Wafer positioning and caching mechanism
Through the combination of the camera positioning device and the load transfer device, the precise positioning of the wafer is achieved, and the problems of low positioning efficiency and low accuracy in the prior art are solved, and the film accuracy and output efficiency are significantly improved.
Patent Information
- Application Number
- CN202323553367.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-25
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2033-12-25
AI Technical Summary
In the prior art, conventional wafer edge finders have low positioning efficiency and low accuracy, which cannot meet the film accuracy requirements and are costly to use.
Using a combination of a camera positioning device and a load transfer device, wafer position information is obtained through a CCD industrial camera, and the wafer is accurately positioned in the X, Y directions and rotation using the adjustment unit.
It significantly improves the accuracy of wafer positioning, saves positioning time, reduces usage costs, avoids damage to wafers, and improves output efficiency.
Smart Images
Figure CN222619721U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of semiconductor manufacturing, and in particular relates to a wafer positioning buffer mechanism. Background Art
[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its original material is silicon. After high-purity polysilicon is dissolved, silicon crystal seeds are added, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, that is, a wafer. In the process of semiconductor wafer manufacturing, automated equipment is usually used to implement the process flow. Before the wafer is filmed, it needs to be transported, and it is generally transported by a robot or a suction cup. In the process of wafer transportation, the position coordinates of the wafer are critical. If the position of the wafer deviates, the robot or suction cup may not be able to take and place the wafer, and the placement position of the wafer will also deviate. Therefore, a specific positioning mechanism is required to position the wafer before it is transported by a robot or a suction cup.
[0003] At present, most wafers are positioned before lamination by using a wafer edge finder. Wafer edge finders are expensive and their positioning accuracy can only reach 0.1mm. With the increasingly higher requirements for lamination accuracy, they can no longer meet the lamination conditions. Therefore, using a wafer edge finder for positioning is not only time-consuming and has low positioning accuracy, but is also expensive and has high usage costs. Utility Model Content
[0004] The utility model aims to provide a wafer positioning buffer mechanism to solve the problems of low positioning efficiency and low precision of conventional wafer edge finders in the prior art.
[0005] To achieve this purpose, the utility model adopts the following technical solutions:
[0006] A wafer positioning buffer mechanism comprises a camera positioning device and a transfer device, wherein the camera positioning device is arranged on one side of the transfer device along a first direction, wherein:
[0007] The transfer device includes a transfer rack, a transfer assembly and an adjustment unit. The transfer rack is provided with an adsorption platform, and the adsorption platform is used to carry a wafer. The movable end of the transfer assembly is connected to the transfer rack. The transfer assembly is configured to drive the transfer rack to move back and forth along the first direction to drive the wafer to the camera positioning device for taking pictures and then reset. The camera positioning device is configured to obtain position information of the wafer on the adsorption platform and send the obtained position information to the adjustment unit. The adjustment unit includes a first adjustment assembly, a second adjustment assembly and a rotation adjustment assembly. The first adjustment assembly is configured to drive the adsorption platform to move back and forth along the first direction to adjust the wafer in the first direction. The second adjustment assembly is configured to drive the adsorption platform to move back and forth along the second direction to adjust the wafer in the second direction. The rotation adjustment assembly is configured to drive the adsorption platform to rotate a specified angle to adjust the rotation angle of the wafer. The second direction is perpendicular to the first direction.
[0008] Furthermore, the camera positioning device includes a CCD industrial camera, a camera bracket and a photographing light source. The CCD industrial camera is fixedly installed on the top end of the camera bracket, and the photographing light source is fixedly arranged on the bottom end of the camera bracket. A gap is reserved between the CCD industrial camera and the photographing light source for the adsorption platform to pass through.
[0009] Furthermore, the first adjustment component includes a first driving member and a first movable member, the fixed end of the first driving member is installed on the transfer frame, the movable end of the first driving member is connected to the first end of the first movable member, the second end of the first movable member is connected to the adsorption platform, and the first driving member drives the first movable member to move to drive the adsorption platform to move along the first direction.
[0010] Furthermore, the second adjustment component includes a second driving member and a second movable member, the fixed end of the second driving member is installed on the transfer frame, the movable end of the second driving member is connected to the first end of the second movable member, the second end of the second movable member is connected to the adsorption platform, and the second driving member drives the second movable member to move to drive the adsorption platform to move along the second direction.
[0011] Furthermore, the rotation adjustment assembly includes a rotation driving member and a rotating member, the fixed end of the rotation driving member is installed on the transfer rack, the movable end of the rotation driving member is connected to the first end of the rotating member, the second end of the rotating member is connected to the adsorption platform, and the rotation driving member drives the rotating member to rotate a specified angle to drive the adsorption platform to rotate.
[0012] Furthermore, the transfer assembly includes a transfer module, a sliding member and two guide rails. The two guide rails are arranged at a distance from each other along the second direction at the bottom of the transfer frame and extend along the first direction. The driving end of the transfer module is connected to the first end of the sliding member, and the second end of the sliding member is fixedly connected to the transfer frame. The transfer module drives the sliding member to reciprocate along the first direction to drive the transfer frame to move.
[0013] Compared with the prior art, the beneficial effects of the wafer positioning cache mechanism are as follows: a camera positioning device is used to replace the traditional wafer edge finder, and the wafer is precisely positioned in cooperation with an adjustment unit. Not only is the design ingenious, the position of the wafer can be adjusted as required to avoid damage to the wafer, but the positioning method is simple and there are no complicated steps. The positioning accuracy is significantly improved, the positioning time is greatly saved, the output efficiency is improved, and the use cost is reduced. Two additional guide rails are added to further improve the stability of the transfer within a limited space. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] In order to more clearly illustrate and understand the technical solutions in the embodiments of the present invention, the following briefly introduces the background technology of the present invention and the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.
[0015] Figure 1 It is a top view schematic diagram of a wafer positioning buffer mechanism provided by an embodiment of the utility model;
[0016] Figure 2 It is a schematic diagram of the three-dimensional structure of a transfer device provided by an embodiment of the utility model;
[0017] Figure 3 It is a side structural schematic diagram of a transfer device provided in one embodiment of the utility model. DETAILED DESCRIPTION
[0018] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.
[0019] In order to facilitate the understanding of the utility model, the utility model will be described more comprehensively with reference to the relevant drawings. The preferred embodiments of the utility model are given in the drawings. However, the utility model can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thoroughly understood. It should be noted that when a component is referred to as "fixed to" another component, it can be directly on another component or there can also be a central component. When a component is considered to be "connected" to another component, it can be directly connected to another component or there may be a central component at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and are not intended to be the only implementation method. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by technicians in the technical field of the utility model. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0020] See also Figures 1 to 3 As shown, in this embodiment, a wafer positioning cache mechanism includes a camera positioning device 1 and a transfer device 2. The camera positioning device 1 is arranged along a first direction ( Figure 1 The X direction in the figure) is arranged on one side of the transfer device 2, wherein the transfer device 2 includes a transfer rack 20, a transfer component 21 and an adjustment unit. An adsorption platform 3 is arranged on the transfer rack 20, and the adsorption platform 3 is used to carry the wafer. The movable end of the transfer component 21 is connected to the transfer rack 20. The transfer component 21 is configured to drive the transfer rack 20 to move back and forth along the first direction to drive the wafer to the camera positioning device 1 for taking pictures and then reset. The camera positioning device 1 is configured to obtain the position information of the wafer on the adsorption platform 3 and send the obtained position information to the adjustment unit. The adjustment unit includes a first adjustment component 4, a second adjustment component 5 and a rotation adjustment component 6. The first adjustment component 4 is configured to drive the adsorption platform 3 to move back and forth along the first direction to adjust the wafer in the first direction. The second adjustment component 5 is configured to drive the adsorption platform 3 to move back and forth along the second direction ( Figure 1 The rotation adjustment component 6 is configured to drive the adsorption platform 3 to rotate a specified angle to adjust the rotation angle of the wafer.
[0021] It can be seen that the utility model adopts a camera positioning device 1 to replace the traditional wafer edge finder, and cooperates with the adjustment unit to accurately position the wafer. Not only is the design ingenious, it can adjust the position of the wafer as required and avoid damage to the wafer. The positioning method is simple and there are no cumbersome steps. The positioning accuracy is significantly improved, the positioning time is greatly saved, the output efficiency is improved, and the use cost is reduced.
[0022] As an implementation method, the adsorption platform 3 is a porous ceramic adsorption platform.
[0023] As an embodiment, the camera positioning device 1 includes a CCD industrial camera 10, a camera bracket 11 and a photographing light source 12. The CCD industrial camera 10 is fixedly installed on the top end of the camera bracket 11, and the photographing light source 12 is fixedly arranged on the bottom end of the camera bracket 11. A gap is reserved between the CCD industrial camera 10 and the photographing light source 12 for the adsorption platform 3 to pass through.
[0024] As an embodiment, the first adjustment component 4 includes a first driving member 40 and a first movable member 41. The fixed end of the first driving member 40 is installed on the transfer rack 20, the movable end of the first driving member 40 is connected to the first end of the first movable member 41, the second end of the first movable member 41 is connected to the adsorption platform 3, and the first driving member 40 drives the first movable member 41 to move, so as to drive the adsorption platform 3 to move along the first direction.
[0025] As an embodiment, the second adjustment component 5 includes a second driving member 50 and a second movable member 51, the fixed end of the second driving member 50 is installed on the transfer rack 20, the movable end of the second driving member 50 is connected to the first end of the second movable member 51, the second end of the second movable member 51 is connected to the adsorption platform 3, and the second driving member 50 drives the second movable member 51 to move, so as to drive the adsorption platform 3 to move along the second direction.
[0026] As an embodiment, the rotation adjustment assembly 6 includes a rotation driving member 60 and a rotating member. The fixed end of the rotation driving member 60 is installed on the transfer rack 20, the movable end of the rotation driving member 60 is connected to the first end of the rotating member, and the second end of the rotating member is connected to the adsorption platform 3. The rotation driving member 60 drives the rotating member to rotate a specified angle to drive the adsorption platform 3 to rotate.
[0027] As an embodiment, the transfer assembly 21 includes a transfer module 210, a sliding member 211 and two guide rails 212. The two guide rails 212 are arranged at the bottom of the transfer rack 20 at intervals along the second direction and extend along the first direction. The driving end of the transfer module 210 is connected to the first end of the sliding member 211, and the second end of the sliding member 211 is fixedly connected to the transfer rack 20. The transfer module 210 drives the sliding member 211 to reciprocate along the first direction to drive the transfer rack 20 to move.
[0028] It can be seen that the addition of two guide rails 212 further improves the stability of transfer within a limited space.
[0029] When the above-mentioned wafer positioning cache mechanism is working: the robot places the wafer on the adsorption platform 3, and after vacuuming, the product is firmly adsorbed on the platform surface; the transfer module 210 drives the transfer rack 20 to move horizontally, and drives the adsorption platform 3 to the bottom of the CCD industrial camera 10; the CCD industrial camera 10 obtains the position information of the wafer on the adsorption platform 3 and sends the obtained position information to the adjustment unit; the transfer module 210 is reset, and the adjustment unit adjusts the wafer to the required state by fine-tuning in the X-axis, Y-axis and rotation according to the feedback information; then the robot takes the adjusted wafer to the next process.
[0030] The above embodiments are only to illustrate the basic principles and characteristics of the present invention. The present invention is not limited by the above embodiments. Without departing from the spirit and scope of the present invention, the present invention may be subject to various changes and modifications, which are within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.
Claims
1. A wafer positioning buffer mechanism, characterized in that: The wafer positioning buffer mechanism comprises a camera positioning device and a transfer device, wherein the camera positioning device is arranged on one side of the transfer device along a first direction, wherein: The transfer device includes a transfer rack, a transfer assembly and an adjustment unit. The transfer rack is provided with an adsorption platform, and the adsorption platform is used to carry a wafer. The movable end of the transfer assembly is connected to the transfer rack. The transfer assembly is configured to drive the transfer rack to move back and forth along the first direction to drive the wafer to the camera positioning device for taking pictures and then reset. The camera positioning device is configured to obtain position information of the wafer on the adsorption platform and send the obtained position information to the adjustment unit. The adjustment unit includes a first adjustment assembly, a second adjustment assembly and a rotation adjustment assembly. The first adjustment assembly is configured to drive the adsorption platform to move back and forth along the first direction to adjust the wafer in the first direction. The second adjustment assembly is configured to drive the adsorption platform to move back and forth along the second direction to adjust the wafer in the second direction. The rotation adjustment assembly is configured to drive the adsorption platform to rotate a specified angle to adjust the rotation angle of the wafer. The second direction is perpendicular to the first direction.
2. The wafer positioning buffer mechanism according to claim 1, characterized in that: The camera positioning device includes a CCD industrial camera, a camera bracket and a photographing light source. The CCD industrial camera is fixedly installed on the top end of the camera bracket, and the photographing light source is fixedly arranged on the bottom end of the camera bracket. A gap is reserved between the CCD industrial camera and the photographing light source for the adsorption platform to pass through.
3. The wafer positioning buffer mechanism according to claim 1, characterized in that: The first adjustment component includes a first driving member and a first movable member, the fixed end of the first driving member is installed on the transfer frame, the movable end of the first driving member is connected to the first end of the first movable member, the second end of the first movable member is connected to the adsorption platform, and the first driving member drives the first movable member to move to drive the adsorption platform to move along the first direction.
4. The wafer positioning buffer mechanism according to claim 1, characterized in that: The second adjustment assembly includes a second driving member and a second movable member, the fixed end of the second driving member is installed on the transfer rack, the movable end of the second driving member is connected to the first end of the second movable member, the second end of the second movable member is connected to the adsorption platform, and the second driving member drives the second movable member to move to drive the adsorption platform to move along the second direction.
5. The wafer positioning buffer mechanism according to claim 1, characterized in that: The rotation adjustment assembly includes a rotation drive member and a rotating member, the fixed end of the rotation drive member is installed on the transfer rack, the movable end of the rotation drive member is connected to the first end of the rotating member, the second end of the rotating member is connected to the adsorption platform, and the rotation drive member drives the rotating member to rotate a specified angle to drive the adsorption platform to rotate.
6. The wafer positioning buffer mechanism according to claim 1, characterized in that: The transfer assembly includes a transfer module, a sliding member and two guide rails. The two guide rails are arranged at a distance along the second direction at the bottom of the transfer frame and extend along the first direction. The driving end of the transfer module is connected to the first end of the sliding member, and the second end of the sliding member is fixedly connected to the transfer frame. The transfer module drives the sliding member to reciprocate along the first direction to drive the transfer frame to move.