Passivation equipment

Abstract

The utility model relates to passivation equipment, which comprises a plurality of parallel process cavities and a plurality of reaction cavities, a conveying device is erected above the process cavities and the reaction cavities, the conveying device comprises at least two carrying mechanisms, a driving mechanism and a transferring mechanism, the at least two carrying mechanisms are movably arranged on the transferring mechanism, and the driving mechanism is arranged on the transferring mechanism. The driving mechanism is connected with the carrying mechanism, and the driving mechanism can drive the carrying mechanism to move along the transferring mechanism. The conveying device has the advantages of being good in process flexibility, capable of achieving accurate control over conveying and capable of improving production efficiency.

Description

Technical Field

[0001] The utility model designs the technical field of passivation, and specifically relates to a passivation device. Background Art

[0002] In the field of semiconductor manufacturing, the surface treatment of silicon wafers is a crucial step that directly affects the performance and reliability of devices. Passivation is a common surface treatment technology that forms a protective film on the surface of silicon wafers to prevent them from reacting with impurities or harmful gases in the environment, thereby improving the stability of silicon wafers and the service life of devices.

[0003] Existing silicon wafer passivation equipment uses a chain transmission method. The machine is composed of multiple chambers in series. Each chamber performs different passivation processes on the silicon wafers. The silicon wafers are placed on the conveyor line and enter the machine from the front loading position. They pass through each chamber in turn. After the process in the previous chamber is completed, they are transferred to the next chamber to continue the process. And so on, until the silicon wafer is transferred from the last chamber at the unloading position, the stack of silicon wafers completes the entire process. The chain transmission method processes silicon wafers in a fixed order, which limits the flexibility of the process. It cannot provide a customized process path for silicon wafers that require special treatment, and it cannot accurately locate the position where the silicon wafer moves. In addition, the number of silicon wafers processed in this way is limited and cannot meet the needs of large-scale production. Utility Model Content

[0004] The utility model aims to provide a passivation device which has good process flexibility, can realize accurate control of conveying and can improve production efficiency.

[0005] A passivation device comprises a plurality of parallel process chambers and a plurality of reaction chambers, wherein a conveying device is arranged above the process chambers and the reaction chambers, wherein the conveying device comprises at least two transport mechanisms, a driving mechanism and a transfer mechanism, wherein at least two of the transport mechanisms are movably mounted on the transfer mechanism, the driving mechanism is connected to the transport mechanism, and the driving mechanism can drive the transport mechanism to move along the transfer mechanism.

[0006] In the above scheme, the transport mechanism is used to transport silicon wafers, and the drive mechanism drives the transport mechanism to move along the transfer mechanism to transport the silicon wafers to the process chamber for passivation pre-treatment, and then transport them to the reaction chamber for passivation. The order in which the transport mechanism transports the silicon wafers to the process chamber and the reaction chamber can be adjusted according to actual process requirements. The drive mechanism can accurately control the position of the transport mechanism during the movement of the transfer mechanism, so that the silicon wafers can be accurately placed in the process chamber and the reaction chamber. The transport mechanism can transport multiple silicon wafers at a time, so that passivation treatment of multiple silicon wafers can be achieved. The two transport mechanisms can work together. When one transport mechanism moves a group of silicon wafers to one of the process chambers and then returns, the other transport mechanism continues the subsequent transport and processing, thereby improving the efficiency of transportation, which can significantly improve production efficiency and production consistency.

[0007] Furthermore, the transport mechanism includes a mounting frame, a first driving member, a lifting assembly and a transport fixture, the first driving member is mounted on the mounting frame, the lifting assembly is vertically connected to a crossbeam of the mounting frame, and the transport fixture is connected to the lifting assembly.

[0008] In the above scheme, by installing the first driving member on the mounting frame, the lifting assembly is vertically connected to the crossbeam of the mounting clamp, so that the first driving member can drive the lifting assembly to rise and fall, and drive the transport fixture to rise and fall, so that the transport fixture loaded with silicon wafers can be lowered into the process chamber and reaction chamber for processing and lifted up for transportation.

[0009] Furthermore, the lifting assembly includes at least two lifting seats, a first connecting plate, a second connecting plate and a connecting frame, the lifting seat is connected to the mounting frame, the first connecting plate is connected to the lifting seat, the second connecting plate is connected to the first connecting plate, the connecting frame is connected to the second connecting plate, and the transport fixture is connected to the connecting frame.

[0010] In the above scheme, the lifting seat can rise and fall vertically under the drive of the first driving member, and is connected to the lifting seat through the first connecting plate, the second connecting plate is connected to the first connecting plate, the connecting frame is connected to the second connecting plate, and the transport fixture is connected to the connecting frame, so that the lifting seat can drive the transport fixture to rise and fall, and the first connecting plate, the second connecting plate and the connecting frame are detachably connected, which is convenient for processing and installation, and can be applied to various transport needs.

[0011] Furthermore, the transport fixture includes a placement rack and a plurality of connecting rods, one end of the connecting rod is connected to the placement rack, and the other end is connected to the connecting frame, and the placement rack is provided with a multi-layer carrier plate, and the carrier plate is provided with a plurality of through holes.

[0012] In the above scheme, a certain distance is created between the placement rack and the connection frame by setting a connecting rod, so that the lifting assembly will not be affected when the silicon wafers in the handling fixture are processed, thereby increasing the service life of the equipment. The silicon wafers are placed in the gap between the multi-layer carriers, so that multiple silicon wafers can be transported at the same time. Multiple through holes are opened on the carrier to ensure better effects during the pre-passivation and passivation of the silicon wafers, thereby improving the passivation quality of the silicon wafers.

[0013] Furthermore, the driving mechanism includes a second driving member, a gear and a rack, the rack is installed on one side of the two conveying mechanisms, the second driving member is installed on the mounting frame, the output end of the second driving member is connected to the gear, and the gear is meshingly connected to the rack.

[0014] In the above solution, the second driving member can be a motor, which can drive the gear to rotate so that the gear moves along the rack, thereby accurately driving the mounting frame to move along the transfer mechanism to the position of the process chamber and the reaction chamber.

[0015] Furthermore, the transfer mechanism has two groups, and the two side beams of the mounting frame are respectively connected to the two groups of the transfer mechanism. The transfer mechanism includes a base, and the base is movably connected to a moving seat. A first rolling member is installed in the moving seat, and the first rolling member is rollingly connected to the upper surface of the base.

[0016] In the above scheme, the base of the transfer mechanism provides stable support, and the combination of the movable seat and the first rolling element enables the mounting frame to maintain smooth movement during the transfer process. This design ensures the stability and safety of the silicon wafer during the transportation process and avoids damage or misoperation caused by unstable movement.

[0017] Furthermore, two ends of the movable seat are connected with movable plates, and two ends of the movable plates are installed with rolling members, and the rolling members are rollingly connected with two side surfaces of the base.

[0018] In the above scheme, the second rolling member can play a limiting role. By rolling connection with the two side surfaces of the base, the second rolling member can effectively limit the moving range of the movable seat on the base, ensuring the stability and safety of the mounting frame during the transportation process, and at the same time further ensuring that the mounting frame moves more smoothly.

[0019] Furthermore, the process chamber includes a fixing seat and a process tank, and the process tank is installed on the upper part of the fixing seat.

[0020] In the above scheme, the process tank is installed on the upper part of the fixed seat, which is convenient for maintenance personnel to inspect and replace. When the process tank needs to be cleaned or replaced, it only needs to be removed from the fixed seat, which simplifies the maintenance operation and reduces maintenance time and cost. It can be adjusted and replaced according to specific process requirements, so that the process chamber can be flexibly adapted to different processing technologies and product requirements, thereby improving the applicability and flexibility of the equipment.

[0021] Furthermore, the reaction chamber comprises a support frame and a reaction tank, wherein the reaction tank is installed at the lower part of the support frame, and a passivation cover is movably installed on the support frame, and the passivation cover can be covered on the reaction tank.

[0022] In the above scheme, the support frame provides a stable support structure to ensure the stability and safety of the reaction tank during operation. The design of the passivation cover can effectively cover the reaction tank to prevent the leakage of reactants or unnecessary chemical reactions, thereby ensuring the safety of operators and equipment. When the handling mechanism transports the silicon wafer into the reaction tank, the passivation cover moves until it covers the reaction tank, thereby better performing the passivation treatment and ensuring production quality.

[0023] Furthermore, it also includes a loading platform and a unloading platform, the loading platform includes a plurality of loading conveying rollers, and the unloading platform includes a plurality of unloading conveying rollers.

[0024] In the above scheme, the loading platform and the unloading platform are respectively equipped with multiple loading conveying rollers and unloading conveying rollers, which can realize efficient silicon wafer transportation. Through the continuous rolling of the loading conveying rollers and the unloading conveying rollers, the loading and unloading of silicon wafers can be realized quickly and stably, thereby improving production efficiency.

[0025] The utility model provides a passivation device with good process flexibility, can realize accurate control of conveying and can improve the beneficial effect of production efficiency. The conveying mechanism is used to convey silicon wafers, and the driving mechanism drives the conveying mechanism to move along the transfer mechanism so as to convey the silicon wafers to the process chamber for passivation pre-treatment, and then convey them to the reaction chamber for passivation. The order of conveying silicon wafers to the process chamber and the reaction chamber by the conveying mechanism can be adjusted according to the actual process requirements. The driving mechanism can accurately control the position of the conveying mechanism during the movement of the transfer mechanism, so that the silicon wafers can be accurately placed in the process chamber and the reaction chamber. The conveying mechanism can convey multiple silicon wafers at a time, so that multiple silicon wafers can be passivated. The two conveying mechanisms can work together. When one conveying mechanism moves a group of silicon wafers to one of the process chambers and then returns, the other conveying mechanism continues the subsequent conveying and processing, which improves the efficiency of conveying, and can significantly improve production efficiency and production consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 The figure is an overall schematic diagram of a passivation device according to an embodiment.

[0027] Figure 2 Schematic diagram of the structure of a conveying device according to an embodiment.

[0028] Figure 3 The figure is a schematic diagram of the structure of a transport mechanism according to an embodiment.

[0029] Figure 4 for Figure 2 A partial enlarged view of point A in the middle.

[0030] Figure 5 for Figure 2 A partial enlarged view of point B in the middle.

[0031] Figure 6 Schematic diagram of the positional relationship between the process chamber and the reaction chamber in one embodiment.

[0032] Figure 7 Schematic diagram of the reaction chamber structure of an embodiment.

[0033] Explanation of the accompanying drawings: 1. process chamber; 11. process tank; 12. fixed seat; 2. reaction chamber; 21. support frame; 22. reaction tank; 23. passivation cover; 3. conveying device; 31. conveying mechanism; 311. mounting frame; 312. first driving member; 313. lifting assembly; 3131. lifting seat; 3132. first connecting plate; 3133. second connecting plate; 3134. connecting frame; 314. conveying fixture; 3141. placement frame; 3142. connecting rod; 3143. carrier plate; 32. driving mechanism; 321. rack; 322. gear; 323. second driving member; 33. transfer mechanism; 331. base; 332. moving seat; 333. first rolling member; 334. moving plate; 335. second rolling member; 4. loading platform; 41. loading conveying roller; 5. unloading platform; 51. unloading conveying roller. DETAILED DESCRIPTION

[0034] The passivation device of the utility model will be further described in detail below in conjunction with specific embodiments and drawings.

[0035] like Figure 1 and Figure 2As shown, in a preferred embodiment, a passivation device of the utility model includes a plurality of parallel process chambers 1 and a plurality of reaction chambers 2, a conveying device 3 is mounted above the process chamber 1 and the reaction chamber 2, and the conveying device 3 includes at least two conveying mechanisms 31, a driving mechanism 32 and a transfer mechanism 33, at least two conveying mechanisms 31 are movably mounted on the transfer mechanism 33, the driving mechanism 32 is connected to the conveying mechanism 31, and the driving mechanism 32 can drive the conveying mechanism 31 to move along the transfer mechanism 33. The conveying mechanism 31 is used to convey silicon wafers, and the conveying mechanism 31 is driven by the driving mechanism 32 to move along the transfer mechanism 33 so as to convey the silicon wafers to the process chamber 1 for passivation pretreatment, and then conveyed to the reaction chamber 2 for passivation. The order in which the conveying mechanism 31 conveys the silicon wafers to the process chamber 1 and the reaction chamber 2 can be adjusted according to the actual process requirements, so that the device has higher flexibility and adaptability.

[0036] The driving mechanism 32 can accurately control the position of the transport mechanism 31 when the transfer mechanism 33 moves, so that the silicon wafers can be accurately placed in the process chamber 1 and the reaction chamber 2, realizing the automation and precise control of the transport process. The transport mechanism 31 can transport multiple silicon wafers at a time, so that multiple silicon wafers can be passivated. The two transport mechanisms 31 can work together. When one transport mechanism 31 moves a group of silicon wafers to one of the process chambers 1 and then returns, the other transport mechanism 31 continues the subsequent transport and processing, which improves the efficiency of transportation, which can significantly improve production efficiency and production consistency. Automated silicon wafer transportation and passivation treatment reduces human intervention and reduces labor costs, while improving production efficiency and production consistency, making the production process more efficient and reliable.

[0037] In the above embodiment, multiple process chambers 1 include those for performing rough cleaning, standard cleaning, final cleaning and drying on silicon wafers, and are designed according to actual production needs; reaction chamber 2 is used for passivation treatment and may be an oxidation chamber, in which the silicon wafer is exposed to an oxidizing gas environment and undergoes an oxidation reaction to form an oxide layer.

[0038] like Figures 1 to 3As shown, in some embodiments, the transport mechanism 31 includes a mounting frame 311, a first driving member 312, a lifting assembly 313 and a transport fixture 314. The first driving member 312 is mounted on the mounting frame 311, the lifting assembly 313 is vertically connected to the cross beam of the mounting frame 311, and the transport fixture 314 is connected to the lifting assembly 313. By mounting the first driving member 312 on the mounting frame 311 and vertically connecting the lifting assembly 313 to the cross beam of the mounting clamp, the first driving member 312 can drive the lifting assembly 313 to rise and fall, and drive the transport fixture 314 to rise and fall. This design ensures the stability and controllability of the transport process, so that the transport fixture 314 loaded with silicon wafers can be lowered into the process chamber 1 and the reaction chamber 2 for processing and lifted up for transportation.

[0039] like Figures 1 to 3 As shown, in some embodiments, the lifting assembly 313 includes at least two lifting seats 3131, a first connecting plate 3132, a second connecting plate 3133 and a connecting frame 3134, the lifting seat 3131 is connected to the mounting frame 311, the first connecting plate 3132 is connected to the lifting seat 3131, the second connecting plate 3133 is connected to the first connecting plate 3132, the connecting frame 3134 is connected to the second connecting plate 3133, and the transport fixture 314 is connected to the connecting frame 3134. The lifting seat 3131 can rise and fall vertically under the drive of the first driving member 312. It is connected to the lifting seat 3131 through the first connecting plate 3132, the second connecting plate 3133 is connected to the first connecting plate 3132, the connecting frame 3134 is connected to the second connecting plate 3133, and the transport fixture 314 is connected to the connecting frame 3134, so that the lifting seat 3131 can drive the transport fixture 314 to rise and fall. The first connecting plate 3132, the second connecting plate 3133 and the connecting frame 3134 are detachably connected, which is convenient for processing and installation, and can be applied to various transport needs.

[0040] like Figure 2 and Figure 3 As shown, in some embodiments, the transport fixture 314 includes a placement rack 3141 and a plurality of connecting rods 3142, one end of the connecting rod 3142 is connected to the placement rack 3141, and the other end is connected to the connection frame 3134, and a multi-layer carrier 3143 is provided on the placement rack 3141, and a plurality of through holes are provided on the carrier 3143. By providing the connecting rod 3142, a certain distance is provided between the placement rack 3141 and the connection frame 3134, so that the lifting assembly 313 will not be affected when the silicon wafer in the transport fixture 314 is processed, thereby improving the service life of the equipment, and the silicon wafer is placed in the gap between the multi-layer carrier 3143, so that multiple silicon wafers can be transported at the same time, and the plurality of through holes provided on the carrier 3143 can ensure better effects of silicon wafer passivation pre-treatment and passivation, thereby improving the passivation quality of the silicon wafer.

[0041] like Figure 2 and Figure 4 As shown, in some embodiments, the driving mechanism 32 includes a second driving member 323, a gear 322 and a rack 321, the rack 321 is installed on one side of the two transport mechanisms 31, the second driving member 323 is installed on the mounting frame 311, the output end of the second driving member 323 is connected to the gear 322, and the gear 322 is meshed and connected with the rack 321. The second driving member 323 can be a motor, and the second driving member 323 can drive the gear 322 to rotate, so that the gear 322 moves along the rack 321, thereby accurately driving the mounting frame 311 to move along the transfer mechanism 33 to the position of the process chamber 1 and the reaction chamber 2. This design ensures the stability and controllability of the transport process, and ensures that the silicon wafer can be accurately transported to the designated position for processing. The motor can provide sufficient power to drive the rotation of the gear 322, thereby ensuring the high efficiency and reliability of the driving mechanism 32, which is suitable for long-term continuous work.

[0042] like Figure 2 and Figure 5 As shown, in some embodiments, there are two groups of transfer mechanisms 33, and the two side beams of the mounting frame 311 are respectively connected to the two groups of transfer mechanisms 33. The transfer mechanism 33 includes a base 331, and the base 331 is movably connected to a moving seat 332. A first rolling member 333 is installed in the moving seat 332, and the first rolling member 333 is rollingly connected to the upper surface of the base 331. The base 331 of the transfer mechanism 33 provides stable support, and the combination of the moving seat 332 and the first rolling member 333 enables the mounting frame 311 to maintain stable movement during the transfer process. This design ensures the stability and safety of the silicon wafer during the transportation process, and avoids damage or misoperation caused by unstable movement. The structure of the transfer mechanism 33 is relatively simple and reliable, easy to manufacture and maintain, not prone to failure, and can ensure long-term stable operation.

[0043] like Figure 2 and Figure 5 As shown, in some embodiments, the two ends of the moving seat 332 are connected to the moving plate 334, and the two ends of the moving plate 334 are installed with the second rolling member 335, and the second rolling member 335 is connected to the two side surfaces of the base 331 in a rolling manner. The second rolling member 335 can play a role of limiting. By being connected to the two side surfaces of the base 331 in a rolling manner, the second rolling member 335 can effectively limit the moving range of the moving seat 332 on the base 331, thereby ensuring the stability and safety of the mounting frame 311 during the transportation process. The provision of the second rolling member 335 also enhances the stability of the moving seat 332 on the base 331. This structural design can effectively prevent the moving seat 332 from being moved or shaken unnecessarily due to external forces or abnormal operations, thereby ensuring the normal operation of the equipment and the safe transportation of silicon wafers.

[0044] like Figure 1and Figure 6 As shown, in some embodiments, the process chamber 1 includes a fixed seat 12 and a process tank 11, and the process tank 11 is installed on the upper part of the fixed seat 12. The fixed seat 12 of the process chamber 1 provides a stable support to ensure that the process tank 11 remains stable during use. This design ensures the structural stability of the process chamber 1, avoids unexpected situations in process operations caused by the instability of the process tank 11, and improves the safety of operation; the process tank 11 is installed on the upper part of the fixed seat 12, which is convenient for maintenance personnel to inspect and replace. When the process tank 11 needs to be cleaned or replaced, it only needs to be removed from the fixed seat 12, which simplifies maintenance operations, reduces maintenance time and cost, and can be adjusted and replaced according to specific process requirements, so that the process chamber 1 can be flexibly applied to different processing technologies and product requirements, and improves the applicability and flexibility of the equipment.

[0045] like Figure 1 , Figure 6 and Figure 7 As shown, in some embodiments, the reaction chamber 2 includes a support frame 21 and a reaction tank 22, the reaction tank 22 is installed at the lower part of the support frame 21, and a passivation cover 23 is movably installed on the support frame 21, and the passivation cover 23 can be covered on the reaction tank 22. The support frame 21 provides a stable support structure to ensure the stability and safety of the reaction tank 22 during operation. The design of the passivation cover 23 can effectively cover the reaction tank 22 to prevent the reactants from leaking or producing unnecessary chemical reactions, and ensure the safety of operators and equipment. When the transport mechanism 31 transports the silicon wafer into the reaction tank 22, the passivation cover 23 moves until it covers the reaction tank 22, so as to better perform the passivation treatment and ensure production quality.

[0046] like Figure 1 and Figure 6 As shown, in some embodiments, a loading platform 4 and a unloading platform 5 are further included, wherein the loading platform 4 includes a plurality of loading conveying rollers 41, and the unloading platform 5 includes a plurality of unloading conveying rollers 51. The loading platform 4 and the unloading platform 5 are respectively equipped with a plurality of loading conveying rollers 4 and unloading conveying rollers 5, which can realize efficient silicon wafer conveying. Through the continuous rolling of the loading conveying rollers 4 and the unloading conveying rollers 5, the loading and unloading of silicon wafers can be realized quickly and stably, thereby improving production efficiency.

[0047] The utility model discloses a passivation equipment working principle and process. The silicon wafer is transported to the position of the conveying device 3 through the loading platform 4, and the silicon wafer is placed in the gap between the multilayer carrier plate 3143 of the handling fixture 314. The second driving member 323 can drive the gear 322 to rotate, so that the gear 322 moves along the rack 321, so that the mounting frame 311 can be driven to move along the transfer mechanism 33, thereby driving the handling fixture 314 to move to the position of the process chamber 1 and the reaction chamber 2. The first driving member 312 can drive the lifting component 313 to rise and fall, and drive the handling fixture 314 to rise and fall, so that the handling fixture 314 loaded with silicon wafers can be lowered and placed in the process chamber 1 and the reaction chamber 2 for processing and lifted up for transportation.

[0048] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0049] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0050] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0051] Although the utility model is described in conjunction with the above specific embodiments, it is obvious that those skilled in the art can make many substitutions, modifications and changes based on the above content. Therefore, all such substitutions, improvements and changes are included in the spirit and scope of the appended claims.

Claims

1. A passivation device, characterized in that: It includes a plurality of parallel process chambers and a plurality of reaction chambers, wherein a conveying device is arranged above the process chambers and the reaction chambers, wherein the conveying device includes at least two conveying mechanisms, a driving mechanism and a transfer mechanism, wherein at least two of the conveying mechanisms are movably mounted on the transfer mechanism, the driving mechanism is connected to the conveying mechanism, and the driving mechanism can drive the conveying mechanism to move along the transfer mechanism.

2. The passivation device according to claim 1, characterized in that The transport mechanism comprises a mounting frame, a first driving member, a lifting assembly and a transport fixture, wherein the first driving member is mounted on the mounting frame, the lifting assembly is vertically connected to a crossbeam of the mounting frame, and the transport fixture is connected to the lifting assembly.

3. The passivation device according to claim 2, characterized in that: The lifting assembly includes at least two lifting seats, a first connecting plate, a second connecting plate and a connecting frame. The lifting seat is connected to the mounting frame, the first connecting plate is connected to the lifting seat, the second connecting plate is connected to the first connecting plate, the connecting frame is connected to the second connecting plate, and the transport fixture is connected to the connecting frame.

4. The passivation device according to claim 3, characterized in that The transport fixture comprises a placement rack and a plurality of connecting rods, one end of the connecting rod is connected to the placement rack, and the other end is connected to the connection frame. The placement rack is provided with a multi-layer carrier plate, and the carrier plate is provided with a plurality of through holes.

5. The passivation device according to claim 2, characterized in that: The driving mechanism includes a second driving member, a gear and a rack, the rack is installed on one side of the two conveying mechanisms, the second driving member is installed on the mounting frame, the output end of the second driving member is connected to the gear, and the gear is meshed with the rack.

6. The passivation device according to claim 2, characterized in that: There are two groups of transfer mechanisms, and the two side beams of the mounting frame are respectively connected to the two groups of transfer mechanisms. The transfer mechanism includes a base, and the base is movably connected to a moving seat. A first rolling member is installed in the moving seat, and the first rolling member is rollingly connected to the upper surface of the base.

7. The passivation device according to claim 6, characterized in that The two ends of the movable seat are connected with movable plates, the two ends of the movable plates are equipped with second rolling members, and the second rolling members are rollingly connected with the two side surfaces of the base.

8. The passivation device according to claim 1, characterized in that The process chamber comprises a fixing seat and a process tank, and the process tank is installed on the upper part of the fixing seat.

9. The passivation device according to claim 1, characterized in that: The reaction chamber comprises a support frame and a reaction tank, wherein the reaction tank is installed at the lower part of the support frame, and a passivation cover is movably installed on the support frame, and the passivation cover can be covered on the reaction tank.

10. The passivation device according to claim 1, characterized in that It also includes a loading platform and a unloading platform. The loading platform includes a plurality of loading conveying rollers, and the unloading platform includes a plurality of unloading conveying rollers.

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