Chip pin packaging structure and communication module
By designing multiple antenna groups and ground pins on the package substrate and ensuring that the spacing between the second ground pin and the antenna pin is smaller than the required spacing, the problem of pin count limit and impedance discontinuity in traditional LGA modules is solved, signal return and impedance continuity is achieved, while increasing the number of antenna pins, adapting to the needs of 5G communication modules.
Patent Information
- Application Number
- CN202421228390.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-05-30
AI Technical Summary
Traditional LGA pin definitions limit the increase in the number of pins, and the spacing between the ground pin and the antenna in the BGA form LGA module is too wide, resulting in discontinuity of impedance and affecting communication performance.
A chip pin package structure is designed, including multiple antenna groups on a package substrate, each antenna group includes an antenna pin and a plurality of first ground pins, the first ground pin and the antenna pin are arranged on different pin rows, and the spacing between the second ground pin for impedance matching and the antenna pin is smaller than the required spacing to ensure continuous impedance.
Through this design, the signal return and impedance continuity of the antenna is ensured, while increasing the number of antenna pins that can be defined in the LGA module in the BGA form, which can adapt to the communication requirements of the communication module.
Smart Images
Figure CN222581161U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of signal processing, and in particular to a chip pin packaging structure and a communication module. Background Art
[0002] As the link in the IoT industry, communication modules provide support for the interconnection of all things and are widely used in IoT (Internet of Things) industries such as POS (Point Of Sale), power grid, and Internet of Vehicles. With the application of 5G large-bandwidth and high-speed modules in the MBB (Mobile Broadband) market, they usually have the function of AP (Access Point), which greatly expands the interface function of the communication module. In addition, as the power consumption of 5G communication modules increases, a large number of GND pins are required for heat dissipation. Therefore, the number of pins required for 5G communication modules is usually more than 400 pins. The traditional LGA (Land Grid Array) pin definition greatly limits the increase in the number of pins. At the same time, due to the small pin spacing of LGA pins, the problem of cold soldering and short circuit occurs. Therefore, the LGA package module combined with the BGA (Ball Grid Array Package) form came into being. While increasing the number of pins, the BGA form LGA module also increases the pin spacing, making the distance between the ground pin and the antenna too wide, resulting in impedance discontinuity and affecting communication performance.
[0003] Therefore, how to provide a solution to the above technical problems is a problem that those skilled in the art need to solve at present. Utility Model Content
[0004] The purpose of this application is to provide a chip pin packaging structure and a communication module, which can ensure the signal return and impedance continuity of the antenna, while increasing the number of definable antenna pins in the BGA form LGA module, and can adapt to the communication requirements of the communication module.
[0005] To solve the above technical problems, the present application provides a chip pin packaging structure, which is applied to a communication module. The chip pin packaging structure includes a packaging substrate, on which a plurality of antenna groups are arranged. Each of the antenna groups includes an antenna pin, and a plurality of first ground pins corresponding to the antenna pin. The first ground pin and the antenna pin are arranged on different pin rows of the packaging substrate. The plurality of first ground pins include two second ground pins for impedance matching of the antenna trace. The spacing between each of the second ground pins and the antenna pin is less than the required spacing so that the impedance of the antenna trace is continuous.
[0006] Optionally, the plurality of first ground pins further include a third ground pin used to cooperate with the second ground pin to surround the antenna pin.
[0007] Optionally, the plurality of first ground pins further include spaced ground pins;
[0008] The spaced ground pin is arranged between two adjacent antenna pins.
[0009] Optionally, a plurality of antenna pins are arranged on the same pin row of the packaging substrate;
[0010] All the second ground pins are arranged on the same pin row of the packaging substrate.
[0011] Optionally, the number of antenna pins is greater than or equal to the required number of antennas of the communication module.
[0012] Optionally, all the second ground pins are arranged on a top pin row of the packaging substrate;
[0013] All of the antenna pins are arranged in a pin row adjacent to the top pin row.
[0014] In order to solve the above technical problems, the present application also provides a communication module, including a printed circuit board and a chip pin packaging structure as described in any one of the above items connected to the printed circuit board.
[0015] Optionally, the printed circuit board and the chip pin packaging structure are connected by welding.
[0016] The present application provides a chip pin packaging structure, which is applied to a communication module. The chip pin packaging structure includes a packaging substrate, on which a plurality of antenna groups are arranged. Each antenna group includes an antenna pin and a plurality of first ground pins arranged corresponding to the antenna pin. The first ground pin and the antenna pin are arranged on different pin rows of the packaging substrate. The plurality of first ground pins include two second ground pins for impedance matching of the antenna trace. The spacing between each second ground pin and the antenna pin is less than the required spacing so that the impedance of the antenna trace is continuous.
[0017] In actual applications, the solution of the present application is adopted. When defining the antenna pin and the ground pin on the packaging substrate, the spacing between the second ground pin designed for impedance matching with the antenna trace and the antenna pin is smaller than the required spacing to make the antenna trace impedance continuous, thereby ensuring the signal return and impedance continuity of the antenna. At the same time, the antenna pin and the ground pin are defined to be located on different pin rows of the packaging substrate, so that more antenna pins can be defined on the pin row where the antenna pin is located, thereby increasing the number of definable antenna pins in the BGA form LGA module, which can adapt to the communication requirements of the communication module.
[0018] The present application also provides a communication module having the same beneficial effects as the above-mentioned chip pin packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0020] Figure 1 A schematic diagram of the first chip pin packaging structure provided in this application;
[0021] Figure 2 A schematic diagram of the second chip pin packaging structure provided by the present application;
[0022] Figure 3 This is a schematic diagram of the third chip pin packaging structure provided in this application. DETAILED DESCRIPTION
[0023] The core of this application is to provide a chip pin packaging structure and a communication module, which can ensure the signal return and impedance continuity of the antenna, while increasing the number of definable antenna pins in the BGA form LGA module, and can adapt to the communication requirements of the communication module.
[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.
[0025] First, please refer to Figure 1 , Figure 1A schematic diagram of a chip pin packaging structure provided in the present application, the chip pin packaging structure includes a packaging substrate 1, a plurality of antenna groups are provided on the packaging substrate 1, each antenna group includes an antenna pin 11, and a plurality of first ground pins arranged corresponding to the antenna pin 11, the first ground pin and the antenna pin 11 are arranged on different pin rows of the packaging substrate 1, the plurality of first ground pins include two second ground pins 12 for impedance matching of the antenna trace, and the spacing between each second ground pin 12 and the antenna pin 11 is less than the required spacing so that the impedance of the antenna trace is continuous.
[0026] In this embodiment, the chip packaging pins include a packaging substrate 1, and a plurality of antenna groups are provided on the packaging substrate 1. Each antenna group includes an antenna pin 11 and a plurality of first ground pins. The plurality of first ground pins are arranged around the antenna pin 11. Specifically, the first ground pin and the antenna pin 11 are arranged on different pin rows of the packaging substrate 1, so that more pins on the pin row where the ground pin 11 is located are defined as antenna pins 11, thereby increasing the number of definable antenna pins in the BGA form LGA module to adapt to the communication requirements of the communication module. The multiple first ground pins include two second ground pins 12, and the second ground pin 12 is used for impedance matching with the antenna trace. It can be understood that the distance between the ground pin used for impedance matching and the antenna pin 11 should not be too large, otherwise it will seriously affect the signal return of the antenna and the continuity of impedance matching, and the design requirements cannot be met at the technical level. Based on this, the present application defines the pin on the packaging substrate 1 whose spacing with the antenna pin 11 is less than the required spacing as the second ground pin 12. It can be understood that in the LGA packaging design using the BGA form, the spacing between two adjacent pins in the horizontal direction is 1.525mm, and the spacing between the ground pin used for impedance matching and the antenna pin 11 should not exceed 0.7mm. Therefore, the antenna pin 11 and the second ground pin 12 should be arranged in different pin rows, such as Figure 1 As shown, the hollow circle is used to indicate the ground pin, and the solid circle is used to indicate the antenna pin 11. With the design of the present application, the spacing between the antenna trace and the second ground pin 12 is 1.525 / 2=0.76mm. On this basis, considering the 0.1mm of the antenna trace itself, the actual spacing between the antenna trace and the second ground pin 12 is about 0.66mm, which can meet the impedance matching requirements and ensure the signal return and impedance continuity of the antenna.
[0027] The present application provides a chip pin packaging structure. When defining an antenna pin 11 and a ground pin on a packaging substrate 1, the spacing between a second ground pin 12 designed for impedance matching with an antenna trace and the antenna pin 11 is smaller than the required spacing for making the antenna trace impedance continuous, thereby ensuring the signal return and impedance continuity of the antenna, while increasing the number of definable antenna pins in a BGA-style LGA module, which can adapt to the communication requirements of the communication module.
[0028] Based on the above embodiments:
[0029] As an optional embodiment, refer to Figure 2 As shown, the plurality of first ground pins further include a third ground pin 13 used to cooperate with the second ground pin 12 to surround the antenna pin 11 .
[0030] In this embodiment, for each antenna pin 11, the corresponding multiple first ground pins also include a third ground pin 13 used to cooperate with the second pin to surround the antenna pin 11, that is, the two second ground pins 12 and the two third ground pins 13 form a complete GND encirclement circle, which can meet the requirements of production testing for RF shielding integrity.
[0031] As an optional embodiment, refer to Figure 3 As shown, the plurality of first ground pins also include spaced ground pins 14;
[0032] The spaced ground pin 14 is disposed between two adjacent antenna pins 11 .
[0033] In this embodiment, an interval ground pin 14 is further provided between any two antenna pins 11. The interval ground pin 14 is provided to achieve signal isolation of antenna wiring in the two antenna pins 11, thereby improving the reliability of data transmission.
[0034] As an optional embodiment, a plurality of antenna pins 11 are arranged on the same pin row of the package substrate 1;
[0035] All the second ground pins 12 are disposed on the same pin row of the package substrate 1 .
[0036] In this embodiment, in order to avoid occupying other pins in the package substrate 1 , multiple antenna pins 11 are defined in the same pin row of the package substrate 1 , and correspondingly, all second ground pins 12 are arranged in the same pin row of the package substrate 1 .
[0037] As an optional embodiment, the number of antenna pins 11 is greater than or equal to the number of antennas required by the communication module. As an optional embodiment, all second ground pins 12 are arranged on the top pin row of the package substrate 1;
[0038] All antenna pins 11 are arranged in a pin row adjacent to the top pin row.
[0039] In this embodiment, since different communication modules require different numbers of antennas, this embodiment selects the pin row in the package substrate 1 for defining the antenna pins 11 based on the number of antennas required by the communication module, the need for multiple antenna pins 11 to be arranged in the same pin row, and the provision of an interval ground pin 14 between any two antenna pins 11. Specifically, the package substrate is a quadrilateral, and the pin rows adjacent to each side of the package substrate are determined as peripheral pin rows on the package substrate. All second ground pins 12 can be arranged on any peripheral pin row, and all antenna pins 11 are arranged on pin rows adjacent to the peripheral pin row defining the second ground pins 12. For the 5G communication module, 8 antennas are required. At the same time, in order to avoid occupying too many signal pins, it is convenient to layout and wire the signal pins in the later stage. Figure 2 As shown, the second ground pin 12 can be arranged in the top pin row, and the antenna pin 11 can be arranged in the second pin row. By adopting the solution of the present application, while the pin spacing of the LGA module in the form of BGA is increased, the number of antenna pins 11 is effectively increased, which can meet the design requirements of 5G communication modules for multiple antennas.
[0040] In a second aspect, the present application further provides a communication module, including a printed circuit board and a chip pin packaging structure connected to the printed circuit board as described in any one of the embodiments above.
[0041] As an optional embodiment, the printed circuit board and the chip pin packaging structure are connected by welding.
[0042] For an introduction to the communication module provided in this application, please refer to the above embodiments, and this application will not go into details here.
[0043] The communication module provided in the present application has the same beneficial effects as the above-mentioned chip pin packaging structure.
[0044] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprising a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.
[0045] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A chip pin packaging structure, applied to a communication module, characterized in that: The chip pin packaging structure includes a packaging substrate, on which a plurality of antenna groups are arranged, each of the antenna groups includes an antenna pin and a plurality of first ground pins arranged corresponding to the antenna pin, the first ground pin and the antenna pin are arranged on different pin rows of the packaging substrate, the plurality of first ground pins include two second ground pins for impedance matching of the antenna trace, and the spacing between each of the second ground pins and the antenna pin is less than the required spacing so that the impedance of the antenna trace is continuous.
2. The chip pin packaging structure according to claim 1, characterized in that: The plurality of first ground pins also include a third ground pin used to cooperate with the second ground pin to surround the antenna pin.
3. The chip pin packaging structure according to claim 1, characterized in that: The plurality of first ground pins also include spaced ground pins; The spaced ground pin is arranged between two adjacent antenna pins.
4. The chip pin packaging structure according to claim 1, characterized in that: The plurality of antenna pins are arranged on the same pin row of the packaging substrate; All the second ground pins are arranged on the same pin row of the packaging substrate.
5. The chip pin packaging structure according to claim 4, characterized in that: The number of the antenna pins is greater than or equal to the required number of antennas of the communication module.
6. The chip pin packaging structure according to any one of claims 1 to 5, characterized in that: All the second ground pins are arranged on the top pin row of the packaging substrate; All of the antenna pins are arranged in a pin row adjacent to the top pin row.
7. A communication module, characterized in that: The invention comprises a printed circuit board and a chip pin packaging structure as claimed in any one of claims 1 to 6 connected to the printed circuit board.
8. The communication module according to claim 7, characterized in that: The printed circuit board and the chip pin packaging structure are connected by welding.