symmetrically mounted on the front and rear sides of the top cover (2) with the center of the top cover (2) as a reference, and the connecting column (21) and the top cover (2) are slidably connected.

7. The semiconductor wafer quartz boat according to claim 1, characterized in that: The lower pressure column (24) is symmetrically installed on the left and right sides of the connection block (23) with the center of the connection block (23) as a reference, and the groove structure of the lower pressure column (24) points to the center of the limit plate (15).

Citation Information

Patent Citations

  • Semiconductor wafer quartz boat

    CN214099605U