Laser chip packaging patch assembly
By designing a laser chip package patch assembly containing a fixed packaging mechanism and a connecting mechanism, the problems of inconvenient packaging process and insufficient chip protection in the prior art are solved, and efficient and simple packaging and effective chip protection are achieved.
Patent Information
- Application Number
- CN202421390056.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-18
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-06-18
AI Technical Summary
The existing laser chip packaging technology is difficult to achieve an efficient and simple packaging process, and the traditional packaging method does not protect the chip enough, which affects subsequent packaging and sales.
A laser chip packaging patch assembly is designed, using a fixed packaging mechanism and a connecting mechanism, and the chip is securely fixed through structures such as support columns, rubber pads, pressure snaps and cover plates, and the connection and separation of multiple devices are achieved through the design of the teeth and slots.
It realizes efficient and simple packaging of laser chips, ensures firm fixation and effective protection of the chips, facilitates subsequent packaging and sales, and improves packaging efficiency and simultaneous packaging capabilities of multiple chips.
Smart Images
Figure CN222601702U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of laser chip packaging, in particular to a laser chip packaging patch component. Background Art
[0002] At present, die bonding is also called chip mounting. Die bonding is a process of bonding the chip to the designated area of the bracket through colloid (generally conductive glue or insulating glue for LED) to form a thermal path or electrical path, which provides conditions for subsequent wire bonding. The SMD component packaging form is a packaging form of semiconductor devices. Chips are also called integrated circuits, or microcircuits, microchips, and chips / chips in electronics. It is a way to miniaturize circuits (mainly semiconductor devices, but also passive components, etc.) and is often manufactured on the surface of semiconductor wafers. SMT involves a wide variety of parts with different styles. Many of them have formed industry-wide standards, which are mainly some chip capacitors and resistors; many are still undergoing constant changes, especially IC parts. The changes in their packaging forms are endless and dazzling. Traditional pin packaging is experiencing the impact of a new generation of packaging forms (BGA, FLIPCHIP, etc.).
[0003] As shown in the announcement number CN 215496676 U, a laser chip packaging patch assembly is disclosed, including an upper sealing plate, a lower sealing plate, connecting pins and a substrate. The upper sealing plate is located on the upper surface of the lower sealing plate, and the connecting pins are provided in multiple specifications. The chip body is fixed on the upper surface of the substrate. Utility Model Content
[0004] The purpose of the utility model is to provide a laser chip packaging patch component to solve the problems raised in the above background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A laser chip packaging patch assembly comprises a fixed packaging mechanism, the fixed packaging mechanism comprises a base, a support column is fixedly installed above the base, a placement platform is fixedly provided inside the support column at the middle position of the support column, a rubber pad is fixedly provided above the placement platform, pressure buckles are fixedly provided at the front and rear of the outer side of the support column, a cover plate is fixedly provided above the support column, grooves are fixedly provided above the cover plate near the four corners, glass is fixedly provided in the middle of the cover plate, and fixed downward pressure columns are fixedly provided below the cover plate at the corners of the glass.
[0007] Preferably, a connecting mechanism is fixedly installed in front of the fixed packaging mechanism, the connecting mechanism includes a latching tooth, and a latching groove is fixedly provided at one end of the other solid end of the base away from the latching tooth, and fixing blocks are fixedly provided at both ends of the latching groove.
[0008] Preferably, a supporting block is fixedly provided above the fixing block, a rotating shaft is fixedly provided above the supporting block, and a clamping block is fixedly provided above the rotating shaft.
[0009] Preferably, a cushion block is fixedly provided at one end of the inner side of the rotating shaft close to the card slot, and a pressure plate is fixedly provided at one end of the right side of the rotating shaft away from the card slot.
[0010] Preferably, connecting blocks are fixedly provided at both ends of the clamping teeth, a clamping plate is fixedly provided above the pressure buckle, and a rotating core is fixedly provided on the outer side of the clamping plate.
[0011] Preferably, a pressure plate is fixedly provided on the right side of the rotating core away from the clamping plate, and an elastic connecting rope is fixedly provided on the upper part of the pressure plate at the connection part with the clamping plate.
[0012] Compared with the prior art, the beneficial effects of the utility model are:
[0013] 1. This laser chip packaging patch assembly, when in use, first take out the device through the grip mechanism and place it on the platform, then remove the fixing mechanism, lift the pressure plate upward to loosen the elastic connecting rope, remove the card plate from the groove, remove the upper cover plate, and then place the four corners of the packaged chip on the placement table to fix it, then put the cover plate down, and press it tightly through the lower pressure column to fix the chip, because there are rubber pads above the placement table and below the lower pressure column to protect the chip from damage. After placement, place the card plate in the groove, and then press hard. Press down the pressure plate so that the pressure buckle fixes the cover plate to complete the laser chip packaging. If necessary, align one end of the tooth of another device B with the slot of this device and insert it forcefully. At this time, the connecting blocks at both ends of the tooth drive the shaft to rotate by pressing down the cushion block, so that the block is pressed down to fix the connecting block, thereby fixing the tooth, so that the two sets of devices are connected as a whole. When not in use, the shaft is rotated by pressing down the pressure plate, so that the block falls off the connecting block, and at the same time the cushion block lifts the connecting block upward to disengage the tooth from the slot, thereby separating the two sets of devices.
[0014] 2. This laser chip packaging patch component only needs to be placed on the placement table, covered with a cover plate, and the fixing device is used to fix the packaged chip through pressure buckles to complete the packaging of the semiconductor discrete device and then the packaging work. The device is easy to use, the fixing method is firm, and the chip is effectively packaged, which facilitates the subsequent packaging and sales work. At the same time, the device is designed with a connecting mechanism to facilitate the connection between two identical devices into a whole, and multiple integrated packaged chips can be connected and packaged at the same time, which is very efficient. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;
[0016] Figure 2 This is a schematic diagram of the cover structure of the utility model;
[0017] Figure 3 This is a schematic diagram of the card slot and card teeth structure of the utility model;
[0018] Figure 4 It is a schematic diagram of the pressure buckle structure of the utility model.
[0019] In the figure: 1. base; 2. support column; 3. placement table; 4. rubber pad; 5. pressure buckle; 6. cover plate; 7. groove; 8. glass; 9. lower pressure column; 10. clamping teeth; 11. clamping slot; 12. fixing block; 13. support block; 14. rotating shaft; 15. clamping block; 16. cushion block; 17. pressure plate; 18. connecting block; 19. clamping plate; 20. rotating core; 21. pressure plate; 22. elastic connecting rope. DETAILED DESCRIPTION
[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1 - Figure 4 As shown, a technical solution provided by the utility model:
[0022] A laser chip packaging patch component comprises a fixed packaging mechanism, the fixed packaging mechanism comprises a base 1, a support column 2 is fixedly installed above the base, a placement platform 3 is fixedly arranged inside the support column 2 at the middle position of the support column 2, a rubber pad 4 is fixedly arranged above the placement platform 3, a pressure buckle 5 is fixedly arranged at the front and rear of the outer side of the support column 2, a cover plate 6 is fixedly arranged above the support column 2, a groove 7 is fixedly arranged above the cover plate 6 near the four corners, a glass 8 is fixedly arranged in the middle part of the cover plate 6, and a fixed downward pressure column 9 is fixedly arranged below the cover plate 6 at the corner position of the glass 8. When using the laser chip packaging patch component, firstly take out the device through the grip mechanism and place it on the platform, then remove the fixing mechanism, loosen the elastic connecting rope by lifting the pressure plate 21 upwards, remove the card plate 19 from the groove 7, remove the upper cover plate 6, and then place the four corners of the packaged chip on the After being fixed on the placement table 3, the cover plate 6 is lowered and pressed by the pressing column 9 to fix the chip, because there are rubber pads 4 above the placement table 3 and below the pressing column 9 to protect the chip from damage. After the placement is completed, the card plate 19 is placed in the groove 7, and then the pressure plate 21 is pressed down hard so that the pressure buckle 5 fixes the cover plate 6, and the laser chip packaging can be completed. If necessary, align one end of the tooth 10 of another piece of the same device B with the end of the slot 11 of this device and insert it forcefully. At this time, the connecting blocks 18 at both ends of the tooth 10 drive the rotating shaft 14 to rotate by pressing the cushion block 16, so that the card block 15 is pressed down to fix the connecting block 18, thereby fixing the tooth 10, so that the two sets of devices are connected as a whole. When not in use, the rotating shaft 14 is rotated by pressing the pressing plate 17, so that the card block 15 falls off from the connecting block 18, and at the same time, the cushion block 16 lifts the connecting block 18 upward to disengage the tooth 10 from the slot 11, thereby separating the two sets of devices.
[0023] In this embodiment, preferably, a connecting mechanism is fixedly installed in front of the fixed packaging mechanism, the connecting mechanism includes a latch tooth 10, and the other end of the base 1 is fixedly provided with a latch groove 11 at one end away from the latch tooth 10, and fixing blocks 12 are fixedly provided at both ends of the latch groove 11.
[0024] In this embodiment, preferably, a support block 13 is fixedly provided above the fixed block 12 , a rotating shaft 14 is fixedly provided above the support block 13 , and a clamping block 15 is fixedly provided above the rotating shaft 14 .
[0025] In this embodiment, preferably, a cushion block 16 is fixedly provided at one end of the inner side of the rotating shaft 14 close to the card slot 11 , and a pressure plate 17 is fixedly provided at one end of the right side of the rotating shaft 14 away from the card slot 11 .
[0026] In this embodiment, preferably, connecting blocks 18 are fixedly provided at both ends of the latch teeth 10 , a clamping plate 19 is fixedly provided above the pressure buckle 5 , and a rotating core 20 is fixedly provided on the outer side of the clamping plate 19 .
[0027] In this embodiment, preferably, a pressure plate 21 is fixedly provided on the right side of the rotating core 20 away from the clamping plate 19 , and an elastic connecting rope 22 is fixedly provided on the upper part of the pressure plate 21 at the connection portion with the clamping plate 19 .
[0028] A laser chip packaging patch assembly of the present embodiment, when in use, first take out the device through the handle mechanism and place it on the platform, then remove the fixing mechanism, lift the pressure plate 21 upwards to loosen the elastic connecting rope, remove the card plate 19 from the groove 7, remove the upper cover plate 6, and then place the four corners of the packaged chip on the placement table 3 for fixing, then put down the cover plate 6, and press it tightly through the lower pressure column 9 to fix the chip, because there are rubber pads 4 above the placement table 3 and below the lower pressure column 9 to protect the chip from damage. After the placement is completed, place the card plate 19 in the groove 7, and then press the pressure plate 21 down hard so that the pressure buckle 5 fixes the cover plate 6, and the laser chip packaging can be completed. If necessary, align one end of the tooth 10 of another piece of the same device B with the end of the slot 11 of this device and insert it forcefully. At this time, the connecting blocks 18 at both ends of the tooth 10 drive the rotating shaft 14 through the lower pressure pad 16. The clamping block 15 is rotated to press down the connecting block 18, thereby fixing the latching tooth 10, so that the two sets of devices are connected as a whole. When not in use, the rotating shaft 14 is rotated by pressing down the pressing plate 17, so that the clamping block 15 is removed from the connecting block 18, and at the same time, the pad 16 lifts the connecting block 18 upward to disengage the latching tooth 10 from the slot 11, so that the two sets of devices are separated. This laser chip packaging patch component only needs to place the chip on the placement table 3 when in use, cover the cover plate 6, and use the pressure buckle 5 to fix the packaged chip to complete the packaging of the semiconductor discrete device, and then the packaging work is carried out. The device is easy to use, the fixing method is firm, and the chip is effectively packaged, which facilitates the subsequent packaging and selling work. At the same time, the device is designed with a connecting mechanism to facilitate the connection between two identical devices as a whole, and can simultaneously connect and package multiple integrated packaged chips, which is very efficient.
[0029] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. A laser chip packaging patch assembly, characterized in that: including a fixed packaging mechanism; The fixed packaging mechanism comprises a base (1), a support column (2) is fixedly installed above the base, a placement platform (3) is fixedly provided inside the support column (2) at a middle position of the support column (2), a rubber pad (4) is fixedly provided above the placement platform (3), and pressure buckles (5) are fixedly provided at the front and rear of the outside of the support column (2); A cover plate (6) is fixedly provided above the support column (2), grooves (7) are fixedly provided above the cover plate (6) near four corners, a glass (8) is fixedly provided in the middle of the cover plate (6), and a fixed downward pressure column (9) is fixedly provided below the cover plate (6) at the corners of the glass (8).
2. A laser chip package assembly according to claim 1, characterized in that: A connecting mechanism is fixedly installed in front of the fixed packaging mechanism, the connecting mechanism comprises a latching tooth (10), and a latching groove (11) is fixedly provided at one end of the other end of the base (1) away from the latching tooth (10), and fixing blocks (12) are fixedly provided at both ends of the latching groove (11).
3. A laser chip package patch assembly according to claim 2, characterized in that: A support block (13) is fixedly arranged above the fixed block (12), a rotating shaft (14) is fixedly arranged above the supporting block (13), and a clamping block (15) is fixedly arranged above the rotating shaft (14).
4. A laser chip package patch assembly according to claim 3, characterized in that: A cushion block (16) is fixedly provided on one end of the inner side of the rotating shaft (14) close to the card slot (11), and a pressure plate (17) is fixedly provided on the right end of the rotating shaft (14) away from the card slot (11).
5. The laser chip package assembly according to claim 2, characterized in that: Connecting blocks (18) are fixedly provided at both ends of the clamping teeth (10), a clamping plate (19) is fixedly provided above the pressure buckle (5), and a rotating core (20) is fixedly provided on the outer side of the clamping plate (19).
6. The laser chip package assembly according to claim 5, characterized in that: A pressure plate (21) is fixedly provided on the right side of the rotating core (20) away from the clamping plate (19), and an elastic connecting rope (22) is fixedly provided on the upper part of the pressure plate (21) at the connection part with the clamping plate (19).