Laser etching machine

Abstract

The utility model relates to the technical field of stainless steel plate production equipment, and provides a laser etching machine which comprises an etching pool, a laser irradiation device and a control system, the etching pool comprises side walls on two sides, end walls at two ends and a pool bottom, and the pool bottom is a light-transmitting glass wall surface; a pair of guide grooves are formed in the inner wall face of the side wall in the length direction of the side wall, the guide grooves form through openings in the two ends of the side wall and sink in the height direction of the side wall, and the top face of each end wall is higher than the lowest sinking position of the corresponding guide groove but not higher than the groove bottom of the corresponding through opening; the laser irradiation device is suitable for irradiating a laser beam to the etching pool from the lower part of the pool bottom; the laser etching machine further comprises a translation device, and the translation device is suitable for enabling a stainless steel plate to penetrate through the etching pool along a path formed by the pair of guide grooves. According to the invention, the line production of laser etching treatment is realized, and the treatment efficiency is higher.

Description

Technical Field

[0001] The utility model relates to the technical field of stainless steel production and processing equipment, in particular to a laser-etching composite processing machine suitable for the surface of a stainless steel plate. Background Art

[0002] Colored stainless steel plates are widely used in elevator car decoration, kitchen and bathroom and hardware appliance finishing, as well as indoor and outdoor decoration. Etching treatment can form an intaglio pattern on the surface of stainless steel plates, which is a new type of stainless steel plate surface modification technology.

[0003] Some etching devices in the prior art use an etching pool to immerse the stainless steel plate in the etching solution to complete the etching process, such as the utility model patent with publication number CN219793186U, entitled "A square wave etching device for stainless steel plate". There are also utility model patents that use the etching solution to spray on the surface of the stainless steel plate to complete the etching process, such as the utility model patent with publication number CN219174623U, entitled "A spray device for mold etching". The former has a relatively good etching effect, but the processing time is longer, while the latter is the opposite.

[0004] In order to achieve a relatively good etching effect in a shorter time, the prior art has proposed a laser-etching composite treatment solution. For example, the utility model patent with publication number CN218175111U, entitled "A laser-induced etching device", can improve the etching efficiency and can also heat a specific area of ​​a stainless steel plate by laser irradiation to etch the specific area, thereby forming a set etching pattern on the surface of the stainless steel plate.

[0005] Flow operation is very important for production efficiency and production stability in actual production. However, the laser generator located above the etching pool affects the loading and unloading of stainless steel plates, which makes it difficult to achieve flow operation in the above solution, and there is room for further improvement in processing efficiency. Utility Model Content

[0006] The laser etching machine provided in the embodiment of the present application solves the impact of the integration of the laser generating device and the etching pool in the etching processing system on the loading and unloading of stainless steel plates, realizes the flow operation of laser etching processing, and has a higher processing efficiency.

[0007] An embodiment of the present application provides a laser etching machine, including an etching pool suitable for etching processing, a laser irradiation device, and a control system, wherein the etching pool includes side walls on both sides, end walls at both ends, and a pool bottom, at least the pool bottom is a light-transmitting glass wall surface; along the length direction of the side wall, a pair of guide grooves are arranged on the inner wall surface of the side wall, the guide grooves form through openings at both ends of the side wall, and sink along the height direction of the side wall, wherein the top surface of the end wall is higher than the lowest point of the sinking of the guide groove but not higher than the groove bottom height of the through opening; the laser irradiation device is suitable for irradiating a laser beam from below the pool bottom to the etching pool; the laser etching machine also includes a translation device, which is suitable for passing a stainless steel plate through the etching pool along the path formed by the pair of guide grooves.

[0008] Preferably, along the length direction of the side wall, the guide groove can be divided into a loading guide section, a sinking section and a unloading guide section; along the height direction of the side wall, the loading guide section and the unloading guide section are arranged at the same height horizontally, and the sinking section sinks; at least the groove heights at each location of the sinking section are equal.

[0009] Preferably, the sinking section has an arc-shaped sinking path.

[0010] Preferably, the sinking amount of the lowest point of the sinking section is 3-10 cm.

[0011] Preferably, the laser irradiation device is arranged below the pool bottom via a scanning device, and the scanning device is suitable for moving the laser irradiation device along a set path.

[0012] Preferably, the scanning device includes a longitudinal track, a transverse track capable of moving along the longitudinal track, an electric slider capable of moving along the transverse track, and a mounting platform fixedly mounted on the electric slider, and the laser irradiation device is fixedly mounted on the mounting platform; the longitudinal track has a path similar to the guide path of the guide groove.

[0013] Preferably, the scanning device further comprises a lifting base, and the longitudinal rail is fixedly mounted on a lifting working surface of the lifting base.

[0014] Preferably, the translation device is suitable for moving the stainless steel plate from above the etching pool, including a gantry track arranged along the length direction of the side wall, a gantry beam arranged across the etching pool, a servo screw mechanism driving the gantry beam to move along the gantry track, and a vacuum adsorption unit installed on the gantry beam through a lifting mechanism.

[0015] Preferably, the vacuum adsorption unit includes a vacuum adsorption platform, an elastic gasket installed on the adsorption surface of the vacuum adsorption platform, a vacuum air source connected to the pipeline of the vacuum adsorption platform, and a vacuum pump, and the elastic gasket has adsorption holes corresponding one-to-one to the air holes on the vacuum adsorption platform.

[0016] Preferably, the top surface height of the end wall located on the material discharge side is lower than the setting height of the through opening formed by the guide groove on this side.

[0017] A laser etching machine provided in an embodiment of the present application has a translation device disposed above an etching pool, which is suitable for loading and unloading stainless steel plates, while a laser irradiation device is disposed below the etching pool, which is suitable for providing laser beam irradiation to the stainless steel plates. Therefore, integrating the laser irradiation device in the etching system does not affect the loading and unloading of the stainless steel plates, and can realize the assembly line operation of laser etching of stainless steel plates, has relatively high processing efficiency, and is suitable for mass production.

[0018] Furthermore, the longitudinal track has a path similar to the guide path of the guide groove, so when the laser irradiation device irradiates the etched surface of the stainless steel plate according to the set scanning path, no matter where the laser irradiation device moves, its distance from the stainless steel plate is always the same, thereby ensuring that the etching degree at various locations on the stainless steel plate is similar. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative labor.

[0020] Figure 1 A structural schematic diagram of a laser etching machine provided in an embodiment of the present application.

[0021] Figure 2 for Figure 1 Schematic diagram of the cross section of AA.

[0022] Figure 3 for Figure 2 A partial enlarged view of point B in the middle.

[0023] Figure 4 A schematic diagram of the structure of the vacuum adsorption unit provided in an embodiment of the present application.

[0024] In the above figure: 1. etching pool, 11. side wall, 12. end wall, 13. pool bottom, 2. laser irradiation device, 3. guide groove, 31. loading guide section, 32. sinking section, 33. unloading guide section, 4. translation device, 41. gantry track, 42. gantry beam, 43. lifting mechanism, 44. vacuum adsorption unit, 441. vacuum adsorption platform, 442. elastic gasket, 443. adsorption hole, 5. scanning device, 51. longitudinal track, 52. transverse track, 53. electric slider, 54. installation platform, 55. lifting base, 6. stainless steel plate. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this application.

[0026] Embodiment 1: Figure 1-4 A laser etching machine is shown as an example in general. A laser etching machine of an embodiment of the present application can widely include an etching pool 1 suitable for etching treatment, a laser irradiation device 2 suitable for providing laser beam irradiation, a pair of guide grooves 3 suitable for forming a moving conveying path of a stainless steel plate 6, a translation device 4 suitable for passing the stainless steel plate 6 through the etching pool 1 along the path formed by the pair of guide grooves 3, and a control system suitable for controlling the action execution of the laser irradiation device 2 and the translation device 4. The control system can be of any suitable type in the prior art.

[0027] The etching pool 1 of the laser etching machine includes side walls 11 on both sides, end walls 12 at both ends, and a pool bottom 13, at least the pool bottom 13 is a light-transmissive glass wall. The side walls 11 on both sides extend downward, and together with the pool bottom 13, form a lower space of the etching pool 1. The etching pool 1 is connected to an external etching liquid storage tank through a prior art reagent circulation system to pass etching liquid into the etching pool 1, or replace the etching liquid in the etching pool 1. The external etching liquid storage tank can also have a heating function to pass etching liquid with a temperature required by the process into the etching pool 1.

[0028] The laser irradiation device 2 of the laser etching machine is installed in the space below the etching pool 1, and can irradiate the laser beam to the etching pool 1 from below the pool bottom 13. The laser irradiation device 2 can be any suitable type in the prior art, at least including a laser irradiation box, a laser generator installed in the laser irradiation box, and a galvanometer mechanism. The difference is that the placement direction of the laser irradiation box is adjusted so that the emission direction of the laser emitter is facing upward, and the galvanometer mechanism is set above the laser generator.

[0029] The side walls 11 on both sides of the etching pool 1 extend upward at the same time, and a pair of guide grooves 3 of the laser etching machine are formed by hollowing out and are opened on the inner wall surface of the upper extension part of the side wall 11. The guide groove 3 penetrates along the length direction of the side wall 11, and forms through openings at both ends of the side wall 11. At the same time, the guide groove 3 sinks along the height direction of the side wall 11. In order to make the guide path formed by the pair of guide grooves 3 unobstructed and enable the guide groove 3 to guide the stainless steel plate 6 to be immersed in the etching liquid, the top surface of the end wall 12 should be higher than the lowest point of the sinking of the guide groove 3 but not higher than the groove bottom height of the through opening.

[0030] In this embodiment, along the length direction of the side wall 11 , the guide groove 3 can be divided into a loading guide section 31 , a sinking section 32 and a unloading guide section 33 .

[0031] Along the height direction of the side wall 11, the feeding guide section 31 and the unloading guide section 33 are arranged horizontally at the same height, and the sinking section 32 sinks. Preferably, the sinking section 32 has an arc-shaped sinking path, and the sinking amount at the lowest point of the sinking section 32 is 3-10 cm. The groove heights of the sinking section 32 are equal at various locations. The groove height of the feeding guide section 31 gradually decreases from the through opening on the feeding side until it is equal to the sinking section 32, and the groove height of the unloading guide section 33 gradually decreases from the through opening on the unloading side until it is equal to the sinking section 32. If the sinking amount of the sinking section 32 exceeds 5 cm, the feeding guide section 31 and the sinking section 32, and the sinking section 32 and the unloading guide section 33 should be connected through a circular arc surface transition.

[0032] For example, the feeding guide section 31 and the unloading guide section 33 have a horizontally arranged groove bottom surface and an inclined groove top surface, the groove height of the through opening is 4 cm, the groove height of the sinking section 32 is 2 cm, the sinking section 32 sinks in an arc shape, and the sinking amount at the lowest point is 8 cm. In other words, the distance between the lowest point of the groove bottom of the sinking section 32 and the plane where the groove bottom of the feeding guide section 31 or the unloading guide section 33 is located is 8 cm. The groove width of the guide groove 3 at each location is 4 cm. The distance between the top surface of the end wall 12 and the plane where the groove bottom of the feeding guide section 31 or the unloading guide section 33 is located is 1 cm. The distance between the side walls 11 on both sides is 1212 mm, and the distance between the groove walls of the guide groove 3 on both sides is 1220 mm.

[0033] The translation device 4 of the laser etching machine is suitable for moving the stainless steel plate 6 through the etching pool 1 along the path formed by the pair of guide grooves 3. Preferably, the translation device 4 is suitable for moving the stainless steel plate 6 from above the etching pool 1.

[0034] The translation device 4 provided in this embodiment includes a gantry track 41 arranged along the length direction of the side wall 11, a gantry beam 42 arranged across the etching pool 1, a servo screw mechanism driving the gantry beam 42 to move along the gantry track 41, and a vacuum adsorption unit 44 installed at the length center of the gantry beam 42 through a lifting mechanism 43. The gantry track 41, the gantry beam 42, the servo screw mechanism, and the lifting mechanism 43 can all be any suitable type in the prior art, and it is only necessary to realize that the gantry beam 42 is driven by the servo screw mechanism to move along the gantry track 41, and the vacuum adsorption unit 44 is driven by the lifting mechanism 43 to be able to rise and fall.

[0035] The vacuum adsorption unit 44 is improved based on the vacuum adsorption plate of the prior art. The vacuum adsorption unit 44 includes a vacuum adsorption platform 441, an elastic gasket 442 installed on the adsorption surface of the vacuum adsorption platform 441, a vacuum air source connected to the vacuum adsorption platform 441 pipeline, a vacuum pump, etc. The elastic gasket 442 has a larger format than the vacuum adsorption platform 441, and is provided with adsorption holes 443 corresponding to the air holes on the vacuum adsorption platform 441. The elastic gasket 442 is a rubber sheet with a thickness of 2-5 cm. Through the setting of the elastic gasket 442, the vacuum adsorption platform 441 can adapt to the bending deformation of the stainless steel plate 6 after entering the guide groove 3, so as to always maintain the adsorption force on the stainless steel plate 6 and maintain the stable transportation of the stainless steel plate 6.

[0036] Taking the processing of a stainless steel plate 6 with a thickness of 0.6 mm and a width of 1219 mm as an example, the laser etching machine provided in this embodiment can work according to the following method:

[0037] First, the vacuum adsorption unit 44 grabs the stainless steel plate 6 with the etching surface facing downward and the back surface facing upward. The stainless steel plate 6 should be cleaned with ionized water before grabbing. At the same time, the etching liquid is introduced into the etching pool 1. The liquid level of the etching liquid is controlled to be 1-1.5 cm from the top surface of the end wall 12 by a liquid level sensor or by calculating the amount of the etching liquid, and the laser irradiation device 2 is turned on.

[0038] Subsequently, the gantry beam 42 is moved along the direction of the gantry track 41 so that the stainless steel plate 6 moves toward the etching pool 1 and the stainless steel plate 6 enters the loading guide section 31, the sinking section 32 and the unloading guide section 33 in sequence; after the stainless steel plate 6 enters the sinking section 32, it is limited by the sinking section 32 and bends without affecting its mechanical strength, and is partially immersed in the etching solution and irradiated by the laser irradiation device 2; the stainless steel plate 6 passes through the sinking section 32 at a uniform speed, and the laser etching processing time of the stainless steel plate 6 can be controlled by controlling the passing speed, until the stainless steel plate 6 leaves the unloading guide section 33 and completes the laser etching processing;

[0039] Finally, the translation device 4 continues to transport the stainless steel plate 6 to the next process, such as an ion water cleaning process and a drying process.

[0040] Embodiment 2: The laser irradiation device 2 provided in this embodiment is arranged close to the loading side, and the laser irradiation device 2 is arranged below the pool bottom 13 through the scanning device 5, and the scanning device 5 is suitable for moving the laser irradiation device 2 along a set path.

[0041] Specifically, the scanning device 5 includes a longitudinal track 51, a transverse track 52 that can move along the longitudinal track 51, an electric slider 53 that can move along the transverse track 52, and a mounting platform 54 fixedly mounted on the electric slider 53, and the laser irradiation device 2 is fixedly mounted on the mounting platform 54. The longitudinal track 51 has a path similar to the guide path of the guide groove 3. The longitudinal track 51 provided in this embodiment corresponds to the feeding guide section 31 and the sinking section 32, so the longitudinal track 51 also has a straight section and an arc section, the straight section is parallel to the bottom surface of the groove of the feeding guide section 31 and is of equal length, and the arc section has a similar arc degree and is of equal length to the sinking section 32. The track structure of the longitudinal track 51 can be of the prior art, for example, a pair of tracks with a "T"-shaped track groove. The transverse track 52 can be any suitable type in the prior art, which is arranged across a pair of longitudinal tracks 51 and has an electric running wheel that can travel along the longitudinal track 51. The electric slider 53 can move along the transverse track 52 through a screw servo mechanism and can support the mounting platform 54. The mounting platform 54 is screwed on the top surface of the electric slider 53, and the laser irradiation device 2 is screwed on the mounting platform 54.

[0042] With the above structure, when the laser irradiation device 2 irradiates the etched surface of the stainless steel plate 6 according to the set scanning path, no matter where the laser irradiation device 2 moves, its distance from the stainless steel plate 6 is always the same, thereby ensuring that the etching degree at various locations on the stainless steel plate 6 is similar.

[0043] Preferably, the scanning device 5 further includes a lifting base 55, and the longitudinal rail 51 is fixedly mounted on the lifting working surface of the lifting base 55 by screwing. The lifting base 55 can be any suitable type in the prior art, suitable for adjusting the distance between the laser irradiation device 2 and the stainless steel plate 6. For example, the lifting base 55 includes a hydraulic cylinder and a support platform.

[0044] The above description is intended to be illustrative and not limiting. Upon reading the above description, many embodiments and many applications beyond the examples provided will be apparent to those skilled in the art. Therefore, the scope of the present teachings should not be determined with reference to the above description, but should be determined with reference to the appended claims and the full scope of equivalents to which such claims are entitled. For the purpose of comprehensiveness, all articles and references, including disclosures of patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended to be a waiver of the subject matter, nor should it be considered that the applicant has not considered the subject matter to be part of the disclosed application subject matter.

Claims

1. A laser etching machine, comprising an etching pool (1) suitable for etching, a laser irradiation device (2), and a control system, characterized in that: The etching pool (1) comprises side walls (11) on both sides, end walls (12) at both ends, and a pool bottom (13), at least the pool bottom (13) is a light-transmissive glass wall surface; along the length direction of the side wall (11), a pair of guide grooves (3) are arranged on the inner wall surface of the side wall (11), the guide grooves (3) form through openings at both ends of the side wall (11) and sink along the height direction of the side wall (11), wherein the top surface of the end wall (12) is higher than the lowest point of the sinking of the guide groove (3) but not higher than the groove bottom height of the through opening; the laser irradiation device (2) is suitable for irradiating a laser beam from below the pool bottom (13) to the etching pool (1); the laser etching machine also comprises a translation device (4), the translation device (4) is suitable for passing a stainless steel plate (6) through the etching pool (1) along a path formed by the pair of guide grooves (3).

2. The laser etching machine according to claim 1, characterized in that: Along the length direction of the side wall (11), the guide groove (3) can be divided into a loading guide section (31), a sinking section (32) and a unloading guide section (33); along the height direction of the side wall (11), the loading guide section (31) and the unloading guide section (33) are arranged at the same height horizontally, and the sinking section (32) sinks; at least the groove heights at various locations of the sinking section (32) are equal.

3. The laser etching machine according to claim 2, characterized in that: The sinking section (32) presents an arc-shaped sinking path.

4. The laser etching machine according to claim 2, characterized in that: The sinking amount of the lowest part of the sinking section (32) is 3-10 cm.

5. The laser etching machine according to claim 1, characterized in that: The laser irradiation device (2) is arranged below the pool bottom (13) via a scanning device (5), and the scanning device (5) is suitable for moving the laser irradiation device (2) along a set path.

6. The laser etching machine according to claim 5, characterized in that: The scanning device (5) comprises a longitudinal track (51), a transverse track (52) capable of moving along the longitudinal track (51), an electric slider (53) capable of moving along the transverse track (52), and a mounting platform (54) fixedly mounted on the electric slider (53), and the laser irradiation device (2) is fixedly mounted on the mounting platform (54); the longitudinal track (51) has a path similar to the guide path of the guide groove (3).

7. The laser etching machine according to claim 6, characterized in that: The scanning device (5) further comprises a lifting base (55), and the longitudinal track (51) is fixedly mounted on a lifting working surface of the lifting base (55).

8. The laser etching machine according to claim 1, characterized in that: The translation device (4) is suitable for moving the stainless steel plate (6) from above the etching pool (1), and comprises a gantry track (41) arranged along the length direction of the side wall (11), a gantry beam (42) arranged across the etching pool (1), a servo screw mechanism for driving the gantry beam (42) to move along the gantry track (41), and a vacuum adsorption unit (44) installed on the gantry beam (42) through a lifting mechanism (43).

9. The laser etching machine according to claim 8, characterized in that: The vacuum adsorption unit (44) comprises a vacuum adsorption platform (441), an elastic gasket (442) mounted on the adsorption surface of the vacuum adsorption platform (441), a vacuum air source connected to the pipeline of the vacuum adsorption platform (441), and a vacuum pump; the elastic gasket (442) has adsorption holes (443) corresponding one-to-one to the air holes on the vacuum adsorption platform (441).

10. The laser etching machine according to claim 1, characterized in that: The top surface height of the end wall (12) located on the material discharge side is lower than the setting height of the through opening formed by the guide groove (3) on this side.

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