Wafer feeding device and wafer testing equipment

Abstract

The utility model provides a wafer feeding device and wafer testing equipment, and relates to the technical field of wafer testing. The wafer feeding device provided by the utility model comprises a bearing piece and a plurality of limiting piece groups. The bearing part is arranged in the horizontal direction and used for bearing the material frame. The multiple limiting piece sets are installed at the top of the bearing piece, each limiting piece set comprises multiple limiting pieces used for limiting the material frames, the multiple limiting piece sets are used for limiting the material frames of different sizes, and wafers of different sizes are placed in the material frames of different sizes. In this way, the wafer feeding device can be compatible with wafers of different sizes, feeding of the wafers of different sizes is achieved, the feeding efficiency can be remarkably improved, and compared with the scheme that a switching clamp needs to be used when the wafers of different sizes are tested in the prior art, the structure and the feeding process of the wafer feeding device are simplified, and the wafer feeding efficiency is improved. And the feeding efficiency and the wafer testing efficiency are improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer testing, in particular to a wafer feeding device and wafer testing equipment. Background Art

[0002] Semiconductor chips refer to semiconductor devices that can achieve certain functions by etching and wiring on semiconductor sheets. With the development of science and technology, semiconductor chips have been widely used in various electronic products. After the mass production of semiconductor chips is completed, the quality of the chips needs to be tested to screen qualified chips. The screening process requires the use of semiconductor testing equipment.

[0003] In order to realize fully automatic testing, the existing chip tester is mainly composed of a wafer loader, a wafer tester and a wafer unloader. The wafer feeder is the core component of the wafer loading and unloading machine.

[0004] The existing wafer feeder can only accommodate wafers of one size. When testing wafers of other sizes, the entire wafer feeder needs to be disassembled and replaced with a wafer feeder of other sizes, which is time-consuming and has low feeding efficiency. Utility Model Content

[0005] An object of the first aspect of the utility model is to provide a wafer feeder to solve the technical problem in the prior art that the wafer feeder needs to be disassembled and assembled when testing wafers of different sizes, resulting in low feeding efficiency.

[0006] A further object of the first aspect of the utility model is to improve the accuracy of positioning the material frame.

[0007] The second aspect of the present invention aims to provide a wafer testing device comprising the above-mentioned wafer feeder.

[0008] According to the purpose of the first aspect of the utility model, the utility model provides a wafer feeding device, comprising:

[0009] The bearing member is arranged in the horizontal direction and is used for bearing the material frame;

[0010] A plurality of groups of limiter groups are installed on the top of the carrier, each group of the limiter groups includes a plurality of limiters for limiting the material frame, and the plurality of groups of the limiter groups are used to limit the material frames of different sizes respectively, and the material frames of different sizes are provided with wafers of different sizes.

[0011] Optionally, the bottom of the material frame is square;

[0012] The plurality of limiting members of each limiting member group are arranged in a square shape and are located outside the corresponding material frame to limit the position of the material frame.

[0013] Optionally, the plurality of the limiting members of any one of the limiting member groups are arranged on the inner side or the outer side of another group of the limiting member groups.

[0014] Optionally, any of the limiting members of any of the limiting member groups limits any side edge of the bottom of the corresponding material frame, and an extension direction of any of the limiting members is consistent with an extension direction of the corresponding side edge.

[0015] Optionally, an extension length of any of the position limiting members of any of the position limiting member groups is greater than an extension length of any of the position limiting members of any of the position limiting member groups located inside the position limiting member group.

[0016] Optionally,

[0017] The bearing member is provided with a plurality of mounting hole groups, and each mounting hole group corresponds to one of the position limiting member groups, so as to install the position limiting member groups.

[0018] Optionally, each group of the limiting component groups is provided with adjustment holes corresponding to the positions of the mounting hole groups, for adjusting the positions of the limiting component groups.

[0019] Optionally, an identification sensor is installed on the top of the carrier to identify the size of the material frame.

[0020] Optionally, the wafer feeding device further includes:

[0021] The driving member is connected to the bearing member and is used to drive the material frame to move vertically up and down.

[0022] According to the purpose of the second aspect of the utility model, the utility model also provides a wafer testing equipment, which includes the above-mentioned wafer feeding device.

[0023] The wafer feeding device of the utility model includes a carrier and a plurality of limiter groups. The carrier is arranged in the horizontal direction and is used to carry a material frame. The plurality of limiter groups are installed on the top of the carrier, and each limiter group includes a plurality of limiters for limiting the material frame. The plurality of limiter groups are used to limit material frames of different sizes respectively, and material frames of different sizes are provided with wafers of different sizes. In this way, the wafer feeding device can be compatible with wafers of different sizes and realize feeding of wafers of different sizes, which can significantly improve the feeding efficiency. Compared with the solution of using a transfer fixture when testing wafers of different sizes in the prior art, the structure of the wafer feeding device and the feeding process are simplified, and the feeding efficiency and wafer testing efficiency are improved.

[0024] Furthermore, in the wafer feeding device of the utility model, a mounting hole group is provided on the carrier, and each group of limiter groups is provided with an adjustment hole corresponding to the mounting hole group, which is used to adjust the position of the limiter group. In this way, the adjustment hole can guide the movement of the limiter, so that the limiter group can position the material frame according to the predetermined position, which is conducive to improving the accuracy of placing the material frame on the wafer feeding device.

[0025] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0027] Figure 1 is a schematic structural diagram of a wafer feeding device according to an embodiment of the utility model;

[0028] Figure 2 is a schematic front view of a wafer feeding device according to an embodiment of the utility model;

[0029] Figure 3 is a schematic left side view of a wafer feeding device according to an embodiment of the utility model;

[0030] Figure 4 is a schematic top view of a wafer feeding device according to an embodiment of the utility model;

[0031] Figure 5 yes Figure 1 A schematic structural diagram of the carrier plate shown;

[0032] Figure 6 yes Figure 1 A schematic structural diagram of the limiting member shown;

[0033] Figure 7 is a schematic assembly diagram of a material frame and a carrier according to an embodiment of the utility model;

[0034] Figure 8 yes Figure 1 A schematic structural diagram of the adjustment base is shown.

[0035] Description of reference numerals:

[0036] 100-wafer feeding device, 10-carrying member, 11-mounting hole group, 20-limiting member group, 21-limiting member, 22-adjusting hole, 30-identification sensor, 40-driving member, 50-connecting member, 60-guide member, 70-adjusting base, 71-first adjustment plate, 71-second adjustment plate, 73-height adjustment screw, 74-gasket, 80-reinforcement member, 200-material frame. DETAILED DESCRIPTION

[0037] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0038] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", etc., indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0039] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features, that is, include one or more of the features. In the description of the present utility model, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. When a feature "includes or contains" one or some of the features it covers, unless otherwise specifically described, this indicates that other features are not excluded and may further include other features.

[0040] Unless otherwise clearly defined and limited, the term "connection" and other terms should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. A person skilled in the art should be able to understand the specific meanings of the above terms in this utility model according to the specific circumstances.

[0041] Unless otherwise defined, all terms (including technical terms and scientific terms) used in the description of this embodiment have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0042] In the prior art, wafers are provided by wafer feeders to wafer testing machines for testing. Currently, there are two main ways to feed wafers. One is to make a 6-inch or 8-inch feeder based on the wafer size, and the other is to use an 8-inch feeder in conjunction with a transfer fixture to achieve compatibility between 6-inch and 8-inch wafers.

[0043] The first feeding method is only compatible with one size of wafer. When users need to change to other specifications of wafers, they need to disassemble the entire feeder and re-calibrate the accuracy. This solution is time-consuming and the overall process is not flexible and flexible. When using 6-inch wafers, the second feeding method requires the use of a transfer fixture to achieve compatibility between 6-inch and 8-inch wafers. The transfer fixture occupies the entire structural space of the feeder, which will reduce the overall feeder storage capacity by half.

[0044] In view of the above problems, an embodiment of the utility model provides a wafer feeding device 100 and a wafer loading device that overcome the above problems or at least partially solve the above problems, and can be compatible with material frames 200 of different sizes on which wafers are placed, thereby improving the practicality and feeding efficiency of the wafer feeding device 100.

[0045] Figure 1 is a schematic structural diagram of a wafer feeding device 100 according to an embodiment of the utility model. Figure 2 is a schematic front view of a wafer feeding device 100 according to an embodiment of the utility model. Figure 3 is a schematic left side view of a wafer feeding device 100 according to an embodiment of the utility model. Figure 4 is a schematic top view of a wafer feeding device 100 according to an embodiment of the utility model. Figure 5 yes Figure 1 The schematic structural diagram of the carrier plate shown in FIG. Figure 6 yes Figure 1 The schematic structural diagram of the limiting member 21 is shown in FIG. Figure 7 It is a schematic assembly diagram of a material frame 200 and a carrier 10 according to an embodiment of the utility model.

[0046] like Figure 1-Figure 5 As shown, the wafer feeding device 100 includes a carrier 10 and a plurality of position limiting member groups 20. The carrier 10 is arranged in a horizontal direction and is used to carry a material frame 200. The plurality of position limiting member groups 20 are installed on the top of the carrier 10, and each position limiting member group 20 includes a plurality of position limiting members 21 for limiting the material frame 200. The plurality of position limiting member groups 20 are used to limit the material frames 200 of different sizes, respectively, and the material frames 200 of different sizes are provided with wafers of different sizes.

[0047] Here, it can be understood that the carrier 10 is arranged in the horizontal direction, and the material frame 200 is placed above the carrier 10. Multiple groups of limiter groups 20 are installed on the top of the carrier 10, and each group of limiter groups 20 includes multiple limiters 21. The multiple limiters 21 in each limiter group 20 can limit the material frame 200 of one size, and different limiter groups 20 can limit the material frames 200 of different sizes respectively.

[0048] Wafers of different sizes can be placed in the material frames 200 of corresponding sizes, so that the wafer feeding device 100 can be compatible with wafers of different sizes, thereby feeding wafers of different sizes. When the wafer feeding device 100 feeds wafers, the wafers are first placed in the material frame 200 one by one, and then the material frame 200 is placed on the carrier 10. The limiting member group 20 on the carrier 10 positions the material frame 200 and limits the material frame 200 to a predetermined position.

[0049] In the embodiment of the utility model, multiple groups of limiter components 20 are arranged on the top of the carrier 10, and the multiple groups of limiter components respectively limit the material frames 200 of different sizes, and the material frames 200 of different sizes are placed with wafers of different sizes. In this way, the wafer feeding device 100 can be compatible with wafers of different sizes, and can feed wafers of different sizes, which can significantly improve the feeding efficiency. Compared with the solution of using a transfer fixture when testing wafers of different sizes in the prior art, the structure and feeding process of the wafer feeding device 100 are simplified, the feeding efficiency and wafer testing efficiency are improved, and the cost can also be saved.

[0050] In some embodiments, the bottom of the material frame 200 is square. The multiple limiting members 21 of each group of limiting member groups 20 are arranged in a square shape and are located outside the corresponding material frame 200 to limit the material frame 200. Specifically, the bottom of the material frame 200 is square and has a frame. The multiple limiting members 21 in the limiting member group 20 are arranged along the outer peripheral side of the material frame 200, and the material frame 200 is placed on the inner side of the placement position formed by the multiple limiting members 21. In this way, each group of limiting member groups 20 can limit the movement of the material frame 200 to the outside of the placement position, so that the material frame 200 is stably set above the carrier 10.

[0051] In other embodiments, the plurality of limiters 21 in each limiter group 20 may also be disposed on the inner side of the corresponding material frame 200. The limiter group 20 located on the inner side of the bottom of the material frame 200 may also limit the movement of the material frame 200, thereby limiting the position of the material frame 200, so that the material frame 200 is stably disposed above the carrier 10.

[0052] In other embodiments, the shape of the bottom of the material frame 200 can be set according to actual needs, for example, a circle. Accordingly, the multiple limiting members 21 of each group of limiting members 20 are arranged in a circle and are located on the outer side or inner side of the corresponding material frame 200 to limit the material frame 200.

[0053] In some embodiments, the plurality of limiters 21 of any limiter group 20 are arranged on the inner side or outer side of another limiter group 20. It can be understood that each limiter group 20 can define a placement position of a material frame 200, and multiple limiter groups 20 define multiple placement positions. Among them, the placement position corresponding to the larger material frame 200 is larger, and the placement position corresponding to the smaller material frame 200 is smaller. The limiter group 20 for limiting the larger material frame 200 is located on the inner side of the limiter group 20 for limiting the smaller material frame 200. In other words, the placement position of the smaller size is inside the placement position of the larger size, and the placement position of the larger size contains the placement position of the smaller size. In this way, the wafer feeding device 100 can be compatible with wafers of different sizes, and the surface area of ​​the carrier 10 can be fully utilized to save costs. In other embodiments, multiple limiter groups 20 can also be arranged to be spaced apart on the carrier 10 as needed.

[0054] In some embodiments, any limiting member 21 of any limiting member group 20 limits any side edge of the bottom of the corresponding material frame 200, and the extension direction of any limiting member 21 is consistent with the extension direction of the corresponding side edge. Specifically, a plurality of limiting members 21 in a group of limiting member groups 20 limit a material frame 200 of a certain size, and any limiting member 21 in the group of limiting member groups 20 can limit the side edge of the bottom of the material frame 200. In this way, when the material frame 200 is placed on the carrier 10, each limiting member 21 in the corresponding limiting member group 20 can play a limiting role, making full use of each limiting member 21 in the limiting member group 20 to improve the limiting effect.

[0055] In one embodiment, the extension direction of any limiting member 21 is consistent with the extension direction of the corresponding side. It can be understood that the limiting member 21 is generally in the shape of a long strip and has a long side and a short side. Here, the short side is consistent with the extension direction of the side of the material frame 200, and the long side abuts against the frame of the material frame 200 to limit the frame of the side of the material frame 200. In this way, the long side structure of the limiting member 21 can be fully utilized, the abutment length of the limiting member 21 and the frame of the side of the material frame 200 is increased, and the limiting effect is improved. Compared with setting the short side of the limiting member 21 to abut against the material frame 200, the limiting effect can be achieved by using fewer limiting members 21, which can save costs.

[0056] In some embodiments, the extension length of any limiting member 21 of any limiting member group 20 is greater than the extension length of any limiting member 21 of any limiting member group 20 located inside it. Here, it can be understood that the smaller size is placed inside the larger size placement position, and the extension length of the limiting member 21 in the limiting member group 20 that limits the larger size material frame 200 is greater than the extension length of the limiting member 21 in the limiting member group 20 that limits the smaller size material frame 200. In this way, considering the different limiting requirements of material frames 200 of different sizes, the limiting effect of the larger size material frame 200 can be improved, so that the larger size material frame 200 can also be stably placed on the carrier 10.

[0057] In this way, a more stable limiting structure can be formed, which can effectively resist external forces, reduce the possibility of displacement of the material frame 200 under the action of external forces, and make the structure of the wafer feeding device 100 more stable. By increasing the length of the outer limiting member group 20, this embodiment can ensure that a larger material frame 200 is stably placed in a larger range.

[0058] The outer limiting member 21 limits the larger material frame 200, and needs to withstand greater force or impact than the inner limiting member 21 when placing the material frame 200 or moving the material frame 200 in the horizontal direction. Increasing the length of the outer limiting member 21 can better disperse the force and reduce the situation where a single point is subjected to excessive force, thereby improving the durability and reliability of the overall structure of the wafer feeding device 100.

[0059] In some embodiments, Figure 5 As shown, a plurality of mounting hole groups 11 are provided on the carrier 10, and each mounting hole group 11 corresponds to a limiter group 20 to install the limiter group 20. Here, the mounting hole group 11 is correspondingly arranged below the limiter group 20, and the limiter 21 is installed in the mounting hole group 11 by screws to achieve connection with the carrier 10.

[0060] In one embodiment, the carrier 10 is provided with two mounting holes corresponding to the positions below each stopper 21, and the stopper 21 is mounted on the carrier 10 by using screws or bolts in cooperation with the mounting holes. The sizes of the mounting holes and the screws are matched to ensure that the two have a high degree of fit, are stably fastened, and are not easily deformed.

[0061] In some embodiments, Figure 6As shown, each of the position-limiting member groups 20 is provided with an adjustment hole 22 corresponding to the position of the mounting hole group 11, which is used to adjust the position of the position-limiting member group 20. Here, the adjustment hole 22 is a waist-shaped hole, and the adjustment hole 22 is perpendicular to the extension direction of the material frame 200 in the horizontal direction, which can provide a clear direction and path for the movement of the position-limiting member 21, so that the position-limiting member group 20 can be positioned according to the predetermined position, and the material frame 200 is placed at the predetermined position. This is conducive to ensuring the stability and accuracy of the material frame 200 placed on the wafer feeding device 100, and preventing the material frame 200 and the wafer from deviating from the predetermined position.

[0062] In addition, the setting of the adjustment hole 22 can optimize the contact mode between the stopper 21 and the carrier 10, and reduce the friction and loss when the stopper 21 moves relative to the carrier 10. This can not only improve the efficiency of adjusting the position of the material frame 200, but also extend the service life of the carrier 10 and reduce maintenance costs.

[0063] In some embodiments, the wafer feeding device 100 further includes an identification sensor 30, which is mounted on the top of the carrier 10 and is used to identify the size of the material frame 200. Specifically, the identification sensor 30 can sense whether the material frame 200 is placed on the carrier 10, and can also identify the model and size of different material frames 200.

[0064] In one embodiment, Figure 4 As shown, there are two groups of limiter sets 20, and the two groups of limiter sets 20 respectively limit the positions of material frames 200 of one size. Two identification sensors 30 are installed on the carrier plate, one identification sensor 30 is located in the middle of the carrier plate, and the other is located below the side of the larger-sized material frame 200. Here, the identification sensor 30 is a spring lifting combination sensor. When the material frame 200 is placed with wafers, the material frame 200 presses down the identification sensor 30, so that the identification sensor 30 sends a signal that the material frame 200 is feeding.

[0065] In some embodiments, the wafer feeding device 100 is further provided with other types of sensors on the carrier plate, such as staggered / stacked sensors, anti-reverse sensors, etc. The staggered / stacked sensors can sense the wafers in the material frame 200 and can determine whether the wafers in the material frame 200 are staggered or stacked. The anti-reverse sensor can determine whether the wafers in the material frame 200 are placed upside down.

[0066] In some embodiments, the wafer feeding device 100 further includes a driving member 40, which is connected to the carrier 10 and is used to drive the material frame 200 to move vertically up and down. Here, the driving member 40 is connected to the identification sensor 30 and can receive the signal of the identification sensor 30. When the identification sensor 30 senses that the material frame 200 is placed on the carrier 10, it sends a signal to the driving member 40, and the driving member 40 drives the material frame 200 to move vertically up and down to achieve wafer loading or unloading. In this way, mechanical automatic loading and unloading can be achieved, avoiding mistakes caused by manual loading and unloading by users, and reducing the risk of damaging wafers.

[0067] In one embodiment, the driving member 40 is a screw slide, the supporting member 10 is connected to the slide of the driving member 40 , and the supporting member 10 moves vertically up and down under the drive of the driving member 40 .

[0068] In some embodiments, the wafer feeding device 100 also includes a connecting member 50 arranged vertically, the top end of the connecting member 50 is connected to the bottom of the carrier 10, and the bottom end is connected to the slide of the driving member 40 to drive the carrier 10 to move under the action of the driving member 40.

[0069] In one embodiment, the connecting member 50 is configured as two connecting plates arranged vertically, the two connecting plates are arranged oppositely on both sides of the slide of the driving member 40, and the top of the connecting plate is connected to the bottom of the carrier 10, which is beneficial to improve the stability of the wafer feeding device 100.

[0070] In some embodiments, the wafer feeding device 100 further includes a guide member 60 arranged vertically, the guide member 60 is slidably connected to the connecting member 50, and the guide member 60 can guide the movement of the connecting member 50 and the carrier 10. In one embodiment, a slide groove is provided on the guide member 60, and the connecting member 50 moves up and down along the slide groove under the drive of the driving member 40. In other embodiments, a slide groove can also be provided on the connecting member 50, and the slide groove of the connecting member 50 is slidably connected to the guide rail on the guide member 60.

[0071] Figure 8 yes Figure 1 Schematic diagram of the structure of the adjustment base 70 is shown. In some embodiments, Figure 8 As shown, the wafer feeding device 100 further includes an adjustment base 70 arranged in the horizontal direction, the adjustment base 70 is located below the driving member 40 and the guide member 60, and is connected to the bottom of the guide member 60. The adjustment base 70 includes a first adjustment plate 71 and a second adjustment plate 72 arranged from bottom to top and capable of adjusting relative positions, and the bottom of the guide member 60 is connected to the second adjustment plate 72, so that the adjustment base 70 can adjust various orientations of the carrier 10 through the guide member 60 and the connecting member 50.

[0072] In some embodiments, a height adjustment screw 73 is provided on the first adjustment plate 71, and a gasket 74 is provided on the second adjustment plate 72. Through the action of the gasket 74 and the height adjustment screw 73, the position of the carrier 10 in six directions, namely, front, rear, left, right, top and bottom, can be adjusted, which is beneficial to improving the accuracy of the position of the material frame 200, so that the material frame 200 can be accurately positioned on the wafer feeding device 100.

[0073] In some embodiments, the wafer feeding device 100 also includes a reinforcement member 80, which is triangular in shape and is respectively connected to the second adjustment plate 72 and the guide member 60, which can improve the structural stability of the wafer feeding device 100 and improve the stability of the movement of the wafer feeding device 100 when loading or unloading wafers.

[0074] The embodiment of the utility model further provides a wafer testing device, which includes the above-mentioned wafer feeding device 100. The wafer feeding device 100 will not be described in detail here.

[0075] The wafer feeding device 100 of this embodiment includes a carrier 10 and a plurality of position limiting member groups 20. The carrier 10 is arranged in a horizontal direction and is used to carry a material frame 200. The plurality of position limiting member groups 20 are installed on the top of the carrier 10, and each position limiting member group 20 includes a plurality of position limiting members 21 for limiting the material frame 200. The plurality of position limiting member groups 20 are used to limit the material frames 200 of different sizes, respectively, and the material frames 200 of different sizes are provided with wafers of different sizes.

[0076] In this way, the wafer feeding device 100 can be compatible with wafers of different sizes and can feed wafers of different sizes, which can significantly improve the feeding efficiency. Compared with the solution in the prior art that requires the use of a transfer fixture when testing wafers of different sizes, the structure and feeding process of the wafer feeding device 100 are simplified, and the feeding efficiency and wafer testing efficiency are improved.

[0077] In addition, in the wafer feeding device 100 of this embodiment, the carrier 10 is provided with a mounting hole group 11, and each group of limiter groups 20 is provided with an adjustment hole 22 corresponding to the mounting hole group 11, which is used to adjust the position of the limiter group 20. In this way, the adjustment hole 22 can guide the movement of the limiter 21, so that the limiter group 20 can position the material frame 200 according to the predetermined position, which is conducive to improving the accuracy of placing the material frame 200 on the wafer feeding device 100.

[0078] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A wafer feeding device, characterized in that: include: The bearing member is arranged in the horizontal direction and is used for bearing the material frame; A plurality of groups of limiter groups are installed on the top of the carrier, each group of the limiter groups includes a plurality of limiters for limiting the material frame, and the plurality of groups of the limiter groups are used to limit the material frames of different sizes respectively, and the material frames of different sizes are provided with wafers of different sizes.

2. The wafer feeding device according to claim 1, characterized in that: The bottom of the material frame is square; The plurality of limiting members of each limiting member group are arranged in a square shape and are located outside the corresponding material frame to limit the position of the material frame.

3. The wafer feeding device according to claim 2, characterized in that: The plurality of the limiting members of any one of the limiting member groups are arranged on the inner side or the outer side of another group of the limiting member groups.

4. The wafer feeding device according to claim 3, characterized in that: Any of the limiting members of any of the limiting member groups limits any side edge of the bottom of the corresponding material frame, and an extending direction of any of the limiting members is consistent with an extending direction of the corresponding side edge.

5. The wafer feeding device according to claim 4, characterized in that: An extension length of any of the position limiting members of any of the position limiting member groups is greater than an extension length of any of the position limiting members of any of the position limiting member groups located inside the position limiting member group.

6. The wafer feeding device according to claim 1, characterized in that: The bearing member is provided with a plurality of mounting hole groups, and each mounting hole group corresponds to one of the position limiting member groups, so as to install the position limiting member groups.

7. The wafer feeding device according to claim 6, characterized in that: Each group of the position-limiting member groups is provided with adjustment holes corresponding to the positions of the installation hole groups, for adjusting the positions of the position-limiting member groups.

8. The wafer feeding device according to claim 1, characterized in that: Also includes: An identification sensor is installed on the top of the carrier and is used to identify the size of the material frame.

9. The wafer feeding device according to claim 1, characterized in that: Also includes: The driving member is connected to the bearing member and is used to drive the material frame to move vertically up and down.

10. A wafer testing device, characterized in that: It comprises a wafer feeding device as described in any one of claims 1-9.

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