Refrigeration mechanism and sampling device

Abstract

The utility model relates to a refrigerating mechanism which comprises a box assembly, the box assembly comprises a first box, the first box is used for containing first refrigerating fluid, the refrigerating assembly comprises a semiconductor refrigerating sheet and a second water cooling piece, the semiconductor refrigerating sheet is provided with a cold face and a hot face, the cold face is used for exchanging heat with a sampling bottle, and the hot face is used for exchanging heat with the sampling bottle; the first refrigerating fluid is configured to circularly flow between the first box body and the second water cooling piece so as to form a first cooling loop, and the second water cooling piece makes contact with the hot face. According to the refrigeration mechanism, the hot surface of the semiconductor refrigeration sheet is cooled through the second water cooling piece, so that the hot surface of the semiconductor refrigeration sheet can absorb more energy from the cold surface, the temperature of the cold surface of the semiconductor refrigeration sheet is lower, and the temperature of the sampling bottle is reduced from a higher numerical value to a target value.

Description

Technical Field

[0001] The present application relates to the field of nuclear power equipment, and in particular to a refrigeration mechanism and a sampling device. Background Art

[0002] Tritium is a radioactive substance that will be converted into tritium water vapor. It will enter the water cycle of the natural environment together with ordinary water and cause radiation to the human body. In order to protect the environment, monitoring the tritium content in water and air through sampling devices has received increasing attention. Usually, the sampling device uses a semiconductor refrigeration sheet as a cooling unit to generate a low-temperature coolant to cool the sampling bottle in the sampling device to prevent the sampling bottle from breaking due to excessive temperature. However, in the related art, the cooling effect of the cooling unit is limited, and it is impossible to generate a sufficiently low-temperature coolant to reduce the temperature of the sampling bottle to the target value when the temperature of the sampling bottle is high. Summary of the invention

[0003] Based on this, it is necessary to provide a refrigeration mechanism to address the problem that the existing cooling unit has limited refrigeration effect and cannot produce coolant of sufficiently low temperature to reduce the temperature of the sampling bottle to the target value when the temperature of the sampling bottle is high.

[0004] A refrigeration mechanism, comprising:

[0005] The box assembly includes a first box, wherein the first box is used to contain a first refrigerant liquid;

[0006] A refrigeration component, comprising a semiconductor refrigeration plate and a second water-cooling element, wherein the semiconductor refrigeration plate has a cold surface and a hot surface, and the cold surface is used for exchanging heat with the sampling bottle;

[0007] The first refrigerant is configured to circulate between the first box and the second water-cooling element to construct a first cooling circuit, and the second water-cooling element is in contact with the hot surface.

[0008] In one embodiment, the refrigeration mechanism includes a heat dissipation component, which is located on the first cooling circuit and connected between the second water-cooling component and the first box body to cool the first refrigerant discharged from the second water-cooling component.

[0009] In one embodiment, the heat dissipation component includes a heat dissipation pipe and a fan. The heat dissipation pipe is located on the first cooling circuit and is connected between the second water-cooling component and the first box body to cool the first refrigerant discharged from the second water-cooling component. The fan is used to perform air cooling on the heat dissipation pipe.

[0010] In one embodiment, the refrigeration mechanism includes a first pump body, and the first pump body is arranged on the first cooling circuit to drive the first refrigerant to circulate in the first cooling circuit.

[0011] When the above-mentioned refrigeration mechanism is working, the energy of the cold surface of the semiconductor refrigeration plate is transferred to the hot surface of the semiconductor refrigeration plate, the temperature of the cold surface of the semiconductor refrigeration plate is reduced, and heat is exchanged with the sampling bottle to reduce the temperature of the sampling bottle. The hot surface of the semiconductor refrigeration plate absorbs the energy from the cold surface of the semiconductor refrigeration plate, and the hot surface of the semiconductor refrigeration plate is heated up. The second water-cooling part contacts the hot surface of the semiconductor refrigeration plate, and the energy of the hot surface of the semiconductor refrigeration plate is transmitted to the second water-cooling part. The first refrigerant in the first box enters the second water-cooling part through the first cooling circuit and absorbs the energy from the hot surface of the semiconductor refrigeration plate to cool down the hot surface of the semiconductor refrigeration plate. The first refrigerant absorbs the energy and heats up, and returns to the first box through the first cooling circuit. The refrigeration mechanism in the present application cools down the hot surface of the semiconductor refrigeration plate through the second water-cooling part, so that the hot surface of the semiconductor refrigeration plate can absorb more energy from the cold surface, and the cold surface temperature of the semiconductor refrigeration plate is lower, so as to reduce the temperature of the sampling bottle from a higher value to a target value.

[0012] A sampling device comprises the aforementioned refrigeration mechanism and a sampling bottle, wherein the cold surface of the semiconductor refrigeration sheet is used for exchanging heat with the sampling bottle.

[0013] In one embodiment, the sampling device includes a first water-cooling component, and the box assembly includes a second box, the second box is used to contain a second refrigerant, the second refrigerant is configured to circulate between the second box and the first water-cooling component to construct a second cooling circuit, the second refrigerant flowing in the second cooling circuit is used to cool the sampling bottle, and the first water-cooling component is in contact with the cold surface of the semiconductor refrigeration plate.

[0014] In one embodiment, the sampling device includes a cooling tube, the sampling bottle is used to contain an absorption liquid capable of absorbing the target gas, the cooling tube is located in the sampling bottle, and the cooling tube is located on the second cooling circuit.

[0015] In one embodiment, the sampling device includes an air intake component and a plurality of sampling bottles, the air intake component includes an air intake pipe, a second connecting pipe and an exhaust pipe, any two adjacent sampling bottles are connected via the second connecting pipe, and among the plurality of sampling bottles, a sampling bottle located at the head end is connected to the air intake pipe, and a sampling bottle located at the end end is connected to the exhaust pipe, and the gas flowing in through the air intake pipe is configured to flow through the plurality of sampling bottles in sequence and then be discharged from the exhaust pipe.

[0016] In one embodiment, the sampling device also includes a catalytic component, and the second connecting pipe includes an air outlet section and an air inlet section, the air outlet section and the air inlet section are connected to two adjacent sampling bottles in a one-to-one correspondence, the air inlet of the catalytic component is connected to the air outlet section, and the exhaust port of the catalytic component is connected to the air inlet section.

[0017] In one embodiment, the sampling device includes a cooling component, which is used to convert external gas into cold air and blow it toward the catalytic component to cool the catalytic component.

[0018] When the sampling device is working, the energy of the cold surface of the semiconductor refrigeration plate is transferred to the hot surface of the semiconductor refrigeration plate, the temperature of the cold surface of the semiconductor refrigeration plate is reduced, and heat is exchanged with the sampling bottle to reduce the temperature of the sampling bottle. The hot surface of the semiconductor refrigeration plate absorbs the energy from the cold surface of the semiconductor refrigeration plate, and the hot surface of the semiconductor refrigeration plate is heated up. The second water-cooling element contacts the hot surface of the semiconductor refrigeration plate, and the energy of the hot surface of the semiconductor refrigeration plate is transmitted to the second water-cooling element. The first refrigerant in the first box enters the second water-cooling element through the first cooling circuit and absorbs the energy from the hot surface of the semiconductor refrigeration plate to cool the hot surface of the semiconductor refrigeration plate. The first refrigerant absorbs the energy and heats up, and returns to the first box through the first cooling circuit. The sampling device in the present application cools the hot surface of the semiconductor refrigeration plate through the second water-cooling element, so that the hot surface of the semiconductor refrigeration plate can absorb more energy from the cold surface, and the cold surface temperature of the semiconductor refrigeration plate is lower, so as to reduce the temperature of the sampling bottle from a higher value to a target value. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is an assembly diagram of a refrigeration mechanism and a sampling bottle in one embodiment of the present application;

[0020] Figure 2 For this application Figure 1 The structural diagram of the refrigeration mechanism;

[0021] Figure 3 For this application Figure 1 The schematic diagram of the structure of the sampling device;

[0022] Figure 4 For this application Figure 3 The structural diagram of the radiator;

[0023] Figure 5 This is a schematic diagram of the structure of a sampling device in one embodiment of the present application;

[0024] Figure 6 This is a schematic diagram of the structure of a sampling device in one embodiment of the present application;

[0025] Figure 7Schematic diagram of the structure of a sampling device in one embodiment of the present application.

[0026] Reference numerals:

[0027] Box assembly 100, first box 110, first liquid inlet 111, first liquid outlet 112, second box 120, second liquid inlet 121, second liquid outlet 122, third box 130, first baffle 131, second baffle 132, air inlet 133, air outlet 134;

[0028] Refrigeration component 200, semiconductor refrigeration sheet 210, first water cooling element 220, third liquid inlet 221, third liquid outlet 222, second water cooling element 230, fourth liquid inlet 231, fourth liquid outlet 232;

[0029] A first pump body 300;

[0030] Heat dissipation assembly 400, fifth liquid inlet 410, fifth liquid outlet 420, heat dissipation pipe 430, heat sink 440, fan 450;

[0031] A second pump body 500;

[0032] Sampling assembly 600, sampling bottle 610, liquid inlet pipe 620, cooling pipe 630, first connecting pipe 640, liquid outlet pipe 650;

[0033] Intake assembly 700, intake pipe 710, second connecting pipe 720, outlet section 721, intake section 722, exhaust pipe 730;

[0034] Catalytic assembly 800;

[0035] Heat dissipation assembly 900 , first heat dissipation element 910 , second heat dissipation element 920 . DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0038] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0042] See also Figure 1 and Figure 2 , Figure 2 The schematic diagram of the structure of the refrigeration mechanism in one embodiment of the present application is shown. The refrigeration mechanism provided in one embodiment of the present application includes: a box assembly 100 and a refrigeration assembly 200. The box assembly 100 includes a first box 110, and the first box 110 is used to contain a first refrigerant. The refrigeration assembly 200 includes a semiconductor refrigeration plate 210 and a second water-cooling component 230. The semiconductor refrigeration plate 210 has a cold surface and a hot surface. The cold surface is used to exchange heat with the sampling bottle 610. The first refrigerant is configured to circulate between the first box 110 and the second water-cooling component 230 to construct a first cooling circuit (not shown). The second water-cooling component 230 is in contact with the hot surface.

[0043] In this embodiment, when the refrigeration mechanism is working, the energy of the cold surface of the semiconductor refrigeration plate 210 is transferred to the hot surface of the semiconductor refrigeration plate 210, the temperature of the cold surface of the semiconductor refrigeration plate 210 is reduced, and heat is exchanged with the sampling bottle 610 to reduce the temperature of the sampling bottle 610, the hot surface of the semiconductor refrigeration plate 210 absorbs the energy from the cold surface of the semiconductor refrigeration plate 210, the hot surface of the semiconductor refrigeration plate 210 is heated up, the second water-cooling component 230 is in contact with the hot surface of the semiconductor refrigeration plate 210, and the energy of the hot surface of the semiconductor refrigeration plate 210 is conducted to the second water-cooling component 230, the first refrigerant in the first box body 110 enters the second water-cooling component 230 through the first cooling circuit, and absorbs the energy from the hot surface of the semiconductor refrigeration plate 210 to cool the hot surface of the semiconductor refrigeration plate 210, the first refrigerant absorbs the energy and heats up, and returns to the first box body 110 through the first cooling circuit. The refrigeration mechanism in the present application cools the hot surface of the semiconductor refrigeration plate 210 through the second water-cooling component 230, so that the hot surface of the semiconductor refrigeration plate 210 can absorb more energy from the cold surface, and the cold surface temperature of the semiconductor refrigeration plate 210 is lower, so as to reduce the temperature of the sampling bottle 610 from a higher value to the target value.

[0044] In some embodiments, a first liquid inlet 111 and a first liquid outlet 112 are provided on the first box body 110, a fourth liquid inlet 231 and a fourth liquid outlet 232 are provided on the second water-cooling component 230, and the first cooling circuit includes a first liquid inlet passage (not shown) and a first liquid outlet passage (not shown), the first liquid inlet passage connects the first liquid outlet 112 and the fourth liquid inlet 231, so that the first refrigerant in the first box body 110 flows into the second water-cooling component 230, and the first liquid outlet passage connects the first liquid inlet 111 and the fourth liquid outlet 232, so that the first refrigerant in the second water-cooling component 230 flows into the first box body 110.

[0045] See also Figure 2 The refrigeration mechanism includes a heat dissipation component 400, which is located on the first cooling circuit and connected between the second water-cooling component 230 and the first box body 110 to cool the first refrigerant discharged from the second water-cooling component 230.

[0046] In this embodiment, during operation, the second water-cooling element 230 discharges the first refrigerant liquid that has been heated up due to absorbing the energy from the hot surface of the semiconductor cooling plate 210. The first refrigerant liquid is cooled by the heat dissipation assembly 400 located on the first cooling circuit and connected between the second water-cooling element 230 and the first box 110, and then returns to the first box 110 along the first cooling circuit. In summary, the first refrigerant liquid discharged from the second water-cooling element 230 is cooled by the heat dissipation assembly 400, so that the first refrigerant liquid returns to the first box 110 at a lower temperature, thereby ensuring that the first refrigerant liquid in the first box 110 always maintains a lower temperature to absorb the energy from the hot surface of the semiconductor cooling plate 210.

[0047] In some embodiments, the heat dissipation component 400 has a fifth liquid inlet 410 and a fifth liquid outlet 420, and the first liquid outlet passage includes a first liquid outlet upper section (not shown) and a first liquid outlet lower section (not shown), the first liquid outlet upper section connects the fifth liquid inlet 410 and the fourth liquid outlet 232, and the first liquid outlet lower section connects the fifth liquid outlet 420 and the first liquid inlet 111.

[0048] See also Figure 2 and Figure 4 In some embodiments, the heat dissipation assembly 400 includes a heat dissipation pipe 430 and a fan 450. The heat dissipation pipe 430 is located on the first cooling circuit and is connected between the second water-cooling component 230 and the first box body 110 to cool the first refrigerant discharged from the second water-cooling component 230. The fan 450 is used to perform air cooling on the heat dissipation pipe 430.

[0049] In this embodiment, during operation, the first refrigerant discharged from the second water-cooling component 230 enters the heat dissipation pipe 430, and the heat dissipation pipe 430 absorbs the heat of the first refrigerant and heats up. The fan 450 blows air toward the heat dissipation pipe 430 to cool the heat dissipation pipe 430. The temperature of the first refrigerant is reduced after the heat is absorbed by the heat dissipation pipe 430. The cooled first refrigerant flows out of the heat dissipation pipe 430 and returns to the first box body 110 through the first cooling circuit.

[0050] In some embodiments, the liquid inlet of the heat dissipation pipe 430 is communicated with the fifth liquid inlet 410 , and the liquid outlet of the heat dissipation pipe 430 is communicated with the fifth liquid outlet 420 .

[0051] In some embodiments, the heat dissipation assembly 400 further includes a heat sink 440 , which is sleeved on the heat dissipation tube 430 . The cold air generated by the fan 450 is transmitted to the heat dissipation tube 430 through the heat sink 440 to cool the first refrigerant in the heat dissipation tube 430 .

[0052] See also Figure 2 In some embodiments, the refrigeration mechanism includes a first pump body 300, and the first pump body 300 is arranged on the first cooling circuit to drive the first refrigerant to circulate in the first cooling circuit.

[0053] In this embodiment, when working, the first pump body 300 drives the first refrigerant to circulate in the first cooling circuit. The first pump body 300 draws the first refrigerant from the first box body 110 into the second water-cooling component 230, and then flows out of the second water-cooling component 230 and returns to the first box body 110.

[0054] In some embodiments, the first liquid inlet passage includes a first liquid inlet upper section (not shown) and a first liquid inlet lower section (not shown), the first liquid inlet upper section connects the first liquid outlet 112 and the liquid inlet of the first pump body 300, and the first liquid inlet lower section connects the liquid outlet of the first pump body 300 and the fourth liquid inlet 231.

[0055] See also Figure 1 , Figure 1 A schematic diagram of the structure of a refrigeration mechanism and a sampling bottle in an embodiment of the present application is shown. The sampling device provided in an embodiment of the present application includes the aforementioned refrigeration mechanism and a sampling bottle 610. The cold surface of the semiconductor refrigeration sheet 210 is used for heat exchange with the sampling bottle 610.

[0056] In this embodiment, when the sampling device is working, the energy of the cold surface of the semiconductor refrigeration plate 210 is transferred to the hot surface of the semiconductor refrigeration plate 210, the temperature of the cold surface of the semiconductor refrigeration plate 210 is reduced, and heat is exchanged with the sampling bottle 610 to reduce the temperature of the sampling bottle 610, the hot surface of the semiconductor refrigeration plate 210 absorbs the energy from the cold surface of the semiconductor refrigeration plate 210, the hot surface of the semiconductor refrigeration plate 210 is heated up, the second water-cooling component 230 is in contact with the hot surface of the semiconductor refrigeration plate 210, and the energy of the hot surface of the semiconductor refrigeration plate 210 is conducted to the second water-cooling component 230, the first refrigerant in the first box body 110 enters the second water-cooling component 230 through the first cooling circuit, and absorbs the energy from the hot surface of the semiconductor refrigeration plate 210 to cool the hot surface of the semiconductor refrigeration plate 210, the first refrigerant absorbs the energy and heats up, and returns to the first box body 110 through the first cooling circuit. The sampling device in the present application cools the hot surface of the semiconductor refrigeration plate 210 through the second water-cooling component 230, so that the hot surface of the semiconductor refrigeration plate 210 can absorb more energy from the cold surface, and the cold surface temperature of the semiconductor refrigeration plate 210 is lower, so as to reduce the temperature of the sampling bottle 610 from a higher value to the target value.

[0057] See also Figure 1 and Figure 3 In some embodiments, the sampling device includes a first water-cooling component 220, and the box assembly 100 includes a second box 120. The second box 120 is used to accommodate a second refrigerant. The second refrigerant is configured to circulate between the second box 120 and the first water-cooling component 220 to construct a second cooling circuit (not shown). The second refrigerant flowing in the second cooling circuit is used to cool the sampling bottle 610, and the first water-cooling component 220 is in contact with the cold surface of the semiconductor refrigeration plate 210.

[0058] In this embodiment, during operation, the second refrigerant in the second housing 120 enters the first water-cooling element 220 through the second cooling circuit, the first water-cooling element 220 contacts the cold surface of the semiconductor cooling plate 210, the cold surface of the semiconductor cooling plate 210 absorbs the energy of the second refrigerant in the first water-cooling element 220, the temperature of the second refrigerant decreases, and the cooled second refrigerant is used to cool the sampling bottle 610, and after cooling the sampling bottle 610, it returns to the second housing 120 through the second cooling circuit. Compared with the cooling method in which the cold surface of the semiconductor cooling plate 210 is in direct contact with the sampling bottle 610, in the above process, the second refrigerant flowing in the second cooling circuit cools the sampling bottle 610, which can ensure that the cooling degree of each area of ​​the sampling bottle 610 is consistent, thereby preventing the sampling bottle 610 from rupturing due to the large temperature difference between each area.

[0059] In some embodiments, a second liquid inlet 121 and a second liquid outlet 122 are provided on the second box body 120, the first water-cooling component 220 has a third liquid inlet 221 and a third liquid outlet 222, the second cooling circuit includes a second liquid inlet passage (not shown) and a second liquid outlet passage (not shown), the second liquid inlet passage connects the second liquid outlet 122 and the third liquid inlet 221, and the second liquid outlet passage connects the third liquid outlet 222 and the second liquid inlet 121.

[0060] In some embodiments, a second pump body 500 is provided on the second cooling circuit to drive the second refrigerant to circulate in the second cooling circuit.

[0061] In some embodiments, the second liquid inlet passage includes a second liquid inlet upper section (not shown) and a second liquid inlet lower section (not shown), the second liquid inlet upper section connects the second liquid outlet 122 and the liquid inlet of the second pump body 500, and the second liquid inlet lower section connects the liquid outlet of the second pump body 500 and the third liquid inlet 221.

[0062] See also Figure 1 In some embodiments, the sampling device includes a cooling tube 630, the sampling bottle 610 is used to contain an absorption liquid capable of absorbing the target gas, the cooling tube 630 is located in the sampling bottle 610, and the cooling tube 630 is located on the second cooling circuit.

[0063] In this embodiment, during operation, the second refrigerant flows from the first water-cooling element 220 into the cooling tube 630 through the second cooling circuit, and the second refrigerant in the cooling tube 630 absorbs the heat of the absorption liquid in the sampling bottle 610. The second refrigerant that absorbs the heat is heated up and returns to the second housing 120 from the cooling tube 630 through the second cooling circuit. In summary, the second refrigerant enters the cooling tube 630 and cools the absorption liquid in the sampling bottle 610, so as to reduce the heat conducted from the absorption liquid to the bottle wall of the sampling bottle 610.

[0064] In some embodiments, the second liquid outlet passage includes a second liquid outlet upper section (not shown) and a second liquid outlet lower section (not shown), the second liquid outlet upper section connects the third liquid outlet 222 and the liquid inlet of the cooling tube 630, and the second liquid outlet lower section connects the liquid outlet of the cooling tube 630 and the second liquid inlet 121.

[0065] See also Figure 5In some embodiments, the sampling device includes an air intake component 700 and multiple sampling bottles 610. The air intake component 700 includes an air intake pipe 710, a second connecting pipe 720 and an exhaust pipe 730. Any two adjacent sampling bottles 610 are connected through the second connecting pipe 720. Among the multiple sampling bottles 610, a sampling bottle 610 located at the head end is connected to the air intake pipe 710, and a sampling bottle 610 located at the end is connected to the exhaust pipe 730. The gas flowing in through the air intake pipe 710 is configured to flow through the multiple sampling bottles 610 in sequence and then be discharged from the exhaust pipe 730.

[0066] In this embodiment, the gas enters a sampling bottle 610 at the head end from the air inlet pipe 710, and flows through multiple sampling bottles 610 in sequence through the second connecting pipe 720, reacts with the absorption liquid in the multiple sampling bottles 610, and finally is discharged from the exhaust pipe 730 connected to the sampling bottle 610 at the end. In the above process, the gas flows through multiple sampling bottles 610 in sequence, and the absorption liquid in each sampling bottle 610 absorbs the target gas, so that the target gas component contained in the gas flowing in through the air inlet pipe 710 is completely absorbed by the absorption liquid.

[0067] In some embodiments, it includes a liquid inlet pipe 620, a first connecting pipe 640 and a liquid outlet pipe 650. The cooling tubes 630 in any two adjacent sampling bottles 610 are connected through the first connecting pipe 640. Among the multiple sampling bottles 610, the liquid inlet of the cooling tube 630 in a sampling bottle 610 located at the head end is connected to the liquid inlet pipe 620, and the liquid outlet of the cooling tube 630 in a sampling bottle 610 located at the end is connected to the liquid outlet pipe 650. The second refrigerant flowing in through the liquid inlet pipe 620 is configured to flow through the cooling tubes 630 in the multiple sampling bottles 610 in sequence and then be discharged from the liquid outlet pipe 650.

[0068] In some embodiments, the second liquid outlet upper section is connected to the third liquid outlet 222 and the liquid inlet pipe 620 , and the second liquid outlet lower section is connected to the liquid outlet pipe 650 and the second liquid inlet 121 .

[0069] See also Figure 5 In some embodiments, the sampling device also includes a catalytic component 800, and the second connecting pipe 720 includes an air outlet section 721 and an air inlet section 722, and the air outlet section 721 and the air inlet section 722 are connected to two adjacent sampling bottles 610 in a one-to-one correspondence, and the air inlet of the catalytic component 800 is connected to the air outlet section 721, and the exhaust port of the catalytic component 800 is connected to the air inlet section 722.

[0070] In this embodiment, during operation, gas flows out from a sampling bottle 610 from the gas outlet section 721 and enters the catalytic component 800. A portion of the gas components in the gas are converted into target gas components under the action of the catalytic component 800, and together with another portion of the gas components in the gas, they enter another sampling bottle 610 from the catalytic component 800 through the gas inlet section 722.

[0071] In some embodiments, a heating coil (not shown) is wound around the outside of the catalytic assembly 800 to heat the catalytic assembly 800 .

[0072] See also Figure 5 and Figure 6 In some embodiments, the sampling device includes a cooling element (not shown), which is used to convert external gas into cold air and blow it toward the catalytic component 800 to cool the catalytic component 800.

[0073] In this embodiment, when working, the cooling element converts the external gas into cold wind and blows it toward the catalyst assembly 800, thereby protecting the catalyst assembly 800 and preventing the catalyst assembly 800 from being damaged due to over-high temperature.

[0074] In some embodiments, the catalytic assembly 800 is located on one side of the first housing 110 along the first direction, the heat dissipation pipe 430 of the heat dissipation assembly 400 is located between the first housing 110 and the catalytic assembly 800, and the fan 450 is located on one side of the heat dissipation pipe 430 close to the first housing 110 along the first direction.

[0075] In some embodiments, a heat dissipation assembly 900 is also included, and the heat dissipation assembly 900 includes a first heat dissipation member 910 and a second heat dissipation member 920. The first heat dissipation member 910 is located on a side of the fan 450 close to the first box body 110 along the first direction, and the second heat dissipation member 920 is located on a side of the heat dissipation pipe 430 close to the catalytic assembly 800 along the first direction. The second heat dissipation member 920 is connected to the exhaust port of the catalytic member 800, and the second heat dissipation member 920 is connected to the air intake section 722 through the first heat dissipation member 910.

[0076] See also Figures 1 to 7 In some embodiments, the box assembly 100 includes a third box 130, and the first box 110, the second box 120, the refrigeration assembly 200, the first pump body 300, the heat dissipation assembly 400, the second pump body 500, the sampling assembly 600, the air intake assembly 700, the catalytic assembly 800, and the heat dissipation assembly 900 are all located in the third box 130.

[0077] In some embodiments, a second baffle 132 extending along the second direction is provided in the third box body 130, and the second baffle 132 is located between the second heat sink 920 and the heat pipe 430. A vent (not shown) is provided on the second baffle 132. An air inlet 133 and an air outlet 134 are provided at both ends of the third box body 130 along the first direction, respectively. The air inlet 133, the air outlet 134 and the vent are coaxial and collinear. External air enters the third box body 130 from the air inlet 133, passes through the fan 450 and becomes cold air, passes through the vent and blows toward the catalytic component 800, and finally leaves the third box body 130 from the air outlet 134.

[0078] In some embodiments, the sampling assembly 600 is located on one side of the first box 110 along the second direction, and a first baffle 131 extending along the first direction is disposed in the third box 130 . The first baffle 131 is located between the first box 110 and the sampling assembly 600 .

[0079] See also Figure 5 The temperature control system provided in one embodiment of the present application includes the aforementioned sampling device, and further includes: a first temperature sensor (not shown), a second temperature sensor (not shown) and a processor (not shown), wherein the first temperature sensor is disposed at the exhaust port of the catalytic assembly 800, and is used to detect the temperature of the gas discharged from the catalytic assembly 800, and the second temperature sensor is used to detect the temperature of the catalytic assembly 800, and the processor is electrically connected to the first temperature sensor, the heating coil, and the second temperature sensor, and when the value detected by the first temperature sensor is greater than the first preset value, the processor adjusts the heating coil to reduce the heating of the catalytic assembly 800 by the heating coil, and vice versa, the processor adjusts the heating coil to increase the heating of the catalytic assembly 800 by the heating coil. When the value detected by the second temperature sensor is greater than the second preset value, the controller turns off the heating of the catalytic assembly 800 by the heating coil, and the catalytic assembly 800 stops working, and the second preset value is greater than the first preset value.

[0080] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0081] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A refrigeration mechanism, characterized in that: The refrigeration mechanism comprises: The box assembly (100) comprises a first box (110), wherein the first box (110) is used to contain a first refrigerant; A refrigeration component (200) comprises a semiconductor refrigeration plate (210) and a second water cooling element (230), wherein the semiconductor refrigeration plate (210) has a cold surface and a hot surface, and the cold surface is used for exchanging heat with a sampling bottle (610); The first refrigerant is configured to circulate between the first box (110) and the second water-cooling element (230) to construct a first cooling circuit, and the second water-cooling element (230) is in contact with the hot surface.

2. The refrigeration mechanism according to claim 1, characterized in that: The refrigeration mechanism comprises a heat dissipation component (400), the heat dissipation component (400) being located on the first cooling circuit and connected between the second water cooling component (230) and the first box (110) to cool the first refrigerant discharged from the second water cooling component (230).

3. The refrigeration mechanism according to claim 2, characterized in that: The heat dissipation component (400) comprises a heat dissipation pipe (430) and a fan (450); the heat dissipation pipe (430) is located on the first cooling circuit and is connected between the second water-cooling component (230) and the first box (110) to cool the first refrigerant discharged from the second water-cooling component (230); and the fan (450) is used to perform air cooling and heat dissipation on the heat dissipation pipe (430).

4. The refrigeration mechanism according to claim 1, characterized in that: The refrigeration mechanism comprises a first pump body (300), wherein the first pump body (300) is arranged on the first cooling circuit and is used to drive the first refrigerant to circulate on the first cooling circuit.

5. A sampling device, characterized in that: It comprises the refrigeration mechanism according to any one of claims 1 to 4, and further comprises the sampling bottle (610), wherein the cold surface of the semiconductor refrigeration sheet (210) is used for exchanging heat with the sampling bottle (610).

6. The sampling device according to claim 5, characterized in that: The sampling device comprises a first water-cooling component (220), the box assembly (100) comprises a second box (120), the second box (120) is used to contain a second refrigerant, the second refrigerant is configured to circulate between the second box (120) and the first water-cooling component (220) to construct a second cooling circuit, the second refrigerant flowing in the second cooling circuit is used to cool the sampling bottle (610), and the first water-cooling component (220) is in contact with the cold surface of the semiconductor refrigeration plate (210).

7. The sampling device according to claim 6, characterized in that: The sampling device comprises a cooling tube (630), the sampling bottle (610) is used to contain an absorption liquid capable of absorbing a target gas, the cooling tube (630) is located in the sampling bottle (610), and the cooling tube (630) is located on the second cooling circuit.

8. The sampling device according to claim 7, characterized in that: The sampling device comprises an air intake component (700) and a plurality of sampling bottles (610), wherein the air intake component (700) comprises an air intake pipe (710), a second connecting pipe (720) and an exhaust pipe (730), any two adjacent sampling bottles (610) are connected via the second connecting pipe (720), and among the plurality of sampling bottles (610), a sampling bottle (610) located at the head end is connected to the air intake pipe (710), and a sampling bottle (610) located at the end end is connected to the exhaust pipe (730), and the gas flowing in through the air intake pipe (710) is configured to flow through the plurality of sampling bottles (610) in sequence and then be discharged from the exhaust pipe (730).

9. The sampling device according to claim 8, characterized in that: The sampling device further comprises a catalytic component (800); the second connecting pipe (720) comprises an air outlet section (721) and an air inlet section (722); the air outlet section (721) and the air inlet section (722) are connected to two adjacent sampling bottles (610) in a one-to-one correspondence; the air inlet of the catalytic component (800) is connected to the air outlet section (721); and the exhaust port of the catalytic component (800) is connected to the air inlet section (722).

10. The sampling device according to claim 9, characterized in that: The sampling device comprises a cooling element, and the cooling element is used to convert external gas into cold air and blow it toward the catalytic component (800) to cool the catalytic component (800).

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