Shell assembly and laser

Abstract

The utility model discloses a shell assembly and a laser, the shell assembly comprises a shell, a heat dissipation frame and a mounting mechanism, and the shell is provided with a cavity; the heat dissipation frame is installed in the cavity and comprises a heat dissipation part and an installation part which are connected with each other, the installation part is located on the side, in the first direction, of the heat dissipation part, and the side, away from the heat dissipation part, of the installation part is used for installing a heating component; the mounting mechanism comprises a circuit board and a mounting frame which are connected with each other, the mounting frame is movably connected with the mounting part or the shell, the mounting frame can move between an extending position and a mounting position relative to the shell, when the mounting frame is located at the mounting position, the mounting mechanism is contained in the cavity and located on the side, in the second direction, of the heat dissipation part, and the second direction is perpendicular to the first direction; when the mounting rack is in the extending position, at least parts of the mounting rack and the circuit board extend out of the shell. According to the shell assembly provided by the embodiment of the invention, all parts in the shell can be arranged more compactly, the size of the shell assembly can be further reduced, and a laser can be more miniaturized.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a shell assembly laser. Background Art

[0002] Lasers are widely used in industrial processing, communications, medical, chemical and aviation fields due to their high photoelectric conversion rate, low power consumption and simple structure. As the application scenarios of lasers increase, the demand for miniaturization of lasers is also increasing. However, inside existing lasers, a large space needs to be reserved for the circuit board for wiring operations, resulting in a large internal space for the laser, which affects the miniaturization of the laser. Utility Model Content

[0003] The embodiments of the present application provide a housing assembly and a laser, aiming to solve the problem that a large space needs to be reserved inside the existing laser for the circuit board for wiring operations, resulting in a large internal space of the laser and affecting the miniaturization of the laser.

[0004] An embodiment of the present application provides a housing assembly, including:

[0005] a housing having a cavity;

[0006] A heat sink, installed in the cavity, the heat sink comprising a heat sink and a mounting portion connected to each other, the mounting portion being located on one side of the heat sink along a first direction, and a side of the mounting portion away from the heat sink being used for mounting a heat generating component;

[0007] The mounting mechanism comprises a circuit board and a mounting frame connected to each other, wherein the mounting frame is movably connected to the mounting portion or the housing, and the mounting frame can move between an extended position and a mounting position relative to the housing. When the mounting frame is in the mounting position, the mounting mechanism is accommodated in the cavity and is located on one side of the heat dissipation portion along a second direction, wherein the second direction is perpendicular to the first direction. When the mounting frame is in the extended position, the mounting frame and at least part of the circuit board extend out of the housing.

[0008] In some embodiments, the mounting frame is slidably connected to the mounting portion or the housing along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

[0009] In some embodiments, the circuit board is mounted on one side of the mounting frame along the second direction; and a surface of the circuit board forms an angle with the second direction.

[0010] In some embodiments, when the mounting bracket is in the mounting position, the circuit board is located between the mounting bracket and the heat dissipation portion.

[0011] In some embodiments, the shell assembly includes two heat dissipation frames, and the heat dissipation parts of the two heat dissipation frames are located between the two mounting parts; the mounting part includes a mounting plate, and an installation space is formed between the mounting plates of the two mounting parts, and the installation space is located on one side of the heat dissipation part along the second direction. The mounting frame is slidably connected between the two mounting plates, and when the mounting frame is in the installation position, the mounting mechanism is accommodated in the installation space.

[0012] In some embodiments, the two mounting plates are respectively provided with first slide grooves extending along the third direction on one side facing the mounting space, and the mounting frame is respectively provided with first slide rails on both side edges along the first direction, and the two first slide rails are slidably installed in the two first slide grooves in a one-to-one correspondence, so that the mounting frame is slidably connected between the two mounting plates; or,

[0013] The two mounting plates are respectively provided with second slide rails extending along the third direction on one side facing the mounting space, and the mounting frame is respectively provided with second slide grooves on both side edges along the first direction, and the two second slide rails are slidably installed in the two second slide grooves one by one, so that the mounting frame is slidably connected between the two mounting plates.

[0014] In some embodiments, the mounting board is provided with a via hole, the via hole penetrates the mounting board along the first direction, and the via hole is used for allowing a wire electrically connected to the circuit board to pass through.

[0015] In some embodiments, a side surface of the circuit board facing away from the mounting frame is provided with an electrical device for electrically connecting to a wire.

[0016] In some embodiments, the heat dissipation portion includes a plurality of fins spaced apart in sequence along the second direction; the housing assembly also includes a fan connected to the outer shell, and an air outlet side of the fan faces the gaps between the fins.

[0017] The embodiment of the present application further provides a laser, the laser comprising the housing assembly as described above, the housing assembly comprising:

[0018] a housing having a cavity;

[0019] A heat sink, installed in the cavity, the heat sink comprising a heat sink and a mounting portion connected to each other, the mounting portion being located on one side of the heat sink along a first direction, and a side of the mounting portion away from the heat sink being used for mounting a heat generating component;

[0020] The mounting mechanism comprises a circuit board and a mounting frame connected to each other, wherein the mounting frame is movably connected to the mounting portion or the housing, and the mounting frame can move between an extended position and a mounting position relative to the housing. When the mounting frame is in the mounting position, the mounting mechanism is accommodated in the cavity and is located on one side of the heat dissipation portion along a second direction, wherein the second direction is perpendicular to the first direction. When the mounting frame is in the extended position, the mounting frame and at least part of the circuit board extend out of the housing.

[0021] The housing assembly provided by the embodiment of the present application is configured such that the mounting frame of the mounting structure can be movable between the extended position and the installation position relative to the housing, and when the mounting frame is in the installation position, the mounting mechanism is contained in the cavity and is located on one side of the heat dissipation portion along the second direction, and when the mounting frame is in the extended position, at least part of the mounting frame and the circuit board extend out of the housing. Thus, when it is necessary to perform wiring operations on the circuit board, the mounting frame can be moved to the extended position, so that at least a part of the circuit board extends outward, so as to facilitate wiring operations on the circuit board on the outside of the housing. After completing the wiring operation of the circuit board, the mounting frame can be moved to the installation position, so that the mounting plate is installed in the cavity of the housing and is located on one side of the heat dissipation portion along the second direction. Since the circuit board is wired on the outside of the housing, there is no need to reserve a large space in the housing for wiring operations on the circuit board, so that the components in the housing can be arranged more compactly, which is conducive to further reducing the size of the housing assembly and making the laser more miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0023] Figure 1 A schematic structural diagram of an embodiment of a laser provided in an embodiment of the present application, wherein a mounting frame of the mounting mechanism is in an extended position;

[0024] Figure 2 A schematic structural diagram of an embodiment of a heat sink and a mounting mechanism of a housing assembly provided in an embodiment of the present application;

[0025] Figure 3 for Figure 2 Another angle view of the middle heat sink and mounting mechanism;

[0026] Figure 4 A schematic diagram of the structure of a mounting frame of a laser mounting mechanism provided in an embodiment of the present application when the mounting frame is in a mounting position.

[0027] Laser 100; housing assembly 110; housing 111; opening 1111; heat sink 112; heat dissipation portion 1121; fins 1122; mounting portion 1123; mounting plate 1124; first slide groove 1125; through hole 1126; mounting space 1127; fan 113; mounting mechanism 114; circuit board 1141; mounting frame 1142; first slide rail 1143; cover plate 115; first direction X; second direction Y; third direction Z. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0029] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific processes and examples of materials, but those of ordinary skill in the art can appreciate the application of other processes and / or the use of other materials.

[0030] The embodiments of the present application provide a housing assembly and a laser, which are described in detail below.

[0031] First, an embodiment of the present application provides a housing assembly.

[0032] Figure 1 A schematic structural diagram of an embodiment of a laser provided in an embodiment of the present application, wherein a mounting frame of the mounting mechanism is in an extended position. Figure 2 This is a schematic diagram of the structure of an embodiment of the heat sink and mounting mechanism of the housing assembly provided in the embodiment of the present application. Figure 1 and Figure 2As shown, the laser 100 includes a housing assembly 110, which includes a shell 111 and a heat sink 112. The shell 111 has a cavity (not shown in the figure), and the heat sink 112 is installed in the cavity. The heat sink 112 includes a heat sink 1121 and a mounting portion 1123 that are connected to each other. The mounting portion 1123 is located on one side of the heat sink 1121 along the first direction X, and the side of the mounting portion 1123 that is away from the heat sink 1121 is used to install a heat-generating component (not shown in the figure). The heat generated by the heat-generating component can be transferred to the heat sink 1121 through the mounting portion 1123, and then the heat is dissipated by the heat sink 1121 to achieve cooling and heat dissipation of the heat-generating component. Among them, the heat-generating component can be a pump source, an optical fiber disk, and other components that need to be dissipated.

[0033] In some embodiments, Figures 1 to 4 As shown, the housing assembly 110 may further include a mounting mechanism 114, the mounting mechanism 114 including a circuit board 1141 and a mounting frame 1142 connected to each other, the mounting frame 1142 being movably connected to the mounting portion 1123 or the housing 111, so that the mounting frame 1142 can be in an extended position (such as Figure 1 as shown) and installation location (as shown Figure 4 When the mounting bracket 1142 is in the mounting position, the mounting mechanism 114 is accommodated in the cavity and is located on one side of the heat dissipation portion 1121 along the second direction Y, and the second direction Y is perpendicular to the first direction X. When the mounting bracket 1142 is in the extended position, at least a portion of the mounting bracket 1142 and the circuit board 1141 extend out of the housing 111.

[0034] The housing assembly 110 provided in the embodiment of the present application is configured such that the mounting frame 1142 can be moved between an extended position and an installed position relative to the housing 111, and when the mounting frame 1142 is in the installed position, the mounting mechanism 114 is accommodated in the cavity and is located on one side of the heat dissipation portion 1121 along the second direction Y, and when the mounting frame 1142 is in the extended position, at least a portion of the mounting frame 1142 and the circuit board 1141 extend out of the housing 111. Thus, when it is necessary to perform wiring operations on the circuit board 1141, the mounting frame 1142 can be moved to the extended position, so that at least a portion of the circuit board 1141 extends outward, so as to facilitate wiring operations on the circuit board 1141 on the outside of the housing 111. After completing the wiring operation of the circuit board 1141, the mounting frame 1142 can be moved to the installed position, so that the mounting plate 1124 is installed in the cavity of the housing 111 and is located on one side of the heat dissipation portion 1121 along the second direction Y.

[0035] Since the circuit board 1141 is wired on the outside of the shell 111, there is no need to reserve a large space in the shell 111 for wiring the circuit board 1141, which enables the components in the shell 111 to be arranged more compactly, which is beneficial to further reduce the size of the housing assembly 110 and make the laser 100 more miniaturized.

[0036] The mounting frame 1142 can be directly or indirectly movably connected to the mounting portion 1123, or the mounting portion 1123 can be directly or indirectly movably connected to the outer shell 111. In addition, the mounting frame 1142 can be slidably connected or rotatably connected to the mounting portion 1123 or the outer shell 111, and it is sufficient for the mounting frame 1142 to be movable relative to the outer shell 111 between the mounting position and the extended position.

[0037] In some embodiments, Figure 2 and Figure 3 As shown, the mounting frame 1142 can be slidably connected to the mounting portion 1123 or the housing 111 along the third direction Z, so that the mounting frame 1142 can slide between the mounting position and the extended position relative to the housing 111. The first direction X, the second direction Y and the third direction Z are perpendicular to each other. Thus, it is possible to avoid interference between the mounting frame 1142 and the heat sink 112 during the movement between the mounting position and the extended position. Moreover, the space occupied by the mounting frame 1142 during the movement between the mounting position and the extended position is small, which is conducive to further reducing the size of the housing assembly 110.

[0038] In some embodiments, the circuit board 1141 may be mounted on one side of the mounting frame 1142 along the second direction Y, and the board surface of the circuit board 1141 forms an angle with the second direction Y. This further reduces the size of the mounting mechanism 114 in the second direction Y, making the mounting mechanism 114 more compact in the housing 111 .

[0039] When the mounting frame 1142 is in the mounting position, the circuit board 1141 can be located between the mounting frame 1142 and the heat dissipation portion 1121, or the circuit board 1141 can be located on the side of the mounting frame 1142 away from the heat dissipation portion 1121. Of course, the circuit board 1141 can also be installed on the side of the mounting frame 1142 along the first direction X. In addition, the angle formed by the board surface of the circuit board 1141 and the second direction Y can be a right angle or an acute angle, which can be determined according to the internal structure of the housing assembly 110.

[0040] Specifically, Figures 1 to 3As shown, the circuit board 1141 is installed on one side of the mounting frame 1142 along the second direction Y. When the mounting frame 1142 is in the installation position, the circuit board 1141 is located on one side of the mounting frame 1142 close to the heat dissipation portion 1121. There is a gap between the circuit board 1141 and the heat dissipation portion 1121 to prevent the heat of the heat dissipation portion 1121 from affecting the circuit board 1141.

[0041] In some embodiments, an electrical device (not shown) for electrically connecting to a wire is provided on a side of the circuit board 1141 that is away from the mounting frame 1142. Thus, when the mounting frame 1142 is in the extended position, the circuit board 1141 can avoid being interfered by the mounting frame 1142 when connecting the wire, which is conducive to improving the connection efficiency between the circuit board 1141 and the wire.

[0042] like Figure 2 and Figure 3 As shown, the housing assembly 110 may include two heat sinks 112, and the heat dissipation portions 1121 of the two heat sinks 112 are located between the two mounting portions 1123. The side of the mounting portions 1123 of the two heat sinks 112 that are away from the corresponding heat dissipation portions 1121 can be used to mount heat generating components. The side of the mounting portion 1123 of one heat sink 112 that is away from the heat dissipation portion 1121 can be used to mount a pump source, while the side of the mounting portion 1123 of the other heat sink 112 that is away from the heat dissipation portion 1121 can be used to mount an optical fiber disk.

[0043] The heat dissipation portion 1121 may include a plurality of fins 1122 that are sequentially spaced and distributed along the second direction Y. A gap for airflow is formed between two adjacent fins 1122. The housing assembly 110 further includes a fan 113 connected to the housing 111, and the air outlet side of the fan 113 faces the gap between the fins 1122. Thus, the fan 113 can provide cold air to the gap between the fins 1122, take away the heat of the fins 1122, and cool the fins 1122.

[0044] The housing assembly 110 may include a plurality of fans 113, which are sequentially distributed along the second direction Y to further improve the heat dissipation effect of the heat dissipation portion 1121. In addition, the plurality of fins 1122 of the two heat dissipation portions 1121 may be arranged one-to-one, or the plurality of fins 1122 of the two heat dissipation portions 1121 may be staggered in the second direction Y. The mounting portion 1123 is arranged in a plate shape, and the mounting portion 1123 is integrally connected to the plurality of fins 1122 of the corresponding heat dissipation portion 1121 along one side of the first direction X. The widths of the fins 1122 of the two heat dissipation portions 1121 in the first direction X may be the same or different, depending on the amount of heat that the heat dissipation portion 1121 needs to dissipate.

[0045] In some embodiments, Figure 2 and Figure 3 As shown, the mounting portion 1123 includes a mounting plate 1124, and a mounting space 1127 is formed between the mounting plates 1124 of the two mounting portions 1123. The mounting space 1127 is located at one side of the heat dissipation portion 1121 along the second direction Y. The mounting frame 1142 is slidably connected between the two mounting plates 1124, and when the mounting frame 1142 is in the mounting position, the mounting mechanism 114 is accommodated in the mounting space 1127. Thus, the mounting frame 1142 can slide relative to the housing 111 between the mounting position and the extended position.

[0046] Among them, the two mounting plates 1124 are respectively provided with a first sliding groove 1125 extending along the third direction Z on one side facing the mounting space 1127, and the mounting frame 1142 is respectively provided with a first sliding rail 1143 on both side edges along the first direction X. The two first sliding rails 1143 are slidably installed in the two first sliding grooves 1125 one by one, so that the mounting frame 1142 can be stably slidably connected between the two mounting plates 1124.

[0047] Specifically, the mounting frame 1142 can be provided in a plate shape. The plate surface of the mounting frame 1142 forms an angle with the second direction Y. One side surface of the circuit board 1141 is arranged opposite to one side surface of the mounting frame 1142. The circuit board 1141 is mounted on the mounting frame 1142 by screw fixing or clamping. The first slide rails 1143 are protrudingly provided on both side edges of the mounting frame 1142 along the first direction X, and the first slide rails 1143 extend along the third direction Z.

[0048] Of course, a second slide rail (not shown in the figure) extending along the third direction Z can also be provided on one side of the two mounting plates 1124 facing the mounting space 1127, and a second slide groove (not shown in the figure) can be provided on the two side edges of the mounting frame 1142 along the first direction X. The two second slide rails are slidably installed in the two second slide grooves one by one, so that the mounting frame 1142 can be stably slidably connected between the two mounting plates 1124.

[0049] In some embodiments, Figure 2 and Figure 3 As shown, a via hole 1126 may be provided on the mounting plate 1124, and the via hole 1126 penetrates the mounting plate 1124 along the first direction X. The via hole 1126 is used for passing a wire electrically connected to the circuit board 1141. The via hole 1126 is located on one side of the mounting space 1127 along the direction in which the mounting frame 1142 moves from the mounting position to the extended position, so that the via hole 1126 is close to the circuit board 1141 on the mounting frame 1142 when the mounting frame 1142 is in the extended position.

[0050] like Figure 1 and Figure 4As shown, the surface of the housing 111 is provided with an opening 1111 communicated with the cavity, and the opening 1111 is used for the mounting bracket 1142 to pass through and extend out of the outer surface of the housing 111, so that the mounting bracket 1142 can move between a mounting position and an extended position.

[0051] In some embodiments, the housing assembly 110 further includes a sealing plate 115 connected to the mounting bracket 1142. When the mounting bracket 1142 is in the mounting position, the sealing plate 115 covers the opening 1111 to prevent dust or other impurities from entering the cavity of the housing 111 from the opening 1111. When the mounting bracket 1142 moves from the mounting position to the extended position, the sealing plate 115 moves with the mounting bracket 1142 to open the opening 1111 of the housing 111. The sealing plate 115 is located on one side of the direction in which the mounting bracket 1142 slides from the mounting position to the extended position, and the plate surface of the sealing plate 115 is perpendicular to the third direction Z.

[0052] Specifically, multiple fans 113 are sequentially arranged along the second direction Y on one side of the housing 111 along the third direction Z, the sealing plate 115 and the fans 113 are located on the same side of the housing 111, and the sealing plate 115 and the multiple fans 113 are sequentially distributed along the second direction Y.

[0053] The embodiment of the present application also provides a laser, which includes a shell assembly. The specific structure of the shell assembly refers to the above embodiment. Since the laser adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.

[0054] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0055] The above is a detailed introduction to a shell assembly and a laser provided in the embodiments of the present application. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of ​​the present application. Ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some of the technical features therein with equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A housing assembly, characterized in that: include: a housing having a cavity; A heat sink is installed in the cavity, the heat sink comprises a heat sink and a mounting portion connected to each other, the mounting portion is located on one side of the heat sink along the first direction, and a side of the mounting portion away from the heat sink is used for mounting a heat generating component; The mounting mechanism comprises a circuit board and a mounting frame connected to each other, wherein the mounting frame is movably connected to the mounting portion or the housing, and the mounting frame can move between an extended position and a mounting position relative to the housing. When the mounting frame is in the mounting position, the mounting mechanism is accommodated in the cavity and is located on one side of the heat dissipation portion along a second direction, wherein the second direction is perpendicular to the first direction. When the mounting frame is in the extended position, the mounting frame and at least part of the circuit board extend out of the housing.

2. The housing assembly according to claim 1, wherein: The mounting frame is slidably connected to the mounting portion or the housing along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

3. The housing assembly according to claim 2, wherein: The circuit board is mounted on one side of the mounting frame along the second direction; a board surface of the circuit board forms an angle with the second direction.

4. The housing assembly according to claim 3, characterized in that: When the mounting bracket is in the mounting position, the circuit board is located between the mounting bracket and the heat dissipation portion.

5. The housing assembly according to claim 2, wherein: The shell assembly includes two heat dissipation frames, and the heat dissipation parts of the two heat dissipation frames are located between the two mounting parts; the mounting part includes a mounting plate, and an installation space is formed between the mounting plates of the two mounting parts, and the installation space is located on one side of the heat dissipation part along the second direction. The mounting frame is slidably connected between the two mounting plates, and when the mounting frame is in the installation position, the mounting mechanism is accommodated in the installation space.

6. The housing assembly according to claim 5, characterized in that: The two mounting plates are respectively provided with first slide grooves extending along the third direction on one side facing the mounting space, and the mounting frame is respectively provided with first slide rails on both side edges along the first direction, and the two first slide rails are slidably installed in the two first slide grooves in a one-to-one correspondence, so that the mounting frame is slidably connected between the two mounting plates; or, The two mounting plates are respectively provided with second slide rails extending along the third direction on one side facing the mounting space, and the mounting frame is respectively provided with second slide grooves on both side edges along the first direction, and the two second slide rails are slidably installed in the two second slide grooves one by one, so that the mounting frame is slidably connected between the two mounting plates.

7. The housing assembly according to claim 5, characterized in that: The mounting plate is provided with a via hole, the via hole penetrates the mounting plate along the first direction, and the via hole is used for a wire electrically connected to the circuit board to pass through.

8. The housing assembly according to claim 1, wherein: An electrical component for electrically connecting to a wire is disposed on a side surface of the circuit board facing away from the mounting frame.

9. The housing assembly according to any one of claims 1 to 8, characterized in that: The heat dissipation portion includes a plurality of fins that are sequentially spaced and distributed along the second direction; the housing assembly also includes a fan connected to the housing, and an air outlet side of the fan faces the gaps between the fins.

10. A laser, characterized in that: The laser comprises the housing assembly according to any one of claims 1 to 9.

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