High-frequency hot-cladding copper-clad plate with multi-layer plate structure and preparation device of high-frequency hot-cladding copper-clad plate

Abstract

The utility model provides a high-frequency hot-melt copper-clad plate with a multilayer plate structure and a preparation device, and relates to the technical field of copper-clad plates, the high-frequency hot-melt copper-clad plate comprises a double-sided base material, a hot-melt CCL is arranged on the double-sided base material, through holes are formed in the centers of the double-sided base material and the hot-melt CCL, the hot-melt CCL comprises an ultra-low profile copper foil, hot-melt PI glue is arranged on the ultra-low profile copper foil, and the hot-melt PI glue is arranged on the double-sided base material. And a release film is arranged on the hot melting P I glue. Through hot melting of the CCL and combination of the glue solution and the CCL, when a manufacturer carries out manufacturing, pressing can be directly carried out, PP glue does not need to be coated, the technological process is saved, the manufacturing efficiency is higher, hot melting PI glue is adopted, the high temperature resistance is good, carbonization is not prone to occurring, and the hot melting PI glue is flexible after being dried, is softer than PP glue and is not prone to puncturing a base material.

Description

Technical Field

[0001] The utility model relates to the technical field of copper clad plates, in particular to a high-frequency hot-melt copper clad plate with a multi-layer plate structure and a preparation device thereof. Background Art

[0002] Copper clad laminate - also known as base material, is a plate-shaped material formed by hot pressing, called copper clad laminate, which is the basic material for PCB and is often called base material. When it is used in the production of multilayer boards, it is also called core board (CORE). It is the basic material of the electronics industry and is mainly used for processing and manufacturing printed circuit boards (PCBs). It is widely used in electronic products such as televisions, radios, computers, computers, and mobile communications.

[0003] The existing multi-layer copper clad laminates often adopt the method of coating PP glue on both sides of the double-layer substrate, and then bonding the single-sided adhesive-free CCL on the glue, and then continuing to coat PP glue, and continuing to bond the single-sided adhesive-free CCL, after obtaining the desired number of layers, lamination is performed; however, the above method has a relatively complicated processing technology and is relatively inconvenient to produce; in addition, when laminating the single-sided adhesive-free CCL and PP glue, it is easy to cause lamination bubbles, which in turn causes a low product qualification rate. The more layers are stacked and the thicker the product is, the more problems there are; in addition, when making through holes, PP glue is prone to high-temperature carbonization, and the holes are prone to wire drawing, and the PP glue is easy to pierce the substrate after hardening. Utility Model Content

[0004] The utility model provides a high-frequency hot-melt copper-clad plate with a multi-layer plate structure and a preparation device thereof, so as to solve at least one of the problems raised in the above-mentioned background technology.

[0005] In order to solve the above technical problems, the utility model discloses a high-frequency hot-melt copper-clad laminate with a multi-layer board structure, including a double-sided substrate, a hot-melt CCL is arranged on the double-sided substrate, a through hole is opened in the center of the double-sided substrate and the hot-melt CCL, the hot-melt CCL includes an ultra-low profile copper foil, a hot-melt PI adhesive is arranged on the ultra-low profile copper foil, and a release film is arranged on the hot-melt PI adhesive.

[0006] Preferably, the release film is in contact with the double-sided substrate.

[0007] Preferably, a preparation device for a high-frequency hot-melt copper-clad laminate having a multi-layer structure is provided, and the preparation device is used to prepare a high-frequency hot-melt copper-clad laminate having a multi-layer structure as described above, comprising a substrate, a stabilizing plate being fixedly arranged on the substrate, auxiliary plates being symmetrically fixedly arranged on the left and right sides of the stabilizing plate, protruding blocks being fixedly arranged on the auxiliary plates, and a pressing mechanism being arranged on the protruding blocks.

[0008] Preferably, the pressing mechanism comprises a pressing rod, the pressing rod passes through the extending block, a pressing plate is fixedly provided at the lower end of the pressing rod, and the pressing plate is slidably connected to the side of the auxiliary plate close to each other.

[0009] Preferably, a pressing block is fixedly arranged on the pressing plate.

[0010] Preferably, a containing frame is also installed on the base plate, and the containing frame is located below the pressing block.

[0011] Preferably, an empty box is arranged in the extending block, a rack is fixedly arranged on the pressing rod, and both the pressing rod and the rack slide through the empty box;

[0012] A driving source is fixedly arranged on one side of the extending block, and the output end of the driving source rotates and extends into the empty box. A gear is fixedly arranged on the output end of the driving source, and the gear is meshed and connected with the rack.

[0013] Preferably, a limit plate is fixedly provided on the upper end of the pressing rod, and a return spring is sleeved on the pressing rod and the rack, one end of the return spring is fixedly connected to the limit plate, and the other end of the return spring is fixedly connected to the extension block.

[0014] Preferably, a sleeve is fixedly provided on the lower surface of the limiting plate, a force sensor is installed in the sleeve, and an abutment block is fixedly provided on the extending block, and the abutment block cooperates with the sleeve.

[0015] Preferably, a central control component is disposed on the substrate, and the central control component is electrically connected to the force sensor and the driving source.

[0016] Compared with the prior art, the utility model provides a high-frequency hot-melt copper-clad plate with a multi-layer plate structure and a preparation device. By hot-melting CCL, the glue liquid and CCL are combined. When the production personnel are making it, they can be directly pressed together without applying PP glue, which saves the process flow and has higher production efficiency. The hot-melt PI glue has good high temperature resistance and is not prone to carbonization. The hot-melt PI glue is flexible after drying, which is softer than PP glue and is not easy to pierce the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the hot-melt CCL of the utility model;

[0020] Figure 3 It is a structural schematic diagram of the prior art;

[0021] Figure 4 It is a structural schematic diagram of a single-sided adhesive-free CCL in the prior art;

[0022] Figure 5 This is the electrographic image of the ultra-low profile copper foil of the utility model after micro-etching;

[0023] Figure 6 It is the electro-display image of the ultra-low profile copper foil of the utility model after the vacuum sputtering particle mosaic method / water plating precipitation method;

[0024] Figure 7 It is a structural schematic diagram of the preparation device of the utility model;

[0025] Figure 8 For the utility model Figure 7 Side view of

[0026] Fig. 9 For the utility model Figure 8 Enlarged view of point A.

[0027] In the figure: 1. Double-sided substrate; 2. Hot-melt CCL; 3. Release film; 4. Hot-melt PI glue; 5. Ultra-low profile copper foil; 6. PP glue layer; 7. Single-sided glue-free CCL; 8. Polyimide layer; 9. Copper foil; 10. Through hole; 11. Channel; 12. Stabilizing plate; 13. Driving source; 14. Auxiliary plate; 15. Base plate; 16. Holding frame; 17. Pressing block; 18. Pressing plate; 19. Pressing rod; 20. Extending block; 21. Reset spring; 22. Limiting plate; 23. Gear; 24. Empty box; 25. Rack; 26. Abutment block; 27. Sleeve; 28. Force sensor. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0029] In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end", "the other end" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Example 1

[0032] The embodiment of the utility model provides a high-frequency hot-melt copper-clad plate with a multi-layer plate structure, such as Figure 1-2 As shown, it includes a double-sided substrate 1, a hot melt CCL2 is arranged on the double-sided substrate 1, a through hole 10 is opened in the center of the double-sided substrate 1 and the hot melt CCL2, the hot melt CCL2 includes an ultra-low profile copper foil 5, a hot melt PI adhesive 4 is arranged on the ultra-low profile copper foil 5, and a release film 3 is arranged on the hot melt PI adhesive 4.

[0033] Preferably, the release film 3 is in contact with the double-sided substrate 1 .

[0034] In the prior art, Figure 3-4 As shown, a PP adhesive layer 6 is arranged on a double-sided substrate 1, and then a single-sided adhesive-free CCL7 is arranged on the PP adhesive layer 6. If multiple layers are required, the PP adhesive layer 6 needs to be further arranged on the single-sided adhesive-free CCL7, and then another layer of the single-sided adhesive-free CCL7 is adhered until the production personnel obtain the desired number of layers, and then the pressing is performed; and the existing single-sided adhesive-free CCL7 includes a copper foil 9 and a polyimide layer, and a channel 11 is opened on the double-sided substrate 1, the PP adhesive layer 6 and the single-sided adhesive-free CCL7 of the prior art;

[0035] Then in the prior art, if multiple layers need to be stacked, PP glue must be applied continuously, and the process is relatively complicated. It is easy to cause lamination bubbles when pressing the single-sided adhesive-free CCL7 and the PP glue layer 6, which in turn causes a low product qualification rate. The more layers are stacked and the thicker the product is, the more problems there are. In addition, when making the through hole 10 / channel 11, the PP glue layer is prone to high-temperature carbonization, the hole will be wired, and the PP glue is easy to pierce the substrate after hardening.

[0036] With the structure of the utility model, the hot melt CCL 2 is the ultra-low profile copper foil 5, the hot melt PI glue 4 and the release film 3 pressed together in sequence, that is, the glue liquid and the CCL are combined. When the production personnel are making it, the double-sided substrate 1 and the hot melt CCL 2 can be directly pressed together without applying PP glue, which saves the process flow and has higher production efficiency. The hot melt PI glue 4 has good high temperature resistance and is not prone to carbonization. The hot melt PI glue 4 is flexible after drying, which is softer than PP glue and is not easy to pierce the substrate.

[0037] Among them, CCL is a copper foil substrate; hot melt PI adhesive is a hot melt polyimide, and the polyimide is sticky after hot melting; and the ultra-low profile copper foil 5 (such as Figure 5-6 As shown), it adopts micro-etching / vacuum sputtering particle inlay method / water plating precipitation method to fill the rough surface to make it smooth, reduce the roughness, increase the transmission speed, and cooperate with hot-melt PI to have better bending resistance.

[0038] Example 2

[0039] A preparation device for a high-frequency hot-melt copper-clad laminate having a multi-layer structure, the preparation device is used to prepare a high-frequency hot-melt copper-clad laminate having a multi-layer structure as described above, such as Figure 7-9 As shown, it includes a base plate 15, on which a stabilizing plate 12 is fixedly arranged, and auxiliary plates 14 are symmetrically fixedly arranged on the left and right sides of the stabilizing plate 12, on which a protruding block 20 is fixedly arranged, and on which a pressing mechanism is arranged.

[0040] Preferably, the pressing mechanism includes a pressing rod 19 , which passes through the extending block 20 , and a pressing plate 18 is fixedly provided at the lower end of the pressing rod 19 , and the pressing plate 18 is slidably connected to a side of the auxiliary plate 14 that is close to each other.

[0041] Preferably, a pressing block 17 is fixedly disposed on the pressing plate 18 .

[0042] Preferably, a containing frame 16 is also installed on the base plate 15 , and the containing frame 16 is located below the pressing block 17 .

[0043] The working principle and beneficial effects of the above technical solution are as follows: the manufacturer first selects how many layers of hot-melt CCL2 are needed. The following uses a double-layer hot-melt CCL2 as an example:

[0044] Place the purchased hot-melt CCL2 into the containing frame 16, then place the double-sided substrate 1 onto the hot-melt CCL2, then place a piece of hot-melt CCL2 on the double-sided substrate 1, and then start the pressing mechanism, the pressing rod 19 begins to descend, the pressing rod 19 drives the pressing plate 18 to descend, the pressing plate 18 drives the pressing block 17 to descend, the pressing block 17 presses the hot-melt CCL2, the double-sided substrate 1 and the hot-melt CCL2 in the containing frame 16, and the production is completed after the pressing is completed; by setting up the pressing mechanism, the high-frequency hot-melt copper clad laminate can be quickly pressed, and only the pressing step is required, and there is no need to apply glue, the production process is simpler and more practical.

[0045] If multiple layers of hot-melt CCL2 are needed, they can be stacked on a layer of hot-melt CCL2 and then pressed, which can be determined by technicians in this field / manufacturers.

[0046] Example 3

[0047] Based on the above embodiment 2, Figure 7-9 As shown, an empty box 24 is provided in the extending block 20, and a rack 25 is fixedly provided on the pressing rod 19, and both the pressing rod 19 and the rack 25 slide through the empty box 24;

[0048] A driving source 13 is fixedly provided on one side of the extension block 20 . The output end of the driving source 13 rotates and extends into the empty box 24 . A gear 23 is fixedly provided on the output end of the driving source 13 . The gear 23 is meshed and connected with a rack 25 .

[0049] Among them, preferably, a limiting plate 22 is fixedly provided on the upper end of the pressing rod 19, and a return spring 21 is sleeved on the pressing rod 19 and the rack 25, one end of the return spring 21 is fixedly connected to the limiting plate 22, and the other end of the return spring 21 is fixedly connected to the protruding block 20.

[0050] The working principle and beneficial effects of the above technical solution are: start the driving source 13, the driving source 13 drives the gear 23, the gear 23 drives the rack 25 to move downward, the rack 25 drives the pressing rod 19 to move downward, the pressing rod 19 drives the pressing plate 18 to descend, the pressing plate 18 drives the pressing block 17 to descend, and the pressing block 17 presses the plate in the containing frame 16; and the setting of the limit plate 22 can prevent the pressing rod 19 from slipping out of the empty box 24, which is safe and practical; and the gear 23 drives the rack 25 to move, so the movement is more stable, that is, the pressing is more stable.

[0051] Example 4

[0052] Based on the above embodiment 3, Figure 7-9As shown, a sleeve 27 is fixedly provided on the lower surface of the limiting plate 22 , a force sensor 28 is installed in the sleeve 27 , and an abutment block 26 is fixedly provided on the extending block 20 , and the abutment block 26 cooperates with the sleeve 27 .

[0053] Preferably, a central control component is disposed on the substrate 15 , and the central control component is electrically connected to the force sensor 28 and the driving source 13 .

[0054] The working principle and beneficial effects of the above technical solution are as follows: the central control component is started to make the driving source 13 start to rotate, the driving source 13 drives the driving gear 23, the gear 23 drives the rack 25 to move downward, the rack 25 drives the pressing rod 19 to move downward, when the pressing rod 19 moves downward, the pressing rod 19 will drive the sleeve 27 to move downward together, and then the abutment block 26 will extend into the sleeve 27 and slowly contact with the force sensor 28, the value detected by the force sensor 28 will be transmitted to the central control component, when the detected value is consistent with the set value (wherein the set value is determined by those skilled in the art, and if the number of layers of the final product required is inconsistent, those skilled in the art can also set different values), the central control component controls the driving source 13 to stop, and then controls the driving source 13 to reverse, drives the gear 23 to reverse, the gear 23 drives the rack 25 to rise, the pressing rod 19 to rise, and completes one press;

[0055] Among them, the central control component can adopt control methods such as single-chip microcomputer, PLC, etc., and its specific structure will not be described in detail as it belongs to the prior art; and by transmitting the detection value to the central control component through the force sensor 28, the forward rotation, reverse rotation and stop of the driving source 13 can be controlled, and the pressing force at each time is the same, so that the qualified rate of the final product is more stable, and the value of each pressing force is constant, which is safer and can effectively prevent product damage caused by excessive pressing force. The entire device has a simple structure, is easy to use, and has high practicality and safety.

[0056] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A high-frequency hot-melt copper-clad plate with a multi-layer plate structure, characterized in that: The invention comprises a double-sided substrate (1), a hot-melt CCL (2) is arranged on the double-sided substrate (1), a through hole (10) is opened in the center of the double-sided substrate (1) and the hot-melt CCL (2), the hot-melt CCL (2) comprises an ultra-low profile copper foil (5), a hot-melt PI adhesive (4) is arranged on the ultra-low profile copper foil (5), and a release film (3) is arranged on the hot-melt PI adhesive (4).

2. The high-frequency hot-melt copper-clad plate with a multi-layer structure according to claim 1, characterized in that: The release film (3) is in contact with the double-sided substrate (1).

3. A preparation device for a high-frequency hot-melt copper-clad laminate having a multi-layer structure, the preparation device being used to prepare a high-frequency hot-melt copper-clad laminate having a multi-layer structure as claimed in any one of claims 1 to 2, characterized in that: The invention comprises a base plate (15), a stabilizing plate (12) is fixedly arranged on the base plate (15), auxiliary plates (14) are symmetrically fixedly arranged on the left and right sides of the stabilizing plate (12), a protruding block (20) is fixedly arranged on the auxiliary plate (14), and a pressing mechanism is arranged on the protruding block (20).

4. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 3, characterized in that: The pressing mechanism comprises a pressing rod (19), the pressing rod (19) passes through the protruding block (20), a pressing plate (18) is fixedly arranged at the lower end of the pressing rod (19), and the pressing plate (18) is slidably connected to the side of the auxiliary plate (14) close to each other.

5. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 4, characterized in that: A pressing block (17) is fixedly arranged on the pressing plate (18).

6. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 5, characterized in that: A containing frame (16) is also installed on the base plate (15), and the containing frame (16) is located below the pressing block (17).

7. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 6, characterized in that: An empty box (24) is arranged in the extending block (20), and a rack (25) is fixedly arranged on the pressing rod (19), and both the pressing rod (19) and the rack (25) slide through the empty box (24); A driving source (13) is fixedly arranged on one side of the extension block (20), and the output end of the driving source (13) rotates and extends into the empty box (24). A gear (23) is fixedly arranged on the output end of the driving source (13), and the gear (23) is meshedly connected with a rack (25).

8. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 7, characterized in that: A limit plate (22) is fixedly arranged on the upper end of the pressing rod (19), and a return spring (21) is sleeved on the pressing rod (19) and the rack (25), one end of the return spring (21) is fixedly connected to the limit plate (22), and the other end of the return spring (21) is fixedly connected to the extension block (20).

9. The device for preparing a high-frequency hot-melt copper-clad plate having a multi-layer plate structure according to claim 8, characterized in that: A sleeve (27) is fixedly arranged on the lower surface of the limiting plate (22), a force sensor (28) is installed in the sleeve (27), and an abutment block (26) is fixedly arranged on the extending block (20), and the abutment block (26) matches the sleeve (27).

10. The device for preparing a high-frequency hot-melt copper-clad plate with a multi-layer plate structure according to claim 9, characterized in that: A central control component is arranged on the base plate (15), and the central control component is electrically connected to the force sensor (28) and the driving source (13).

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