Flip chip packaging COB light source based on 9V high voltage

Abstract

The utility model discloses a COB light source based on 9V high-voltage flip chip packaging. The COB light source comprises a metal substrate, an organic material box dam, a plurality of 9V flip LED chips and fluorescent powder colloid. A connecting circuit is pre-printed on the surface of the metal substrate; the organic material box dam is arranged on the surface of the metal substrate, and an enclosed circular dam forms an LED chip fixing area; the plurality of 9V flip LED chips are uniformly distributed in the LED chip fixing area of the organic material box dam and are electrically connected with the connecting circuit on the metal substrate; and the fluorescent powder colloid is uniformly coated in the LED chip fixing area of the organic material box dam and covers the 9V flip LED chip. According to the single 9V LED chip, the number of the LED chips can be greatly reduced, and the advantages of higher reliability and smaller LES are achieved on the basis that the power of the single 9V LED chip is the same as that of an existing LED COB light source.

Description

Technical Field

[0001] The utility model relates to the technical field of LEDs, in particular to a COB light source based on 9V high-voltage flip chip packaging. Background Art

[0002] With the rapid development of LED technology, LED light sources have gradually replaced traditional light sources and become a new generation of artificial light sources due to their advantages such as high energy efficiency, long life and environmental friendliness. LED COB (Chip On Board) light sources are a very important type of LED lighting application products. They achieve lighting functions by fixing and electrically connecting multiple 3V LED chips on a metal substrate and coating it with phosphor colloid.

[0003] However, existing LED COB light sources have some technical and application limitations. Specifically, existing technologies usually use 12, 24, 36 or more 3V LED chips designed in multiples of 12, and connect them in series to achieve an input voltage of 36V to match the common LED driver power supply on the market. This design has the following shortcomings:

[0004] Since a large number of 12*n (where n is 1, 2, 3...) 3vLED chips are needed to meet the voltage requirements of the adapter, once any of the chips has a problem, whether it is a short circuit or an open circuit, it may cause the light source to work abnormally and cause quality problems, which will affect the operation of the entire light source and reduce the reliability of the light source.

[0005] A large number of 3VLED chips are distributed in the dam, and the size of the dam, also known as the light emitting surface LES (light emitting surface) in the industry, is difficult to control to be very small; at the same time, due to the excessive number of chips, the overall light source light emitting surface is too large. When customers design optics in the process of high-end product applications, they cannot meet the requirements of designing small-angle products, such as angles within 15 degrees. Because small LES is more conducive to secondary optical design of lighting products, further improvement is needed. Utility Model Content

[0006] In view of the problems existing in the prior art, the utility model provides a COB light source based on 9V high-voltage flip chip packaging.

[0007] In order to achieve the above purpose, the technical solution of the utility model is as follows:

[0008] The utility model provides a COB light source based on 9V high voltage flip chip packaging, comprising: a metal substrate, an organic material dam, a plurality of 9V flip chip LED chips, and a fluorescent powder colloid;

[0009] The surface of the metal substrate is pre-printed with a connection circuit;

[0010] The organic material dam is arranged on the surface of the metal substrate, and the enclosed circular dam forms an LED chip fixing area;

[0011] A plurality of the 9V flip-chip LED chips are evenly distributed in the LED chip fixing area of ​​the organic material dam and are electrically connected to the connection circuit on the metal substrate;

[0012] The fluorescent powder colloid is evenly coated in the LED chip fixing area of ​​the organic material dam and covers the 9V flip-chip LED chip.

[0013] Preferably, the metal substrate is an aluminum substrate or a copper substrate.

[0014] Preferably, the 9V flip-chip LED chip is fixed in the LED chip fixing area by eutectic bonding or die-bonding adhesive bonding.

[0015] Preferably, the number of the plurality of 9V flip-chip LED chips is an integer multiple of 4.

[0016] Preferably, the size of the organic material dam is adjusted according to the required light emitting area.

[0017] Preferably, the electrical connection between the 9V flip-chip LED chip and the connection circuit is eutectic electrical connection or connection by bonding of conductive metal wires.

[0018] Preferably, when the number of the 9V flip-chip LED chips is 4, the 4 9V flip-chip LED chips are fully connected in series, and the diameter of the light-emitting area is less than 4 mm.

[0019] Preferably, when the number of the 9V flip-chip LED chips (4) is 8, the 8 9V flip-chip LED chips are connected in 4 series and 2 parallels, and the diameter of the light-emitting area is less than 6 mm.

[0020] The technical solution of the utility model has the following beneficial effects:

[0021] This technical solution LED COB light source uses high voltage LED flip chip, single 9V LED chip, which can greatly reduce the number of LED chips used, and achieve the same power as the existing LED COB light source, and achieve the advantages of higher reliability and smaller LES. The commonly used number is 4, 8, 12, or even more 4*n, where n is 1, 2, 3...; a smaller number of 9V LED chips are electrically connected in a certain space, which naturally improves the reliability of the entire light source; a smaller number of 9VLED chips are evenly distributed in the circular dam, which effectively reduces the light emitting area LES (light emitting surface) of the LED COB, which is more conducive to secondary optical design of lighting products.

[0022] The utility model improves reliability: by using a smaller number of 9V high-voltage flip-chip LED chips, the total number of chips in a single light source is reduced, thereby reducing the risk of failure of the entire light source due to a single chip failure.

[0023] The utility model reduces the light emitting area: since the number of LED chips used is reduced, a smaller light emitting area (LES) can be achieved without sacrificing power output, which is beneficial for secondary optical design of high-end lighting products and meets the needs of small-angle lighting.

[0024] The utility model has good compatibility: the LED COB light source of the utility model maintains the same 36V input voltage as the existing light source, and can be well compatible with the general LED drive power output on the market.

[0025] The utility model has high flexibility: by adjusting the number of 9V flip-chip LED chips, LED COB light source models with different powers can be flexibly designed to meet the needs of diverse lighting products. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a structural diagram of Embodiment 1;

[0027] Figure 2 This is a structural diagram of Embodiment 2;

[0028] Figure 3 The structure of the prior art is shown in FIG. Figure 1 ;

[0029] Figure 4 The structure of the prior art is shown in FIG. Figure 2 . DETAILED DESCRIPTION

[0030] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0031] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise expressly specified or limited, a first feature is “on” or “below” a second feature.

[0035] “Under” may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature being “above”, “above”, and “above” the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being “under”, “below”, and “below” the second feature includes the first feature being directly below and obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0036] Embodiment 1:

[0037] Reference Figure 1 The utility model provides a COB light source based on 9V high voltage flip chip packaging, comprising: a metal substrate 1, an organic material dam 2, a plurality of 9V flip chip LED chips 4, and a fluorescent powder colloid 5;

[0038] The surface of the metal substrate 1 is pre-printed with a connection circuit to achieve electrical connection. The metal substrate 1 is set as an aluminum substrate or a copper substrate. The use of the aluminum substrate or the copper substrate is helpful for heat dissipation of the LED chip due to its good thermal conductivity.

[0039] The organic material dam 2 is arranged on the surface of the metal substrate 1, and the enclosed circular dam forms an LED chip fixing area, which can protect the LED chip from the influence of the external environment. The shape and size of the dam determine the light emitting area (LES), which in turn affects the optical performance of the light source; the size of the organic material dam 2 is adjusted according to the required light emitting area.

[0040] A plurality of the 9V flip-chip LED chips 4 are evenly distributed in the LED chip fixing area of ​​the organic material dam 2, and are electrically connected to the connecting circuit on the metal substrate 1; wherein the 9V flip-chip LED chips 4 are designed to be evenly distributed in the organic material dam 2, and such distribution helps to provide uniform light emission of the light source and optimize the light output, and the 9V flip-chip LED chips 4 are fixed in the LED chip fixing area by eutectic or solid crystal adhesive bonding, ensuring that the chip will not shift or fall off during subsequent packaging, use and temperature cycling; the electrical connection method between the 9V flip-chip LED chip and the connecting circuit is eutectic electrical connection or conductive metal wire bonding. In the packaging design of the LED light source, these connection technologies ensure that the LED chip can be stably and reliably connected to the external circuit, thereby realizing effective conversion of electrical energy into light energy.

[0041] The phosphor colloid 5 is evenly coated in the LED chip fixing area of ​​the organic material dam 2 and covers the 9V flip-chip LED chip 4, and is used to convert the light emitted by the 9V flip-chip LED chip to produce the required color temperature and light color. The formula and dosage of the phosphor colloid are adjusted according to the color temperature parameters of the light source to meet specific lighting requirements.

[0042] The number of the multiple 9V flip-chip LED chips is an integer multiple of 4. In this embodiment 1, the number of 9V flip-chip LED chips is 4, and the 4 9V flip-chip LED chips are fully connected in series, wherein the light emitting area (LES) diameter is less than 4mm, the power is 4w, the current during normal operation is 100mA, and the input voltage is 36v.

[0043] Reference Figure 3 The number of LED chips is 12 and all are set to 3V. The typical photoelectric parameters that can be achieved are: power is 4W, current is 100mA during normal operation, input voltage is 36V, LES: Ф8mm.

[0044] From this, we can see that the technical solution of using four 9V high-voltage flip chips and 36V voltage packaging COB light sources can improve the overall light source reliability while also achieving a smaller LES.

[0045] Embodiment 2:

[0046] Reference Figure 2 The utility model provides a COB light source based on 9V high voltage flip chip packaging, comprising: a metal substrate 1, an organic material dam 2, a plurality of 9V flip chip LED chips 4, and a fluorescent powder colloid 5;

[0047] The surface of the metal substrate 1 is pre-printed with a connection circuit to achieve electrical connection. The metal substrate 1 is set as an aluminum substrate or a copper substrate. The use of the aluminum substrate or the copper substrate is helpful for heat dissipation of the LED chip due to its good thermal conductivity.

[0048] The organic material dam 2 is arranged on the surface of the metal substrate 1, and the enclosed circular dam forms an LED chip fixing area, which can protect the LED chip from the influence of the external environment. The shape and size of the dam determine the light emitting area (LES), which in turn affects the optical performance of the light source; the size of the organic material dam 2 is adjusted according to the required light emitting area.

[0049] A plurality of the 9V flip-chip LED chips 4 are evenly distributed in the LED chip fixing area of ​​the organic material dam 2, and are electrically connected to the connecting circuit on the metal substrate 1; wherein the 9V flip-chip LED chips 4 are designed to be evenly distributed in the organic material dam 2, and such distribution helps to provide uniform light emission of the light source and optimize the light output, and the 9V flip-chip LED chips 4 are fixed in the LED chip fixing area by eutectic or solid crystal adhesive bonding, ensuring that the chip will not shift or fall off during subsequent packaging, use and temperature cycling; the electrical connection method between the 9V flip-chip LED chip and the connecting circuit is eutectic electrical connection or conductive metal wire bonding. In the packaging design of the LED light source, these connection technologies ensure that the LED chip can be stably and reliably connected to the external circuit, thereby realizing effective conversion of electrical energy into light energy.

[0050] The phosphor colloid 5 is evenly coated in the LED chip fixing area of ​​the organic material dam 2 and covers the 9V flip-chip LED chip 4, and is used to convert the light emitted by the 9V flip-chip LED chip to produce the required color temperature and light color. The formula and dosage of the phosphor colloid are adjusted according to the color temperature parameters of the light source to meet specific lighting requirements.

[0051] The number of the multiple 9V flip-chip LED chips is an integer multiple of 4. In this embodiment 1, the number of 9V flip-chip LED chips is 8, and the 8 9V flip-chip LED chips are connected in 4 series and 2 parallels, wherein the light emitting area (LES) diameter is less than 6mm, the power is 12w, the current during normal operation is 200mA, and the input voltage is 36v.

[0052] Reference Figure 4 The number of LED chips is 12 and all are set to 3V. The typical photoelectric parameters that can be achieved are: power is 12W, current is 200mA during normal operation, input voltage is 36V, LES: Ф11mm.

[0053] From this, we can see that the technical solution of using 8 9V high-voltage flip chips and 36V voltage packaging COB light sources can improve the overall light source reliability while also achieving a smaller LES.

[0054] From the above-mentioned Embodiment 1 and Embodiment 2, it can be known that the LED COB light source of this technical solution uses a high-voltage LED flip chip, a single 9V LED chip, which can greatly reduce the number of LED chips used, and achieve the advantages of higher reliability and smaller LES on the basis of the same power as the existing LED COB light source. The commonly used number is 4, 8, 12, or even more 4*n;

[0055] 1. Fewer number of 9V LED chips are electrically connected in a certain space, which naturally improves the reliability of the entire light source.

[0056] 2. Fewer 9V LED chips are evenly distributed in the circular dam, effectively reducing the light emitting surface LES (light emitting surface) of the LED COB, which is more conducive to secondary optical design of lighting products.

[0057] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.

Claims

1. A 9V high voltage flip chip package COB light source, characterized in that: include: Metal substrate (1), organic material dam (2), multiple 9V flip-chip LED chips (4), phosphor colloid (5); A connection circuit is pre-printed on the surface of the metal substrate (1); The organic material dam (2) is arranged on the surface of the metal substrate (1), and the enclosed circular dam forms an LED chip fixing area; A plurality of the 9V flip-chip LED chips are evenly distributed in the LED chip fixing area of ​​the organic material dam (2), and are electrically connected to the connection circuit on the metal substrate (1); The fluorescent powder colloid (5) is evenly coated in the LED chip fixing area of ​​the organic material dam (2) and covers the 9V flip-chip LED chip (4).

2. The 9V high voltage flip chip package COB light source according to claim 1, characterized in that: The metal substrate (1) is set to be an aluminum substrate or a copper substrate.

3. The 9V high voltage flip chip package COB light source according to claim 1, characterized in that: The 9V flip-chip LED chip (4) is fixed in the LED chip fixing area by means of eutectic bonding or solid crystal adhesive bonding.

4. The 9V high voltage flip chip package COB light source according to claim 3, characterized in that: The number of the plurality of 9V flip-chip LED chips (4) is an integer multiple of 4.

5. The 9V high voltage flip chip package COB light source according to claim 1, characterized in that: The size of the organic material dam (2) is adjusted according to the required light-emitting area.

6. The 9V high voltage flip chip package COB light source according to claim 4, characterized in that: The electrical connection method between the 9V flip-chip LED chip (4) and the connection circuit is eutectic electrical connection or connection by bonding of conductive metal wires.

7. The 9V high voltage flip chip package COB light source according to claim 6, characterized in that: When the number of the 9V flip-chip LED chips (4) is 4, the 4 9V flip-chip LED chips are fully connected in series, and the diameter of the light-emitting area is less than 4 mm.

8. The 9V high voltage flip chip package COB light source according to claim 6, characterized in that: When the number of the 9V flip-chip LED chips (4) is 8, the 8 9V flip-chip LED chips are connected in 4 series and 2 parallels, and the diameter of the light-emitting area is less than 6 mm.

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