Device for curing BCB

Abstract

The utility model belongs to the technical field of semiconductors, and particularly relates to a device for curing BCB, which comprises a support base and a plurality of laminated bases sequentially laminated on the support base, the support base and the laminated bases respectively comprise a wafer bearing plate and a support frame for supporting the wafer bearing plate, the top surface of the wafer bearing plate is provided with a plurality of wafer fixing grooves, and the bottom parts of the wafer fixing grooves are hollow. According to the device, the BCB curing process of a plurality of wafers can be carried out at the same time, the curing efficiency is high, the productivity is large, the bottoms of the wafer fixing grooves are hollowed out, and the two faces of each wafer are parallel to the airflow direction, so that the temperatures of the two faces of each wafer are kept the same in the heating and cooling process, the overall temperature uniformity of the wafers is better maintained, the curing effect is better, and the production efficiency is improved. And meanwhile, the airflow in the cavity of the curing equipment can be kept in a laminar flow state all the time, and the consistency and repeatability of products in batches are better.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductors, and in particular relates to a device for BCB curing. Background Art

[0002] In the field of high-speed semiconductor lasers, in order to reduce capacitance and increase bandwidth, the BCB (benzocyclobutene) process is usually added to achieve the purpose, so the BCB process is crucial for high-speed semiconductor lasers. Therefore, the production process of the BCB process is also crucial to the performance of high-speed semiconductor lasers.

[0003] At present, the existing equipment and process only support a maximum of 4 batches of curing, which is inefficient. In addition, the back of the wafer and the carrier are in hard contact during the curing process and cooling, which will cause uneven heating. In addition, the cavity of the current BCB curing equipment is relatively small, and the internal airflow is in a non-laminar state. The curing and cooling process in a non-laminar state will affect the consistency and repeatability of the product. Utility Model Content

[0004] In order to overcome the deficiencies of the above-mentioned prior art, the purpose of the utility model is to provide a device for BCB curing, which has high curing efficiency, large production capacity, and better curing consistency and repeatability.

[0005] To achieve the above-mentioned purpose, the technical solution of the utility model is a device for BCB curing, comprising a supporting base and a plurality of stacked bases stacked in sequence on the supporting base, the supporting base and the stacked base both comprising a wafer carrier plate and a supporting frame for supporting the wafer carrier plate, a plurality of wafer fixing grooves are arranged on the top surface of the wafer carrier plate, and the bottom portion of the wafer fixing groove is hollowed out.

[0006] As one of the implementation modes, the edge of the wafer fixing groove is provided with a limiting straight edge for limiting the direction of the wafer.

[0007] As one of the implementation modes, the edge of the wafer fixing groove is also provided with a pick-up and placement groove for facilitating the suction pen to pick up and place the wafer.

[0008] As one of the implementation modes, the limiting straight edge and the pick-and-place groove are consistent in position and direction at the edge of each wafer fixing groove.

[0009] As one of the implementation modes, a plurality of wafer codes corresponding to the wafer fixing grooves are arranged on the top surface of the wafer carrier plate.

[0010] As one of the implementation modes, the diameter of the wafer fixing groove is 1-2 mm larger than the diameter of the wafer to be placed, and the depth of the wafer fixing groove is 1 mm.

[0011] As one of the implementation modes, the support frame of the support base is an inverted trapezoidal frame, and the bottom of the wafer carrier plate of the support base is fixed to the top of the inverted trapezoidal frame.

[0012] As one of the implementation modes, the support frame of the stacking base includes a plurality of support columns, and the bottom of the wafer carrier plate of the stacking base is fixed to the top of the plurality of support columns.

[0013] As one of the implementation modes, a positioning pin is provided at the bottom of each of the support columns; and a plurality of positioning grooves are provided on each of the wafer carrier plates, and the positioning grooves correspond one-to-one to and cooperate with the positioning pins on the stacked base above them.

[0014] As one of the implementation modes, each of the wafer carrier plates is provided with a clamp handle.

[0015] Compared with the prior art, the utility model has the following beneficial effects:

[0016] The device of this embodiment can perform the BCB curing process on multiple wafers at the same time, with high curing efficiency and large production capacity. The bottom portion of the wafer fixing groove is hollowed out, and both sides of the wafer are parallel to the airflow direction, so that the temperature of both sides of the wafer is kept the same during the heating and cooling process, and the overall temperature uniformity of the wafer is better maintained, and the curing effect is better. At the same time, the airflow in the cavity of the curing equipment can always maintain a laminar state, and the consistency and repeatability of products between batches are better. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of a device for BCB curing provided by an embodiment of the utility model;

[0019] In the figure: 101, support base; 102, wafer fixing groove; 103, fixture handle; 104, positioning pin; 105, stacking base; 106, wafer coding; 107, limiting straight edge; 108, positioning groove; 109, pick-and-place groove. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0022] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "several" means at least one or more, and "multiple" means two or more.

[0023] like Figure 1 As shown, this embodiment provides a device for BCB curing, including a support base 101 and a plurality of stacked bases 105 stacked in sequence on the support base 101, the support base 101 and the stacked base 105 both include a wafer carrier plate and a support frame for supporting the wafer carrier plate, the top surface of the wafer carrier plate is provided with a plurality of wafer fixing grooves 102, and the bottom portion of the wafer fixing groove 102 is hollowed out. The device of this embodiment can simultaneously perform the BCB curing process of multiple wafers, with high curing efficiency and large production capacity, and the bottom portion of the wafer fixing groove 102 is hollowed out, and both sides of the wafer are parallel to the airflow direction, so that the temperature of both sides of the wafer is kept the same during heating and cooling, and the temperature uniformity of the entire wafer is better maintained, and the curing effect is better. At the same time, the airflow in the cavity of the curing equipment can always maintain a laminar state, and the consistency and repeatability of products between batches are better.

[0024] To optimize the above implementation, the edge of the wafer fixing groove 102 is provided with a limiting straight edge 107 for limiting the direction of the wafer. Figure 1 As shown, a section of the circumferential edge of the wafer fixing groove 102 is a straight edge. The limiting effect of the straight edge can prevent the wafer from rotating or shifting in the wafer fixing groove 102, thereby ensuring the consistency of the directions of all wafers.

[0025] To optimize the above implementation, the edge of the wafer fixing groove 102 is also provided with a pick-up and placement groove 109 for facilitating the suction pen to pick up and place the wafer. Through the pick-up and placement groove 109, the suction pen can more easily approach the wafer, thereby completing the pick-up and placement operation more accurately. In one embodiment, the pick-up and placement groove 109 is rectangular, which is convenient for the suction pen to insert and remove.

[0026] like Figure 1 The pick-up and placement groove 109 is deeper than the wafer fixing groove 102, and the top of the pick-up and placement groove 109 is connected to the end of the limiting straight edge 107 of the wafer fixing groove 102, and the bottom of the pick-up and placement groove 109 is connected to the hollow area below the wafer fixing groove 102, which is convenient for the suction pen operation.

[0027] Furthermore, the positions and directions of the limiting straight edge 107 and the placing and picking groove 109 at the edges of each wafer fixing groove 102 are consistent. Figure 1 As shown, the wafer fixing grooves 102 are evenly distributed in an array on the wafer carrier plate, which improves the utilization rate of the wafer carrier plate; the position and direction of the limiting straight edges 107 and the pick-up and placement grooves 109 on the circumferential edges of each wafer fixing groove 102 are consistent, which can simplify the loading and unloading operation process and improve work efficiency.

[0028] To optimize the above embodiment, a plurality of wafer codes 106 corresponding to the wafer fixing slots 102 are arranged on the top surface of the wafer carrier plate. The wafer codes 106 are arranged close to the corresponding wafer fixing slots 102 to prevent mixing when placing and taking wafers, and the relative positions of the wafer codes 106 and the corresponding wafer fixing slots 102 are consistent, which helps the operator to quickly and accurately identify and locate each fixing slot and its corresponding wafer code 106.

[0029] In this embodiment, the wafer fixing groove 102 is consistent with the shape of the wafer to be placed, and the diameter of the wafer fixing groove 102 is 1-2 mm larger than the diameter of the wafer to be placed, which is convenient for quickly and accurately taking and placing the wafer. Furthermore, the depth of the wafer fixing groove 102 is 1 mm, which is convenient for wafer positioning and also convenient for taking and placing the wafer.

[0030] In one embodiment, the support frame of the support base 101 is an inverted trapezoidal frame, and the bottom of the wafer carrier plate of the support base 101 is fixed to the top of the inverted trapezoidal frame. The inverted trapezoidal frame includes an upper rectangular frame and a lower rectangular frame, the size of the upper rectangular frame is consistent with the size of the wafer carrier plate, the size of the lower rectangular frame is smaller than the size of the upper rectangular frame, and the four corners of the upper rectangular frame are connected to the four corners of the lower rectangular frame through connecting rods, respectively, so as to increase the contact area between the wafer and the cavity.

[0031] In one embodiment, the support frame of the stacking base 105 includes a plurality of support columns, and the bottom of the wafer carrier plate of the stacking base 105 is fixed to the top of the plurality of support columns. The wafer carrier plate of the stacking base 105 is supported on the wafer carrier plate below it through the support columns, so that a certain distance is maintained between the upper and lower layers of wafers. Furthermore, the distance between the upper and lower adjacent wafer carrier plates is 10-20mm, which ensures that there is a certain distance between the upper and lower layers of wafers while reducing the overall height of the device.

[0032] Furthermore, each support column is provided with a positioning pin 104 at the bottom; each wafer carrier is provided with a plurality of positioning grooves 108, and each positioning groove 108 corresponds to and cooperates with the positioning pin 104 on the stacking base 105 above it. The positions and sizes of the positioning grooves 108 and the positioning pins 104 correspond to each other. By cooperating with the positioning pins 104 and the positioning grooves 108, the stacking base 105 can be supported on the support base 101 or the stacking base 105 below it, and its position can be limited, while keeping the top surface of the support column and the top surface of the wafer carrier bottom plate below it at a certain height. This embedded design facilitates the addition and fixing of more layers of stacking bases 105.

[0033] like Figure 1 As shown, the wafer carrier plate is square, and the four corners of each wafer carrier plate are provided with the positioning groove 108, the four corners of the wafer carrier plate of the stacked base 105 are provided with the supporting columns, and the bottom of each supporting column is provided with a positioning pin 104; two layers of stacked bases 105 are arranged above the supporting base 101.

[0034] In this embodiment, each wafer carrier is provided with a clamp handle 103. Optimally, the two opposite ends of the wafer carrier are provided with a clamp handle 103 to facilitate the placement of the support base 101 and the stacking base 105.

[0035] All components of the device of this embodiment are made of quartz material, which is resistant to high temperatures, has good stability and long service life.

[0036] When using the device of this embodiment for BCB curing, place the device on a flat and clean workbench, remove each layer of the stacked base 105 and place it properly; use a suction pen to suck the back of the wafer, place the wafer in the wafer fixing groove 102 of the first layer of the support base 101, slightly adjust the wafer position so that the wafer's parameter resolution position corresponds to the limiting straight edge 107, ensure that the wafer placement direction is placed in the direction of the limiting straight edge 107, and ensure that the wafers are placed in order and stable; after the first layer of the support base 101 is full, take the handle of the second layer of the stacked base 105 with both hands, and after the positioning pin 104 of the second layer of the stacked base 105 is overlapped with the positioning groove 108 of the support base 101, place the wafers in sequence according to the wafer code 106 until the second layer of the wafer fixing groove 102 is full, and then place the third layer of the stacked base 105, and so on. After placing all the wafers as required, slowly put them into the cavity of the curing equipment, ensure that they are placed stably, and then close the cavity door. After the curing and cooling are completed, slowly take out the device and place it on a flat and clean workbench. After ensuring that there is no foreign matter on the surface, according to the wafer code 106, use a vacuum suction pen to take out the wafers on the corresponding wafer fixing slots 102 one by one through the pick-and-place slots 109 and put them into the corresponding wafer box. The wafers can be taken out in order from high to low.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A device for BCB curing, characterized in that: It includes a supporting base and a plurality of stacked bases stacked in sequence on the supporting base, the supporting base and the stacked base both include a wafer carrying plate and a supporting frame for supporting the wafer carrying plate, the top surface of the wafer carrying plate is provided with a plurality of wafer fixing grooves, and the bottom part of the wafer fixing grooves is hollowed out.

2. The device for BCB curing according to claim 1, characterized in that: The edge of the wafer fixing groove is provided with a limiting straight edge for limiting the direction of the wafer.

3. The device for BCB curing according to claim 2, characterized in that: The edge of the wafer fixing groove is also provided with a placement groove for facilitating the suction pen to take and place the wafer.

4. The device for BCB curing according to claim 3, characterized in that: The positions and directions of the limiting straight edge and the placing and picking grooves at the edges of the wafer fixing grooves are consistent.

5. The device for BCB curing according to claim 1, characterized in that: A plurality of wafer codes corresponding to the wafer fixing grooves are arranged on the top surface of the wafer carrier plate.

6. The device for BCB curing according to claim 1, characterized in that: The diameter of the wafer fixing groove is 1-2 mm larger than the diameter of the wafer to be placed, and the depth of the wafer fixing groove is 1 mm.

7. The device for BCB curing according to claim 1, characterized in that: The support frame of the support base is an inverted trapezoidal frame, and the bottom of the wafer carrier plate of the support base is fixed to the top of the inverted trapezoidal frame.

8. The device for BCB curing according to claim 1, characterized in that: The support frame of the stacking base includes a plurality of support columns, and the bottom of the wafer carrier plate of the stacking base is fixed to the top of the plurality of support columns.

9. The device for BCB curing according to claim 8, characterized in that: A positioning pin is provided at the bottom of each of the support columns; a plurality of positioning grooves are provided on each of the wafer carrier plates, and the positioning grooves correspond one-to-one to the positioning pins on the stacked base above them and cooperate with each other.

10. The device for BCB curing according to claim 1, characterized in that: Each of the wafer carrying plates is provided with a clamp handle.

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