Stripping device

By designing a stripping device including a suction part, a connecting belt, a guide part and a support part, the problem of difficulty in removing the pre-film on the bottom surface of the semiconductor device is solved, and an efficient and stable stripping process is achieved.

CN222619700UActive Publication Date: 2025-03-14JCET GROUP CO LTD
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Patent Information

Application Number
CN202420624632.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-03-28
Publication Date
2025-03-14
Estimated Expiration
2034-03-28

AI Technical Summary

Technical Problem

The prior art is difficult to effectively remove the pre-layer film on the bottom surface of the semiconductor device, resulting in a complex removal process and low efficiency.

Method used

A stripping device is designed, including a suction part, a connecting belt, a guide part and a support part. The suction part passes through a vacuum adsorption device, and the connecting belt is used to peel off the pre-film. The guide part provides a peeling guide for the connecting belt and provides support to the device. The support part assists the guide part to prevent the device from falling off.

Benefits of technology

It realizes efficient and stable peeling of the pre-film at the bottom of the device, with high success rate, stable work and high efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of stripping processing, and discloses a stripping device which adsorbs at least one device in vacuum through a suction part; stripping the pre-pasting film from the bottom surface of the corresponding device through the connecting belt; the guide part provides stripping guide for the connecting belt and provides support for the corresponding device, so that the device is prevented from being torn off from the suction part by the connecting belt; the supporting part assists the guiding part in providing support for the corresponding device, the device is prevented from being torn off from the suction part by the connecting belt, so that the pre-sticking film at the bottom of the device can be stripped, and the success rate, the working stability and the efficiency are high.
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Description

Technical Field

[0001] The utility model relates to the technical field of stripping processing, in particular to a stripping device. Background Art

[0002] In the semiconductor packaging process, a pre-film needs to be formed on the bottom surface of the device in a certain process, and then the pre-film on the bottom surface of the semiconductor device needs to be removed after the process is completed. Therefore, a stripping device is needed to easily strip the pre-film on the bottom surface of the device. Utility Model Content

[0003] The utility model aims to overcome the problem that the pre-lamination film on the bottom surface of the existing device is difficult to remove, and provides a peeling device.

[0004] In order to achieve the above object, the utility model provides a peeling device, comprising:

[0005] A suction part, used for vacuum adsorbing at least one device, wherein the bottom surface of the device has a pre-attached film;

[0006] A connecting tape, used to connect the bottom surface of the pre-lamination film and peel the pre-lamination film off the bottom surface of the corresponding device;

[0007] The guide part is used to enter the interface between the device and the corresponding pre-lamination film, provide a peeling guide for the connection belt to peel off the pre-lamination film, and provide support for the corresponding device to prevent the device from being torn off from the suction part by the connection belt;

[0008] The support portion is used to assist the guide portion in providing support to the corresponding device to prevent the device from being torn off the suction portion by the connecting belt.

[0009] As an implementation method, the connecting tape is an adhesive tape, and the bonding force between the pre-attachment film and the corresponding adhesive tape is greater than the bonding force between the same pre-attachment film and the corresponding device.

[0010] As an implementable embodiment, it also includes:

[0011] The roller is used to apply pressure to the adhesive tape located on the bottom surface of the pre-lamination film to improve the bonding force between the adhesive tape and the pre-lamination film.

[0012] As an implementation method, the top surface of the guide portion is parallel to the entry direction of the guide portion into the interface, the front end of the guide portion has a slope inclined along the thickness direction, an angle is formed between the slope of the guide portion and the top surface of the guide portion, and the angle is an acute angle, the slope of the guide portion and the top surface of the guide portion constitute the starting end of the guide portion entering the interface, and the guide portion enters the interface by relative movement through the starting end in a direction parallel to the bottom surface of the device.

[0013] As an implementation method, the support portion is used to support the device via the connecting tape and the pre-lamination film, and the support portion is located outside the front end of the guide portion, and the positions of the support portion and the guide portion are relatively fixed.

[0014] As an implementation method, the supporting surface of the supporting portion is a plane, the supporting portion has an inclined surface along the thickness direction at the front end away from the device, and an angle is formed between the inclined surface of the supporting portion and the top surface of the guide portion, and the angle is an obtuse angle.

[0015] As an implementation method, the angle between the inclined surface of the support portion and the support surface of the guide portion is greater than 95 degrees and less than 180 degrees.

[0016] As an implementation method, the support portion is a sphere or a cylinder, and the support surface of the support portion is a curved surface of the sphere or the cylinder.

[0017] As an implementation method, the absorption portion includes at least one recessed groove for accommodating a device, the depth of the recessed groove is less than or equal to the thickness of the corresponding device, and the width of the recessed groove is greater than the length of the corresponding device.

[0018] As an implementation method, when there are at least two recessed grooves, there is a gap between adjacent recessed grooves.

[0019] As an implementation method, the device includes a substrate, a chip located on one side of the substrate, and a plastic package located on the surface of the substrate and encapsulating the chip. The pre-laminated film is located on the other side of the substrate, and the side of the pre-laminated film and the surface of the plastic package have a coating layer.

[0020] Beneficial effects of the utility model:

[0021] The utility model discloses a stripping device, which vacuum absorbs at least one device through a suction part; strips a pre-sticking film from the bottom surface of a corresponding device through a connecting belt; provides a stripping guide for the connecting belt and provides support for the corresponding device through a guiding part to prevent the device from being torn off from the suction part by the connecting belt; provides support for the corresponding device through a supporting part and an auxiliary guiding part to further prevent the device from being torn off from the suction part by the connecting belt, thereby realizing stripping of the pre-sticking film on the bottom of the device, with a high success rate, stable operation and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A schematic diagram of forming a film-coating device provided by the utility model;

[0023] Figure 2 A schematic diagram of the suction portion and the connecting belt of the stripping device provided by the utility model;

[0024] Figure 3 A schematic diagram of the guide part and the support part of the peeling device provided by the utility model;

[0025] Figure 4 Schematic diagram of guide parts of different shapes of the peeling device provided by the utility model;

[0026] Figure 5 Schematic diagram of supporting parts of different shapes of the peeling device provided by the utility model. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] The technical terms or scientific terms used in this application should be the usual meanings understood by those skilled in the art. The words "top surface", "bottom surface", "front end", "above", "below", "upper", "lower" and other directional terms in this implementation are defined relative to the orientation shown schematically in the accompanying drawings. It should be understood that these directional terms are relative concepts. They are used for description and clarification relative to each other, and they can change accordingly according to the change of the orientation placed. In the description of the embodiments of the present application, unless otherwise specified, the meaning of "multiple" is two or more. It should be noted that the "connection" in this application should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral body; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. It should be noted that "movement" in this application refers to relative movement, that is, only one of the structures can be moved to achieve relative movement between the two structures, or both structures can be moved at the same time to achieve relative movement.

[0029] According to research, in the semiconductor packaging process, due to actual needs, it is necessary to form a pre-film on the bottom surface of the device. After the packaging is completed, the pre-film on the bottom surface of the semiconductor device needs to be removed. Therefore, a stripping device that is convenient for stripping the pre-film on the bottom surface of the device is needed. For example, in the LGA coating process, in order to reduce the generation of coating burrs, a pre-film will be formed on the back of the device, and then the pre-film will be stripped after sputtering. The peeling interface between the pre-film and the product side wall is smooth and neat, and no broken coating metal burrs will be generated. For details, see Figure 1 (a) is a schematic diagram of forming a pre-bonding film 20 on the bottom surface of the device 10. Figure 1(b) It is necessary to provide a sputtering film 30 having an opening. Figure 1 The structure of (a) is placed on the surface of the sputtered adhesive film 30 and covers the opening, and then a coating layer 40 is formed on the surface of the device 10, thereby forming a coated device. Figure 1 (c) The ejector pin 50 and the suction nozzle 60 can work together to generate an upward force on the pre-laminated film 20 and the device 10 located on the surface of the pre-laminated film, thereby separating the pre-laminated film 20 from the sputtered film 30, and separating the coating layer 40 on the side of the pre-laminated film 20 from the coating layer 40 on the surface of the sputtered film 30, thereby reducing the burrs of the coating layers at the separation point. However, after the coated device is formed, the pre-laminated film 20 needs to be separated from the bottom surface of the device 10.

[0030] Therefore, see Figure 3 Some embodiments of the present invention provide a peeling device, including:

[0031] The suction part 100 is used for vacuum adsorption of at least one device 10, wherein the bottom surface of the device 10 has a pre-sticking film 20; the connecting tape 70 is used for connecting the bottom surface of the pre-sticking film 20 to peel off the pre-sticking film 20 from the bottom surface of the corresponding device 10; the guiding part 200 is used for entering the interface between the device 10 and the corresponding pre-sticking film 20, providing a peeling guide for the connecting tape 70 to peel off the pre-sticking film 20, and providing support to the corresponding device 10 to prevent the device 10 from being torn off from the suction part 100 by the connecting tape 70; the supporting part 300 is used for assisting the guiding part 200 in providing support to the corresponding device 10 during the process of the connecting tape 70 peeling off the pre-sticking film 20, so as to prevent the device 10 from being torn off from the suction part 100 by the connecting tape 70.

[0032] In some embodiments, the suction part 100 includes at least one recessed groove 110 for accommodating the device 10. In some embodiments, in order to accommodate the device 10, the width of the recessed groove 110 is greater than the length of the corresponding device 10 to be sucked, and in order to allow the pre-attachment film 20 on the bottom surface of the device 10 to be exposed in the recessed groove 110 so as to be peeled and removed by the connection belt 70 and the guide part 200, the depth of the recessed groove 110 is less than or equal to the thickness of the corresponding device 10 to be sucked. In some embodiments, when there are at least two recessed grooves, the sizes of at least two recessed grooves 110 can be the same, and the width of the recessed groove 110 can be set to be greater than the maximum length of the device 10 to be sucked, and the depth of the recessed groove 110 is less than or equal to the maximum thickness of the corresponding device 10 to be sucked.

[0033] In some embodiments, when there are multiple devices 10, the pre-attachment films respectively located on the bottom surfaces of at least two devices 10 may be connected or separated. In some embodiments, the devices may be different types of packaged devices. For example, see Figure 1 The device 10 includes a substrate 11, a chip 12 located on one side of the substrate 11, a plastic package 13 located on the surface of the substrate 11 and encapsulating the chip 12, and the pre-bonding film 20 is located on the other side of the substrate 11. In some embodiments, the pre-bonding film on the bottom of the device 10 can also be different types of adhesive films. In some embodiments, the pre-bonding film 20 on the bottom of the device 10 can be used to assist in forming a coated device. For details, see Figure 1 After forming the coated device, the side of the pre-film 20 and the surface of the plastic package body 13 have a coating layer 40, and the pre-film 20 located on the bottom surface of the device 10 and the coating layer 40 located on the surface of the pre-film need to be removed, and the stripping device in this embodiment can play a role.

[0034] In some embodiments, see Figure 3 , when there are at least two recessed grooves 110, there is a gap between adjacent recessed grooves 110 of the vacuum unit 100. In some embodiments, the suction unit 100 can suck multiple devices distributed in an array through multiple recessed grooves 110. In some embodiments, the gaps between the recessed grooves 110 can be set to allow the suction unit 100 to vacuum absorb multiple devices 10 at the same time. In some embodiments, the gaps between adjacent recessed grooves 110 can be determined based on the gaps between adjacent devices in the previous process. For example, when the device 10 is Figure 1 The coated device shown in the figure is Figure 1 After the method steps shown in (b) form a coating layer 40 on the surfaces of the plurality of devices and the corresponding pre-laminated films, the suction unit 100 in this embodiment can replace the Figure 1 The suction nozzle 60 in (c) directly separates the coating layer 40 through the cooperation of the suction part 100 and the ejector pin 50, and then peels off the pre-lamination film 20 through the cooperation of the connecting belt 70, the guide part 200 and the support part 300.

[0035] In some embodiments, there is at least one connection tape 70. When there is one connection tape 70, the connection tape 70 is used to connect the bottom surfaces of all the pre-lamination films 20. When there are at least two connection tapes 70, each connection tape 70 can be used to adhere to the bottom surface of at least one pre-lamination film 20. For example, for devices distributed in an array, all devices can be connected to one connection tape, or devices in each row or column can be connected to one connection tape respectively according to the number of rows and columns.

[0036] In some embodiments, Figure 3 As shown, the pre-attachment film 20 can be peeled off from the bottom surface of the corresponding device 10 along with the connection belt 70 by pulling the end of the connection belt 70 along with the interface of the guide part 200. In some embodiments, during the process of the connection belt 70 peeling off the pre-attachment film 20, the connection belt 70 will simultaneously exert a downward pulling force on the pre-attachment film 20 and the corresponding device 10, and the pulling force exerted by the connection belt 70 can be caused by external manpower pulling the connection belt 70, or by other structures not shown in the peeling device of this embodiment pulling the connection belt 70, and the pulling force exerted by the connection belt 70 on the device 10 may cause the corresponding device to fall off from the absorption part 100, therefore, the guide part 200 and the support part 300 are required to support the corresponding device 10.

[0037] In some embodiments, the bonding force between the pre-attachment film 20 and the corresponding connection belt 70 may be greater than the bonding force between the same pre-attachment film 20 and the corresponding device 10, so that the pre-attachment film 20 will be peeled off when the connection belt 70 is pulled. In some embodiments, after the suction part 100 vacuum-attaches the device 10, the connection belt 70 may be connected to the bottom surface of the adsorbed pre-attachment film 20, and then the guide part 200 and the support part 300 cooperate with the connection belt 70 to peel off the pre-attachment film 20.

[0038] In some embodiments, the connection tape 70 may be an adhesive tape, and the bonding force between the pre-attachment film 20 and the corresponding adhesive tape is greater than the bonding force between the same pre-attachment film 20 and the corresponding device 10. Figure 2 The provided peeling device also includes a roller 80. After the suction part 100 sticks the device 10 to the adhesive tape through the pre-sticking film 20, the roller 80 can apply pressure to the adhesive tape located on the bottom surface of the pre-sticking film 20 to increase the bonding force between the adhesive tape and the pre-sticking film 20.

[0039] In some embodiments, the guide portion 200 may be a rectangular parallelepiped, a cube, a prism, a sphere, a cylinder, a cone or other geometrical body, so that it can move relative to the interface between the device 10 and the corresponding pre-adhesive film 20, thereby providing a peeling guide for the connection tape 70 to peel off the pre-adhesive film 20, and providing support for the device 10 located above the pre-adhesive film when the connection tape 70 peels off the pre-adhesive film 20, thereby preventing the device 10 from being torn off by the connection tape 70 and causing the suction portion 100 to leak vacuum. In some embodiments, after entering the interface, the guide portion 200 applies a thrust toward the pre-adhesive film 20 to provide a peeling guide. Figure 3 The direction indicated by the middle arrow is the direction in which the guide portion 200 enters the interface between the device 10 and the corresponding pre-lamination film 20. In some embodiments, the guide portion 200 may be made of metal.

[0040] In some embodiments, the top surface 210 of the guide portion is a plane, the top surface 210 of the guide portion is parallel to the direction of entry into the interface, and the front end of the guide portion 200 has an inclined surface 220 inclined along the thickness direction, for example, see Figure 4 Schematic diagram of two types of formed inclined surfaces 220, wherein an angle is formed between the inclined surface 220 of the guide portion and the top surface 210 of the guide portion, and the angle is an acute angle, that is, the angle is greater than 0 degrees and less than 90 degrees. In one embodiment, the inclined surface 220 of the guide portion and the top surface 110 of the guide portion constitute the starting end of the guide portion 200 entering the interface, and the guide portion 200 enters the interface by relatively moving in a direction parallel to the bottom surface 101 of the device 10 through the starting end, and the starting end can apply a thrust toward the pre-attached film 20 to the pre-attached film 20, so as to provide a peeling guide, and the connecting belt 70 can form a path for peeling the pre-attached film 20 based on the starting end, and can also provide support for the device 10 corresponding to the pre-attached film 20. In some embodiments, when the guide portion 200 enters the interface between the device 10 and the corresponding pre-attached film 20, the top surface 210 of the guide portion moves relative to the device 10 against the bottom surface 101 of the device 10. In one embodiment, when the device 10 is a film-coated device, the side of the removed pre-film 20 still has a film-coating layer 40, but because the film-coating layer 40 is very thin, when the connecting tape 70 peels off the pre-film 20, the connecting tape 70 will peel off the film-coating layer 40 on the side of the pre-film 20 together.

[0041] In some embodiments, see Figure 3 , the support part 300 is used to support the device 10 through the connecting tape 70 and the pre-attachment film 20. In one embodiment, the support surface 310 of the support part can be attached to the bottom surface of the connecting tape 70 and move relative to the connecting tape 70. In some embodiments, the support part 300 is located outside the front end of the guide part 200, and the positions of the support part 300 and the guide part 200 are relatively fixed, so as to achieve synchronous forward movement, so as not to interfere with the guide part 200 entering the interface to achieve peeling, and can also form support at the position where the guide part 200 does not reach on the bottom surface of the same device, thereby achieving the function of assisting the guide part 200 to provide support for the device 10 corresponding to the pre-attachment film peeled off from the connecting tape 70, and preventing the device 10 from being pulled off by the pulling force of the connecting tape 70, resulting in vacuum leakage of the suction part 100. In some embodiments, the material of the support part 300 can be metal.

[0042] In some embodiments, the support surface 310 of the support portion is a plane, the front end of the support portion 300 has an inclined surface 320 along the thickness direction, the front end of the support portion 300 is located on the side of the support portion away from the guide portion 200, and an angle is formed between the inclined surface 320 of the support portion and the support surface 310 of the support portion, and the angle is an obtuse angle, that is, greater than 90 degrees and less than 180 degrees, so as to reduce friction resistance and prevent puncturing of the connecting belt 70. In one embodiment, the angle between the inclined surface of the support portion and the top surface of the guide portion is greater than 95 degrees and less than 180 degrees, which further prevents puncturing of the connecting belt 70.

[0043] In some embodiments, the support portion 300 is a sphere or a cylinder, and the support surface 310 of the support portion is an arc surface of the sphere or the cylinder. The support portion 300 can move by rolling on the arc surface.

[0044] Although the utility model has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the utility model. Any technical personnel in this field can make possible changes and modifications to the technical solution of the utility model by using the methods and technical contents disclosed above without departing from the spirit and scope of the utility model. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the utility model without departing from the content of the technical solution of the utility model are within the protection scope of the technical solution of the utility model.

Claims

1. A stripping device, characterized in that: include: A suction part, used for vacuum adsorbing at least one device, wherein the bottom surface of the device has a pre-attached film; A connecting tape, used to connect the bottom surface of the pre-lamination film and peel the pre-lamination film off the bottom surface of the corresponding device; The guide part is used to enter the interface between the device and the corresponding pre-lamination film, provide a peeling guide for the connection belt to peel off the pre-lamination film, and provide support for the corresponding device to prevent the device from being torn off from the suction part by the connection belt; The support portion is used to assist the guide portion in providing support to the corresponding device to prevent the device from being torn off the suction portion by the connecting belt.

2. The stripping device according to claim 1, characterized in that: The connecting tape is an adhesive tape, and the bonding force between the pre-attachment film and the corresponding adhesive tape is greater than the bonding force between the same pre-attachment film and the corresponding device.

3. The stripping device according to claim 2, characterized in that: Also includes: The roller is used to apply pressure to the adhesive tape located on the bottom surface of the pre-lamination film to improve the bonding force between the adhesive tape and the pre-lamination film.

4. The stripping device according to claim 1, characterized in that: The top surface of the guide portion is parallel to the entry direction of the guide portion into the interface, the front end of the guide portion has a slope inclined along the thickness direction, an acute angle is formed between the slope of the guide portion and the top surface of the guide portion, the slope of the guide portion and the top surface of the guide portion constitute the starting end of the guide portion entering the interface, and the guide portion enters the interface by relative movement through the starting end in a direction parallel to the bottom surface of the device.

5. The stripping device according to claim 1, characterized in that: The support portion is used to support the device via the connection tape and the pre-lamination film. The support portion is located outside the front end of the guide portion. The positions of the support portion and the guide portion are relatively fixed.

6. The stripping device according to claim 5, characterized in that: The supporting surface of the supporting part is a plane, and the front end of the supporting part away from the device has an inclined surface along the thickness direction, and an angle is formed between the inclined surface of the supporting part and the top surface of the guiding part, and the angle is an obtuse angle.

7. The stripping device according to claim 6, characterized in that: The angle between the inclined surface of the supporting portion and the supporting surface of the guiding portion is greater than 95 degrees and less than 180 degrees.

8. The stripping device according to claim 5, characterized in that: The support portion is a sphere or a cylinder, and the support surface of the support portion is a curved surface of the sphere or the cylinder.

9. The stripping device according to claim 1, characterized in that: The absorption portion includes at least one recessed groove for accommodating a device, the depth of the recessed groove is less than or equal to the thickness of the corresponding device, and the width of the recessed groove is greater than the length of the corresponding device.

10. The stripping device according to claim 9, characterized in that: When there are at least two recessed grooves, there is a gap between adjacent recessed grooves.

11. The stripping device according to claim 1, characterized in that: The device comprises a substrate, a chip located on one side of the substrate, and a plastic package located on the substrate surface and encapsulating the chip. The pre-lamination film is located on the other side of the substrate. The side of the pre-lamination film and the surface of the plastic package have a coating layer.