Elastic sheet connecting structure and electronic equipment

Abstract

The embodiment of the utility model provides an elastic piece connecting structure and electronic equipment, the elastic piece connecting structure is suitable for a circuit board, one side of the circuit board is provided with external equipment, and the elastic piece connecting structure comprises a base which is arranged on a welding surface of the edge side of the circuit board and is connected with a circuit on the circuit board; the first end of the elastic connecting arm is connected to the base, and the second end of the elastic connecting arm extends out of the side part of the base; wherein the elastic connecting arm obliquely extends from one side of the welding face to the other side of the welding face, the base and the second end of the elastic connecting arm are located on the two sides of the welding face respectively, and the end portion of the second end abuts against external equipment. According to the technical scheme, the base is connected to the welding face of the circuit board, and the base and the second end of the elastic connecting arm are located on the two sides of the welding face respectively, so that the situation that the base and the elastic connecting arm of the elastic piece connecting structure are located on the same face of the circuit board is effectively avoided, and the space occupied by the circuit board in the height direction is remarkably reduced; therefore, the electronic equipment can be developed to be light and thin.

Description

Technical Field

[0001] The present application relates to the technical field of spring-type connectors, and in particular to a spring connection structure and electronic equipment. Background Art

[0002] Circuit connection is an indispensable and abundant link in electronic equipment and systems, and the stability of circuit connection is crucial to achieving the stability of electronic equipment performance. As the structure of electronic terminal products becomes more and more compact, the size of electronic equipment is increasingly moving towards miniaturization, which poses a great challenge to the electrical connection of different circuit boards. As a commonly used elastic electrical connection method in electronic equipment, there is a stronger demand for electrical connection springs to occupy a small board space and have high reliability in the whole machine.

[0003] However, the base and elastic arm of the existing electrical connection spring are usually located on the same side of the soldering surface of the circuit board, and the long side of the base of the electrical connection spring is placed perpendicular to the circuit board. In addition, since the rebound of the elastic arm requires a certain amount of space, the electrical connection spring cannot be made very thin, which will make the circuit board occupy more space in the height direction, which is not conducive to the development of electronic equipment towards thinness. Utility Model Content

[0004] Multiple aspects of the present application provide a spring connection structure and an electronic device, which are used to reduce the space occupied by the spring connection structure above the circuit board, which is conducive to the development of electronic devices equipped with such a circuit board towards lighter and thinner.

[0005] The embodiment of the present application provides a spring connection structure, which is applicable to a circuit board, one side of which is provided with an external device, and the spring connection structure includes:

[0006] A base, which is arranged on a welding surface at an edge side of the circuit board and is connected to a circuit on the circuit board;

[0007] An elastic connecting arm, a first end of which is connected to the base and a second end of which extends outside a side portion of the base;

[0008] The elastic connecting arm obliquely extends from one side of the welding surface to the other side of the welding surface, the base and the second end of the elastic connecting arm are respectively located on both sides of the welding surface, and the end of the second end abuts against the external device.

[0009] Optionally, along the height direction of the spring connection structure, the second end has a contact point with the external device, and the height of the contact point is higher than the height of the welding surface.

[0010] Optionally, the distance between the contact point and the welding surface is equal to the thickness of the circuit board;

[0011] Alternatively, the thickness of the circuit board is m millimeters, the distance between the contact point and the welding surface is n millimeters, and the numerical difference between m and n is less than or equal to 1 millimeter.

[0012] Optionally, the base further includes a first connecting portion and / or a second connecting portion, and the first connecting portion and / or the second connecting portion are respectively connected to the welding surface.

[0013] Optionally, the first connection portion is a surface mount solder foot, and the second connection portion is a direct-insert package solder foot;

[0014] The welding surface is correspondingly provided with welding pads and welding holes, the surface mount welding feet are welded and connected to the welding pads, and the direct insertion package welding feet are welded and connected to the welding holes.

[0015] Optionally, the base has an accommodating space, the width of the accommodating space is greater than the width of the elastic connecting arm, and when the elastic connecting arm is pressed, part of the elastic connecting arm can retreat into the accommodating space.

[0016] Optionally, the elastic connecting arm includes a first arm and a second arm, the first end of the first arm is connected to the base, the second end of the first arm is connected to the first end of the second arm through an arc segment, and the second end of the second arm extends into the accommodating space;

[0017] A contact structure is provided on the arc segment.

[0018] Optionally, the width of the first end of the first arm is greater than the width of the second end of the first arm, and along the length direction of the first arm, the first arm includes a narrowing section and an inclined section, and the width of the narrowing section gradually decreases;

[0019] The angle between the narrowed section and the base is a right angle or an obtuse angle, and the angle between the narrowed section and the inclined section is an obtuse angle.

[0020] Optionally, the base includes a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are respectively arranged on both sides of the bottom plate to form a groove structure with an accommodating space;

[0021] The first arm of the elastic connecting arm is connected to the end of the bottom plate.

[0022] Optionally, a first connecting portion and a second connecting portion are respectively provided on the top of the first side plate and the second side plate, and the first connecting portion and the second connecting portion are spaced apart;

[0023] The first connecting portion is a bent structure, and the top surface of the first connecting portion is a surface mounted surface to be welded to the circuit board;

[0024] Along the height direction of the base, the height of the top end of the second connecting portion is greater than the height of the surface mounting surface.

[0025] Optionally, along the length direction of the base, the ends of the first side plate and the second side plate close to the elastic connecting arm are respectively provided with baffles extending along the width direction of the base;

[0026] The width of the baffle gradually narrows from top to bottom.

[0027] Optionally, a scratch-proof structure is provided at the top of the baffle, and the scratch-proof structure extends from the top of the baffle toward the direction where the accommodating space is located;

[0028] The top of the anti-scratch structure is flush with the top of the first side plate or the second side plate.

[0029] In another embodiment of the present application, there is also provided an electronic device, comprising a circuit board, an external device and at least one of the above-mentioned spring-type connection structures;

[0030] The spring connection structure is arranged on the welding surface at the edge side of the circuit board;

[0031] The external device is located beside the circuit board, the elastic connecting arm on the spring connection structure extends obliquely from one side of the welding surface to the other side of the welding surface, the base and the second end of the elastic connecting arm are respectively located on both sides of the welding surface, and the end of the elastic connecting arm abuts against the external device.

[0032] In the technical solution provided in the present application, the base is connected to the welding surface of the circuit board. Along the height direction of the spring connection structure, the elastic connecting arm extends obliquely from one side of the welding surface to the other side of the welding surface. The second ends of the base and the elastic connecting arm are respectively located on both sides of the welding surface, thereby effectively avoiding the base and the elastic connecting arm of the spring connection structure being located on the same surface of the circuit board. The space occupied by the circuit board in the height direction is significantly reduced, which is conducive to the development of electronic equipment towards lighter and thinner directions. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0034] Figure 1 A simplified structural diagram of a use scenario of a spring-type connection structure provided in an embodiment of the present application;

[0035] Figure 2 A front view of a spring connection structure provided in an embodiment of the present application;

[0036] Figure 3 A three-dimensional diagram of a spring connection structure provided in an embodiment of the present application;

[0037] Figure 4 Another three-dimensional diagram of a spring connection structure provided in an embodiment of the present application;

[0038] Figure 5 A schematic diagram of the installation of a circuit board provided in an embodiment of the present application;

[0039] Figure 6 A simplified structural diagram of another usage scenario of a spring connection structure provided in an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in combination with the specific embodiments of the present application and the corresponding drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present application.

[0041] In the present application, the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present application, unless otherwise specified, "multiple" means two or more. In addition, in the present application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components schematically placed in the drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to each other, and they may change accordingly according to changes in the orientation of the components placed in the drawings.

[0042] In this application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium. In addition, the term "coupling" can be a way of achieving electrical connection for signal transmission. "Coupling" can be a direct electrical connection or an indirect electrical connection through an intermediate medium.

[0043] Figure 1 A schematic diagram of a use scenario of a spring connection structure provided in an embodiment of the present application is shown in FIG. Figure 2 This is a front view of a spring connection structure provided in an embodiment of the present application. Figure 1 and Figure 2The embodiment of the present application provides a spring connection structure 2, which is suitable for a circuit board 1, and an external device 3 is provided on one side of the circuit board 1. The spring connection structure 2 includes: a base 21 and an elastic connection arm 22. The base 21 is provided on the welding surface 103 on the edge side of the circuit board 1, and is connected to the circuit on the circuit board 1. The base 21 can be connected to the circuit on the circuit board 1 through a welding process, or can be connected to the circuit board 1 through a fastener (screw, rivet, etc.). The connection between the base 21 and the circuit board 1 not only includes a structural fastening connection between the base 21 and the circuit board 1, but also the base 21 is coupled to the circuit on the circuit board 1. The first end of the elastic connection arm 22 is connected to the base 21, and the second end extends to the outside of the side of the base 21. The elastic connection arm 22 is used to connect to the external device 3 on the side of the circuit board 1. Since the elastic connection arm 22 is elastic, the distance of the end extending out can be changed under the action of an external force, so as to adapt to the stable connection of the external device 3 at different distances from the side of the circuit board 1.

[0044] In order to improve the space utilization of the spring connection structure 2, the elastic connection arm 22 extends obliquely from one side of the welding surface 103 of the circuit board 1 to the other side of the welding surface 103, the base 21 and the second end of the elastic connection arm 22 are respectively located on both sides of the welding surface 103, and the end of the second end is connected to the external device 3. In the technical solution of the present application, the ends of the base 21 and the elastic connection arm 22 are respectively located on both sides of the welding surface 103, so that it can effectively avoid that when the base 21 and the elastic connection arm 22 are located on the same side, more space is occupied in the height direction.

[0045] Generally, the circuit board 1 has a top surface 101 (TOP surface) and a bottom surface 102 (BOTTOM surface). Circuit structures are arranged on the top surface and the bottom surface of the circuit board 1, and electronic components can be soldered on the top surface or the bottom surface. In the technical solution provided in the present application, the soldering surface 103 can be the top surface 101 of the circuit board or the bottom surface 102 of the circuit board.

[0046] Taking the circuit board 1 as a PCB board in a mobile phone as an example, usually, due to the large size and heavy weight of some electronic components (such as: USB (Universal Serial Bus) interface, SIM (Subscriber Identity Module) card holder, etc.), they need to be soldered on the TOP surface of the circuit board 1, so the soldering surface at this time is the top surface 101 of the circuit board 1. In the technical solution of the present application, the circuit board 1 includes but is not limited to: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, ultra-thin circuit board, ultra-thin circuit board, printed (copper etching technology) circuit board, etc.

[0047] The external device 3 may be an antenna board, a structural metal bracket, a metal middle frame grounding circuit, a camera electrostatic protection module, a camera grounding circuit, a side key, a flash, an infrared laser, a signal transmission line, a sound cavity, a microphone, a receiver, various types of sensor flexible boards, a wireless charging module, an NFC (Near Field Communication) antenna, etc. The embodiment of the present application does not impose any special restrictions on the specific form of the external device 3.

[0048] Taking the electronic device as a mobile phone as an example, the conventional spring connection structure 2 is welded on the BOTTOM surface of the circuit board 1, and the long side of the base 21 of the spring connection structure 2 is placed perpendicular to the circuit board 1, and the base 21 of the spring connection structure 2 and the elastic connecting arm 22 are located on the same side of the welding surface 103. This arrangement will occupy more space along the thickness direction of the circuit board 1, which is not conducive to the thinning design of the circuit board 1. In the technical solution provided in the present application, by using the TOP surface of the circuit board 1 as the welding surface 103 of the circuit board 1, the elastic connecting arm 22 extends from the TOP surface of the circuit board 1 to the BOTTOM surface of the circuit board 1, thereby effectively avoiding the base 21 of the spring connection structure 2 and the elastic connecting arm 22 being located on the same side of the welding surface 103, and the second ends of the base 21 and the elastic connecting arm 22 are respectively located on both sides of the welding surface, and the space occupied by the circuit board 1 in the height direction is significantly reduced, which is conducive to the thinning design of the circuit board 1.

[0049] Another conventional spring-clip connection structure 2 is achieved by directly lowering the height of the base 21 of the spring-clip connection structure 2, thereby achieving thinning of the space above the BOTTOM surface of the circuit board 1. However, in order to achieve a stable electrical connection between the elastic connection arm 22 and the external device 3, the length of the elastic connection arm 22 needs to be long enough, which will cause the welding equipment to hit the steel mesh when welding the circuit board 1 on the TOP surface of the circuit board 1. Therefore, this setting method will make the elastic connection arm 22 unusable. However, in the technical solution of the present application, the spring-clip connection structure 2 is arranged on the TOP surface of the circuit board 1, and the elastic connection arm 22 extends from the top surface 101 of the circuit board 1 toward the bottom surface 102 of the circuit board 1. The extended elastic connection arm 22 does not hinder the welding equipment from welding larger electronic devices such as USB interfaces and SIM card holders on the TOP surface of the circuit board 1.

[0050] See also Figure 5In the technical solution provided in the present application, the base 21 of the spring connection structure 2 is arranged on the TOP surface of the circuit board 1, and the elastic connection arm 22 extends obliquely from one side of the welding surface 103 of the circuit board 1 to the direction of the other side. The extension direction of the elastic connection arm 22 can also be matched with the assembly direction of the circuit board 1, and the elastic connection arm 22 extending outward will not affect the assembly of the circuit board 1. When the circuit board is installed along the installation direction, after the elastic connection arm 22 abuts against the external device 3, the elastic connection arm will retreat in the direction of the arrow C, thereby avoiding being damaged by the external device 3. If the extension direction of the elastic connection arm 22 does not match the assembly direction of the circuit board 1, during the assembly process, the elastic connection arm 22 extending outward can be easily damaged and deformed by the external device 3. Therefore, the technical solution to the problem raised in the present application can effectively improve the adaptability of the circuit board 1 assembly, and the application range of the spring connection structure 2 is also wider.

[0051] In a specific embodiment, the circuit board 1 is a PCB board in a mobile phone, and the external device 3 is an antenna board arranged on the middle frame of the mobile phone. The circuit structure is connected between the PCB board and the antenna board through a plurality of spring connection structures 2. Usually, the PCB board is arranged on the middle frame body, and the antenna board is arranged on the frame body of the middle frame. The PCB board and the antenna board are separated by a certain distance, and the elastic connecting arm 22 having a certain length and extending outward obliquely can effectively be electrically connected to the antenna board.

[0052] See also Figure 1 , in order to control the height of the elastic connecting arm 22 protruding from the second surface of the circuit board 1. In an embodiment provided in the present application, along the height direction of the spring connecting structure 2 (the arrow Z direction in the figure), the second end and the external device 3 have a contact point D, and the distance between the contact point D and the welding surface 103 is equal to the thickness of the circuit board 1, as shown in the figure, m is equal to n. The arrow Z direction can also be considered as the thickness direction of the circuit board 1. Specifically, the arrow X direction is the length direction of the spring connecting structure 2, and the contact point D is located at the outermost side of the elastic connecting arm 22 along the X direction. A section of the elastic connecting arm 22 extends obliquely outward from the welding surface 103, and the distance between the contact point D and the welding surface 103 is equal to the thickness of the circuit board 1.

[0053] See also Figure 2 , the angle between the elastic connecting arm 22 and the welding surface 103 is α, and the value range of α is [30 degrees to 60 degrees], preferably 45 degrees. In the technical solution provided in the present application, a portion of the elastic connecting arm 22 extends obliquely outward from the welding surface 103 (TOP surface of the circuit board 1), and the height of the contact point D is equal to the thickness of the circuit board 1, which can not only effectively prevent the elastic connecting arm 22 from protruding too high from the BOTTOM surface (bottom surface 102) of the circuit board 1, thereby achieving thinning of the space above the BOTTOM surface of the circuit board 1, but also enable the elastic connecting arm 22 to effectively contact the external device 3 beside the circuit board 1.

[0054] See also Figure 1 and Figure 2 In addition, along the thickness direction of the circuit board 1, the contact point D can be located above or below the bottom surface 102 of the circuit board 1. Specifically, in another embodiment provided in the present application, the thickness of the circuit board 1 is m millimeters, the distance between the contact point D and the welding surface 103 is n millimeters, and the numerical difference between m and n is less than or equal to 1 millimeter. It can be understood that the height from the contact point D to the welding surface 103 is slightly higher than the second surface of the circuit board 1, or slightly lower than the second surface of the circuit board 1. In the technical solution of the present application, the height of the contact point D should not be too high or too low. When the contact point D is too high, the height of the elastic connecting arm 22 protruding from the bottom surface 102 of the circuit board 1 is also too high. When the contact point D is too low, the inclination angle of the elastic connecting arm 22 is too small, which is not conducive to the rebound of the elastic connecting arm 22 and is easy to break.

[0055] See also Figure 3 The base 21 has a receiving space 50, the width of which is greater than the width of the elastic connecting arm 22. When the elastic connecting arm 22 is compressed, part of the elastic connecting arm 22 can be retracted into the receiving space 50. In a specific embodiment, Figure 1 As shown, when the spring connection structure 2 is installed on the circuit board 1, the outer wall of the base 21 is roughly flush with the side wall of the circuit board 1, and on different circuit boards 1, the distance between the external device 3 and the side wall of the circuit board 1 is usually different. When the distance between the external device 3 and the side wall of the circuit board 1 is small, the elastic connection arm 22 will rebound a certain distance and abut against the external device 3, and part of the elastic connection arm 22 will extend into the accommodating space 50.

[0056] Further, see Figures 2 to 4 The elastic connecting arm 22 includes a first arm 4 and a second arm 5, a gap is provided between the first arm 4 and the second arm 5, and the first arm 4 and the second arm 5 can be arranged in parallel or in a non-parallel manner. Specifically, the first end of the first arm 4 is connected to the base 21 and is located at the bottom of the base 21, the second end of the first arm 4 is connected to the first end of the second arm 5 through the arc segment 6, and the second end of the second arm 5 extends into the accommodating space 50.

[0057] In order to make the end of the elastic connecting arm 22 have better electrical connectivity and wear resistance, a contact structure 7 is provided on the arc segment 6. Figures 2 to 4, the contact structure 7 is a ridge structure on the arc segment 6, and the elastic connecting arm 22 is electrically connected to the external device 3 through the ridge structure. The ridge structure can be the same material as the elastic connecting arm 22, or it can be a different material. Taking the example that the ridge structure and the elastic connecting arm 22 are made of different materials, the ridge structure is made of brass with good conductivity and better wear resistance. As the circuit board 1 is vibrated, the end of the elastic connecting arm 22 will continue to rub against the external device 3, and the more wear-resistant brass material can effectively increase the service life of the elastic connecting arm 22, and the electrical connection is not prone to failure. In addition, a film can be applied on the ridge structure to make it more wear-resistant.

[0058] See also Figures 2 to 4 In order to improve the structural strength and elastic force of the elastic connecting arm 22, the width of the first end of the first arm 4 is greater than the width of the second end of the first arm 4. Along the length direction of the first arm 4, the first arm 4 includes a narrowing section 41 and an inclined section 42, and the width of the narrowing section 41 gradually decreases. Specifically, the first end of the first arm 4 is connected to the base 21, and the connection between the narrowing section 41 and the inclined section 42 is approximately located on the welding surface 103. It can be understood that when the welding surface 103 is the top surface 101 of the circuit board 1, the inclined section 42 of the first arm 4 extends obliquely from the welding surface 103 toward the bottom surface 102 of the circuit board 1. When the elastic connecting arm 22 is subjected to force and rebounds, the force acting on the connection between the elastic connecting arm 22 and the base 21 is the largest, and this position is also more likely to break. By setting the narrowing section 41, the connection strength between the first arm 4 and the base 21 can be guaranteed, and the volume of the first arm 4 can be avoided to be too large. In one embodiment of the present application, the angle between the narrowing section 41 and the base 21 is a right angle or an obtuse angle, and the angle between the narrowing section and the inclined section 42 is an obtuse angle. When the angle between the narrowing section 41 and the base 21 is a right angle, the narrowing section 41 is substantially flush with the side surface of the base 21.

[0059] In the technical solution provided in the present application, when the elastic connecting arm 22 is compressed and deformed and rebounds, the locations where the deformation occurs on the elastic connecting arm 22 may be one or more. For example, the location where the elastic connecting arm 22 is compressed and deformed is the narrowing section 41. When the elastic connecting arm 22 is compressed, the connection between the narrowing section 41 and the base 21 is deformed. Specifically, the angle between the narrowing section 41 and the base 21 changes from a right angle to an acute angle. For another example, the location where the elastic connecting arm 22 is compressed and deformed is the inclined section 42. When the elastic connecting arm 22 is compressed, the connection between the narrowing section 41 and the inclined section 42 is deformed. Specifically, the angle between the narrowing section 41 and the inclined section 42 becomes larger. When there are multiple locations where the elastic connecting arm 22 is compressed and deformed, the locations where the elastic connecting arm 22 is compressed and deformed are the narrowing section 41 and the inclined section 42.

[0060] See also Figures 2 to 4In one embodiment provided in the present application, the base 21 includes a bottom plate 213, a first side plate 211 and a second side plate 212. The first side plate 211 and the second side plate 212 are respectively arranged on both sides of the bottom plate 213 to form a groove structure with an accommodating space 50. The first arm 4 of the elastic connecting arm 22 is connected to the end of the bottom plate 213. Specifically, the first side plate 211 and the second side plate 212 are respectively vertically connected to both sides of the bottom plate 213 to form a groove structure or a U-shaped structure. The elastic connecting arm 22 is located at the end of the groove structure, and the narrowed section 41 of the first arm 4 is substantially flush with the end edge of the first side plate 211 or the second side plate 212.

[0061] In the technical solution provided in the present application, the first arm 4 of the elastic connecting arm 22 is connected to the end of the base plate 213, which will make the starting end of the elastic connecting arm 22 away from the welding surface. When the spring connection structure is welded to the welding surface 103, the tin paste can be effectively prevented from climbing up the elastic connecting arm 22, and the elasticity of the elastic connecting arm 22 is not easily invalidated.

[0062] Further, see Figure 4 The back side of the bottom plate 213 is the suction surface. Usually, the spring connection structure 2 is mounted on the circuit board 1 through surface mount technology (SMT). The area of ​​the bottom plate 213 is large, and equipment such as a placement machine and a reflow soldering machine can effectively absorb the suction surface, thereby facilitating the assembly of the spring connection structure 2 during the production of the circuit board 1 and reducing the ejection rate of the spring connection structure 2 when being absorbed.

[0063] In order to facilitate the stable connection of the spring connection structure 2 to the circuit board 1, see Figures 2 to 4 In one embodiment provided in the present application, the base 21 further includes a first connection portion 8 and / or a second connection portion 9, and the first connection portion 8 and / or the second connection portion 9 are respectively connected to the welding surface 103. The number of the first connection portion 8 and the second connection portion 9 on the base 21 is not specifically limited, and it can be one or more.

[0064] In a specific implementation provided in the present application, the first connection portion 8 is a surface mount solder foot, which is soldered to the circuit board 1 through surface mount technology. The second connection portion 9 is a dual in-line package (DIP) solder foot, which is usually soldered to the solder hole of the circuit board 1. Solder pads and solder holes are correspondingly arranged on the soldering surface 103 of the circuit board 1, the surface mount solder foot is soldered to the solder pad, and the DIP solder foot is soldered to the solder hole.

[0065] Further, see Figures 2 to 4In a specific embodiment provided in the present application, the top of the first side plate 211 and the second side plate 212 are respectively provided with a first connection portion 8 and a second connection portion 9, and the first connection portion 8 and the second connection portion 9 are arranged at intervals. The number of the first connection portion 8 and the second connection portion 9 on the first side plate 211 and the second side plate 212 can be one or more, and the first side plate 211 and the second side plate 212 are respectively provided with a first connection portion 8 and a second connection portion 9 on the top as an example. In a specific implementation, the first connection portion 8 is a bent structure, and the upper top surface of the first connection portion 8 is a surface mount surface 81 welded to the circuit board 1. In order to match the second connection portion 9, a welding hole is provided on the circuit board 1, and the second connection portion 9 can be inserted into the welding hole. Along the height direction of the base 21, the height of the top end of the second connection portion 9 from the bottom plate 213 is greater than the height of the surface mount surface 81. When the second connection portion is attached to the pad on the circuit board 1, the second connection portion 9 is inserted into the welding hole on the circuit board 1. The first connection portion 8 can improve welding drift and the second connection portion 9 can improve welding strength, thereby ensuring the stability of the electrical connection between the base 21 and the circuit board 1 .

[0066] In a specific embodiment, along the length direction of the base 21, the first side plate 211 has a first end and a second end, the second end is an end close to the elastic connecting arm 22, and the first connecting portion 8 is arranged close to the first end, and the second connecting portion 9 is located between the first end and the second end. Of course, in other embodiments of the present application, the positions of the first connecting portion 8 and the second connecting portion 9 can be swapped.

[0067] Furthermore, the ends of the first side plate 211 and the second side plate 212 close to the elastic connecting arm 22 are respectively provided with a width direction ( Figure 3 The baffle 10 extends in the direction of the arrow Y in the middle), and the width of the baffle 10 gradually narrows from top to bottom. Since the first side plate 211 and the second side plate 212 are mirror-symmetrical structures, the first side plate 211 is taken as an example for detailed description. Specifically, the second end of the first side plate 211 is provided with a Figure 3The vertical plate 11 extends in the direction of the arrow Z in the middle (in the direction of the arrow Z in the middle), the height of the top of the vertical plate 11 is slightly greater than the height of the top of the second connecting portion 9, the side of the vertical plate 11 constitutes the end of the first side plate 211, and the end of the first side plate 211 is provided with a baffle 10, the extension direction of the baffle 10 is the width direction of the base 21, and the plane of the baffle 10 is roughly flush with the plane of the end of the base 21. When the narrowing section 41 of the first arm 4 is perpendicular to the bottom plate 213, the plane of the baffle 10 is also roughly flush with the plane where the narrowing section 41 is located. In a specific embodiment, the baffle 10 is wedge-shaped, and the width of the baffle 10 gradually narrows from top to bottom along the height direction of the base 21. Providing the baffle 10 at the end of the base 21 can effectively prevent the elastic connecting arm 22 from being over-pressed, and avoid excessive deformation of the elastic connecting arm 22 when the pressure is too large. Specifically, when the external device 3 fits the end of the base 21 , the elastic connecting arm 22 is compressed to produce the maximum deformation. Due to the effect of the baffle 10 , the external device 3 can be prevented from further compressing the elastic connecting arm 22 .

[0068] See also Figure 2 and Figure 3 In one embodiment provided in the present application, a scratch-resistant structure 12 is provided at the top of the baffle 10. The scratch-resistant structure 12 extends from the top of the baffle 10 toward the direction where the accommodation space 50 is located. The top of the scratch-resistant structure 12 is flush with the top of the first side plate 211 or the second side plate 212. Specifically, the extension direction of the scratch-resistant structure 12 is the length direction of the base 21 ( Figure 3 The end of the anti-scratch structure 12 is arc-shaped, and the top of the anti-scratch structure 12 is substantially flush with the end of the vertical plate 11.

[0069] In one embodiment of the present application, an electronic device is also provided, which includes a circuit board 1, an external device 3 and at least one of the above-mentioned spring connection structures 2, and the spring connection structure 2 is arranged on the welding surface 103 on the edge side of the circuit board 1. The external device 3 is located beside the circuit board 1, and the elastic connection arm 22 on the spring connection structure 2 extends obliquely from one side of the welding surface 103 of the circuit board 1 to the other side of the welding surface 103, and the base 21 and the second end of the elastic connection arm 22 are respectively located on both sides of the welding surface 103, and the end of the elastic connection arm 22 abuts against the external device 3. When a plurality of spring connection structures 2 are provided on the circuit board 1, the electronic device may also have a plurality of external devices 3, and the connection between the circuit board 1 and the external device 3 may be connected through one spring connection structure 2 or through a plurality of spring connection structures 2. The welding surface 103 may be the top surface 101 of the circuit board 1 or the bottom surface 102 of the circuit board 1.

[0070] Electronic devices include, but are not limited to, mobile phones, tablet computers, laptop computers, televisions, smart wearable products (e.g., smart watches, smart bracelets), virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, and other electronic products. The embodiments of the present application do not impose any special restrictions on the specific forms of the above-mentioned electronic devices.

[0071] See also Figure 6 In a specific embodiment, the external device 3 is a camera module, the circuit board 1 is a PCB board in a mobile phone, and the camera module is located on one side of the PCB board and is spaced a certain distance from the PCB board. In order to realize the grounding of the camera module VCM (Voice Coil Motor), at least one spring connection structure 2 is welded to the welding seat of the grounding circuit on the TOP surface of the PCB board, and the elastic connection arm 22 of the spring connection structure 2 extends outward obliquely, and its end abuts against the circuit corresponding to the camera module. Since the spring connection structure 2 is a conductor, the camera module VCM can be grounded.

[0072] To summarize, in the technical solution provided in the present application, the base is connected to the welding surface of the circuit board, and along the height direction of the spring connection structure, the elastic connecting arm extends obliquely from one side of the welding surface to the other side of the welding surface, and the second ends of the base and the elastic connecting arm are respectively located on both sides of the welding surface, thereby effectively avoiding the base and the elastic connecting arm of the spring connection structure being located on the same surface of the circuit board, and the space occupied by the circuit board in the height direction is significantly reduced, which is conducive to the development of electronic equipment towards lighter and thinner directions.

[0073] The above is only an exemplary embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A spring connection structure, characterized in that: Applicable to a circuit board, one side of which is provided with an external device, the spring connection structure comprises: A base, which is arranged on a welding surface at an edge side of the circuit board and is connected to a circuit on the circuit board; An elastic connecting arm, a first end of which is connected to the base and a second end of which extends outside a side portion of the base; The elastic connecting arm obliquely extends from one side of the welding surface to the other side of the welding surface, the base and the second end of the elastic connecting arm are respectively located on both sides of the welding surface, and the end of the second end abuts against the external device.

2. The spring connection structure according to claim 1, characterized in that: Along the height direction of the spring connection structure, the second end has a contact point with the external device, and the height of the contact point is higher than the height of the welding surface.

3. The spring connection structure according to claim 2, characterized in that: The distance between the contact point and the welding surface is equal to the thickness of the circuit board; Alternatively, the thickness of the circuit board is m millimeters, the distance between the contact point and the welding surface is n millimeters, and the numerical difference between m and n is less than or equal to 1 millimeter.

4. The spring sheet connection structure according to any one of claims 1 to 3, characterized in that: The base further includes a first connecting portion and / or a second connecting portion, and the first connecting portion and / or the second connecting portion are respectively connected to the welding surface.

5. The spring sheet connection structure according to claim 4, characterized in that: The first connection portion is a surface mount solder pin, and the second connection portion is a direct-insert package solder pin; The welding surface is correspondingly provided with welding pads and welding holes, the surface mount welding feet are welded and connected to the welding pads, and the direct insertion package welding feet are welded and connected to the welding holes.

6. The spring sheet connection structure according to claim 1, characterized in that: The base has an accommodating space, the width of the accommodating space is greater than the width of the elastic connecting arm, and when the elastic connecting arm is pressed, part of the elastic connecting arm can retreat into the accommodating space.

7. The spring sheet connection structure according to claim 6, characterized in that: The elastic connecting arm comprises a first arm and a second arm, the first end of the first arm is connected to the base, the second end of the first arm is connected to the first end of the second arm through an arc segment, and the second end of the second arm extends into the accommodating space; A contact structure is provided on the arc segment.

8. The spring sheet connection structure according to claim 7, characterized in that: The width of the first end of the first arm is greater than the width of the second end of the first arm. Along the length direction of the first arm, the first arm includes a narrowing section and an inclined section, and the width of the narrowing section gradually decreases; The angle between the narrowed section and the base is a right angle or an obtuse angle, and the angle between the narrowed section and the inclined section is an obtuse angle.

9. The spring sheet connection structure according to any one of claims 5 to 8, characterized in that: The base includes a bottom plate, a first side plate and a second side plate, wherein the first side plate and the second side plate are respectively arranged on both sides of the bottom plate to form a groove structure with an accommodating space; The first arm of the elastic connecting arm is connected to the end of the bottom plate.

10. The spring sheet connection structure according to claim 9, characterized in that: A first connecting portion and a second connecting portion are respectively provided on the top of the first side plate and the second side plate, and the first connecting portion and the second connecting portion are spaced apart; The first connecting portion is a bent structure, and the top surface of the first connecting portion is a surface mounted surface to be welded to the circuit board; Along the height direction of the base, the height of the top end of the second connecting portion is greater than the height of the surface mounting surface.

11. The spring sheet connection structure according to claim 10, characterized in that: Along the length direction of the base, the ends of the first side plate and the second side plate close to the elastic connecting arm are respectively provided with baffles extending along the width direction of the base; The width of the baffle gradually narrows from top to bottom.

12. The spring sheet connection structure according to claim 11, characterized in that: The top of the baffle is provided with an anti-scratch structure, and the anti-scratch structure extends from the top of the baffle toward the direction where the accommodating space is located; The top of the anti-scratch structure is flush with the top of the first side plate or the second side plate.

13. An electronic device, characterized in that: It comprises a circuit board, an external device and at least one spring connection structure according to any one of claims 1 to 12; The spring connection structure is arranged on the welding surface at the edge side of the circuit board; The external device is located beside the circuit board, the elastic connecting arm on the spring connection structure extends obliquely from one side of the welding surface to the other side of the welding surface, the base and the second end of the elastic connecting arm are respectively located on both sides of the welding surface, and the end of the elastic connecting arm abuts against the external device.

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