Supporting device, semiconductor chamber and semiconductor process equipment

Abstract

The utility model provides a supporting device, a semiconductor chamber and semiconductor process equipment, and relates to the technical field of semiconductors. The supporting device comprises a base and a supporting piece fixedly arranged on the base, the supporting piece is provided with a breaking opening, and the breaking opening is configured to allow a mechanical arm to convey a wafer; the inner side, facing the middle of the base, of the supporting piece is provided with a supporting face, a contour face defined by the supporting face is an annular arc face, the diameter of the contour face is gradually decreased from top to bottom, and the supporting face is configured to support a wafer. When the supporting device is applied to a semiconductor cavity, wafers of multiple sizes can be centered and supported, compatibility and supporting position accuracy are high, the supporting position is the edge of the wafer, and scratching to the back face of the wafer is small; and meanwhile, the structure is simple, and the wafer can be conveyed by matching with a manipulator without arranging an ejector pin.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, and in particular to a supporting device, a semiconductor chamber and semiconductor process equipment. Background Art

[0002] Semiconductor process equipment generally has a support device in the chamber to support the wafer so as to transfer, calibrate the position or perform corresponding process treatment on the wafer. In the related technology, especially for wafers with metal film deposited on the back, the support device is easy to scratch the back of the wafer when supporting the wafer, affecting the product yield and performance; at the same time, the support device generally needs to be equipped with fingers and manipulators to cooperate to receive and send the wafer, which has a complex structure and cannot achieve the centering of the wafer. Utility Model Content

[0003] The purpose of the utility model is to provide a supporting device, a semiconductor chamber and a semiconductor process equipment to solve the technical problems in the related art that the supporting device is easy to scratch the back side of the wafer when supporting the wafer, thus affecting the product yield and performance, and the supporting device has a complex structure and cannot achieve wafer centering.

[0004] In order to solve the above problems, the utility model provides a supporting device, comprising a base and a supporting member fixed to the base, wherein the supporting member has a disconnecting opening, and the disconnecting opening is configured for a robot to transfer a wafer;

[0005] The support member has a support surface on the inner side facing the middle of the base. The contour surface formed by the support surface is an annular arc surface and its diameter decreases from top to bottom. The support surface is configured to support a wafer.

[0006] Optionally, the contour surface is a truncated conical surface.

[0007] Optionally, the angle between the generatrix of the contour surface and the horizontal plane ranges from 10° to 20°.

[0008] Optionally, the contour surface is coaxial with the base.

[0009] Optionally, the support member includes a support seat and a support leg, the top end of the support leg is fixed to the support seat, and the bottom end is detachably fixed to the base, and the support surface is located on the support seat.

[0010] Optionally, the support seat includes a first seat body and a second seat body arranged at an interval, the disconnection port is formed between the first seat body and the second seat body, and the support surface includes a first support area located at the first seat body and a second support area located at the second seat body; the support leg is fixedly arranged between the first seat body and the base, and the support leg is fixedly arranged between the second seat body and the base.

[0011] Optionally, the number of the supporting legs connected between the first seat body and the base is one, and the number of the supporting legs connected between the second seat body and the base is two.

[0012] Optionally, the first seat body and the second seat body are both rectangular seat bodies, the side wall corresponding to one long side of the first seat body is a first long side wall, the side wall corresponding to one long side of the second seat body is a second long side wall, and the first long side wall and the second long side wall are parallel and oppositely arranged on both sides of the base.

[0013] Optionally, a corner of the first seat body is notched toward the second seat body to form a first avoidance side wall, and a corner of the second seat body is notched toward the first seat body to form a second avoidance side wall, and the first avoidance side wall and the second avoidance side wall are symmetrical about the axis center of the base, wherein a first loading and unloading channel is formed between the first avoidance side wall and the second avoidance side wall, and a second loading and unloading channel is formed between the first long side wall and the second long side wall.

[0014] Optionally, the top surface of the base is provided with at least two groups of mounting positions, the support legs are detachably fixed to one group of mounting positions, and when the support legs are connected to the mounting positions of different groups, the diameter ranges of the contour surface are different.

[0015] Optionally, the mounting position includes a limiting groove corresponding to the supporting leg, and a limiting hole is provided at the bottom of the limiting groove; a limiting column extending downward is provided at the bottom end of the supporting leg, and the bottom end of the supporting leg is cooperated and inserted in the corresponding limiting groove, and the limiting column is cooperated and inserted in the corresponding limiting hole.

[0016] The utility model also provides a semiconductor chamber, comprising a chamber body with a transfer port and the above-mentioned supporting device, wherein the supporting device is installed in the chamber body, and the disconnection port of the supporting device corresponds to the transfer port.

[0017] The utility model also provides a semiconductor process equipment, including a front-end chamber of the equipment, a transmission chamber and the above-mentioned semiconductor chamber, wherein the semiconductor chamber has two transmission ports and two disconnection ports, one of which is connected to the front-end chamber of the equipment, and the other is connected to the transmission chamber.

[0018] When the support device provided by the utility model is applied to a semiconductor chamber, wafers with diameters within a first range can all be stably supported by the support surface of the support device, thereby improving the size compatibility of the wafer supported by the support device. Specifically, the robot can carry the wafer into the chamber through the transfer port of the chamber body and transfer the wafer to the top of the support surface. Then the robot descends through the disconnect port to a height below the support surface and exits through the disconnect port and the transfer port. The support surface that is tapered from top to bottom can guide and center the wafer through a simple guiding structure, so that the wafer can overlap at the height of the contour circle where the support surface and the wafer diameter are approximately equal, thereby improving the coaxiality and position accuracy of the wafer and the support surface, and correspondingly improving the process processing accuracy of the wafer; at the same time, the wafer and the support surface are in line contact and the contact length is less than the outer circumference of the wafer. On the basis of ensuring the stability of the support device supporting the wafer, the scratches on the back of the wafer caused by the support device can also be effectively reduced, thereby correspondingly improving the yield and performance of the product.

[0019] Similarly, when the wafer needs to be sent out, the robot can extend to the bottom of the wafer through the transfer port and the disconnection port, and then the robot rises to a position higher than the support member. The wafer is then taken down by the robot and sent out through the transfer port with the robot. The setting of the interruption opening of the support device can realize the transfer of the wafer by the lifting and lowering of the robot, and there is no need to set components such as ejector pins in the support device, thereby improving the structural simplicity of the support device.

[0020] The semiconductor process equipment provided by the utility model adopts the above-mentioned supporting device and semiconductor chamber, and has all the beneficial effects of the supporting device and semiconductor chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 A schematic diagram of a semiconductor process equipment provided by an embodiment of the utility model;

[0023] Figure 2 for Figure 1 A partial schematic diagram of the middle loading and unloading chamber connected between the front chamber and the transfer chamber of the equipment, wherein the vacuum manipulator extends into the first loading and unloading channel;

[0024] Figure 3 for Figure 1A partial schematic diagram of the middle loading and unloading chamber connected between the front chamber and the transfer chamber of the device, wherein the atmospheric manipulator extends into the second loading and unloading channel;

[0025] Figure 4 An axonometric diagram of a wafer supported by a supporting device provided in an embodiment of the utility model;

[0026] Figure 5 for Figure 4 A cross-sectional view of a middle support device when supporting a wafer;

[0027] Figure 6 for Figure 5 A partial enlarged view of

[0028] Figure 7 An axonometric schematic diagram of a support device provided in an embodiment of the utility model;

[0029] Figure 8 An axonometric diagram of the second seat body connected to the support leg in the support device provided in an embodiment of the utility model;

[0030] Fig. 9 An axonometric view of the first seat body connected to the support leg in the support device provided in an embodiment of the utility model.

[0031] Description of reference numerals:

[0032] 10-loading platform; 20-equipment front chamber; 30-loading and unloading chamber; 31-chamber body; 31a-front transfer port; 31b-end transfer port; 32-support device; 40-transmission chamber; 50-process chamber; 60-atmospheric manipulator; 70-vacuum manipulator; 80-wafer; 100-base; 110-limiting groove; 120-limiting hole; 200-support member; 210-disconnection port; 220 -support surface; 221-first support area; 222-second support area; 230-support seat; 231-first seat body; 231a-first long side wall; 231b-first avoidance side wall; 232-second seat body; 232a-second long side wall; 232b-second avoidance side wall; 240-support leg; 250-connecting ear; 260-limiting column; 310-first loading and unloading channel; 320-second loading and unloading channel. DETAILED DESCRIPTION

[0033] The technical solution of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] This embodiment provides a supporting device 32, such as Figure 4 and Figure 7 As shown, it includes a base 100 and a support member 200 fixed to the base 100, the support member 200 has a disconnection opening 210, and the disconnection opening 210 is configured for a robot to transfer a wafer 80; the support member 200 has a support surface 220 on the inner side facing the middle of the base 100, the contour surface surrounded by the support surface 220 is an annular arc surface and its diameter decreases from top to bottom, and the support surface 220 is configured to support the wafer 80.

[0037] This embodiment also provides a semiconductor chamber, such as Figure 2 As shown, it includes a chamber body 31 with a transfer port and the above-mentioned supporting device 32. The supporting device 32 is installed in the chamber body 31, and the disconnecting port 210 of the supporting device 32 corresponds to the transfer port.

[0038] In the support device 32 provided in this embodiment, the contour surface formed by the support surface 220 is an annular arc surface and its diameter decreases from top to bottom, then the contour lines formed by the support surface 220 at different heights are all circles and their diameters decrease from top to bottom, and the diameter range of each contour circle formed by the support surface 220 is a first range; when the support device 32 is applied to a semiconductor chamber, the wafers 80 with a diameter within the first range can be stably supported by the support surface 220 of the support device 32, thereby improving the size compatibility of the support device 32 supporting the wafer 80. Specifically, the robot can carry the wafer 80 into the chamber body 31 through the transfer port, and transfer the wafer 80 to the top of the support surface 220, and then the robot descends to below the support surface 220 through the disconnection port 210. The height of the support surface 220 is adjusted and exits through the disconnection port 210 and the transfer port. The support surface 220, which is tapered from top to bottom, can guide and center the wafer 80 through a simple guiding structure, so that the wafer 80 can overlap at the height of the contour circle where the support surface 220 and the wafer 80 have approximately the same diameter, thereby improving the coaxiality and position accuracy of the wafer 80 and the support surface 220, and correspondingly improving the process processing accuracy of the wafer 80; at the same time, the wafer 80 and the support surface 220 are in line contact and the contact length is less than the outer circumference of the wafer 80. On the basis of ensuring the stability of the support device 32 supporting the wafer 80, it can also effectively reduce the scratches on the back of the wafer 80 caused by the support device 32, and correspondingly improve the yield and performance of the product.

[0039] Similarly, when the wafer 80 needs to be sent out, the robot can extend to the bottom of the wafer 80 through the transfer port and the disconnection port 210, and then the robot rises to a position higher than the support 200, and the wafer 80 is then taken down by the robot and sent out with the robot through the transfer port; the setting of the interruption opening 210 of the support device 32 can realize the transfer of the wafer 80 by the lifting and lowering of the robot, and there is no need to set components such as ejector pins in the support device 32, thereby improving the structural simplicity of the support device 32.

[0040] Specifically, in this embodiment, Figure 7 As shown, the contour surface is a truncated conical surface. The generatrix of the support surface 220 is a straight line segment inclined from top to bottom toward the middle of the base 100. The processing convenience and accuracy of the support surface 220 are higher, and accordingly, the processing cost is lower, and the support stability of the wafer 80 is higher; in addition, the diameter of the contour circle formed by each height of the support surface 220 is continuously and evenly changed, and accordingly, it can be adapted to the support of all sizes of wafers 80 within the first range and the support stability is higher.

[0041] Specifically, in this embodiment, Figure 6 As shown, the angle α between the generatrix of the profile surface and the horizontal plane is in the range of 10°-20°, preferably 15°.

[0042] Of course, in other embodiments, the generatrix of the contour surface may also be a convex arc segment or a concave arc segment, and the support surface 220 is a convex arc surface or a concave arc surface accordingly.

[0043] Optionally, in this embodiment, the contour surface is coaxial with the base 100. When the support surface 220 supports the wafer 80, the wafer 80 is coaxial with the contour surface where the support surface 220 is located under the guiding and centering action of the support surface 220. If the contour surface is coaxial with the base 100, the wafer 80 is stably supported on the support surface 220, that is, coaxial with the base 100, so that the position coordinates of the wafer 80 can be determined according to the position coordinates of the base 100, and the processing accuracy of the wafer 80 in the subsequent process and the subsequent conveying accuracy of the wafer 80 by the robot can be improved; in addition, the effective space above the base 100 can be fully utilized, and the offset of the support device 32 from the base 100 can be reduced, and the occurrence of collision between the wafer 80 and the inner wall of the chamber body 31 during the transmission process can be reduced.

[0044] In this embodiment, Figure 4 and Figure 7 As shown, the support member 200 includes a support seat 230 and a support leg 240. The top end of the support leg 240 is fixed to the support seat 230, and the bottom end is detachably fixed to the base 100. The support surface 220 is located on the support seat 230. This is one of the specific forms of the support member 200. The support leg 240 supports the support seat 230. The support seat 230 is discontinuously arranged to form a disconnection port 210 for the robot to transfer the wafer 80. The structure is simple, the material consumption is small, and the cost is low. The support member 200 is detachably connected to the base 100 through the support leg 240. When the support surface 220 is worn, the connection between the support leg 240 and the base 100 can be removed, so that the support member 200 can be removed for replacement and other maintenance, which correspondingly improves the maintenance convenience of the support device. In addition, the connection position of the support leg 240 and the base 100 can be adjusted according to actual needs, thereby improving the applicability of the support device.

[0045] Specifically, in this embodiment, Figure 4 and Figure 7As shown, the support seat 230 includes a first seat body 231 and a second seat body 232 which are spaced apart, a disconnection opening 210 is formed between the first seat body 231 and the second seat body 232, and the support surface 220 includes a first support area 221 located at the first seat body 231 and a second support area 222 located at the second seat body 232; a support leg 240 is fixed between the first seat body 231 and the base 100, and a support leg 240 is fixed between the second seat body 232 and the base 100. The support seat 230 includes a first seat body 231 and a second seat body 232 which are both disconnected at both ends, and has a simple structure. When in use, the first support area 221 and the second support area 222 can support different circumferential areas of the wafer 80. On the basis of ensuring the support stability and centering effect of the wafer 80, the length of the contact line with the edge of the wafer 80 is further reduced, thereby further reducing the possible scratches on the back of the wafer 80 caused by the support device 32. In addition, a disconnection port 210 is formed between the two opposing ends of the first base body 231 and the second base body 232, so that the support device 32 can be adapted to a semiconductor chamber having a transfer port, such as a process chamber 50, wherein the transfer port corresponds to one of the disconnection ports 210; or, the support device 32 can also be adapted to a chamber body 31 having two transfer ports, such as a loading and unloading chamber 30, wherein the two transfer ports correspond one-to-one to the two disconnection ports 210, thereby improving the adaptability of the support device 32.

[0046] Of course, in other embodiments, the number of the base bodies in the support base 230 can also be three or four, etc., and is not limited to the above two.

[0047] In this embodiment, the top surface of the base 100 is provided with at least two groups of mounting positions, and the support legs 240 are detachably fixed to one of the groups of mounting positions, and when the support legs 240 are connected to different groups of mounting positions, the diameter ranges of the contour surface are different. When the support member 200 is connected to different groups of mounting positions through its support legs 240, the contour surface formed by the support surface 220 is approximately an annular arc surface, and the diameter ranges of the annular arc surface are different. The support legs 240 can be connected to different mounting positions according to actual needs to support the wafer 80 of the corresponding diameter range, thereby increasing the compatibility of the support device 32 with the diameter of the wafer 80.

[0048] In this embodiment, Figure 4-Figure 7 As shown, the mounting position includes a limiting groove 110 provided on the top surface of the base 100 and corresponding to the support leg 240, and a limiting hole 120 is provided at the bottom of the limiting groove 110; Figure 8 and Fig. 9 As shown, a limiting column 260 extending downward is provided at the bottom end of the supporting leg 240 , and the bottom end of the supporting leg 240 is plugged into the corresponding limiting groove 110 , and the limiting column 260 is plugged into the corresponding limiting hole 120 .

[0049] The number, relative position, shape, etc. of the limiting grooves 110 in each group of installation positions correspond to the number, relative position, shape, etc. of the supporting legs 110 in the supporting member 200. During installation, the radial position of the first seat body 231 and the second seat body 232 is limited by plugging and matching the supporting legs 240 with the limiting grooves 110 in different groups, and the diameter range of the annular arc surface is changed accordingly; specifically, the limiting column 260 can be first plugged into the corresponding limiting hole 120, and then the bottom end of the supporting leg 240 can be plugged into the corresponding limiting groove 110, so as to achieve double preliminary positioning of the supporting leg 240 and the base 100, thereby improving the connection position accuracy of the two; in particular, when the bottom end of the supporting leg 240 is circular and the limiting groove 110 is circular, the limiting column 260 and the limiting hole 120 can be eccentrically set to limit the circumferential angle of the supporting leg 240 plugged into the limiting groove 110.

[0050] After the support leg 240 and the base 100 are initially positioned, a connector can be used to detachably fix the bottom end of the support leg 240 to the base 100 to improve the stability of the connection between the support leg 240 and the base 100 .

[0051] Specifically, Figure 4-Figure 7 As shown, the bottom end of the support leg 240 may be provided with a horizontally extending connecting ear 250, and the limiting column 260 is located on the bottom surface of the connecting ear 250, and the initial positioning of the support leg 240 connected to the base 100 is achieved by the matching insertion of the connecting ear 250 and the limiting groove 110; wherein, the number of the limiting columns 260 at the bottom of the connecting ear 250 may be two.

[0052] In this embodiment, Fig. 9 As shown, the number of the supporting leg 240 connected between the first base body 231 and the base 100 is one. Figure 8 As shown, there are two supporting legs 240 connected between the second base body 232 and the base 100. With this number of supporting legs 240, the base 100 and the connecting piece before the improvement can be used continuously, thereby improving the recycling of the base 100 and the connecting piece and reducing the improvement cost.

[0053] Optionally, in this embodiment, if Figure 2 and Figure 3As shown, the first seat body 231 and the second seat body 232 are both rectangular seats, the side wall corresponding to one long side of the first seat body 231 is the first long side wall 231a, and the side wall corresponding to one long side of the second seat body 232 is the second long side wall 232a, and the first long side wall 231a and the second long side wall 232a are parallel and oppositely arranged on both sides of the base 100. The first seat body 231 and the second seat body 232 are both rectangular seats with regular shapes, which are more convenient and accurate to process, and the two are arranged in parallel when installed on the base 100, and the relative position accuracy of the first seat body 231 and the second seat body 232 can be identified according to the parallelism of the first long side wall 231a and the second long side wall 232a, thereby improving the position accuracy of the first seat body 231 and the second seat body 232.

[0054] Specifically, in this embodiment, Figure 2 and Figure 3 As shown, a corner of the first seat body 231 facing the second seat body 232 is notched to form a first avoidance side wall 231b, and a corner of the second seat body 232 facing the first seat body 231 is notched to form a second avoidance side wall 232b. The first avoidance side wall 231b and the second avoidance side wall 232b are symmetrical about the axis center of the base 100, wherein a first loading and unloading channel 310 is formed between the first avoidance side wall 231b and the second avoidance side wall 232b, and a second loading and unloading channel 320 is formed between the first long side wall 231a and the second long side wall 232a. On the one hand, the first seat body 231 and the second seat body 232 are symmetrical about the axis center of the base 100. The first seat body 231 and the second seat body 232 are both seats with the same shape and size. They can be processed in batches during processing, which is more convenient and less costly. On the other hand, the support device 32 can be applied to the loading and unloading chamber 30, and its first loading and unloading channel 310 and the second loading and unloading channel 320 are arranged at an angle, which can be respectively adapted to the conveying direction of the atmospheric manipulator 60 in the front end chamber 20 of the equipment and the conveying direction of the vacuum manipulator 70 in the transmission chamber 40, thereby ensuring that the first support area 221 and the second support area 222 are large in area and stably support the wafer 80, while reducing interference with the atmospheric manipulator 60 and the vacuum manipulator 70, thereby ensuring stable conveying of the wafer 80 by both.

[0055] Specifically, Figure 2 and Figure 3 As shown, the first avoidance side wall 231b and the second avoidance side wall 232b are respectively located at two ends of the first seat body 231 and the second seat body 232 that are away from each other, which can effectively avoid the interference between the atmospheric manipulator and the first seat body and the second seat body.

[0056] This embodiment also provides a semiconductor process equipment, including a front-end chamber 20 of the equipment, a transfer chamber 40 and the above-mentioned semiconductor chamber, the semiconductor chamber has two transfer ports and two disconnection ports 210, one of which is connected to the front-end chamber 20 of the equipment, and the other is connected to the transfer chamber 40. The semiconductor chamber can switch between the atmospheric environment and the vacuum environment as a loading and unloading chamber 30. Specifically, the front-end chamber 20 of the equipment is an atmospheric environment, and an atmospheric manipulator 60 is arranged therein. The loading and unloading chamber 30 needs to be converted to an atmospheric environment before it can be connected to the front-end chamber 20 of the equipment for wafer transfer. The transfer chamber 40 is a vacuum environment, and a vacuum manipulator 70 is arranged therein. The loading and unloading chamber 30 needs to be converted to a vacuum environment before it can be connected to the transfer chamber 40 for wafer transfer. The front transfer port 31a of the loading and unloading chamber 30 is connected to the front chamber 20 of the equipment, and the rear transfer port 31b is connected to the transfer chamber 40. The atmospheric manipulator 60 can transfer the wafer 80 to the loading and unloading chamber 30 or send out the wafer 80 in the loading and unloading chamber 30. The vacuum manipulator 70 is used to transfer the wafer 80 in the loading and unloading chamber 30 to the transfer chamber 40 and the process chamber 50 for process treatment, or to transfer the processed wafer 80 to the loading and unloading chamber 30. Among them, the semiconductor process equipment adopts the above-mentioned support device 32 and semiconductor chamber, and has all the beneficial effects of the support device 32 and the semiconductor chamber.

[0057] Specifically, Figure 1 As shown, the semiconductor process equipment includes three loading platforms 10 (Loadport), an equipment front end chamber 20 (Equipment Front End Module, EFEM), two loading and unloading chambers 30 (Load-Lock, LL), a transfer chamber 40 (transport chamber) and six process chambers 50 (Process Module, PM) along the transmission route, wherein an atmospheric manipulator 60 is installed in the equipment front end chamber 20, and a vacuum manipulator 70 is installed in the transfer chamber 40, and two adjacent loading and unloading chambers 30 and six process chambers 50 are arranged at intervals along the circumference of the transfer chamber 40, and the two loading and unloading chambers 30 are connected between the equipment front end chamber 20 and the transfer chamber 40, wherein one loading and unloading chamber 30 is used for the input of wafers 80, and the other loading and unloading chamber 30 is used for the output of wafers 80.

[0058] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in the field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the utility model.

Claims

1. A supporting device, characterized in that: It comprises a base (100) and a support member (200) fixed to the base (100), wherein the support member (200) has a disconnection opening (210), and the disconnection opening (210) is configured for a robot to transfer a wafer (80); The support member (200) has a support surface (220) on the inner side facing the middle of the base (100), the contour surface surrounded by the support surface (220) is an annular arc surface and its diameter decreases from top to bottom, and the support surface (220) is configured to support a wafer (80).

2. The support device according to claim 1, characterized in that: The contour surface is a truncated conical surface.

3. The supporting device according to claim 2, characterized in that: The included angle between the generatrix of the contour surface and the horizontal plane is in the range of 10°-20°.

4. The supporting device according to claim 1, characterized in that: The contour surface is coaxial with the base (100).

5. The supporting device according to any one of claims 1 to 4, characterized in that: The support member (200) comprises a support seat (230) and a support leg (240); the top end of the support leg (240) is fixedly connected to the support seat (230) and the bottom end is detachably fixedly connected to the base (100); and the support surface (220) is located on the support seat (230).

6. The supporting device according to claim 5, characterized in that: The support seat (230) comprises a first seat body (231) and a second seat body (232) which are spaced apart from each other, the disconnection opening (210) being formed between the first seat body (231) and the second seat body (232), the support surface (220) comprising a first support area (221) located on the first seat body (231) and a second support area (222) located on the second seat body (232); the support leg (240) is fixedly arranged between the first seat body (231) and the base (100), and the support leg (240) is fixedly arranged between the second seat body (232) and the base (100).

7. The supporting device according to claim 6, characterized in that: The number of the supporting legs (240) connected between the first seat body (231) and the base (100) is one, and the number of the supporting legs (240) connected between the second seat body (232) and the base (100) is two.

8. The supporting device according to claim 6, characterized in that: The first base body (231) and the second base body (232) are both rectangular base bodies; the side wall corresponding to one long side of the first base body (231) is a first long side wall (231a); the side wall corresponding to one long side of the second base body (232) is a second long side wall (232a); the first long side wall (231a) and the second long side wall (232a) are parallel and oppositely arranged on two sides of the base (100).

9. The supporting device according to claim 8, characterized in that: A first avoidance side wall (231b) is formed by a corner notch of the first seat body (231) facing the second seat body (232), and a second avoidance side wall (232b) is formed by a corner notch of the second seat body (232) facing the first seat body (231). The first avoidance side wall (231b) and the second avoidance side wall (232b) are symmetrical about the axis center of the base (100), wherein a first loading and unloading channel (310) is formed between the first avoidance side wall (231b) and the second avoidance side wall (232b), and a second loading and unloading channel (320) is formed between the first long side wall (231a) and the second long side wall (232a).

10. The supporting device according to claim 5, characterized in that: The top surface of the base (100) is provided with at least two groups of mounting positions, the support leg (240) is detachably fixed to one of the groups of mounting positions, and when the support leg (240) is connected to the mounting positions of different groups, the diameter ranges of the contour surface are different.

11. The support device according to claim 10, characterized in that: The mounting position comprises a limiting groove (110) corresponding to the supporting leg (240), and a limiting hole (120) is provided at the bottom of the limiting groove (110); a limiting column (260) extending downward is provided at the bottom end of the supporting leg (240), and the bottom end of the supporting leg (240) is plugged into the corresponding limiting groove (110), and the limiting column (260) is plugged into the corresponding limiting hole (120).

12. A semiconductor chamber, characterized in that: It comprises a chamber body (31) having a transfer port and a supporting device (32) according to any one of claims 1 to 11, wherein the supporting device (32) is installed in the chamber body (31), and a disconnecting port (210) of the supporting device (32) corresponds to the transfer port.

13. A semiconductor process equipment, characterized in that: It comprises a device front-end chamber (20), a transmission chamber (40) and the semiconductor chamber as claimed in claim 12, wherein the semiconductor chamber has two transmission ports and two disconnection ports (210), one of which is connected to the device front-end chamber (20) and the other is connected to the transmission chamber (40).

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