Microporous polishing pad suitable for infrared materials

Abstract

The utility model relates to the technical field of polishing pads, in particular to a micropore polishing pad suitable for infrared materials, which comprises a polishing pad base body, a plurality of heat conduction columns arranged along the thickness direction of the polishing pad base body are arranged on the polishing pad base body, and a micropore pad is fixedly arranged on the surface of the polishing pad base body. A plurality of micropores formed in the thickness direction of the micropore pad are formed in the micropore pad, a first stud is fixedly installed on the bottom face of the polishing pad base body, a sliding base is further fixedly installed on the bottom face of the polishing pad base body, a second stud is connected into the sliding base in a sliding mode, a sliding groove is formed in the sliding base, and a penetrating hole is formed in the top wall of the sliding groove; and a limiting disc is fixedly installed at the bottom end of the second stud, the limiting disc is located in the sliding groove and is in sliding connection with the sliding groove, the second stud penetrates out of the penetrating-out hole, and the first stud and the second stud are both in threaded connection with nuts. The polishing device facilitates timely heat conduction operation, improves the polishing precision and is convenient to use.

Description

Technical Field

[0001] The utility model relates to the technical field of polishing pads, in particular to a microporous polishing pad suitable for infrared materials. Background Art

[0002] Due to their unique physical and chemical properties, infrared materials are widely used in military, medical, electronic and other fields. However, the polishing of infrared materials has always been a technical problem. During the polishing operation, traditional polishing wheels have low surface precision and are difficult to achieve the ideal polishing effect. At present, in order to achieve high-precision polishing operations, polishing pads are usually used instead of polishing wheels for grinding operations.

[0003] There are many types of polishing pads on the market, and most of them can meet the requirements of infrared materials for surface finish and precision. However, most polishing pads are not provided with microporous structures and heat-conducting structures, which is not conducive to timely dissipation of the heat generated during the grinding process. If the heat during the grinding process cannot be dissipated in time, the temperature of the surface of the infrared material being polished will rise, affecting the performance of the infrared material and causing inconvenience to the user. In view of this, we propose a microporous polishing pad suitable for infrared materials. Utility Model Content

[0004] The purpose of the utility model is to provide a microporous polishing pad suitable for infrared materials to solve the defects mentioned in the above background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A microporous polishing pad suitable for infrared materials comprises a polishing pad base, the polishing pad base is provided with a plurality of heat-conducting columns arranged along the thickness direction of the polishing pad base, a microporous pad is fixedly mounted on the surface of the polishing pad base, the microporous pad is provided with a plurality of micropores arranged along the thickness direction of the microporous pad, a first stud is fixedly mounted on the bottom surface of the polishing pad base, a sliding seat is also fixedly mounted on the bottom surface of the polishing pad base, and a second stud is slidably connected in the sliding seat.

[0007] Preferably, the diameter of the micropores is between 50 and 300 μm, and the depth is between 100 and 800 μm. The micropores can effectively absorb the heat generated during the polishing process, reduce the polishing temperature, and protect the performance of the infrared material. At the same time, the micropores can also increase the contact area between the polishing pad and the infrared material, thereby improving the polishing efficiency and accuracy.

[0008] Preferably, a slide groove is provided in the slide seat, and a through hole is provided on the top wall of the slide groove. A limit plate is fixedly installed on the bottom end of the second stud, and the limit plate is located in the slide groove and is slidably connected to the slide groove. The second stud passes through the through hole, so that the second stud can move left and right to perform position adjustment operations.

[0009] Preferably, the outer diameter of the limiting plate is larger than the width of the through hole, and the size of the limiting plate is matched with the size of the slide groove, so that the limiting plate can slide stably in the slide groove without being pulled out from the through hole.

[0010] Preferably, nuts are threadedly connected to the first stud and the second stud, and the nuts are tightened for fixing operation.

[0011] Preferably, the first stud and the second stud are both sleeved with elastic washers, and the elastic washers are used to prevent the nut from loosening.

[0012] Preferably, the sliding seat and the first stud are located on the same axis, and are used to slide the second stud to adjust the distance between the first stud and the second stud.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] 1. The utility model can use the heat-conducting column to perform heat-conducting operations through the heat-conducting column. In addition, through the micropores provided, the micropore structure can effectively absorb the heat generated during the polishing process, reduce the polishing temperature, and protect the performance of the infrared material. At the same time, the micropores can also increase the contact area between the polishing pad and the infrared material, improve the polishing efficiency and accuracy, and is suitable for the polishing operation of infrared materials, achieving the effect of high-precision polishing and timely heat dissipation.

[0015] 2. The utility model provides a first stud and a second stud, and the second stud can slide, so as to adjust the distance between the first stud and the second stud, so as to facilitate the fixed installation of the polishing pad base on the corresponding transmission shaft outside. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is one of the explosion structure schematic diagrams of the utility model;

[0018] Figure 3 This is the second schematic diagram of the explosion structure of the utility model;

[0019] Figure 4 It is a structural schematic diagram of the slide seat of the utility model.

[0020] The meaning of each number in the figure is:

[0021] 1. polishing pad base; 10. heat conducting column; 11. microporous pad; 12. micropore; 13. first stud; 14. slide seat; 141. slide groove; 142. through hole;

[0022] 2. Second stud; 20. Limiting plate; 21. Elastic washer; 22. Nut. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] See also Figure 1-Figure 4 The utility model provides a technical solution: a microporous polishing pad suitable for infrared materials, comprising a polishing pad base 1, on which a plurality of heat-conducting columns 10 arranged along the thickness direction of the polishing pad base 1 are arranged, and the heat-conducting columns 10 are used for heat conduction operation to improve heat dissipation performance; a microporous pad 11 is fixedly installed on the surface of the polishing pad base 1, and a plurality of micropores 12 arranged along the thickness direction of the microporous pad 11 are arranged on the microporous pad 11, and the diameter of the micropores 12 is between 50 and 300 μm, and the depth is between 100 and 800 μm. The structure of the micropores 12 can increase the contact area with the air, can effectively absorb the heat generated during the polishing process, reduce the polishing temperature, and protect the performance of the infrared material. At the same time, the micropores 12 can also increase the contact area between the polishing pad and the infrared material, improve the polishing efficiency and precision, and are suitable for the polishing operation of infrared materials;

[0025] Specifically, a first stud 13 is fixedly installed on the bottom surface of the polishing pad base 1, and a slide seat 14 is also fixedly installed on the bottom surface of the polishing pad base 1. A second stud 2 is slidably connected inside the slide seat 14. Nuts 22 are threadedly connected to the first stud 13 and the second stud 2, and the nuts 22 are used for fixing operations after being tightened.

[0026] In this embodiment, a slide groove 141 is provided in the slide seat 14, and a through hole 142 is provided on the top wall of the slide groove 141. A limit plate 20 is fixedly installed on the bottom end of the second stud 2. The limit plate 20 is located in the slide groove 141 and is slidably connected to the slide groove 141. The second stud 2 passes through the through hole 142, so that the second stud 2 can move left and right to perform position adjustment operations.

[0027] Specifically, the outer diameter of the limiting plate 20 is larger than the width of the through hole 142 , and the size of the limiting plate 20 matches the size of the slide groove 141 , so that the limiting plate 20 can stably slide in the slide groove 141 without being pulled out of the through hole 142 .

[0028] Furthermore, elastic washers 21 are sleeved on the first stud 13 and the second stud 2 , and the elastic washers 21 are used to prevent the nut 22 from loosening.

[0029] In addition, the sliding seat 14 and the first stud 13 are located on the same axis and are used to slide the second stud 2 to adjust the distance between the first stud 13 and the second stud 2 .

[0030] When the microporous polishing pad suitable for infrared materials of the utility model is used, firstly, the first stud 13 is aligned with the through hole of the flange part on the external transmission shaft, then the second stud 2 is slid, and the position of the second stud 2 is adjusted so that the first stud 13 and the second stud 2 can both pass through the through hole of the flange part on the external transmission shaft, and then the elastic washer 21 is sleeved on the first stud 13 and the second stud 2, and the nut 22 is tightened on the first stud 13 and the second stud 2 to complete the fixing operation. After fixing, as the external transmission shaft rotates, the polishing pad base 1 and the microporous pad 11 are driven to rotate, and the microporous pad 11 is used to rotate against the surface of the infrared material to perform the polishing operation.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.

Claims

1. A microporous polishing pad suitable for infrared materials, comprising a polishing pad substrate (1), characterized in that: The polishing pad base (1) is provided with a plurality of heat-conducting columns (10) arranged along the thickness direction of the polishing pad base (1); a microporous pad (11) is fixedly mounted on the surface of the polishing pad base (1); the microporous pad (11) is provided with a plurality of micropores (12) arranged along the thickness direction of the microporous pad (11); a first stud (13) is fixedly mounted on the bottom surface of the polishing pad base (1); a sliding seat (14) is also fixedly mounted on the bottom surface of the polishing pad base (1); a second stud (2) is slidably connected inside the sliding seat (14).

2. The microporous polishing pad suitable for infrared materials according to claim 1, characterized in that: The diameter of the micropore (12) is between 50 and 300 μm, and the depth is between 100 and 800 μm.

3. The microporous polishing pad suitable for infrared materials according to claim 1, characterized in that: A slide groove (141) is arranged in the slide seat (14), a through hole (142) is arranged on the top wall of the slide groove (141), a limit plate (20) is fixedly installed at the bottom end of the second stud (2), the limit plate (20) is located in the slide groove (141) and is slidably connected to the slide groove (141), and the second stud (2) is inserted through the through hole (142).

4. The microporous polishing pad suitable for infrared materials according to claim 3, characterized in that: The outer diameter of the limiting plate (20) is greater than the width of the through hole (142), and the size of the limiting plate (20) is matched with the size of the sliding groove (141).

5. The microporous polishing pad suitable for infrared materials according to claim 1, characterized in that: The first stud (13) and the second stud (2) are both threadedly connected with nuts (22), and the nuts (22) are used for fixing operations after being tightened.

6. The microporous polishing pad suitable for infrared materials according to claim 5, characterized in that: The first stud (13) and the second stud (2) are both sleeved with elastic washers (21), and the elastic washers (21) are used to prevent the nut (22) from loosening.

7. The microporous polishing pad suitable for infrared materials according to claim 6, characterized in that: The sliding seat (14) and the first stud (13) are located on the same axis and are used to slide the second stud (2) to adjust the distance between the first stud (13) and the second stud (2).

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