Heat dissipation system of chip testing machine
By using a combined system of heat dissipation base, reverse gravity heat pipe and heat dissipation fins in the chip test machine, the problem of difficulty in heat dissipation of high-power CPU is solved, efficient heat dissipation and space savings are achieved, and equipment stability and testing performance are improved.
Patent Information
- Application Number
- CN202421354597.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-13
AI Technical Summary
The cooling system of existing chip test machines is difficult to effectively dissipate heat when facing high-power CPUs, resulting in poor equipment stability and excessive design height, affecting test performance and equipment stability.
The heat dissipation system is adopted that includes a heat dissipation base, an inverse gravity heat pipe and a heat dissipation fin. The heat from the CPU is transferred to the inverse gravity heat pipe through the heat dissipation base, and then transmitted to the heat dissipation fin through the inverse gravity heat pipe for heat dissipation, achieving efficient heat transfer and space saving.
It realizes efficient heat dissipation, reduces the design height of the equipment, improves the stability and test performance of the equipment, and saves costs and space.
Smart Images
Figure CN222600174U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of memory chip testing, and in particular relates to a heat dissipation system of a chip testing machine. Background Art
[0002] In the memory chip testing industry, when testing products, on the one hand, it is necessary to control the high and low temperatures of the tested products. The accuracy and uniformity of temperature control directly affect the performance and results of the test. On the other hand, it is necessary to control the heat dissipation and temperature of the hardware systems such as the test motherboard that provide support. It is the guarantee for the stable operation of the entire test system and an important factor affecting the performance of the test. In the hardware system of the test machine, the CPU is the main one that needs heat dissipation and temperature control. Generally, standard CPU air cooling or water cooling devices are selected to meet the temperature control and heat dissipation requirements of the system. Now, as the power consumption of CPUs is getting higher and higher, the performance of the matching radiators is also required to be higher and higher.
[0003] Large-scale testing of memory chips usually involves mounting a tester on a handler to load and unload, press, and test the memory chips. The coordination between the transport and pressing mechanisms on the handler and the tester directly affects the stability and status of the equipment.
[0004] The cooling system designed in some chip testers, on the one hand, meets the needs of hardware design without changing the optimal placement of parts (Note: a tester is usually composed of several groups of test motherboards to achieve more DUT tests). Several DUT test positions are set at one end of the TOP surface of the test motherboard, and a CPU that needs heat dissipation is set on one side. The CPU has a large power consumption and requires good heat dissipation to ensure its normal operation.
[0005] On the other hand, the Handler handling and pressing mechanism that needs to be coordinated is shown, and space is reserved. When testing, the handling mechanism is first required to suck the chip from the tray to the test DUT position, and then the pressing mechanism is moved to the top of the DUT test position for pressing, and the test particles are heated and pressurized for testing. In this process, the supporting parts on the upper surface of the test board need to be thinner and flatter to leave space for the handling mechanism and the pressing mechanism. The general solution is to set a heat sink on the CPU, and then install an air duct to dissipate the heat of the heat sink. However, as the power consumption of the CPU increases, the physical dimensions of the heat sink are limited in length and width, and the physical height needs to be higher and higher. This will increase the avoidance height and stroke of the nozzle mechanism and the pressing mechanism. The larger the required avoidance and stroke, the greater the inertia of the mechanism and the worse the stability. Utility Model Content
[0006] The utility model aims to provide a heat dissipation system for a chip tester, so as to solve the above problems existing in the prior art.
[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0008] A chip tester heat dissipation system comprises a heat dissipation base, a counter-gravity heat pipe and heat dissipation fins, wherein the heat dissipation base is arranged at the upper end of the CPU of a test mainboard, the DUT test positions of the test mainboard are arranged at intervals on one side of the heat dissipation base, and the two sides of the heat dissipation base are fixedly connected to the test mainboard and a mainboard support plate supported at the lower end of the test mainboard; the heat dissipation fins are arranged below the mainboard support plate, one end of the counter-gravity heat pipe is connected to the middle of the upper end of the heat dissipation base, and the other end of the counter-gravity heat pipe passes through the mainboard support plate and is connected to the heat dissipation fins.
[0009] As a preferred technical solution in the utility model, the heat dissipation base includes two parallel connecting strips and a heat conducting plate connected between the two connecting strips, the lower end of the heat conducting plate is in contact with the CPU of the test motherboard, and the upper end of the heat conducting plate is connected to one end of the counter-gravity heat pipe.
[0010] As a preferred technical solution in the utility model, a first cooling fan is arranged below the mainboard support plate, and the outlet of the first cooling fan is aligned with the cooling fins.
[0011] As a preferred technical solution in the utility model, a second cooling fan is also arranged under the mainboard support plate, the inlet of the second cooling fan is aligned with the cooling fins, and the outlet of the first cooling fan is in a straight line with the inlet of the second cooling fan.
[0012] As a preferred technical solution in the utility model, two test mainboards are installed on the mainboard support plate, and a heat dissipation base is provided on the upper end of the CPU of the two test mainboards. A heat dissipation fin is provided under the mainboard support plate corresponding to each heat dissipation base, and each heat dissipation base is connected to the corresponding heat dissipation fin through a counter-gravity heat pipe; the two heat dissipation fins are located between the first heat dissipation fan and the second heat dissipation fan, and the first heat dissipation fan, the second heat dissipation fan and the two heat dissipation fins are located on the same straight line.
[0013] As a preferred technical solution in the utility model, the mainboard support plate is installed at the upper end of the test machine, the first cooling fan, the second cooling fan and two cooling fins are all arranged in the test machine, and vents are arranged on both sides of the test machine.
[0014] As a preferred technical solution in the utility model, a heat dissipation duct is arranged in the test machine, and two ends of the heat dissipation duct are respectively two vents, and the first heat dissipation fan, the second heat dissipation fan and the two heat dissipation fins are all located in the heat dissipation duct.
[0015] Beneficial effect: The utility model transfers the heat of high power consumption of the CPU on the test motherboard to the reverse gravity heat pipe through the heat dissipation base, and then conducts it to the heat dissipation fins under the motherboard support plate through the reverse gravity heat pipe, wherein efficient heat transfer is achieved through the reverse gravity heat pipe, and the heat in the heat pipe can be quickly conducted out, and the reverse gravity heat pipe can be flattened and bent according to structural requirements, so that the structure size above the tester (i.e., the operating surface) is thinner, which facilitates the operation of the operating surface, makes room for the pressing mechanism on the matching Handler, and provides more space for the transport mechanism, making the up and down travel of the transport smaller, improving the stability of the Handler equipment, and reducing the design height of the equipment, saving cost and space. BRIEF DESCRIPTION OF THE DRAWINGS
[0016] Figure 1 It is a schematic diagram of the structure of the utility model;
[0017] Figure 2 This is a schematic diagram of the heat dissipation base, the anti-gravity heat pipe and the heat dissipation fins before they are matched in the utility model;
[0018] Figure 3 It is a structural schematic diagram of the test mainboard in the utility model;
[0019] Figure 4 It is a cross-sectional view of the utility model when being tested on a Handler device.
[0020] In the figure: 1-heat sink; 101-connecting strip; 102-heat conducting plate; 2-anti-gravity heat pipe; 3-heat sink fins; 4-test motherboard; 401-CPU; 402-DUT test position; 5-fastening screws; 6-motherboard support plate; 7-first cooling fan; 8-second cooling fan; 9-testing machine; 10-conveying mechanism; 11-pressing mechanism. DETAILED DESCRIPTION
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the utility model will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the utility model, but does not constitute a limitation of the utility model.
[0022] Example:
[0023] like Figure 1-Figure 4As shown, the present embodiment provides a heat dissipation system for a chip tester, including a heat dissipation base 1, a counter-gravity heat pipe 2 and heat dissipation fins 3. The heat dissipation base 1 is arranged at the upper end of the CPU 401 of the test mainboard 4, and the DUT test position 402 of the test mainboard 4 is arranged at intervals on one side of the heat dissipation base 1, which does not affect the DUT test. Of course, the height of the upper end of the counter-gravity heat pipe 2 in the horizontal direction should also be controlled according to actual conditions to ensure that it does not affect the DUT test. The two sides of the heat dissipation base 1 are fixedly connected to the test mainboard 4 and the mainboard support plate 6 supported at the lower end of the test mainboard 4, such as by fastening screws 5, or bayonet connection, welding, etc., to ensure structural stability; the heat dissipation fins 3 are arranged below the mainboard support plate 6, which does not affect the pressing of the pressing mechanism 11, one end of the counter-gravity heat pipe 2 is connected to the middle of the upper end of the heat dissipation base 1, and the other end of the counter-gravity heat pipe 2 passes through the mainboard support plate 6 and is connected to the heat dissipation fins 3, so that the heat can be effectively transferred to the heat dissipation fins 3, thereby dissipating the heat through the heat dissipation fins 3.
[0024] The utility model transfers the heat of high power consumption of CPU401 on the test mainboard 4 to the reverse gravity heat pipe 2 through the heat dissipation base 1, and then conducts it to the heat dissipation fins 3 under the mainboard support plate 6 through the reverse gravity heat pipe 2, wherein efficient heat transfer is achieved through the reverse gravity heat pipe 2, and the heat in the heat pipe can be quickly conducted out, and the reverse gravity heat pipe 2 can be flattened and bent according to structural requirements, so that the structure size of the operating surface above the tester is thinner, which facilitates the operation of the operating surface, makes room for the pressing mechanism on the matching Handler, and provides more space for the transport mechanism, so that the up and down travel of the transport is smaller, thereby improving the stability of the Handler equipment, reducing the design height of the equipment, and saving cost and space.
[0025] As a preferred implementation scheme in this embodiment, it needs to be further explained that the heat dissipation base 1 includes two parallel connection strips 101 and a heat conducting plate 102 connected between the two connection strips 101. The lower end of the heat conducting plate 102 fits with the CPU 401 of the test mainboard 4, so that the heat conducting plate 102 can be made thinner and the heat conduction efficiency is higher. The connection strip 101 ensures the stability during the connection. The upper end of the heat conducting plate 102 is connected to one end of the counter-gravity heat pipe 2, such as by welding or bonding with a thermal conductive adhesive. Preferably, when the two sides of the heat dissipation base 1 are connected to the test mainboard 4 and the mainboard support plate 6 supported at the lower end of the test mainboard 4 by fastening screws 5, both ends of the two connection strips 101 are provided with mounting countersunk holes for connecting the fastening screws 5, so that the loading and unloading of the fastening screws 5 is easier.
[0026] As a preferred implementation scheme in this embodiment, it needs to be further explained that a first cooling fan 7 is arranged under the mainboard support plate 6, and the outlet of the first cooling fan 7 is aligned with the cooling fins 3, so that the heat of the cooling fins 3 can be taken away more quickly, so that the cooling efficiency of the cooling fins 3 is better.
[0027] As a preferred implementation scheme in this embodiment, it needs to be further explained that a second cooling fan 8 is also arranged under the mainboard support plate 6, the inlet of the second cooling fan 8 is aligned with the cooling fins 3, and the outlet of the first cooling fan 7 and the inlet of the second cooling fan 8 are in a straight line. The first cooling fan 7 and the second cooling fan 8 cooperate with each other, so that the heat can be dissipated more efficiently.
[0028] As a preferred implementation scheme in this embodiment, it needs to be further explained that two test mainboards 4 are installed on the mainboard support plate 6, and a heat dissipation base 1 is provided on the upper end of the CPU 401 of the two test mainboards 4. A heat dissipation fin 3 is provided under the mainboard support plate 6 corresponding to each heat dissipation base 1, and each heat dissipation base 1 is connected to the corresponding heat dissipation fin 3 through a counter-gravity heat pipe 2; the two heat dissipation fins 3 are located between the first heat dissipation fan 7 and the second heat dissipation fan 8, and the first heat dissipation fan 7, the second heat dissipation fan 8 and the two heat dissipation fins 3 are located on the same straight line. By utilizing the effective space, the test efficiency can be made more efficient while ensuring the heat dissipation effect.
[0029] As a preferred implementation scheme in this embodiment, it needs to be further explained that the mainboard support plate 6 is installed at the upper end of the test machine 9, the first cooling fan 7, the second cooling fan 8 and the two cooling fins 3 are all arranged in the test machine 9, and ventilation holes are arranged on both sides of the test machine 9, so as to achieve efficient heat dissipation during the test. Figure 4 As shown, the first cooling fan 7 and the second cooling fan 8 are not shown in the figure. In practice, the conveying mechanism 10 is used to control the pressing mechanism 11 to press the DUT test position.
[0030] As a preferred implementation scheme in this embodiment, it needs to be further explained that a heat dissipation duct is provided in the testing machine 9, and two ventilation holes are respectively provided at both ends of the heat dissipation duct. The first heat dissipation fan 7, the second heat dissipation fan 8 and the two heat dissipation fins 3 are all located in the heat dissipation duct, and the airflow is guided through the heat dissipation duct to further improve the heat dissipation efficiency.
[0031] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the protection scope of the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.
Claims
1. A chip testing machine heat dissipation system, characterized in that: The invention comprises a heat dissipation base (1), a counter-gravity heat pipe (2) and heat dissipation fins (3); the heat dissipation base (1) is arranged on the upper end of a CPU (401) of a test mainboard (4); two sides of the heat dissipation base (1) are fixedly connected to the test mainboard (4) and a mainboard support plate (6) supported on the lower end of the test mainboard (4); the heat dissipation fins (3) are arranged below the mainboard support plate (6); one end of the counter-gravity heat pipe (2) is connected to the middle of the upper end of the heat dissipation base (1); and the other end of the counter-gravity heat pipe (2) passes through the mainboard support plate (6) and is connected to the heat dissipation fins (3).
2. A chip tester heat dissipation system according to claim 1, characterized in that: The heat dissipation base (1) comprises two parallel connecting bars (101) and a heat conducting plate (102) connected between the two connecting bars (101); the lower end of the heat conducting plate (102) is in contact with a CPU (401) of a test motherboard (4); and the upper end of the heat conducting plate (102) is connected to one end of a counter-gravity heat pipe (2).
3. A chip testing machine heat dissipation system according to claim 1 or 2, characterized in that: A first cooling fan (7) is arranged below the mainboard support plate (6), and an outlet of the first cooling fan (7) is aligned with the cooling fins (3).
4. A chip tester heat dissipation system according to claim 3, characterized in that: A second cooling fan (8) is also provided below the mainboard support plate (6), the inlet of the second cooling fan (8) is aligned with the cooling fins (3), and the outlet of the first cooling fan (7) and the inlet of the second cooling fan (8) are in a straight line.
5. A chip tester heat dissipation system according to claim 4, characterized in that: Two test mainboards (4) are installed on the mainboard support plate (6); a heat dissipation base (1) is provided on the upper end of the CPU (401) of the two test mainboards (4); a heat dissipation fin (3) is provided below the mainboard support plate (6) corresponding to each heat dissipation base (1); each heat dissipation base (1) is connected to the corresponding heat dissipation fin (3) via a counter-gravity heat pipe (2); the two heat dissipation fins (3) are located between a first heat dissipation fan (7) and a second heat dissipation fan (8); and the first heat dissipation fan (7), the second heat dissipation fan (8) and the two heat dissipation fins (3) are located on the same straight line.
6. A chip tester heat dissipation system according to claim 5, characterized in that: The mainboard support plate (6) is installed at the upper end of the test machine (9), the first cooling fan (7), the second cooling fan (8) and the two cooling fins (3) are all arranged in the test machine (9), and ventilation holes are arranged on both sides of the test machine (9).
7. A chip tester heat dissipation system according to claim 6, characterized in that: The testing machine (9) is provided with a heat dissipation duct, with two ventilation openings at both ends of the heat dissipation duct, and the first heat dissipation fan (7), the second heat dissipation fan (8) and the two heat dissipation fins (3) are all located in the heat dissipation duct.