Wafer supporting ring and wafer supporting structure
By adopting a combination structure of a non-metal ring and an inlaid metal ring in the wafer support ring, the existing wafer support ring is easily deformed and has low strength, and the effects of high strength, light weight and low cost are achieved.
Patent Information
- Application Number
- CN202421343565.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-13
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-13
AI Technical Summary
The existing wafer support rings are prone to deformation, have low strength, and are prone to damage during transportation and processing, and have high manufacturing costs and high transportation costs.
A combination structure of a non-metal ring and a metal ring is adopted, in which a hole is provided in the middle of the non-metal ring, the metal ring is embedded in the annular groove of the non-metal ring, and the outer wall and inner wall of the metal ring are provided with grooves to enhance firmness.
Increases the strength of the wafer support ring, prevents deformation, reduces weight and manufacturing costs, and reduces transportation costs.
Smart Images
Figure CN222619740U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor manufacturing equipment, in particular to a wafer support ring and a wafer support structure. Background Art
[0002] Wafers are the basic materials for manufacturing semiconductor chips. After a long crystal growth process, silicon crystal rods are obtained, and then they are cut, rolled, sliced, chamfered, polished, laser engraved, and packaged to become the basic raw materials of integrated circuit factories - silicon wafers. Wafers need to be transported and stored between each process. Wafer support rings are used to fix wafers, facilitate subsequent wafer production and processing, and prevent expensive wafers from being bruised or scratched during the production process.
[0003] The general wafer support ring is a metal wafer support ring or a plastic wafer support ring. The metal wafer support ring is heavy, expensive to manufacture, and requires professional rust-proof packaging during transportation, which makes the transportation cost high. The plastic wafer support ring has low strength, is easy to break and deform, and is easy to be damaged and generate dust when cutting the wafer. Utility Model Content
[0004] In order to solve the problems of the prior art, the utility model provides a wafer support ring which is not easy to deform, has high strength, is corrosion-resistant and is light in weight.
[0005] The purpose of the utility model can be achieved through the following technical solutions:
[0006] A wafer support ring comprises a non-metallic ring and a metal ring. The non-metallic ring has a hole in the middle, an annular groove is formed on the upper surface of the non-metallic ring near the hole, the metal ring is fixed in the annular groove, and the upper surface of the non-metallic ring is flush with the upper surface of the metal ring.
[0007] As a further solution of the utility model: the metal ring is embedded in the non-metal ring by an in-mold injection molding process.
[0008] As a further solution of the utility model: the inner and outer ring edges of the upper surface of the metal ring are provided with chamfers.
[0009] As a further solution of the utility model: grooves are provided on the outer wall and the inner wall of the metal ring.
[0010] As a further solution of the utility model: the groove is triangular, trapezoidal, sawtooth or semicircular.
[0011] As a further solution of the utility model: the metal ring is made of steel.
[0012] As a further solution of the utility model: the metal ring is stainless steel or stainless iron or carbon steel.
[0013] As a further solution of the utility model: the non-metallic ring is artificial graphite, special ceramics, synthetic rubber, synthetic resin or synthetic fiber.
[0014] As a further solution of the utility model: the non-metallic ring is polycarbonate, polyacrylate, rigid polyvinyl chloride, polyphenylene sulfide or glass fiber.
[0015] The utility model also provides a wafer support structure, including a wafer support ring, a membrane and a wafer, wherein the membrane is adhered to the wafer support ring, and the edge of the membrane is adhered to the upper surface of the metal ring, and the wafer is placed at the hole position of the non-metallic ring and adhered to the upper surface of the membrane.
[0016] The beneficial effects of the utility model are as follows: the metal ring can improve the strength of the non-metal ring, so that the wafer support ring is not easily deformed, and the weight of the wafer support ring is reduced, thereby reducing the cost during transportation. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] The utility model is further described below in conjunction with the accompanying drawings.
[0018] Figure 1 The utility model is a schematic diagram of a wafer support ring and a wafer support structure;
[0019] Figure 2 It is a cross-sectional view of the utility model along line AA;
[0020] Figure 3 It is a cross-sectional view of Example 2 of the present utility model;
[0021] Figure 4 It is a cross-sectional view of embodiment 3 of the present invention. DETAILED DESCRIPTION
[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0023] Example 1
[0024] like Figure 1 and Figure 2As shown, the utility model is a wafer support ring, comprising a non-metal ring 201 and a metal ring 202. The non-metal ring 201 has a hole 203 in the middle, and an annular groove 204 is formed on the upper surface of the non-metal ring 201 near the hole 203. The metal ring 202 is fixed in the annular groove 204, and the upper surface of the non-metal ring 201 is flush with the upper surface of the metal ring 202. The metal ring 202 can improve the strength of the non-metal ring 201, so that the wafer support ring 200 is not easily deformed.
[0025] The non-metallic ring 201 is artificial graphite, special ceramics, synthetic rubber, synthetic resin or synthetic fiber, preferably PPS, ABS, PA or glass fiber. Other plastics may also be used, such as polyethylene, polyvinyl chloride, polystyrene, polypropylene, phenolic plastic, amino plastic, polyoxymethylene, polycarbonate, polytetrafluoroethylene, polymethyl methacrylate, epoxy resin, etc.
[0026] The metal ring 202 is made of stainless steel, stainless iron or carbon steel, and the grades that can be used are SUS420, SUS430, SK5, SK7, 65 manganese, etc. The thickness of the metal ring is about 1.2 mm and the width is about 11 mm. When the metal ring 202 is made of stainless steel, it is made by curling and welding the stainless steel material. Specifically, the whole roll of stainless steel material is automatically cut to the length required for inlaying a circle by a coiling machine, and then automatically rolled into a ring, and then welded at the interface, and then polished to remove the burrs at the interface, and then heat treated, leveled and quenched to improve the overall hardness of the metal ring 202. After heat treatment, the size of the metal ring 202 will be biased, and the metal ring 202 is cut into a suitable size again by laser. Finally, the metal ring 202 is embedded in the non-metallic ring 201 by an in-mold injection molding process. This has low production cost, and the light weight makes the transportation cost relatively low. In addition to stainless steel, the metal ring can also be made of stainless iron, or other alloys, non-ferrous metals or ferrous metals.
[0027] Example 2
[0028] like Figure 3 As shown, this embodiment is an improvement on the embodiment 1. The inner and outer edges of the upper surface of the metal ring 202 are provided with chamfers 205. Compared with the embodiment 1, the metal ring 202 is more firmly embedded in the non-metal ring 201.
[0029] Example 3
[0030] like Figure 4 As shown, the difference between this embodiment and embodiment 2 is that triangular grooves 206 are provided on the outer wall and the inner wall of the metal ring 202. Compared with embodiment 2, the metal ring 202 is more firmly embedded in the non-metal ring 201. In addition to the triangle, the groove 206 can also be trapezoidal, sawtooth or semicircular, and is not limited to these shapes.
[0031] Example 4
[0032] like Figure 1 As shown, a wafer support structure includes a wafer 100, a film 101, and a wafer support ring 200. The film 101 is pasted on the wafer support ring 200, and the edge of the film 101 is pasted on the upper surface of the metal ring 202. The wafer 100 is placed at the hole 203 of the non-metal ring 201 and pasted on the upper surface of the film 101. During processing, the edge of the film 101 can be pasted on the metal ring 201, so that the film can be supported during cutting, and the metal ring 202 is padded under the film 101 so that the wafer support ring 200 is not easily scratched during cutting.
[0033] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.
[0034] The above is a detailed description of an embodiment of the utility model, but the content is only a preferred embodiment of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.
Claims
1. A wafer support ring, characterized in that: It comprises a non-metallic ring and a metal ring. The non-metallic ring has a hole in the middle, an annular groove is formed on the upper surface of the non-metallic ring near the hole, the metal ring is fixed in the annular groove, and the upper surface of the non-metallic ring is flush with the upper surface of the metal ring.
2. The wafer support ring according to claim 1, characterized in that: The metal ring is embedded in the non-metal ring by an in-mold injection molding process.
3. The wafer support ring according to claim 2, characterized in that: The inner and outer ring edges of the upper surface of the metal ring are provided with chamfers.
4. The wafer support ring according to claim 2, characterized in that: Grooves are arranged on the outer wall and the inner wall of the metal ring.
5. The wafer support ring according to claim 4, characterized in that: The groove is triangular, trapezoidal, sawtooth or semicircular.
6. The wafer support ring according to claim 1, characterized in that: The metal ring is made of steel.
7. The wafer support ring according to claim 1, characterized in that: The metal ring is made of stainless steel, stainless iron or carbon steel.
8. The wafer support ring according to claim 1, characterized in that: The non-metallic ring is artificial graphite, special ceramics, synthetic rubber, synthetic resin or synthetic fiber.
9. The wafer support ring according to claim 1, characterized in that: The non-metallic ring is polycarbonate, polyacrylate, rigid polyvinyl chloride, polyphenylene sulfide or glass fiber.
10. A wafer support structure, characterized in that: It comprises a wafer support ring, a film and a wafer as described in any one of claims 1 to 9, wherein the film is adhered to the wafer support ring and the edge of the film is adhered to the upper surface of the metal ring, and the wafer is placed at the hole position of the non-metallic ring and adhered to the upper surface of the film.