Packaging body

Abstract

The utility model relates to the technical field of sensors, and discloses a packaging body, which comprises a shell, the surface of the shell is provided with a first groove and a second groove communicated with the first groove, and the inner surface of the second groove is provided with a clamping groove; the magnetic core is fixed in the first groove; the side face of the semiconductor device is provided with a glue overflowing protrusion corresponding to the clamping groove, and the semiconductor device is clamped and fixed in the second groove through the glue overflowing protrusion and the clamping groove, so that the semiconductor device is further fixed through overflowing glue on the side face of the semiconductor device; the parallelism problem between the Hall wheel speed sensor magnetic core and the semiconductor is solved, and the stability of the magnetic field is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of sensors, in particular to a packaging body. Background Art

[0002] With the development trend of intelligentization in the modern automobile industry, wheel speed is essential information. Vehicle dynamic control system (VDC), electronic stability program (ESP), anti-lock braking system (ABS), automatic transmission control system, etc. all need wheel speed information. These components are related to the stability of vehicle driving, so detecting wheel speed is particularly critical. Wheel speed sensor is a component used to measure the speed of automobile wheels. At present, there are two main types of wheel speed sensors that are more common: magnetoelectric wheel speed sensor and Hall wheel speed sensor. Among them, the Hall wheel speed sensor uses the Hall effect principle, that is, a control current is passed through the two ends of the semiconductor, and a magnetic core is mounted in the vertical direction of the semiconductor device to apply a magnetic field with a magnetic field strength of B. Then, a potential proportional to the product of the control current and the magnetic induction intensity B will be generated at the other two ends of the semiconductor device. This is the Hall potential. This places requirements on the position between the magnetic field and the semiconductor. Currently, the wheel speed sensors on the market are mainly of straight-plug type. In actual application, they need to be bent at the specified position of the pin. However, due to the bending resistance of metal, the springback of the pin after actual bending will cause the magnetic core and the semiconductor device to be non-parallel, affecting the magnetic field strength and thus the product function. Therefore, controlling the parallelism between the magnetic core and the semiconductor is of great significance to the performance of the Hall-type wheel speed sensor. Utility Model Content

[0003] The utility model aims to overcome the problem that the magnetic core and the semiconductor are not parallel to each other due to the springback of the pin, and provides a packaging body.

[0004] In order to achieve the above object, the utility model provides a package body, comprising:

[0005] A shell, wherein the surface of the shell has a first groove and a second groove connected to the first groove, and the inner surface of the second groove has a clamping groove;

[0006] a magnetic core, wherein the magnetic core is fixed in the first groove;

[0007] A semiconductor device, wherein the side surface of the semiconductor device has a glue overflow protrusion corresponding to the clamping slot, and the semiconductor device is fixed in the second groove by the clamping engagement between the glue overflow protrusion and the clamping slot.

[0008] As an implementation method, the inner surface of the second groove includes the inner bottom surface of the second groove and the inner wall of the second groove, the card groove includes a transverse card groove portion and a longitudinal card groove portion, the transverse card groove portion extends transversely along the inner bottom surface of the second groove, the longitudinal card groove portion extends longitudinally along the inner wall of the second groove and is connected with the transverse card groove portion, and the semiconductor device has a surrounding glue overflow protrusion on the side contacting the inner surface of the second groove.

[0009] As an implementation method, the semiconductor device includes a semiconductor device body and a pin connected to the semiconductor device body, the semiconductor device body is fixed in the second groove, the pin extends from the opening of the second groove, the pin has a first bending portion, and the pin is bent toward the shell surface through the first bending portion and extends along the shell surface.

[0010] As an implementation method, the housing surface is in contact with the pins.

[0011] As an implementation manner, the second groove is located on the first end surface of the shell, and the first groove is located between the first end of the shell and the second end of the shell.

[0012] As an implementation method, the second end surface of the housing has a pin mounting area, the first end of the pin is connected to the semiconductor device body, and the second end of the pin is connected to the pin mounting area.

[0013] As an implementation method, a first inclined portion is provided between the second end of the pin and the first bending portion and is inclined downward toward the second end of the pin, and the shell surface has a first inclined surface corresponding to the first inclined portion.

[0014] As an implementation method, the end surface of the first end portion of the shell has a shell opening, and the second groove is connected to the shell opening.

[0015] As an implementation method, the housing surface is in contact with the pins.

[0016] As an implementation method, the magnetic core is a semi-cylinder, one end face of the magnetic core is a plane and faces the semiconductor device, the other end face of the magnetic core is a plane and faces the inner wall of the first groove, the bottom surface of the magnetic core is a plane, and the side surface of the magnetic core is a curved surface and is respectively connected to the inner surface of the first groove.

[0017] As an implementation method, there is a gap between the magnetic core and the semiconductor device.

[0018] Beneficial effects of the utility model:

[0019] The utility model discloses a packaging body, comprising: a shell, a surface of the shell having a first groove and a second groove connected to the first groove, an inner surface of the second groove having a card slot; a magnetic core, the magnetic core being fixed in the first groove; a semiconductor device, a side surface of the semiconductor device having a glue overflow protrusion corresponding to the card slot, the semiconductor device being fixed in the second groove by engaging the glue overflow protrusion with the card slot, so that the semiconductor device is further fixed by utilizing the glue overflow on the side surface of the semiconductor device, thereby solving the problem of parallelism between the magnetic core and the semiconductor of the Hall wheel speed sensor and ensuring the stability of the magnetic field.

[0020] The utility model limits the semiconductor device by retaining the overflow glue around the semiconductor device, and the pin is designed to be bent and the pin position is limited by the pin mounting area, so that the position of the semiconductor in the Hall wheel speed sensor will not be offset, and at the same time, the bending point of the pin is prevented from being broken due to concentrated force under dynamic conditions, thereby ensuring the normal operation of the sensor and improving the reliability of the Hall wheel speed sensor and the safety level of the vehicle. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of a package provided by some embodiments of the utility model;

[0022] Figure 2 A schematic diagram of a housing of a package provided by some embodiments of the utility model;

[0023] Figure 3 A schematic diagram of a magnetic core of a package provided by some embodiments of the utility model;

[0024] Figure 4 Schematic diagram of a semiconductor device of a package body provided in some embodiments of the present invention. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] The technical terms or scientific terms used in this application should be understood by those skilled in the art in the ordinary sense. The terms "first", "second" and similar words used in the specification and claims of this application do not indicate any order, quantity or importance, but are only used to distinguish different components. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. It should be noted that the terms "including" and "having" and their variations involved in this application are intended to cover non-exclusive inclusions. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" is two or more. The "upper", "lower", etc. used in this application are defined based on the orientation shown in the figure. It should be understood that these directional terms are relative concepts, which are used for description and clarification relative to, and they can change accordingly according to the change of the orientation in which the chip stack package is placed.

[0027] In this application document, unless otherwise clearly specified and limited, the terms "connected", "connection", etc. should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] See also Figures 1 to 4 Some embodiments of the utility model provide a package body, including: a shell 100, wherein the surface of the shell 100 has a first groove 110 and a second groove 120 connected to the first groove 110, and the inner surface of the second groove 120 has a card slot 130; a magnetic core 300, wherein the magnetic core 300 is fixed in the first groove 110; and a semiconductor device 200, wherein the side surface of the semiconductor device 200 has a glue overflow protrusion 221 corresponding to the card slot 130, and the semiconductor device 200 is fixed in the second groove 120 by the engagement of the glue overflow protrusion 221 and the card slot 130.

[0029] In some embodiments, after the semiconductor device is plastic-sealed, it is necessary to remove excess glue on the side of the plastic package to reduce the risk of contamination and improve the product appearance. However, the utility model comprehensively considers the application environment and packaging characteristics of the Hall-type wheel speed sensor, retains the glue-overflowing protrusion on the side of the plastic package, and designs a slot at the position of the Hall sensor housing corresponding to the glue-overflowing protrusion of the plastic package, and uses the glue-overflowing protrusion to limit the semiconductor device, thereby ensuring the parallelism between the semiconductor device and the magnetic core.

[0030] In some embodiments, see Figure 2The surface of the housing 100 has a first groove 110, the first groove 110 is used to place the magnetic core 300, the side wall of the first groove 110 has a groove opening 111, the first groove 110 is connected to the second groove 120 through the groove opening 111, in some embodiments, the surface of the housing 100 has a second groove 120, the second groove 120 is used to place the semiconductor device 200, in some embodiments, the second groove 120 is located on the first end surface of the housing 100, and the first groove 110 is located between the first end of the housing 100 and the second end of the housing. In some embodiments, the end surface of the first end of the housing 100 has a shell opening 101, and the second groove 120 is connected to the shell opening 101. In some embodiments, the inner surface of the second groove 120 includes the inner bottom surface of the second groove 120 and the inner wall of the second groove 120, and the clamping groove 130 includes a transverse clamping groove portion 131 and a longitudinal clamping groove portion 132, wherein the transverse clamping groove portion 131 extends transversely along the inner bottom surface of the second groove, and the longitudinal clamping groove portion 132 extends longitudinally along the inner wall of the second groove and is connected to the transverse clamping groove portion 131. In other embodiments, the clamping groove 130 may also only include the longitudinal clamping groove portion 132 to fix the semiconductor device 200.

[0031] In some embodiments, the second groove 120 is located on the first end surface of the housing 100, and the second end surface of the housing 100 has a pin mounting area 150 for welding the pins 210. In some embodiments, the first groove 110 is located between the first end of the housing 100 and the second end of the housing 100. In some embodiments, the housing surface between the first groove 110 and the pin mounting area 150 has a first inclined surface 140 that is inclined downward toward the pin mounting area 150. In other embodiments, the first inclined surface 140 may also be inclined upward toward the pin mounting area 150.

[0032] The utility model further defines the pin position by welding the pin 210 through the pin mounting area 150 to exchange information with external components, thereby preventing the first bent portion 211 of the pin 210 from being fractured due to concentrated force under dynamic conditions, thereby affecting the reliability of the Hall-type wheel speed sensor and the vehicle. The present embodiment further improves stability by designing the first inclined surface 140.

[0033] In some embodiments, see Figure 3, the magnetic core 300 may be a semi-cylinder, one end face 303 of the magnetic core is a plane and faces the semiconductor device 200, the other end face 303 of the magnetic core is a plane and faces the inner wall of the first groove 110, the bottom face 301 of the magnetic core is a plane, and the side face 302 of the magnetic core is a curved surface, which are respectively connected to the inner surface of the first groove 110; specifically, the bottom face 301 of the magnetic core is connected to the inner bottom face of the first groove 110, and the side face 302 of the magnetic core is connected to the inner wall of the first groove 110. In one embodiment, the side face 302 of the magnetic core and the inner wall of the first groove 110 may be fixed by the extrusion between the two when in contact, or may be further connected by an adhesive. In other embodiments, the magnetic core 300 may also be a cylinder, one end face of the magnetic core 300 is a plane and faces the semiconductor device, the other end face of the magnetic core 300 is a plane and faces the inner wall of the first groove 110, the bottom surface of the magnetic core is a curved surface, and the side surface of the magnetic core 300 is a curved surface and is respectively connected to the inner surface of the first groove 110.

[0034] In this embodiment, the side surface of the magnetic core 300 that contacts the inner wall of the first groove 110 is set as a curved surface, so as to prevent the corner of the magnetic core from being damaged due to collision during assembly and transportation, thereby preventing the device performance from being affected. In this embodiment, the bottom surface of the magnetic core 300 is further set as a flat surface to further stabilize the magnetic core 300.

[0035] In some embodiments, see Figure 4The semiconductor device 200 includes a semiconductor device body 220 and a pin 210 connected to the semiconductor device body 220. The semiconductor device body 220 is fixed in the second groove 120. The pin 210 is located on a side of the semiconductor device body 220. The pin 210 extends from the opening of the second groove 120. The pin 210 has a first bending portion 211. The pin 210 is bent toward the surface of the housing 100 through the first bending portion 211 and extends along the surface of the housing 100. In some embodiments, the pin 210 can extend along an interface that is parallel or substantially parallel to the surface of the housing 100. In some embodiments, the surface of the housing 100 is in contact with the pin 210. In some embodiments, the first end of the pin 210 is connected to the semiconductor device body 220, and the second end of the pin 210 is connected to the pin mounting area 150. In some embodiments, when the slot 130 includes a transverse slot portion 131 and a longitudinal slot portion 132, the semiconductor device body 220 may have overflow protrusions 221 corresponding to the slot 130 on the three sides in contact with the inner surface of the second groove 120. When the slot 130 only includes a longitudinal slot portion 132, the semiconductor device body 220 may also form overflow protrusions 221 corresponding to the slot 130 on the two sides in contact with the inner surface of the second groove 120. In some embodiments, the semiconductor device body 220 is a plastic package body, and the overflow glue around the semiconductor device body 220 is the overflow glue protrusion 221 naturally formed during the plastic packaging process, which does not require additional processing. The size and distribution position of the slot 130 in the second groove 120 can be designed according to the overflow glue protrusion 221.

[0036] In some embodiments, the surface of the housing 100 is in contact with the pins 210 to achieve support.

[0037] In some embodiments, a first inclined portion 212 is provided between the second end of the pin 210 and the first bent portion 211, and is inclined downward toward the second end of the pin 210. The first inclined portion 212 corresponds to the first inclined surface 140 on the surface of the housing 100, further stabilizing the pin 210. In other embodiments, the first inclined portion 212 may also be inclined upward toward the second end of the pin 210.

[0038] In some embodiments, the magnetic core 300 and the semiconductor device 200 may be spaced apart or in contact with each other according to the required magnetic field strength.

[0039] Although the utility model has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A package, characterized in that: include: A shell, wherein the surface of the shell has a first groove and a second groove connected to the first groove, and the inner surface of the second groove has a clamping groove; a magnetic core, wherein the magnetic core is fixed in the first groove; A semiconductor device, wherein the side surface of the semiconductor device has a glue overflow protrusion corresponding to the clamping slot, and the semiconductor device is fixed in the second groove by the clamping engagement between the glue overflow protrusion and the clamping slot.

2. The package according to claim 1, characterized in that: The inner surface of the second groove includes the inner bottom surface of the second groove and the inner wall of the second groove, the card groove includes a transverse card groove part and a longitudinal card groove part, the transverse card groove part extends transversely along the inner bottom surface of the second groove, the longitudinal card groove part extends longitudinally along the inner wall of the second groove and is connected with the transverse card groove part, and the semiconductor device has a surrounding glue overflow protrusion on the side contacting with the inner surface of the second groove.

3. The package according to claim 1, characterized in that: The semiconductor device includes a semiconductor device body and a pin connected to the semiconductor device body, the semiconductor device body is fixed in the second groove, the pin extends from the opening of the second groove, the pin has a first bending portion, the pin is bent toward the shell surface through the first bending portion and extends along the shell surface.

4. The package according to claim 3, characterized in that: The housing surface is in contact with the pins.

5. The package according to claim 3, characterized in that: The second groove is located on the first end surface of the housing, and the first groove is located between the first end of the housing and the second end of the housing.

6. The package according to claim 5, characterized in that: The second end surface of the housing has a pin mounting area, the first end of the pin is connected to the semiconductor device body, and the second end of the pin is connected to the pin mounting area.

7. The package according to claim 6, characterized in that: A first inclined portion is provided between the second end of the pin and the first bending portion and is inclined downward toward the second end of the pin, and the shell surface has a first inclined surface corresponding to the first inclined portion.

8. The package according to claim 5, characterized in that: The end surface of the first end portion of the housing has a housing opening, and the second groove is communicated with the housing opening.

9. The package according to claim 1, characterized in that: The magnetic core is a semi-cylinder, one end face of the magnetic core is a plane and faces the semiconductor device, the other end face of the magnetic core is a plane and faces the inner wall of the first groove, the bottom surface of the magnetic core is a plane, and the side surface of the magnetic core is a curved surface and is respectively connected to the inner surface of the first groove.

10. The package according to claim 1, characterized in that: There is a gap between the magnetic core and the semiconductor device.

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