Heat dissipation device, light source controller and camera system

Abstract

The utility model discloses a heat dissipation device, a light source controller and a camera system, and relates to the field of radiators, the heat dissipation device comprises an air cooling radiator and a refrigeration assembly, the refrigeration assembly comprises a thermoelectric refrigerator, and the refrigeration assembly further comprises a condensate water absorption part; an opening is formed in the condensate water absorbing part, the thermoelectric refrigerating unit is arranged in the opening, and the surface of the cold end of the refrigerating assembly faces the outer side of the opening; a mounting hole communicated with an inner cavity of the air-cooled radiator is formed in a shell of the air-cooled radiator, and the condensate water absorbing part is arranged on the mounting hole. The heat dissipation device not only obviously delays formation of condensate water, but also efficiently collects and treats the generated condensate water, thereby preventing potential pollution of water drops to equipment, and ensuring stable operation and long-term performance of the equipment.

Description

Technical Field

[0001] The utility model relates to the technical field of radiators, and in particular to a heat dissipation device, a light source controller using the heat dissipation device, and a camera system using the light source controller. Background Art

[0002] In high-power devices, such as light source controllers and cameras, electronic devices usually require efficient heat dissipation solutions to maintain optimal operation. These devices often use thermoelectric coolers (also known as heat dissipation devices made of thermo-electric effect, which utilize the Peltier effect) for cooling and heat dissipation.

[0003] The working principle of a thermoelectric cooler is that when two different metals are connected by a conductor and direct current is passed through, the temperature of one side will decrease, forming a cold surface, while the temperature of the other side will increase, forming a hot surface. However, when the temperature of the cold surface of the thermoelectric cooler is about 10°C lower than the ambient temperature, the water vapor in the air will be cooled and liquefied, thus producing condensed water.

[0004] The generation of this condensation is a serious threat to electronic devices. If the condensation flows into the interior of the device, it may cause problems such as rust, short circuits and contamination, seriously affecting the performance and life of the device.

[0005] Therefore, when using a thermoelectric cooler for cooling and heat dissipation, how to reduce the generation of condensed water on the cold surface and effectively collect and treat the condensed water on the cold surface is an urgent problem that technicians in this field need to solve. Utility Model Content

[0006] The utility model aims to solve one of the technical problems in the related art to a certain extent. To this end, the utility model provides a heat dissipation device, a light source controller and a camera system, which significantly delay the formation of condensed water, efficiently collect and process the generated condensed water, thereby preventing potential contamination of the equipment by water droplets and ensuring the stable operation and long-term performance of the equipment.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A heat dissipation device comprises an air-cooled heat sink and a refrigeration assembly, wherein the refrigeration assembly comprises a thermoelectric cooler, and the refrigeration assembly further comprises a condensed water absorber; the condensed water absorber is formed with an opening, the thermoelectric cooler is arranged in the opening, and the surface of the cold end of the refrigeration assembly faces the outside of the opening;

[0009] A mounting hole communicating with the inner cavity of the air-cooled radiator is formed on the shell of the air-cooled radiator, and the condensed water absorber is arranged on the mounting hole.

[0010] In the above solution, there is a mounting hole on the shell of the air-cooled radiator, and the hole is connected to the inner cavity of the air-cooled radiator. The condensed water absorber is placed on the mounting hole, so that when condensed water is generated, it can be collected by the absorber and dried by the warm air in the inner cavity of the air-cooled radiator through the mounting hole, thereby avoiding potential damage to the equipment caused by condensed water.

[0011] Optionally, the refrigeration component includes a thermoelectric cooler and a heat conducting plate; the heat conducting plate is arranged on a refrigeration surface of the thermoelectric cooler, and a surface of the heat conducting plate facing away from the refrigeration surface forms a surface of a cold end of the refrigeration component.

[0012] Optionally, the condensation water absorber includes a sleeve body and at least one step portion arranged on the inner surface of the sleeve body; the opening is located on the sleeve body, the step portion is spaced apart from the opening, the heat conducting plate is arranged in the sleeve body and between the step portion and the opening, and a portion of the heat conducting plate is arranged on the step portion; the thermoelectric cooler is arranged in a limited space on the condensation water absorber corresponding to the step portion.

[0013] Optionally, the sleeve body includes two opposite first side walls and two opposite second side walls, the two first side walls are located between the two second side walls and respectively connect the two second side walls; and the step portion is arranged on the inner surface of the first side wall.

[0014] Optionally, the condensation water absorber includes two opposite step portions respectively arranged on the inner surfaces of the two first side walls.

[0015] Optionally, the outer surface of the sleeve body is in contact with the inner surface of the mounting hole.

[0016] Optionally, the refrigeration assembly further includes a vapor chamber, which is disposed on a side of the thermoelectric cooler away from the heat conducting plate; and the vapor chamber is at least partially located in an opening of the condensed water absorber.

[0017] Optionally, the distance between the refrigeration component and the first shell wall of the shell of the air-cooled radiator is greater than the distance between the refrigeration component and the second shell wall of the shell of the air-cooled radiator, the first shell wall and the second shell wall are arranged opposite to each other, and one side edge of the heat spreader protrudes from the thermoelectric cooler and the protruding side is close to the second shell wall.

[0018] Optionally, the vapor chamber includes a hole interior and a hole exterior that are connected, the hole interior is located inside the mounting hole, the hole exterior is located outside the mounting hole, a gap is formed between a side wall of the hole interior and an inner wall of the mounting hole, and a portion of the condensed water absorber is disposed in the gap;

[0019] The outer portion of the hole is in contact with the surface of the housing of the air-cooled radiator in the area outside the mounting hole;

[0020] The condensation water absorber is provided with an avoidance gap at one end facing the mounting hole, and the connection between the inside of the hole and the outside of the hole is in contact with the surface of the avoidance gap.

[0021] Optionally, a heat conducting medium is provided between the thermoelectric cooler and the heat conducting plate, and / or a heat conducting medium is provided between the thermoelectric cooler and the heat spreader.

[0022] Optionally, the condensation water absorber includes any one of a water-absorbing sponge, a porous metal, a microporous ceramic, and a porous membrane.

[0023] Optionally, the air-cooled radiator includes a housing, a cooling fan and a plurality of cooling fins;

[0024] The shell includes a first shell wall and a second shell wall arranged opposite to each other, and a connecting plate respectively connecting the first shell wall and the second shell wall at both ends; the multiple heat dissipation fins are located between the first shell wall and the second shell wall and the multiple heat dissipation fins are spaced to form an air duct, and the heat dissipation fan is arranged at one end of the air duct; the mounting hole is arranged on the connecting plate.

[0025] Optionally, one end of the condensed water absorber passes through the mounting hole and abuts against the plurality of heat dissipation fins.

[0026] In addition, the utility model also provides a light source controller in the second aspect, including a shell, a laser generator, a driving board electrically connected to the laser generator and the heat dissipation device, wherein the air-cooled radiator is arranged on the inner wall of the shell; the refrigeration component is located on the shell opposite to the air-cooled radiator and the inner wall of the shell, and the surface of the cold end of the refrigeration component is in contact with the laser generator.

[0027] Optionally, the light source controller also includes an optical fiber assembly; the housing includes a display operation panel assembly, an outlet panel opposite to the display operation panel assembly, and a bottom plate and an upper cover located between the display operation panel assembly and the outlet panel; an optical fiber outlet is provided on the outlet panel, one end of the optical fiber assembly is connected to the laser generator, and the other end of the optical fiber assembly passes through the optical fiber outlet.

[0028] Optionally, the shell is provided with a ventilation opening and a ventilation fan arranged at the ventilation opening.

[0029] Furthermore, the utility model further provides a camera system in a third aspect, comprising a camera and a light source controller as described in the second aspect, wherein the light source controller provides a light source to the camera via an optical fiber component.

[0030] These features and advantages of the utility model will be disclosed in detail in the following specific embodiments and drawings. The best implementation or means of the utility model will be fully presented in conjunction with the drawings, but it is not a limitation of the technical solution of the utility model. In addition, these features, elements and components appearing in each of the following texts and drawings are multiple, and are marked with different symbols or numbers for convenience, but all represent components with the same or similar structure or function. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The utility model is further described below in conjunction with the accompanying drawings:

[0032] Figure 1 Detailed description of the invention Figure 2 is an exploded view of the heat dissipation device in some embodiments.

[0033] Figure 2 It is a cross-sectional view of the heat dissipation device in some embodiments along the extension direction of the heat dissipation fins.

[0034] Figure 3 It is a cross-sectional view of the heat dissipation device in some embodiments, perpendicular to the extension direction of the heat dissipation fins.

[0035] Figure 4a and Figure 4b They are schematic diagrams of the structure of the condensation water absorber at different viewing angles in some embodiments.

[0036] Figure 5 Schematic diagram of the structure of the air-cooled radiator housing in some embodiments.

[0037] Figure 6 for Figure 1 Enlarged view of point A in the middle.

[0038] Figure 7 Schematic diagram of the structure of the light source controller in some embodiments.

[0039] Among them, 10, refrigeration component; 100, heat conduction plate; 200, thermoelectric cooler; 300, heat spreader; 310, inside of the hole; 320, outside of the hole; 400, condensation water absorber; 410, sleeve body; 411, avoidance gap; 420, step portion; 20, air-cooled radiator; 21, shell; 22, first shell wall; 23, second shell wall; 24, connecting plate; 25, mounting hole; 25a, extension portion; 26, cooling fan; 27, cooling fins; 31, shell; 32, display operation panel assembly; 33, outlet panel; 34, bottom plate; 35, upper cover; 36, optical fiber outlet; 37, vent; 38, ventilation fan; 39, laser generator; 40, drive board; 41, optical fiber assembly. DETAILED DESCRIPTION

[0040] The following is a detailed description of embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments in the implementation manner are intended to be used to explain the present invention and should not be construed as limiting the present invention.

[0041] References to "one embodiment" or "an example" or "an example" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment itself may be included in at least one embodiment disclosed in the present utility model. The appearance of the phrase "in one embodiment" in various places in the specification does not necessarily refer to the same embodiment.

[0042] In order to deal with the problem of condensed water generated on the cold surface of the thermoelectric cooler, several solutions have been proposed in the industry. One of the methods is to use sealed isolation, which involves enclosing the thermoelectric cooler and the module to be cooled, the heat spreader and its connecting cables in a highly protected sealed cavity to meet the IP68 protection level. To prevent the intrusion of water vapor, assembly must be carried out in a vacuum box or a dry environment, and a desiccant must be placed in the cavity to absorb moisture. Although this method can effectively isolate moisture, it also brings design and cost challenges, including complex design, high cost, and inefficient assembly process.

[0043] Another method is to use software control, using a temperature sensor to monitor the difference between the cold surface of the thermoelectric cooler and the ambient temperature, and automatically shut down the device through background logic when the temperature difference is too large to prevent condensation. Although this method is direct, it has potential failure risks and will directly interrupt the operation of the device when it overheats, which not only affects the performance of the device, but may also lead to waste of resources and affect the user experience.

[0044] In view of these limitations of existing solutions, the present solution provides a heat dissipation device in a first aspect.

[0045] like Figure 1 , Figure 2 and Figure 3 As shown, the heat dissipation device includes an air-cooled heat sink 20 and a refrigeration component 10. The refrigeration component 10 includes a thermoelectric refrigerator 200 and a condensed water absorber 400. The condensed water absorber 400 is formed with an opening, and the thermoelectric refrigerator 200 is arranged in the opening, which can completely wrap around the cold surface of the thermoelectric refrigerator 200 to avoid direct contact with the outside air, and only make the surface of the cold end of the refrigeration component 10 face the outside of the opening, so as to closely fit with the heat source for heat exchange and realize efficient heat dissipation function. The shell 21 of the air-cooled heat sink 20 is formed with a mounting hole 25 connected to the inner cavity of the air-cooled heat sink 20, and the condensed water absorber 400 is arranged on the mounting hole 25.

[0046] The surface and interior of the condensed water absorber 400 both have microporous structures, which can effectively delay the water vapor in the outside air from contacting the cold surface of the thermoelectric cooler 200 .

[0047] In addition, the microporous structure also has storage capacity. Water vapor passes through the micropores and condenses into liquid water in the low temperature area. These micropores can also effectively store it to prevent the condensed water from overflowing. When the diameter of the micropores is small enough, they can also produce capillary action to effectively transport the condensed water to other areas of the absorbent, so that the moisture is evenly distributed and the removal of water is accelerated by increasing the evaporation area. In particular, since the condensed water absorbent 400 is located on the mounting hole 25 connected to the inner cavity of the air-cooled radiator 20, the warm air flow generated by the air-cooled radiator 20 when it is working can dry the condensed water absorbent 400 through the mounting hole and quickly take away the water vapor generated by the evaporation of the condensed water.

[0048] The heat dissipation device has a simple structure, low cost, and is easy to process and manufacture. It significantly delays the formation of condensed water, while efficiently collecting and processing the generated condensed water, avoiding possible contamination of the equipment by water droplets, thereby ensuring the stable operation and long-term performance of the equipment.

[0049] In some embodiments, Figure 1 , Figure 2 and Figure 3 As shown, the refrigeration component 10 includes a thermoelectric cooler 200 and a heat conductive plate 100. The thermoelectric cooler has a cooling surface and a heating surface that are relatively arranged. The heat conductive plate 100 is arranged on the cooling surface of the thermoelectric cooler 200, and the surface of the heat conductive plate 100 that is away from the cooling surface forms the surface of the cold end of the refrigeration component 10. The heat conductive plate 100 has excellent thermal conductivity, and copper is usually selected as the material because the copper heat conductive plate 100 has extremely high thermal conductivity. The size and thickness of the heat conductive plate 100 are carefully designed to meet the heat dissipation requirements of heat sources of different sizes. Its design principle ensures that heat can be effectively absorbed and transferred to meet the performance requirements in various heat dissipation scenarios.

[0050] In some embodiments, Figure 1 , Figure 2 , Figure 4a and Figure 4b As shown, the condensed water absorber 400 includes a sleeve body 410 and at least one step 420 disposed on the inner surface of the sleeve body 410. For example, when the heat conducting plate 100 and the thermoelectric cooler 200 are circular, the step 420 in the sleeve body 410 is annular.

[0051] The opening is located on the sleeve body 410, and the step portion 420 is spaced from the opening. The heat conducting plate 100 is disposed in the sleeve body 410 and between the step portion 420 and the opening, and a portion of the heat conducting plate 100 is disposed on the step portion 420. The thermoelectric cooler 200 is disposed in a limited space on the condensed water absorber 400 corresponding to the step portion 420.

[0052] In order to match the shape and size of the heat conducting plate 100 and the thermoelectric cooler 200, the opening of the sleeve body 410 is precisely designed to ensure that the heat conducting plate 100 can be relatively accurately embedded therein, to achieve seamless connection, and to prevent the generation of large gaps. The setting of the step portion 420 not only ensures a close fit with the edge of the heat conducting plate 100, but also, in some cases, considering that the condensation water absorber 400 may be made of a deformable material, such as a water-absorbing sponge, the height of the step portion 420 is also designed to exceed the thickness of the thermoelectric cooler 200. Such a height difference leaves room for the deformation of the material. When the heat conducting plate 100 is close to the thermoelectric cooler 200, the step portion 420 can be appropriately compressed to enhance the connection strength of the contact surface and further ensure a close fit between the structures.

[0053] In some embodiments, Figure 4a and Figure 4b As shown, the sleeve body 410 includes two opposite first side walls and two opposite second side walls, the two first side walls are located between the two second side walls and respectively connect the two second side walls. The step portion 420 is provided on the inner surface of the first side wall.

[0054] In some embodiments, Figure 4a and Figure 4b As shown, a condensed water absorber 400 designed for a rectangular heat conducting plate 100 and a thermoelectric cooler 200 is shown. The absorber includes two opposite step portions 420, which are respectively arranged on the inner surfaces of the two first side walls. This design ensures a perfect fit with the rectangular heat conducting plate 100 and the thermoelectric cooler 200, thereby providing a precise and stable supporting surface, and optimizing the heat transfer efficiency and sealing of the entire heat dissipation device.

[0055] In some embodiments, Figure 2 As shown, the outer surface of the sleeve body 410 fits tightly with the inner surface of the mounting hole 25. This delicate docking relationship ensures the continuity and sealing of the entire structure, allowing the heat dissipation device to effectively collect condensed water during operation while preventing external pollutants and moisture from invading, thereby protecting the device from potential damage.

[0056] In some embodiments, Figure 3As shown, the distance between the refrigeration assembly 10 and the first shell wall 22 of the shell 21 of the air-cooled radiator 20 is greater than the distance between the refrigeration assembly 10 and the second shell wall 23 of the shell 21 of the air-cooled radiator 20. The first and second shell walls 23 are arranged opposite to each other, indicating that the refrigeration assembly 10 is not placed in the center of the shell 21 of the air-cooled radiator 20, but is closer to the side of the second shell wall 23. In order to adapt to this asymmetric design, the position of the mounting hole 25 on the shell 21 of the air-cooled radiator 20 is also adjusted accordingly.

[0057] The refrigeration assembly 10 further includes a heat spreader 300, which is disposed on a side of the thermoelectric cooler 200 away from the heat conducting plate 100, and one edge of the heat spreader 300 protrudes from the thermoelectric cooler 200 and the protruding side is close to the second shell wall 23, that is, the protruding portion of the edge of the heat spreader 300 extends from the mounting hole to the second shell wall 23, so as to conduct heat as evenly as possible to the area between the first shell wall 22 and the second shell wall 23 of the shell 21 of the air-cooled radiator 20. Similarly, the heat spreader 300 can be made of a material with a high thermal conductivity, such as a copper heat spreader 300.

[0058] In some embodiments, according to Figure 1 and Figure 6 As shown, the heat sink 300 consists of two parts: an inner hole 310 and an outer hole 320. The inner hole 310 is located in the mounting hole 25, and the outer hole 320 extends outside the mounting hole 25. Structurally, the side wall of the inner hole 310 maintains a certain interval with the inner wall of the mounting hole 25, and a part of the condensed water absorber 400 is arranged in this interval.

[0059] In order to evenly distribute heat and improve heat dissipation efficiency, the outer portion 320 of the hole is designed to closely match the surface of the area outside the mounting hole 25 of the housing 21 of the air-cooled heat sink 20 .

[0060] In addition, the condensation water absorber 400 is provided with an escape notch 411 at one end near the mounting hole 25. The escape notch 411 enables the connection between the hole interior 310 and the hole exterior 320 to fit closely with the surface thereof, and such a setting is intended to ensure the continuity of the structure and the optimization of the heat exchange effect.

[0061] In some embodiments, in order to fix the vapor chamber 300, an extension portion 25a is extended from the inner wall of the housing near the second housing wall in the mounting opening, and the extension portion 25a extends toward the first housing wall. The extension portion is integrally formed with the housing to provide a support surface for the vapor chamber. Most of the extension portion is located within the coverage area of ​​the vapor chamber to reduce the occupation of the mounting hole.

[0062] In some embodiments, the hole outer portion 320 can be fastened to the air-cooled heat sink 20 housing 21 by fasteners, and the heat conducting plate 100 can be fixed to the hole inner portion 310 by fasteners, while pressing the thermoelectric cooler 200. Further, the fasteners can also be provided on the extension portion 25a.

[0063] In addition, in some embodiments, the refrigeration component 10 can also be arranged in a central manner on the air-cooled radiator 20, that is, the mounting hole 25 is arranged in the center of the connecting plate 24, the heat spreader 300 is arranged in the middle of the mounting hole, and the surrounding of the heat spreader and the inner wall of the mounting hole form a circular distribution interval, which can be one continuous interval or multiple discontinuous intervals, and the condensed water absorber 400 is arranged in the interval and fills the interval. The heat spreader is fixed to the fin, or connected to the area outside the mounting hole through the connecting section between multiple discontinuous intervals. The arrangement of the refrigeration component 10 on the air-cooled radiator 20 can be flexibly arranged by those skilled in the art according to the situation without limitation.

[0064] In some embodiments, in order to improve the efficiency of heat conduction, a heat conducting medium may be provided between the thermoelectric cooler 200 and the heat conducting plate 100, and / or between the thermoelectric cooler 200 and the heat spreader 300, and / or between the hole exterior 320 of the heat spreader 300 and the surface of the housing 21 of the air-cooled heat sink 20. These heat conducting media may be materials with high thermal conductivity, such as thermal paste, thermal grease, thermal pads or other types of thermal interface materials, which function to fill tiny uneven surfaces, thereby reducing air gaps and improving the efficiency of heat transfer. In practical applications, the selection of a suitable heat conducting medium must take into account factors such as compatibility, temperature resistance, thermal conductivity, and long-term stability to ensure that the heat dissipation system can operate reliably.

[0065] In some embodiments, the condensation absorber 400 may be composed of one or more materials, including absorbent sponges, porous metals, microporous ceramics, and porous membranes. These materials all have the ability to absorb and store water, thereby effectively managing condensation caused by temperature differences during the heat dissipation process. The absorbent sponge can absorb and retain water through capillary action. In terms of material selection, polyurethane (PU) or polyvinyl alcohol (PVA) can be used as the raw materials for making sponges. These materials have good water absorption and water storage capabilities. Porous metals combine good thermal conductivity and moisture management capabilities; microporous ceramics are known for their tiny and interconnected pore structures that can absorb and store moisture; and porous membranes usually have selective water vapor permeability, which can effectively separate and manage water vapor. The choice of material depends on the specific heat dissipation requirements, cost-effectiveness, and application environment to ensure that the performance and reliability of the heat dissipation device are optimized.

[0066] In some embodiments, Figure 1 and Figure 5 As shown, the air-cooled heat sink 20 is composed of multiple components: a housing 21 , at least one heat dissipation fan 26 and multiple heat dissipation fins 27 .

[0067] The structure of the housing 21 is composed of a first housing wall 22 and a second housing wall 23 which are arranged opposite to each other, and the two are connected by a connecting plate 24. The first housing wall 22 and the second housing wall 23 are erected in parallel on the bottom wall of the device, for example, on the bottom plate 34 of the housing of the light source controller. The connecting plate 24 is opposite to the bottom wall of the device, and both are arranged horizontally.

[0068] These heat dissipation fins 27 are arranged between the first and second shell walls 23, and are spaced apart from each other to form an air duct for air circulation, thereby enhancing the heat dissipation effect. The heat dissipation fan 26 is placed at one end of these air ducts, and its function is to drive the air flow and accelerate the heat transfer process. In addition, the mounting hole 25 is provided on the connecting plate 24 for fixing and connecting other components. The connecting plate 24 of the air-cooled radiator 20 is designed to be placed horizontally so that the bottom of the condensation water absorber 400 is exposed at the bottom of the mounting hole 25 and acts as a wind-receiving surface. The condensation water absorber 400 has a cavity structure for accommodating components such as the thermoelectric cooler 200, the heat conducting plate 100 and the heat source, and condensation water is easily generated on the surface of these components during operation. In order to ensure effective contact and fixation of these components, the condensation water absorber 400 is tightly pressed.

[0069] When the thermoelectric cooler 200 is running and cooling, if its surface temperature is 10 degrees or more lower than the surrounding environment, condensed water may form on its surface. At this time, the upper step surface and the surrounding side walls of the condensed water absorber 400 will absorb this water through capillary action, and gradually guide the water to the bottom of the absorber by gravity. At the same time, the operation of the radiator fan causes air to be blown to the bottom of the condensed water absorber 400. Such wind flow can promote the evaporation of water in the water-absorbing sponge, thereby effectively achieving the effect of dehumidification and keeping dry.

[0070] In some embodiments, one end of the condensation absorber 400 passes through the mounting hole 25 and directly contacts the heat dissipation fin 27. This design enables the condensation absorber 400 to fit closely on the heat dissipation fin 27, effectively absorbing and managing the condensation generated by the temperature difference, and preventing it from accumulating and possibly causing adverse effects on the device.

[0071] In addition, in the second aspect, the present invention also proposes a light source controller, such as Figure 1 and Figure 7As shown, the light source controller includes a housing 31, at least one laser generator 39, a driving board 40 electrically connected to the laser generator 39, and the heat dissipation device as described above. The air-cooled radiator 20 is arranged on the inner wall of the housing 31, specifically, on the bottom wall of the housing 31, and the refrigeration component 10 is located on the shell 21 opposite to the inner wall of the air-cooled radiator 20 and the housing 31, that is, the refrigeration component 10 and the inner wall of the housing 31 are respectively on two opposite end surfaces of the air-cooled radiator 20. The cold end of the refrigeration component 10 is tightly fitted with the heat exchange surface of the laser generator 39 so as to effectively extract heat from the laser generator 39.

[0072] In some embodiments, the light source controller further includes an optical fiber assembly 41; the housing 31 includes a display operation panel assembly 32, an outlet panel 33 opposite to the display operation panel assembly 32, a bottom plate 34 and an upper cover 35 located between the display operation panel assembly 32 and the outlet panel 33, the upper cover 35 having three faces, which is connected with the bottom plate 34 to form a rectangular cylindrical structure, wherein the display operation panel assembly 32 and the outlet panel 33 are respectively located at the tube mouth positions at both ends of the cylindrical structure. A special optical fiber outlet 36 is provided on the outlet panel 33, which is used to guide one end of the optical fiber assembly 41 to establish a connection with the laser generator 39, and allows the other end of the optical fiber assembly 41 to extend to the outside of the housing 31 through the optical fiber outlet 36, so as to transmit the light source.

[0073] In some embodiments, the design of the housing 31 further considers the improvement of heat dissipation efficiency, and therefore includes a vent 37, and a ventilation fan 38 is installed at the vent 37. Specifically, the vent 37 is provided on the upper cover 35, and is located close to one side of the display operation panel assembly 32. The function of the ventilation fan 38 is to blow air into the housing 31, or to discharge the hot air inside through the vent 37, so as to promote the internal air circulation.

[0074] In addition, the present invention also provides a camera system in a third aspect, such as a linear array camera system and a planar array camera system, which is mainly composed of two parts: one is the camera itself, and the other is a light source controller as described in detail in the second aspect. The light source controller provides the camera with the necessary light source through its built-in optical fiber assembly 41 to ensure that the camera has uniform and stable lighting support during the image capture process.

[0075] In addition, since the light source controller integrates the heat dissipation device mentioned in the first aspect, it has efficient thermal management functions and can maintain the stability of the device under different operating environments. This design significantly improves the reliability and performance of the camera system in long-term operation or changing environments, ensuring high efficiency and high precision of the image capture process, thereby adapting to diverse application requirements.

[0076] The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Those skilled in the art should understand that the present invention includes but is not limited to the contents described in the drawings and the above specific embodiments. Any modification that does not deviate from the functional and structural principles of the present invention shall be included in the scope of the claims.

Claims

1. A heat dissipation device, comprising an air-cooled heat sink and a refrigeration component, wherein the refrigeration component comprises a thermoelectric cooler, characterized in that: The refrigeration assembly further includes a condensed water absorbing member; the condensed water absorbing member is formed with an opening, the thermoelectric cooler is arranged in the opening, and the surface of the cold end of the refrigeration assembly faces the outside of the opening; A mounting hole communicating with the inner cavity of the air-cooled radiator is formed on the shell of the air-cooled radiator, and the condensed water absorber is arranged on the mounting hole.

2. The heat dissipation device according to claim 1, characterized in that: The refrigeration component includes a thermoelectric cooler and a heat conducting plate; the heat conducting plate is arranged on a refrigeration surface of the thermoelectric cooler, and a surface of the heat conducting plate away from the refrigeration surface forms a surface of a cold end of the refrigeration component.

3. The heat dissipation device according to claim 2, characterized in that: The condensation water absorber includes a sleeve body and at least one step portion arranged on the inner surface of the sleeve body; the opening is located on the sleeve body, the step portion is spaced apart from the opening, the heat conducting plate is arranged in the sleeve body and between the step portion and the opening, and a portion of the heat conducting plate is arranged on the step portion; the thermoelectric cooler is arranged in a limited space on the condensation water absorber corresponding to the step portion.

4. The heat dissipation device according to claim 3, characterized in that: The sleeve body comprises two opposite first side walls and two opposite second side walls, the two first side walls are located between the two second side walls and respectively connect the two second side walls; the step portion is arranged on the inner surface of the first side wall.

5. The heat dissipation device according to claim 4, characterized in that: The condensation water absorber includes two opposite step portions respectively provided on inner surfaces of the two first side walls.

6. The heat dissipation device according to claim 3, characterized in that: The outer surface of the sleeve body is in contact with the inner surface of the mounting hole.

7. The heat dissipation device according to claim 2, characterized in that: The refrigeration assembly further includes a vapor chamber, which is disposed on a side of the thermoelectric cooler away from the heat conducting plate, and at least a portion of the vapor chamber is located in an opening of the condensed water absorber.

8. The heat dissipation device according to claim 7, characterized in that: The distance between the refrigeration component and the first shell wall of the shell of the air-cooled radiator is greater than the distance between the refrigeration component and the second shell wall of the shell of the air-cooled radiator, the first shell wall and the second shell wall are arranged opposite to each other, and one side edge of the heat spreader protrudes from the thermoelectric cooler and the protruding side is close to the second shell wall.

9. The heat dissipation device according to claim 8, characterized in that: The vapor chamber comprises a hole inner portion and a hole outer portion connected to each other, the hole inner portion is located inside the mounting hole, the hole outer portion is located outside the mounting hole, a gap is formed between a side wall of the hole inner portion and an inner wall of the mounting hole, and a portion of the condensed water absorber is disposed in the gap; The outer portion of the hole is in contact with the surface of the housing of the air-cooled radiator in the area outside the mounting hole; The condensation water absorber is provided with an avoidance gap at one end facing the mounting hole, and the connection between the inside of the hole and the outside of the hole is in contact with the surface of the avoidance gap.

10. The heat dissipation device according to claim 7, characterized in that: A heat conducting medium is arranged between the thermoelectric cooler and the heat conducting plate, and / or a heat conducting medium is arranged between the thermoelectric cooler and the heat spreader.

11. The heat dissipation device according to claim 1, characterized in that: The condensed water absorber includes any one of a water-absorbing sponge, a porous metal, a microporous ceramic, and a porous membrane.

12. The heat dissipation device according to claim 1, characterized in that: The air-cooled radiator comprises a housing, a cooling fan and a plurality of cooling fins; The shell includes a first shell wall and a second shell wall arranged opposite to each other, and a connecting plate respectively connecting the first shell wall and the second shell wall at both ends; the multiple heat dissipation fins are located between the first shell wall and the second shell wall and the multiple heat dissipation fins are spaced to form an air duct, and the heat dissipation fan is arranged at one end of the air duct; the mounting hole is arranged on the connecting plate.

13. The heat dissipation device according to claim 12, characterized in that: One end of the condensed water absorber passes through the mounting hole and abuts against the plurality of heat dissipation fins.

14. A light source controller, comprising a housing, a laser generator, a driving board electrically connected to the laser generator, and a heat sink as claimed in any one of claims 1 to 13, characterized in that: The air-cooled radiator is arranged on the inner wall of the shell; the refrigeration component is located on the shell body opposite to the air-cooled radiator and the inner wall of the shell, and the surface of the cold end of the refrigeration component is in contact with the laser generator.

15. The light source controller according to claim 14, characterized in that: The light source controller also includes an optical fiber assembly; the housing includes a display operation panel assembly, an outlet panel opposite to the display operation panel assembly, a bottom plate and an upper cover located between the display operation panel assembly and the outlet panel; an optical fiber outlet is provided on the outlet panel, one end of the optical fiber assembly is connected to the laser generator, and the other end of the optical fiber assembly passes through the optical fiber outlet.

16. The light source controller according to claim 14 or 15, characterized in that: The shell is provided with a ventilating opening and a ventilation fan arranged at the ventilating opening.

17. A camera system, comprising a camera and a light source controller as claimed in any one of claims 14 to 16, characterized in that: The light source controller provides light source to the camera through an optical fiber assembly.

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