Semiconductor substrate structure

Abstract

The utility model discloses a semiconductor substrate structure which comprises a substrate and a polishing device, the polishing device is arranged around the substrate, a supporting column is installed at the bottom of the substrate, a base is installed at the bottom of the supporting column, the side face of the base is connected with a polishing solution conveying pipeline, and the polishing solution conveying pipeline is connected with the polishing solution conveying pipeline. One end of the polishing liquid conveying pipeline is connected with a connecting piece, the outer ring of the connecting piece is sleeved with a carrier, a pressure sensor is installed on the surface of the carrier, the bottom of the carrier is connected with a polishing disc, a polishing head is installed on the surface of the polishing disc, and a control panel is arranged on the surface of the base. An emergency stop button is arranged on the lower right portion of the base. According to the utility model, chemical mechanical polishing (CMP) is executed in semiconductor manufacturing through the polishing device, so that scattering of electrons on the surface of a semiconductor is reduced, the electron mobility is improved, the crystal quality is improved, the consistency is ensured, the process controllability is improved, the contact performance is optimized, and the leakage current is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of mechanical engineering, in particular to a semiconductor substrate structure. Background Art

[0002] With the advancement of science and technology, the demand for manufacturing electronic devices continues to grow. The new generation of chips, sensors, storage devices, etc. have higher requirements for semiconductor substrates and require more advanced construction technologies to meet the growing performance requirements.

[0003] The existing semiconductor substrate structure has the following problems when used: First, the problem of chip and substrate assembly: In a semiconductor substrate structure of CN201120498588.X, a semiconductor substrate structure is provided, which mainly sets a plurality of first columnar bumps on the upper surface of the substrate to electrically connect a chip, and sets a plurality of second columnar bumps on the lower surface of the substrate to electrically connect an external circuit board. Wherein, the first columnar bump and the second columnar bump are selected from copper column bumps or nickel column bumps. The first columnar bump of the semiconductor substrate structure of the utility model can avoid the problem that the bumps between the existing chip and the substrate are prone to produce defective products during reflow soldering, and the problem that the heat dissipation and heat resistance of the bumps are poor; and the second columnar bump of the semiconductor substrate structure can avoid the problem that the solder balls between the existing substrate and an external circuit board have poor heat dissipation and heat resistance, but when preparing the semiconductor substrate, the surface roughness may become a problem; second, the surface roughness will cause the migration of electrons on the semiconductor surface to be scattered. This scattering effect may increase the mean free path of electrons, reduce the electron mobility, and thus affect the electrical performance of the device. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor substrate structure to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor substrate structure, comprising a substrate and a polishing device, wherein the polishing device is arranged around the substrate, a support column is installed at the bottom of the substrate, a base is installed at the bottom of the support column, a polishing liquid delivery pipeline is connected to the side of the base, a connecting piece is connected to one end of the polishing liquid delivery pipeline, a carrier is sleeved on the outer ring of the connecting piece, a pressure sensor is installed on the surface of the carrier, a polishing disk is connected to the bottom of the carrier, a polishing head is installed on the surface of the polishing disk, a control panel is arranged on the surface of the base, and an emergency stop button is arranged at the lower right corner of the base.

[0006] Preferably, the base plate and the support column are connected by a slot, and the size of the slot of the support column is larger than that of the base plate.

[0007] Preferably, the support column and the base are welded, and the base and the support column are connected and fixed.

[0008] Preferably, the base is mechanically connected to the polishing liquid delivery pipeline, and the polishing liquid delivery pipeline is made of polyethylene.

[0009] Preferably, the polishing liquid delivery pipeline is connected to the connecting piece by a groove, and the connecting piece and the polishing liquid delivery pipeline guide the polishing liquid.

[0010] Preferably, the connector and the carrier are connected via a sleeve, and the carrier and the connector are of matching sizes.

[0011] Preferably, the carrier is connected to the polishing disc by screws, and the polishing disc and the carrier are tightly fitted.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] The utility model provides an electric lifting device, and the polishing device performs chemical mechanical polishing (CMP) in semiconductor manufacturing, which improves the surface roughness of the semiconductor substrate and brings multiple benefits; first, by improving the flatness of the surface and reducing the roughness, the performance of semiconductor devices can be significantly improved, especially in high-performance and high-integration devices. The smooth surface helps to reduce the scattering of electrons on the semiconductor surface and improve the electron mobility, which is crucial for the performance of high-frequency and high-speed electronic devices. In addition, CMP can also improve crystal quality, ensure consistency, improve process controllability, optimize contact performance, reduce leakage current, etc., providing key support for the stability and reliability of semiconductor devices. Overall, by implementing CMP through a polishing device, high-performance and high-reliability semiconductor device preparation can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model.

[0015] Figure 2 It is a schematic diagram of the internal structure of the utility model.

[0016] Figure 3 It is a schematic diagram of the polishing structure of the utility model.

[0017] Figure 4 It is a schematic diagram of the bottom structure of the polishing structure of the utility model.

[0018] In the figure: 1, substrate; 2, polishing device; 201, support column; 202, base; 203, polishing liquid delivery pipeline; 204, connecting piece; 205, carrier; 206, pressure sensor; 207, polishing plate; 208, polishing head; 209, control panel; 210, emergency stop button. DETAILED DESCRIPTION

[0019] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0020] See also Figure 1-4 The utility model provides an embodiment: a semiconductor substrate structure, including a substrate 1 and a polishing device 2, the polishing device 2 is arranged around the substrate 1, a support column 201 is installed at the bottom of the substrate 1, a base 202 is installed at the bottom of the support column 201, a polishing liquid delivery pipeline 203 is connected to the side of the base 202, one end of the polishing liquid delivery pipeline 203 is connected to a connecting piece 204, the outer ring of the connecting piece 204 is sleeved with a carrier 205, a pressure sensor 206 is installed on the surface of the carrier 205, a polishing disk 207 is connected to the bottom of the carrier 205, a polishing head 208 is installed on the surface of the polishing disk 207, a control panel 209 is arranged on the surface of the base 202, and an emergency stop button 210 is arranged at the lower right corner of the base 202.

[0021] The base plate 1 and the support column 201 are connected by a slot. The size of the slot of the support column 201 is larger than that of the base plate 1, providing support and stability for fixing and supporting the polishing head 208 and related components.

[0022] The support column 201 and the base 202 are welded, and the base 202 and the support column 201 are connected and fixed, providing a basic support structure for the entire polishing device 2 to ensure that the equipment remains stable during operation.

[0023] The base 202 is mechanically connected to the polishing liquid delivery pipe 203, which is made of polyethylene and is used to convey objects through the polishing head 208 to ensure that the entire surface can be evenly polished.

[0024] The polishing liquid delivery pipeline 203 and the connecting piece 204 are connected by a groove. The connecting piece 204 and the polishing liquid delivery pipeline 203 guide the polishing liquid and connect various components to ensure that they work together to form a complete polishing system.

[0025] The connecting member 204 and the carrier 205 are connected by a sleeve. The carrier 205 matches the connecting member 204 in size and carries the object to be polished and moves it to the vicinity of the polishing head 208 for polishing.

[0026] The carrier 205 is connected to the polishing disc 207 by screws. The polishing disc 207 fits tightly against the carrier 205 and is mounted on the polishing head 208 to carry polishing materials (such as polishing cloth or abrasive) to polish the surface of the object through rotational motion.

[0027] Working principle: The working principle of the polishing device 2 involves the coordinated operation of multiple components. First, the support column 201 and the base 202 provide support and stability to ensure the correct position of the substrate 1. The polishing liquid delivery pipeline 203 is responsible for delivering the polishing liquid to the polishing area. The connector 204 and the carrier 205 firmly fix the substrate 1 on the polishing disk 207 to ensure a uniform polishing effect. The pressure sensor 206 monitors the pressure changes during the polishing process to help adjust the polishing parameters in real time. The polishing head 208 distributes the polishing liquid evenly on the surface of the substrate 1 through rotation and movement, and removes surface defects and unevenness through friction. The control panel 209 and the emergency stop button 210 are used to adjust and control the entire polishing process to ensure the safety and accuracy of the operation. The synergy of the entire system enables the polishing device 2 to accurately control the polishing process and achieve efficient polishing of the surface of the semiconductor substrate 1, thereby ensuring the preparation of a high-quality, flat substrate 1.

[0028] The above is only an embodiment of the utility model, and the common sense such as the known specific structure and characteristics in the scheme is not described too much here. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and the utility model can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the utility model. Any figure mark in the claims should not be regarded as limiting the claims involved.

Claims

1. A semiconductor substrate structure, comprising a substrate (1) and a polishing device (2), characterized in that: A polishing device (2) is arranged around the substrate (1); a support column (201) is installed at the bottom of the substrate (1); a base (202) is installed at the bottom of the support column (201); a polishing liquid delivery pipeline (203) is connected to the side of the base (202); one end of the polishing liquid delivery pipeline (203) is connected to a connecting piece (204); a carrier (205) is sleeved on the outer ring of the connecting piece (204); a pressure sensor (206) is installed on the surface of the carrier (205); a polishing disc (207) is connected to the bottom of the carrier (205); a polishing head (208) is installed on the surface of the polishing disc (207); a control panel (209) is arranged on the surface of the base (202); and an emergency stop button (210) is arranged at the lower right of the base (202).

2. A semiconductor substrate structure according to claim 1, characterized in that: The base plate (1) and the support column (201) are connected by a slot, and the size of the slot of the support column (201) is larger than the size of the base plate (1).

3. The semiconductor substrate structure according to claim 1, characterized in that: The support column (201) and the base (202) are welded, and the base (202) and the support column (201) are connected and fixed.

4. The semiconductor substrate structure according to claim 1, characterized in that: The base (202) and the polishing liquid delivery pipeline (203) are mechanically connected, and the polishing liquid delivery pipeline (203) is made of polyethylene.

5. The semiconductor substrate structure according to claim 1, characterized in that: The polishing liquid delivery pipeline (203) and the connecting piece (204) are connected by a groove, and the connecting piece (204) and the polishing liquid delivery pipeline (203) form a guide for the polishing liquid.

6. The semiconductor substrate structure according to claim 1, characterized in that: The connecting piece (204) and the carrier (205) are connected by a sleeve, and the sizes of the carrier (205) and the connecting piece (204) are consistent.

7. The semiconductor substrate structure according to claim 1, characterized in that: The carrier (205) and the polishing disc (207) are connected by screws, and the polishing disc (207) and the carrier (205) are tightly fitted.

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