Fixing device for chip manufacturing

Abstract

The utility model relates to the technical field of chip manufacturing, and discloses a fixing device for chip manufacturing, which comprises a base, a concave support is fixedly mounted on one side of the top of the base, a fixing seat is fixedly mounted on the top of the support, a placement groove is formed in the top of the fixing seat, and a clamping groove is formed in the top of the placement groove. A chip positioning mechanism is mounted in each group of placing grooves; the chip positioning mechanism comprises piston holes formed in the four corners of the containing groove, and limiting grooves formed in the bottoms of the four sets of piston holes. According to the utility model, after a chip is placed in the placing groove, the abutting rods at the four corners are extruded, so that the abutting rods push the limiting sliding blocks at the bottom to extrude the pressure sensors, the pressure sensors under pressure transmit signals to the control processor, the mutually corresponding electromagnetic valves are opened, and the air pump transmits negative pressure into the negative pressure groove through the branch pipe; and the placed chips can be automatically and firmly fixed, so that the chip processing efficiency is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip manufacturing, in particular to a fixing device used for chip manufacturing. Background Art

[0002] At present, chip is a general term for semiconductor component products. Integrated circuits with circuits manufactured on the surface of semiconductor chips are also called thin-film integrated circuits. Another type of thick-film integrated circuit is a miniaturized circuit composed of independent semiconductor devices and passive components integrated into a substrate or circuit board.

[0003] When the chip is being manufactured, it is necessary to first ensure that the chip is firmly fixed on the processing table, and then cooperate with the robot and manual operator to perform precise processing on the chip.

[0004] When fixing chips in the market, most of them are placed in molds, but it is not easy to ensure that the chip fits perfectly with the fitting groove in the mold, resulting in the risk of chip deviation in the mold, which makes the chip very easy to be damaged during processing. Therefore, a new technical solution needs to be designed to solve this problem. Utility Model Content

[0005] The purpose of the utility model is to provide a fixing device for chip manufacturing, which solves the problems raised in the background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a fixing device for chip manufacturing, comprising a base, a bracket is fixedly installed on one side of the top of the base, the bracket is a concave bracket, a fixing seat is fixedly installed on the top of the bracket, a placement groove is opened on the top of the fixing seat, and a chip positioning mechanism is installed in each group of the placement grooves;

[0007] The chip positioning mechanism includes piston holes opened at the four corners of the placement groove, limit grooves opened at the bottom of the four groups of piston holes, limit blocks slidably installed in the four groups of limit grooves, support rods fixedly installed on the tops of the four groups of limit blocks, and pressure sensors fixedly installed at the bottoms of the four groups of limit grooves.

[0008] As an optional solution of the technical solution of the present application, the pressure sensor and the limit block correspond to each other, and the push rod is movably connected to the piston hole.

[0009] As an optional solution of the technical solution of the present application, a spring is sleeved on the bottom of each group of the support rods, and both sides of each group of the springs are respectively fixed to the inner wall of the limit groove and the outer wall of the limit block, so as to support the support rods.

[0010] As an optional solution of the technical solution of the present application, a rubber pad is fixedly installed on the top of each group of the push rods to prevent the top of the push rods from rubbing against the chip.

[0011] As an optional solution of the technical solution of the present application, a negative pressure groove is opened in the middle of each group of placement grooves, and a branch pipe is installed at the bottom of each group of negative pressure grooves. A solenoid valve is fixedly installed on each group of branch pipes to control the air pressure transported inside the branch pipes.

[0012] As an optional solution of the technical solution of the present application, an air pump is fixedly installed on one side of the bottom of the base, and the air inlet end of the air pump is connected to the other end of the multiple groups of branch pipes, so as to deliver negative pressure to the branch pipes.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] 1. The technical solution of the present application places the chip in the placement groove, squeezes the push rods located at the four corners, so that the push rods push the limit slider at the bottom to squeeze the pressure sensor. The pressure sensor under pressure will transmit the signal to the control processor, open the corresponding solenoid valves, and allow the air pump to transmit the negative pressure through the branch pipe to the negative pressure groove, which can automatically fix the placed chip firmly and greatly improve the chip processing efficiency.

[0015] 2. In the technical solution of the present application, a spring is sleeved on the bottom of each group of push rods, and the two sides of each group of springs are respectively fixed to the inner wall of the limit groove and the outer wall of the limit block. When the operator presses down the push rod to control the branch pipe for conveying negative pressure, the negative pressure groove with negative pressure will adsorb the chip. At the same time, when the chip is not completely adsorbed by the negative pressure groove, the spring on the push rod will support the push rod and lift the chip, which can well detect whether the chip is firmly fixed to avoid the chip loosening during processing and causing chip damage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Other features, objects and advantages of the present invention will become more apparent by reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0017] Figure 1 This is a schematic diagram of the overall structure of a fixing device for chip manufacturing according to the utility model;

[0018] Figure 2 The utility model is a schematic diagram of the chip positioning mechanism structure of a fixing device for chip manufacturing.

[0019] In the figure: 1. base; 11. air pump; 12. bracket; 13. fixing seat; 2. placement groove; 21. piston hole; 22. limit groove; 23. limit block; 24. push rod; 25. pressure sensor; 26. spring; 27. rubber pad; 3. negative pressure groove; 31. branch pipe; 32. solenoid valve. DETAILED DESCRIPTION

[0020] See also Figure 1-2 The utility model provides a technical solution: a fixing device for chip manufacturing, comprising a base 1, a bracket 12 is fixedly installed on one side of the top of the base 1, the bracket 12 is a concave bracket 12, a fixing seat 13 is fixedly installed on the top of the bracket 12, a placement groove 2 is opened on the top of the fixing seat 13, and a chip positioning mechanism is installed in each group of placement grooves 2;

[0021] The chip positioning mechanism includes piston holes 21 opened at the four corners of the placement groove 2, limit grooves 22 opened at the bottom of the four groups of piston holes 21, limit blocks 23 slidably installed in the four groups of limit grooves 22, push rods 24 fixedly installed on the tops of the four groups of limit blocks 23, and pressure sensors 25 fixedly installed at the bottom of the four groups of limit grooves 22. The pressure sensors 25 correspond to the limit blocks 23, and the push rods 24 are movably connected to the piston holes 21.

[0022] In this technical solution, after placing the chip in the placement groove 2, the push rods 24 located at the four corners are squeezed, so that the push rods 24 push the limiting slider at the bottom to squeeze the pressure sensor 25. The pressure sensor 25 under pressure will transmit a signal to the control processor, open the corresponding solenoid valves 32, and allow the air pump 11 to transmit the negative pressure through the branch pipe 31 to the negative pressure groove 3, which can automatically fix the placed chip firmly and greatly improve the chip processing efficiency.

[0023] In some technical solutions, a spring 26 is sleeved on the bottom of each group of push rods 24 , and both sides of each group of springs 26 are fixedly installed on the inner wall of the limiting groove 22 and the outer wall of the limiting block 23 , respectively, so as to support the push rods 24 .

[0024] In this technical solution, when the operator presses down the push rod 24 to control the branch pipe 31 that delivers negative pressure, the negative pressure groove 3 with negative pressure will adsorb the chip. At the same time, when the chip is not completely adsorbed by the negative pressure groove 3, the spring 26 on the push rod 24 will support the push rod 24 and lift the chip up. This can well detect whether the chip is firmly fixed to avoid the chip from loosening during processing and causing chip damage.

[0025] In some technical solutions, a rubber pad 27 is fixedly installed on the top of each set of push rods 24 to prevent the top of the push rods 24 from rubbing against the chip.

[0026] In this technical solution, when the chip needs to be installed in the placement groove 2, the chip will be limited to fit with the top of the four groups of push rods 24. The rubber pads 27 installed on the top of the push rods 24 can prevent damage caused by friction between the top of the push rods 24 and the chip.

[0027] In some technical solutions, a negative pressure groove 3 is opened in the middle of each group of placement grooves 2, and a branch pipe 31 is installed at the bottom of each group of negative pressure grooves 3. A solenoid valve 32 is fixedly installed on each group of branch pipes 31, which can control the air pressure transported inside the branch pipe 31. An air pump 11 is fixedly installed on one side of the bottom of the base 1, and the air inlet end of the air pump 11 is connected and installed with the other end of the multi-component pipe 31, so that negative pressure can be transported to the branch pipe 31.

[0028] In this technical solution, when the air pump 11 is driven to deliver negative pressure to the multi-component connecting pipe 31, the solenoid valve 32 installed on the multi-component connecting pipe 31 can well control the negative pressure delivered inside each component connecting pipe 31, ensuring that the negative pressure can be accurately delivered to the negative pressure tank 3.

[0029] When a fixture for chip manufacturing is used, it should be noted that the utility model is a fixture for chip manufacturing, and each component is a universal standard part or a component known to technical personnel in this field, and its structure and principle can be known to technical personnel through technical manuals or through conventional experimental methods.

[0030] When in use, first install the base 1 on the workbench and turn on the power to ensure that the air pump 11 and multiple sets of solenoid valves 32 are used normally. Then, multiple sets of chips are placed in the placement groove 2 to wait for the chip processing. At the same time, cooperate with the chip positioning mechanism. After the chip is placed in the placement groove 2, squeeze the levers 24 at the four corners to make the levers 24 push the limit slider at the bottom to squeeze the pressure sensor 25. The pressure sensor 25 under pressure will transmit the signal to the control processor to open the corresponding solenoid valves 32, so that the air pump 11 will transmit the negative pressure to the negative pressure groove 3 through the branch pipe 31, which can automatically align the placed chips. The chip can be firmly fixed, which greatly improves the chip processing efficiency. At the same time, a spring 26 is sleeved on the bottom of each group of push rods 24, and the two sides of each group of springs 26 are respectively fixed to the inner wall of the limit groove 22 and the outer wall of the limit block 23. When the operator presses down the push rod 24 to control the branch pipe 31 for conveying negative pressure, the negative pressure groove 3 with negative pressure will adsorb the chip. At the same time, when the chip is not completely adsorbed by the negative pressure groove 3, the spring 26 on the push rod 24 will support the push rod 24 and lift the chip, which can well detect whether the chip is firmly fixed, avoid the chip from loosening during processing, resulting in chip damage.

Claims

1. A fixture for chip manufacturing, comprising a base (1), characterized in that: A bracket (12) is fixedly mounted on one side of the top of the base (1), the bracket (12) is a concave bracket (12), a fixing seat (13) is fixedly mounted on the top of the bracket (12), a placement groove (2) is provided on the top of the fixing seat (13), and a chip positioning mechanism is installed in each group of the placement grooves (2); The chip positioning mechanism comprises piston holes (21) each provided at the four corners of the placement groove (2), limiting grooves (22) each provided at the bottom of the four groups of the piston holes (21), limiting blocks (23) each slidably mounted in the four groups of the limiting grooves (22), supporting rods (24) each fixedly mounted on the top of the four groups of the limiting blocks (23), and pressure sensors (25) each fixedly mounted on the bottom of the four groups of the limiting grooves (22).

2. A fixing device for chip manufacturing according to claim 1, characterized in that: The pressure sensor (25) and the limit block (23) correspond to each other, and the push rod (24) is movably connected to the piston hole (21).

3. A fixing device for chip manufacturing according to claim 1, characterized in that: The bottom of each group of the support rods (24) is sleeved with a spring (26), and the two sides of each group of the springs (26) are respectively fixedly mounted on the inner wall of the limiting groove (22) and the outer wall of the limiting block (23).

4. A fixing device for chip manufacturing according to claim 1, characterized in that: A rubber pad (27) is fixedly mounted on the top of each group of the support rods (24).

5. A fixing device for chip manufacturing according to claim 1, characterized in that: A negative pressure groove (3) is provided in the middle of each group of placement grooves (2), a branch pipe (31) is connected to the bottom of each group of negative pressure grooves (3), and a solenoid valve (32) is fixedly installed on each group of branch pipes (31).

6. A fixing device for chip manufacturing according to claim 5, characterized in that: An air pump (11) is fixedly mounted on one side of the bottom of the base (1), and an air inlet end of the air pump (11) is connected to the other ends of the plurality of branch pipes (31).

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