Current sensor and electronic device

Abstract

The embodiment of the utility model provides a current sensor and electronic equipment. The current sensor comprises a shell, an accommodating cavity is formed in the shell, and the outer surface of the shell is configured to be attached to a conductor to be detected; and the circuit board assembly is arranged in the accommodating cavity, the circuit board assembly comprises a magnetic induction chip, and the magnetic induction chip is used for transmitting the magnetic field change of the conductor to be detected to the circuit board assembly.

Description

Technical Field

[0001] The embodiments of the present application relate to the field of sensor technology, and more specifically, to a current sensor and an electronic device. Background Art

[0002] Current sensors are commonly used in the fields of electricity, automobiles, automatic control, etc. to monitor current.

[0003] At present, for the application of Hall current sensors in current measurement, it is usually necessary to surround the conductor to be measured with a ferromagnetic core structure, and the core structure has a break structure (measurement area) for arranging and installing the magnetic sensor. The magnetic field generated by the measured current around the conductor forms a uniformly amplified magnetic field in the break area (measurement area) under the action of the ferromagnetic core, which is then sensed by the magnetic sensor and outputs a voltage signal linearly corresponding to the measured current after signal amplification and conditioning, thus forming a current measurement function.

[0004] However, the use of ferromagnetic cores has many application defects, such as difficulty in layout, large size, high cost, poor responsiveness of current measurement due to hysteresis, and limited range due to magnetic saturation. In addition, due to the core structure, the conductor to be measured needs to pass through the inside of the sensor module, making the module structure complex and large in size.

[0005] In view of this, it is necessary to provide a new technical solution to solve any of the above technical problems. Utility Model Content

[0006] The purpose of this application is to provide a new technical solution for current sensor and electronic equipment.

[0007] In a first aspect, the present application provides a current sensor. A housing is formed inside the housing to form a receiving cavity, and an outer surface of the housing is configured to fit a conductor to be measured;

[0008] A circuit board assembly is disposed in the accommodating cavity, and the circuit board assembly includes a magnetic induction chip, and the magnetic induction chip is used to transmit the magnetic field change of the conductor to be measured to the circuit board assembly.

[0009] Optionally, an opening is formed on the conductor to be tested.

[0010] Optionally, a recessed groove is formed on the housing, and the recessed groove is configured to carry the conductor to be tested.

[0011] Optionally, the setting position of the recessed groove corresponds to the setting position of the magnetic induction chip.

[0012] Optionally, a signal terminal is provided on the housing, one end of the signal terminal is electrically connected to the circuit board assembly, and the other end of the signal terminal is used to be electrically connected to an external device, and the external device includes the conductor to be tested.

[0013] Optionally, a first mounting seat is provided on the shell, and the conductor to be measured is fastened to the first mounting seat.

[0014] Optionally, in a case where a recessed groove is formed on the shell, the setting position of the first mounting seat corresponds to the formation position of the recessed groove.

[0015] Optionally, the conductor to be measured is arranged on an external device, a second mounting seat is further arranged on the shell, and the current sensor is fastened to the external device through the second mounting seat.

[0016] Optionally, the first mounting seat, the second mounting seat and the shell are integrally formed.

[0017] The second aspect of the embodiment of the present application further provides an electronic device, wherein the electronic device comprises the current sensor as described in the first aspect.

[0018] According to the embodiments of the present application, no magnetic core is provided inside the current sensor, and current detection of the conductor to be measured after power is turned on is achieved by fitting the conductor to be measured to the outer surface of the shell. By improving the internal structure of the current sensor and the setting method of the conductor to be measured, the volume of the current sensor is reduced without affecting the current detection result of the conductor to be measured.

[0019] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0021] Figure 1 Shown is a structural diagram of a current sensor provided in an embodiment of the present application.

[0022] Figure 2 Shown is an exploded view of the current sensor provided in an embodiment of the present application.

[0023] Figure 3 Shown is a structural diagram of the connection between the current sensor provided in an embodiment of the present application and an external device.

[0024] Description of reference numerals:

[0025] 1. housing; 11. first housing; 12. second housing; 111. recessed groove; 13. signal terminal; 14. first mounting seat; 15. second mounting seat;

[0026] 2. Circuit board assembly; 21. Circuit board body; 22. Magnetic induction chip;

[0027] 3. External device; 31. Conductor to be measured; 311. Opening; 3111. First opening; 3112. Second opening. DETAILED DESCRIPTION

[0028] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0029] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present application, its application, or uses.

[0030] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0031] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0032] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0033] In the prior art, a ferromagnetic core (magnetic concentration effect) is provided in the current sensor. The use of a ferromagnetic core has multiple application defects, such as difficulty in layout, large size, high cost, poor responsiveness of current measurement due to hysteresis, and limited range due to magnetic saturation, which affects the current measurement of the copper busbar for detecting current. In addition, in the prior art, a detection hole is usually provided on the current sensor, and the copper busbar for detecting current is inserted into the detection hole, and the current on the copper busbar is detected by the Hall effect, which makes the current sensor complex in structure and large in size.

[0034] In addition, in the prior art, when the current of the conductor to be measured is detected by a current sensor, since a magnetic core is provided inside the current sensor, it is necessary to sense the magnetic field change of the conductor to be measured through the magnetic core. Therefore, the conductor to be measured needs to pass through the current sensor, and the setting position of the magnetic core and the equipment position of the conductor to be measured need to be considered at the same time.

[0035] Based on any of the above technical problems, the first aspect of the embodiment of the present application provides a current sensor. The current sensor provided in the embodiment of the present application is a coreless current sensor, that is, the magnetic core is removed inside the current sensor, avoiding the poor responsiveness of current measurement due to hysteresis, the defect of limited range due to magnetic saturation, and also reducing the volume of the current sensor to a certain extent. The embodiment of the present application provides a coreless current sensor, and the copper bar of the current to be detected is arranged in affixed relation with the outer surface of the housing 1 of the current sensor, avoiding the need for the copper bar of the current to be detected to pass through the interior of the sensor (in the prior art, the copper bar of the current to be detected passes through the interior of the current sensor because the internal magnetic core is required to sense the magnetic field change of the copper bar of the current to be detected), simplifying the internal structure of the current sensor and reducing the volume of the current sensor.

[0036] Specifically, refer to Figure 1 and Figure 2 The current sensor includes: a housing 1 and a circuit board assembly 2. A housing cavity is formed inside the housing 1, and the outer surface of the housing 1 is configured to fit with the conductor 31 to be measured; the circuit board assembly 2 is arranged in the housing cavity, and the circuit board assembly 2 includes a magnetic induction chip 22, and the magnetic induction chip 22 is used to transmit the magnetic field change of the conductor 31 to be measured to the circuit board assembly 2.

[0037] In the embodiment of the present application, the current sensor only includes a housing 1 and a circuit board assembly 2. Compared with the prior art, no magnetic core is provided inside the current sensor. In the case where no magnetic core is provided inside the current sensor, there is no need for the magnetic core to sense the current of the conductor 31 to be measured. In the case where the magnetic core is not required to sense the current of the conductor 31 to be measured, the conductor 31 to be measured does not need to pass through the interior of the current sensor. Therefore, in the embodiment of the present application, when the current of the conductor 31 to be measured is detected by the current sensor, it is only necessary to fit the conductor 31 to be measured with the outer surface of the housing 1, and the current detection of the conductor 31 to be measured is realized by the magnetic induction chip 22, thereby achieving the purpose of reducing the volume of the current sensor.

[0038] For example, the current sensor includes a housing 1, which may include a first housing 11 and a second housing 12. The first housing 11 and the second housing 12 are assembled together by snapping, bonding, etc. The first housing 11 and the second housing 12 enclose a receiving cavity. Figure 2 The second shell 12 is a cover plate structure, the first shell 11 is a shell 1 structure, and the cover plate structure is covered on the shell 1 structure to form the shell 1 of the current sensor.

[0039] The current sensor includes a circuit board assembly 2. When the current sensor detects the current of the conductor 31 to be measured, it is only necessary to fit the conductor 31 to be measured with the outer surface of the housing 1, and the current detection of the conductor 31 to be measured is realized by the magnetic induction chip 22 included in the circuit board assembly 2. The magnetic induction chip 22 is a chip that uses the magnetic field induction phenomenon to store and transmit data. The magnetic induction chip 22 senses the change of the magnetic field of the conductor 31 to be measured (after power is turned on) to realize the reading and writing of information. For example, the magnetic induction chip 22 senses the change of the magnetic field of the conductor 31 to be measured that is powered on, and converts the change of the magnetic field into a current signal and transmits it to the circuit board assembly 2, which is finally output by the circuit board assembly 2 to complete the current detection of the conductor 31 to be measured that is powered on.

[0040] Therefore, in the embodiment of the present application, a current sensor is provided, in which no magnetic core is arranged inside the current sensor, and the current detection of the conductor 31 to be measured after power is turned on is realized by fitting the conductor 31 to be measured with the outer surface of the housing 1. By improving the internal structure of the current sensor and the setting method of the conductor 31 to be measured, the volume of the current sensor is reduced without affecting the current detection result of the conductor 31 to be measured. For example, the current sensor provided in the embodiment of the present application has a simple structure, and the volume can be reduced by more than 40% compared with the existing current sensor.

[0041] In one embodiment, an opening 311 is formed on the conductor 31 to be tested.

[0042] In this embodiment, an opening 311 is formed on the conductor 31 to be measured, for example, a groove is formed on the conductor 31 to be measured to form the opening 311. After the opening 311 is formed on the conductor 31 to be measured, a structure similar to differential measurement is formed, so that when the current sensor detects the current of the conductor 31 to be measured that is energized, external interference is shielded to a certain extent, and a better measurement effect can be achieved without providing a magnetic core inside the current sensor.

[0043] In a specific embodiment, referring to Figure 3 Two openings 311 are formed on the conductor 31 to be measured, and the two openings 311 include a first opening 3111 and a second opening 3112. The opening 311 of the first opening 3111 and the opening 311 of the second opening 3112 are arranged in opposite directions, and the first opening 3111 and the second opening 3112 are arranged in a staggered manner. In this way, a structure similar to differential measurement is formed on the conductor 31 to be measured, which can better shield external interference. When a magnetic core is not arranged inside the current sensor, the current measurement accuracy can be improved.

[0044] In one embodiment, a recessed groove 111 is formed on the housing 1 , and the recessed groove 111 is configured to carry the conductor 31 to be tested.

[0045] In this embodiment, when the current of the conductor 31 to be measured is detected by the current sensor, the conductor 31 to be measured is set in the recessed groove 111, and the recessed groove 111 plays a limiting role for the conductor 31 to be measured, that is, the conductor 31 to be measured can be accurately positioned by the recessed groove 111, thereby avoiding the arbitrary setting position of the conductor 31 to be measured, which affects the normal detection of the current of the conductor 31 to be measured.

[0046] In one embodiment, the setting position of the recessed groove 111 corresponds to the setting position of the magnetic induction chip 22. For example, three magnetic induction chips 22 are set on the circuit board body 21, and correspondingly, three recessed grooves 111 are formed on the housing 1. When three recessed grooves 111 are formed on the housing 1, a conductor 31 to be measured is set in each recessed groove 111, and the current sensor can detect the current of the three conductors 31 to be measured.

[0047] In one embodiment, a signal terminal 13 is provided on the housing 1 , one end of the signal terminal 13 is electrically connected to the circuit board assembly 2 , and the other end of the signal terminal 13 is used to electrically connect to an external device 3 , and the external device 3 includes the conductor 31 to be tested.

[0048] In this embodiment, the housing 1 is provided with a signal terminal 13 , for example, the signal terminal 13 and the housing 1 may be integrally injection molded.

[0049] One end of the signal terminal 13 is electrically connected to the circuit board assembly 2. For example, the circuit board assembly 2 includes a circuit board body 21 and a magnetic induction chip 22. The magnetic induction chip 22 is electrically connected to the circuit board body 21, and the signal terminal 13 is electrically connected to the circuit board body 21. The other end of the signal terminal 13 is electrically connected to the external device 3. For example, the external device 3 is an inverter, and the magnetic induction chip 22 is electrically connected to the main control module of the inverter. It should be noted that the external device 3 includes but is not limited to an inverter. For example, the external device 3 can be any electronic device including a conductive copper busbar (the conductive copper busbar is the conductor 31 to be tested).

[0050] Specifically, when the current of the energized conductor 31 to be tested is detected by the current sensor, the conductor 31 to be tested is limited in the recessed groove 111, and the energized conductor 31 to be tested generates a magnetic field change. The magnetic induction chip 22 senses the magnetic field change and converts the magnetic field change into an electrical signal and transmits it to the circuit board body 21. Finally, the circuit board body 21 transmits the electrical signal to the main control module of the inverter to complete the current detection of the conductor 31 to be tested.

[0051] In one embodiment, referring to Figure 3The circuit board assembly 2 includes a circuit board body 21 and a magnetic induction chip 22. The circuit board body 21 is installed with three magnetic induction chips 22 and a number of capacitors and resistors (not shown in the figure) through the SMT process. The three magnetic induction chips 22 are horizontally arranged on the circuit board body 21. The circuit board body 21 can be set in the accommodating cavity of the shell 1 through positioning pins and connected to the signal terminal 13.

[0052] In one embodiment, referring to Figure 1-Figure 3 A first mounting seat 14 is provided on the housing 1 , and the conductor to be measured 31 is fastened to the first mounting seat 14 .

[0053] In this embodiment, refer to Figure 1-Figure 3 A first mounting seat 14 is provided on the shell 1. For example, the first mounting seat 14 and the shell 1 can be integrally injection molded.

[0054] When the conductor 31 to be measured fits with the outer surface of the housing 1, for example, the conductor 31 to be measured is limited in the recessed groove 111, and the conductor 31 to be measured fits with the outer surface of the housing 1, the conductor 31 to be measured is fastened to the first mounting seat 14. In a specific embodiment, a first mounting hole is provided on the conductor 31 to be measured, and a second mounting hole is provided on the first mounting seat 14. Fasteners such as bolts penetrate the first mounting hole and the second mounting hole, so that the conductor 31 to be measured is fastened to the first mounting seat 14.

[0055] In this embodiment, when the current of the energized conductor 31 is detected by the current sensor, the conductor 31 can be fixed by the first mounting seat 14 to avoid the conductor 31 being set at an arbitrary position and affecting the normal detection of the current of the conductor 31.

[0056] In one embodiment, when a recessed groove 111 is formed on the housing 1 , the arrangement position of the first mounting seat 14 corresponds to the formation position of the recessed groove 111 .

[0057] Specifically, when the recessed groove 111 is formed on the housing 1 , the conductor to be measured 31 is limited by the recessed groove 111 , so as to preliminarily limit the setting position of the conductor to be measured 31 .

[0058] For example, the conductor 31 to be measured is usually a conductive copper busbar or a straight conductor. In this embodiment, the setting position of the first mounting seat 14 and the formation position of the recessed groove 111 are defined in a one-to-one correspondence. In this way, after the conductor 31 to be measured is initially limited by the recessed groove 111, the conductor 31 to be measured and the first mounting seat 14 can be directly fastened together without bending the conductor 31 to be measured. The setting position of the conductor 31 to be measured is further fixed by the first mounting seat 14 to ensure the reliability of the conductor 31 to be measured being set on the outer surface of the shell 1.

[0059] In one embodiment, the conductor to be measured 31 is disposed on the external device 3 , and a second mounting seat 15 is further disposed on the housing 1 , and the current sensor is fastened to the external device 3 via the second mounting seat 15 .

[0060] In this embodiment, a second mounting base 15 is further provided on the housing 1, and the current sensor is fastened to the external device 3 through the second mounting base 15. For example, the external device 3 is an inverter, a mounting hole is reserved on the inverter, a through hole is provided on the second mounting base 15, and fasteners such as bolts penetrate the mounting hole and the through hole in sequence to connect the external device 3 and the current sensor together.

[0061] In one embodiment, the first mounting seat 14 , the second mounting seat 15 and the housing 1 are integrally formed.

[0062] In this embodiment, the first mounting seat 14 , the second mounting seat 15 and the housing 1 can be integrally injection molded, which simplifies the molding process of the first mounting seat 14 , the second mounting seat 15 and the housing 1 .

[0063] In an optional embodiment, the current sensor provided in the embodiment of the present application is compatible with the interface of a traditional magnetic core sensor and is easy to be applied in industry.

[0064] The second aspect of the embodiment of the present application further provides an electronic device. The electronic device includes the current sensor as described in the first aspect. For example, the electronic device may be a motor controller of a new energy vehicle.

[0065] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0066] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are only for illustration, not for limiting the scope of the present application. It should be understood by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A current sensor, characterized in that: include: A housing (1), wherein a receiving cavity is formed inside the housing (1), and an outer surface of the housing (1) is configured to fit with a conductor (31) to be measured; A circuit board assembly (2), the circuit board assembly (2) being arranged in the accommodating cavity, the circuit board assembly (2) comprising a magnetic induction chip (22), the magnetic induction chip (22) being used to transmit the magnetic field change of the conductor (31) to be measured to the circuit board assembly (2).

2. The current sensor according to claim 1, characterized in that: An opening is formed on the conductor (31) to be measured.

3. The current sensor according to claim 1, characterized in that: A recessed groove (111) is formed on the housing (1), and the recessed groove (111) is configured to carry the conductor (31) to be tested.

4. The current sensor according to claim 3, characterized in that: The arrangement position of the recessed groove (111) corresponds to the arrangement position of the magnetic induction chip (22).

5. The current sensor according to claim 1, characterized in that: The housing (1) is provided with a signal terminal (13), one end of the signal terminal (13) is electrically connected to the circuit board assembly (2), and the other end of the signal terminal (13) is used to electrically connect to an external device (3), wherein the external device (3) includes the conductor to be tested (31).

6. The current sensor according to any one of claims 1 to 5, characterized in that: The housing (1) is provided with a first mounting seat (14), and the conductor to be measured (31) is fastened to the first mounting seat (14).

7. The current sensor according to claim 6, characterized in that: When a recessed groove (111) is formed on the housing (1), the arrangement position of the first mounting seat (14) corresponds to the formation position of the recessed groove (111).

8. The current sensor according to claim 6, characterized in that: The conductor to be measured (31) is arranged on the external device (3), and a second mounting seat (15) is also arranged on the housing (1), and the current sensor is fastened to the external device (3) via the second mounting seat (15).

9. The current sensor according to claim 8, characterized in that: The first mounting seat (14), the second mounting seat (15) and the housing (1) are integrally formed.

10. An electronic device, characterized in that: The electronic device comprises the current sensor according to any one of claims 1-9.

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