Cross-medium temperature measuring device and kitchen cooking electric appliance

Abstract

The embodiment of the utility model provides a cross-medium temperature measuring device and a kitchen cooking electric appliance. The cross-medium temperature measuring device comprises a heat conductor, a first temperature sensor, a second temperature sensor and a heat insulator. A first temperature sensor is arranged at the position, close to a first surface, in a heat conductor, a second temperature sensor is arranged at the position, close to a second surface, in the heat conductor, and a heat insulator is arranged on the side face of the heat conductor. According to the cross-medium temperature measuring device, the first temperature sensor and the second temperature sensor are used for measuring the heat flow of the heat conductor, then the temperature of the object to be subjected to temperature measurement can be calculated, and compared with a traditional temperature measuring device for measuring the temperature of a single point, the cross-medium temperature measuring device is high in precision.

Description

Technical Field

[0001] Embodiments of the present application relate to the field of temperature measurement technology, and in particular, to a cross-medium temperature measurement device and a kitchen cooking appliance. Background Art

[0002] Cooking appliances generally need to monitor the temperature of the food or pots they heat in order to match the appropriate heating power and the control methods that affect the characteristics of the food. However, the current temperature measurement method in the field of home appliances is relatively simple. Generally, a temperature sensor is placed on the home appliance to achieve the purpose of monitoring the temperature. Usually, this temperature sensor cannot directly contact the food or pots. This temperature measurement method has major defects in many cases, especially when it is necessary to measure the temperature of another object across one object. It depends largely on the thermal conductivity of the object being crossed, resulting in a long response time and low accuracy of the traditional single sensor temperature measurement method. Utility Model Content

[0003] The embodiments of the present application provide a cross-medium temperature measurement device and a kitchen cooking appliance to at least partially improve the above-mentioned problems.

[0004] In a first aspect, an embodiment of the present application provides a cross-medium temperature measurement device, comprising: a heat conductor, a first temperature sensor, a second temperature sensor, and an insulator.

[0005] The heat conductor has a first surface and a second surface facing each other and a side surface connected between the first surface and the second surface, wherein the first surface is used to contact a medium in contact with an object to be measured. The first temperature sensor is disposed in the heat conductor and adjacent to the first surface. The second temperature sensor is disposed in the heat conductor and adjacent to the second surface. The heat insulator is sleeved on the side surface.

[0006] In one implementation, a line connecting the first temperature sensor and the second temperature sensor is perpendicular to the first surface.

[0007] In one embodiment, the first temperature sensor and the second temperature sensor are both disposed on the central axis of the heat conductor.

[0008] In one embodiment, the heat conductor includes a contact portion and a supporting portion, the supporting portion is connected to the contact portion, the first surface is located at the contact portion, the cross-sectional area of ​​the contact portion is larger than the cross-sectional area of ​​the supporting portion, and the heat insulator includes a first cylinder and a second cylinder connected to each other, the first cylinder is sleeved outside the supporting portion, and the second cylinder is sleeved outside the contact portion.

[0009] In one embodiment, the heat conductor is provided with a first mounting groove and a second mounting groove, the first temperature sensor is arranged in the first mounting groove, and the second temperature sensor is arranged in the second mounting groove.

[0010] In one embodiment, the first mounting groove is opened on the first surface, and the second mounting groove is opened on the second surface.

[0011] In one embodiment, openings of the first mounting groove and the second mounting groove are formed on the side surface.

[0012] In one embodiment, an opening of one of the first mounting groove and the second mounting groove is formed on the side surface, and an opening of the other one is formed on the first surface or the second surface.

[0013] In one embodiment, the first temperature sensor and the second temperature sensor are both disposed inside the heat conductor, and the heat conductor, the first temperature sensor, and the second temperature sensor are integrally disposed.

[0014] In one embodiment, the cross-medium temperature measuring device further includes: a wire, one end of which is used to be electrically connected to the first temperature sensor and the second temperature sensor, and the other end of which is led out from a side of the thermal insulator adjacent to the second surface.

[0015] In a second aspect, an embodiment of the present application provides a kitchen cooking appliance, which is provided with the cross-medium temperature measuring device as described above.

[0016] The cross-medium temperature measuring device and the kitchen cooking appliance provided in the embodiments of the present application are provided with a first temperature sensor disposed in the heat conductor adjacent to the first surface, a second temperature sensor disposed in the heat conductor adjacent to the second surface, and a heat insulator disposed on the side of the heat conductor. Since there is a medium between the object to be measured and the heat conductor, the heat flow of the heat conductor is measured by using the first temperature sensor and the second temperature sensor, and the temperature of the object to be measured can be further inferred. Compared with the traditional temperature measuring device for measuring the temperature of a single point, the cross-medium temperature measuring device has high accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1A schematic diagram showing a structure of a cross-medium temperature measuring device provided by an embodiment of the present application installed on an induction cooker;

[0019] Figure 2 A schematic structural diagram of another cross-medium temperature measurement device provided in an embodiment of the present application is shown;

[0020] Figure 3 A schematic structural diagram of another cross-medium temperature measurement device provided in an embodiment of the present application is shown;

[0021] Figure 4 A schematic structural diagram of another cross-medium temperature measurement device provided in an embodiment of the present application is shown;

[0022] Figure 5 A schematic structural diagram of yet another cross-medium temperature measurement device provided in an embodiment of the present application is shown;

[0023] Figure 6 A structural block diagram of a kitchen cooking appliance provided in one embodiment of the present application is shown.

[0024] Figure numerals: kitchen cooking appliance 1, cross-medium temperature measuring device 10, heat conductor 110, first surface 111, second surface 112, side 113, contact portion 114, support portion 115, first mounting groove 116, second mounting groove 117, first temperature sensor 120, second temperature sensor 130, insulation 140, first cylinder 141, second cylinder 142, wire 150, microcrystalline panel 20, substrate 30. DETAILED DESCRIPTION

[0025] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0026] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application.

[0027] Cooking appliances generally need to monitor the temperature of the food or pots they heat in order to match the appropriate heating power and control measures that affect the characteristics of the food.

[0028] However, the current temperature measurement method in the field of home appliances is relatively simple. Generally, a temperature sensor is placed on the home appliance to achieve the purpose of monitoring the temperature. Usually, this temperature sensor cannot directly contact the food or pots. This temperature measurement method has major defects in many cases, especially when it is necessary to measure the temperature of another object across one object. It depends largely on the thermal conductivity of the object being crossed, resulting in a long response time and low accuracy of the traditional single sensor temperature measurement method.

[0029] Taking induction cookers as an example, there are generally two conventional temperature measurement methods for induction cookers: one is to place the temperature sensor on the lower surface of the microcrystalline panel of the induction cooker, and achieve the purpose of temperature monitoring through the heat transfer of the microcrystalline panel; the other is to open a hole in the microcrystalline panel of the induction cooker, install the packaged temperature sensor on a spring support device, and make the temperature sensor pass through the opening of the microcrystalline panel to directly contact the pot, so as to achieve the purpose of measuring the temperature of the pot.

[0030] In the first temperature measurement method, due to the poor thermal conductivity of the microcrystalline panel, the temperature sensor measures the temperature inaccurately and has obvious hysteresis; although the second temperature measurement method avoids the problem of poor thermal conductivity of the microcrystalline panel, it requires opening holes on the microcrystalline surface, which destroys the overall aesthetics of the induction cooker, and the opening of the holes will also cause problems such as poor sealing. Based on the above problems, the embodiment of the present application provides a cross-medium temperature measurement device to at least partially improve the above problems.

[0031] See also Figure 1 , Figure 1 The schematic diagram of the structure of a cross-medium temperature measurement device 10 provided in one embodiment of the present application is shown. In this embodiment, the cross-medium temperature measurement device 10 may include: a heat conductor 110 , a first temperature sensor 120 , a second temperature sensor 130 and a heat insulator 140 .

[0032] The heat conductor 110 has a first surface 111 and a second surface 112 opposite to each other and a side surface 113 connected between the first surface 111 and the second surface 112 . The first surface 111 is used to contact with a medium that contacts an object to be temperature measured.

[0033] For the convenience of explanation, the embodiment of the present application is explained by taking the cross-medium temperature measuring device 10 applied to an induction cooker as an example. The induction cooker may include a microcrystalline panel 20 and a substrate 30. The microcrystalline panel 20 may hold a pot. In this embodiment, the microcrystalline panel 20 is the medium, and the pot is the object to be measured. The cross-medium temperature measuring device 10 may be arranged between the microcrystalline panel 20 and the substrate 30, and abut against the microcrystalline panel 20 and the substrate 30, so as to facilitate the fixation of the cross-medium temperature measuring device 10 and facilitate the cross-medium temperature measuring device 10 to conduct the temperature of the microcrystalline panel 20. The heat conductor 110 is used to absorb the heat of the microcrystalline panel 20 and transfer the heat of the microcrystalline panel 20 to the first temperature sensor 120 and the second temperature sensor 130.

[0034] The embodiments of the present application do not limit the specific structure and material of the heat conductor 110. For example, in some embodiments, the heat conductor 110 can be made of a material with high thermal conductivity, such as metal, ceramic, graphite, etc. These materials have excellent thermal conductivity, can quickly transfer heat, reduce thermal resistance, and improve heat conduction efficiency. The specific thermal conductive material to be used can be selected according to actual conditions.

[0035] Specifically, metal material is a common heat conductor 110, such as copper, silver, etc., which have good thermal conductivity and high thermal stability. When the contact area between metals is large, the metal bonds between atoms can transfer heat and diffuse the heat rapidly. In addition, metal materials have strong tensile strength and compressive strength and can withstand large thermal stress. However, metal materials also have certain limitations, such as high density, high cost, poor oxidation resistance, etc.

[0036] Ceramic materials are also excellent thermal conductors 110, such as aluminum oxide, silicon nitride, etc. Ceramics have the advantages of high melting point, high hardness, low thermal expansion coefficient, etc., which make them have good stability in high temperature environments. In addition, the gaps between ceramic materials are small, which helps to quickly transfer heat. However, the thermal conductivity of ceramic materials is still slightly lower than that of metal materials, and the impact resistance is poor, and it is easy to break.

[0037] Graphite has excellent thermal conductivity and chemical stability as a heat conductor 110. The carbon atoms in the graphite crystal are arranged in a hexagonal plane layered structure, forming strong π bonds, which allows heat to be quickly transferred between graphite layers. Graphite also has a low thermal expansion coefficient and good oxidation resistance, making it stable in high temperature environments. However, the tensile strength and compressive strength of graphite materials are relatively low.

[0038] In this embodiment, the longitudinal cross-section of the heat conductor 110 can be roughly T-shaped. The heat conductor 110 can include a contact portion 114 and a support portion 115. The support portion 115 can be connected to the contact portion 114, and the first surface 111 can be located at the contact portion 114. The cross-sectional area of ​​the contact portion 114 can be greater than the cross-sectional area of ​​the support portion 115. It can be understood that the embodiment of the present application does not limit the specific structure of the support portion 115 and the contact portion 114. For example, the support portion 115 and the contact portion 114 can both be cylindrical structures. For another example, the support portion 115 and the contact portion 114 can both be rectangular structures. For another example, one of the support portion 115 and the contact portion 114 is a rectangular structure and the other is a cylindrical structure, etc.

[0039] The embodiment of the present application is explained by taking the example that both the support portion 115 and the contact portion 114 are cylindrical structures. The cross-sectional area of ​​the contact portion 114 is the diameter of the contact portion 114, and the cross-sectional area of ​​the support portion 115 is the diameter of the support portion 115. The cross-sectional area of ​​the contact portion 114 is larger than the cross-sectional area of ​​the contact portion 114, so that the contact area between the contact portion 114 and the microcrystalline panel 20 can be larger, thereby facilitating the microcrystalline panel 20 to transfer heat to the heat conductor 110, so as to increase the speed at which the first temperature sensor 120 and the second temperature sensor 130 sense the temperature of the heat conductor 110, thereby improving the temperature measurement efficiency of the cross-medium temperature measuring device 10.

[0040] Furthermore, in the present embodiment, the heat conductor 110 may also be provided with a first mounting groove 116 and a second mounting groove 117, and the first mounting groove 116 and the second mounting groove 117 may be used to accommodate the first temperature sensor 120 and the second temperature sensor 130, respectively. It should be noted that the present embodiment of the application does not specifically limit the first mounting groove 116 and the second mounting groove 117. For example, an opening may be provided on the outer surface of the heat conductor 110 to form a mounting groove. It can be understood that the present embodiment of the application does not limit the specific position of the above-mentioned opening.

[0041] Please continue reading Figure 1 In this embodiment, the first mounting groove 116 and the second mounting groove 117 can both be set on the support portion 115. Specifically, the first mounting groove 116 and the second mounting groove 117 can be set on the side 113, and the opening of the first mounting groove 116 and the opening of the second mounting groove 117 are formed in the same direction, which can facilitate the production and processing of the heat conductor 110.

[0042] In one embodiment, the first temperature sensor 120 is disposed in the heat conductor 110 and adjacent to the first surface 111, and the first temperature sensor 120 can be used to measure the temperature in the heat conductor 110 adjacent to the first surface 111. The second temperature sensor 130 is disposed in the heat conductor 110 and adjacent to the second surface 112, and the second temperature sensor 130 can be used to measure the temperature in the heat conductor 110 adjacent to the second surface 112.

[0043] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0044] It should be noted that the embodiment of the present application does not limit the specific structure and type of the first temperature sensor 120 and the second temperature sensor 130. For example, a negative temperature coefficient thermistor (NTC) sensor, an infrared temperature sensor or a thermocouple sensor may be used. The embodiment of the present application preferably uses a negative temperature coefficient thermistor sensor.

[0045] Specifically, it can be a ceramic NTC thermistor, a thin film NTC thermistor, a glass NTC thermistor or a silicon carbide NTC thermistor, among which the ceramic NTC thermistor uses oxide ceramic as the main material, has a higher temperature coefficient of resistance and stability, the thin film NTC thermistor uses metal oxide film as the main material, has higher sensitivity and stability, the glass NTC thermistor uses glass as the main material, has higher stability and reliability, and the silicon carbide NTC thermistor has higher sensitivity and stability. The specific temperature sensor to be used can be selected according to the actual situation.

[0046] It should be noted that, in the embodiment of the present application, the first temperature sensor 120 and the second temperature sensor 130 have a certain distance in the direction perpendicular to the first surface 111, so that there is a temperature difference between the first temperature sensor 120 and the second temperature sensor 130, and then it is convenient to calculate the heat flow in the heat conductor 110. It should be noted that, since the temperature of the object to be measured will gradually transfer from the first surface 111 to the second surface 112, and the temperature transfer process takes time, there is a temperature difference between the first temperature sensor 120 and the second temperature sensor 130.

[0047] Furthermore, in one embodiment, the line connecting the temperature measuring point of the first temperature sensor 120 and the temperature measuring point of the second temperature sensor 130 is perpendicular or nearly perpendicular to the first surface 111, so that the response time of the temperature sensing between the first temperature sensor 120 and the second temperature sensor 130 can be shortened, thereby speeding up the detection speed.

[0048] Furthermore, in one embodiment, the first temperature sensor 120 and the second temperature sensor 130 can be arranged on or near the central axis of the heat conductor 110. It can be understood that the closer to the edge of the heat conductor 110, the greater the possibility of being affected by the external temperature. Therefore, the above-mentioned setting of the first temperature sensor 120 and the second temperature sensor 130 can further reduce the impact of the external temperature on the first temperature sensor 120 and the second temperature sensor 130, which is beneficial to improve the measurement accuracy of the first temperature sensor 120 and the second temperature sensor 130.

[0049] In addition, in one embodiment, the cross-medium temperature measuring device 10 may further include a wire 150, one end of which is used to electrically connect to the first temperature sensor 120 and the second temperature sensor 130. Specifically, in this embodiment, one end of the wire 150 may be divided into two bundles, one of which may be drawn out from the opening of the first mounting groove 116 after connecting to the first temperature sensor 120, and the other may be drawn out from the opening of the second mounting groove 117 after connecting to the second temperature sensor. The other end is drawn out from the side of the insulator 140 adjacent to the second surface 112. Using one wire 150 to simultaneously connect the first temperature sensor 120 and the second temperature sensor 130 may reduce the number of wires 150 used, thereby avoiding the problem of the wire 150 being entangled and causing a short circuit. It should be noted that the embodiment of the present application does not limit the specific structure and shape of the wire 150. For example, copper wire, silver wire, etc. may be used, and the specific selection may be made according to actual conditions.

[0050] The insulator 140 can be sleeved on the side 113, and the insulator 140 can be used to reduce the impact of the external environment on the first temperature sensor 120 and the second temperature sensor 130, thereby improving the accuracy of the first temperature sensor 120 and the second temperature sensor 130, and finally improving the accuracy of the temperature measurement of the object to be measured. It should be noted that the insulator 140 can be a solid insulator 140, such as rubber, plastic or wood, etc. The molecular structure of these materials is relatively complex, and the interaction between molecules is weak, resulting in poor thermal conductivity.

[0051] It should be noted that in some other embodiments, gas, such as nitrogen, helium, etc., can also be used as an insulator. The molecular distance between these gases is large and the thermal conductivity is poor. Specifically, the above-mentioned gas can be filled between the microcrystalline panel 20 and the substrate 30. However, this method has high requirements on the sealing of the induction cooker. The embodiment of the present application preferably sets a solid insulator 140, and the following description will be taken as an example of the insulator 140 being a solid material.

[0052] Furthermore, in one embodiment, the insulator 140 may include a first cylinder 141 and a second cylinder 142 that are connected to each other. The first cylinder 141 may be sleeved outside the support portion 115, and the second cylinder 142 may be sleeved outside the contact portion 114. That is to say, in this embodiment, a T-shaped groove may be formed inside the insulator 140, and the heat conductor 110 may be embedded in the T-shaped groove. In addition, the contact portion 114 of the heat conductor 110 may abut against the end face of the first cylinder 141, which may also facilitate the connection between the heat conductor 110 and the insulator.

[0053] The cross-medium temperature measuring device 10 provided in the embodiment of the present application is configured such that a first temperature sensor 120 is disposed in the heat conductor 110 adjacent to the first surface 111, a second temperature sensor 130 is disposed in the heat conductor 110 adjacent to the second surface 112, and a heat insulator 140 is disposed on the side surface 113 of the heat conductor 110. Since there is a medium between the object to be measured and the heat conductor 110, the heat flow of the heat conductor 110 is measured by using the first temperature sensor 120 and the second temperature sensor 130, and the temperature of the object to be measured can be inferred. Compared with a traditional temperature measuring device for measuring a single point temperature, the cross-medium temperature measuring device 10 has high accuracy.

[0054] It should be noted that in this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0055] It can be understood that, in order to facilitate the wire 150 to be led out from the second surface 112, in this embodiment, a wire 150 channel can be formed between the outer surface of the support portion 115 provided with the first mounting groove 116 and the second mounting groove 117 and the inner surface of the insulator 140, and the wire 150 channel can be used for wiring, and the wire 150 channel can be connected to the first mounting groove 116 and the second mounting groove 117. Specifically, after the wire 150 is connected to the first temperature sensor 120 and the second temperature sensor 130, the wire 150 can be led out from the second surface 112 through the wire 150 channel.

[0056] See also Figure 2 , Figure 2 The schematic diagram of the structure of the cross-medium temperature measuring device 10 provided by another embodiment of the present application is shown. In this embodiment, the first temperature sensor 120, the second temperature sensor 130, the wire 150, the heat conductor 110 and the heat insulator 140 can be combined by an integral molding method. For example, a filling process can be adopted to pour a solidifiable heat conductive material into the heat insulator 140 as the heat conductor 110, and the first temperature sensor 120, the second temperature sensor 130 and the wire 150 are encapsulated in the above-mentioned solidifiable heat conductive material one by one, which is conducive to improving the overall structural strength of the cross-medium temperature measuring device 10.

[0057] See also Figure 3 , Figure 3 A schematic diagram of the structure of a cross-medium temperature measuring device 10 provided in another embodiment of the present application is shown. In this embodiment, the heat conductor 110 may also be provided with a first mounting groove 116 and a second mounting groove 117, the first mounting groove 116 is opened on the first surface 111, and the second mounting groove 117 is opened on the second surface 112, that is, in this embodiment, the first temperature sensor 120 and the second temperature sensor 130 may be externally arranged, which may reduce the difficulty of processing the heat conductor 110, thereby reducing the processing cost, and at the same time, in this embodiment, the first temperature sensor 120 may directly contact the medium, thereby obtaining the temperature more quickly, so as to improve the detection speed of the cross-medium temperature measuring device 10.

[0058] In this embodiment, one end of the wire 150 can also be divided into two bundles, one of which is connected to the first temperature sensor 120, and then routed along the first surface 111 to the insulator 140, and routed inside the insulator 140; the other is connected to the second temperature sensor 130, and then routed along the second surface 112 to the insulator 140. The two bundles of wires 150 can be bundled inside the insulator 140, and then the other end of the wire 150 can be led out through the insulator 140, for example, from the side of the insulator 140 away from the heat conductor 110. The embodiment of the present application routes the wire inside the insulator 140, which can avoid the wire being subjected to excessively high temperature, resulting in damage to the wire, and is beneficial to increasing the service life of the wire.

[0059] In addition, the first mounting groove 116 and the second mounting groove 117 are respectively arranged on the first surface 111 and the second surface 112, so that the distance between the first temperature sensor 120 and the second temperature sensor 130 can be maximized, thereby making the temperature difference at the first temperature sensor 120 and the temperature difference at the second temperature sensor 130 more obvious, avoiding the distance between the first temperature sensor 120 and the second temperature sensor 130 being too close, resulting in the temperature difference at the first temperature sensor 120 and the second temperature sensor 130 being unclear, thereby improving the detection accuracy of the cross-medium temperature measuring device 10.

[0060] In another embodiment, the first temperature sensor 120 and the second temperature sensor 130 may be directly printed on the first surface 111 and the second surface 112 by a printing process. In this way, the first temperature sensor 120 and the second temperature sensor 130 may be more closely connected to the heat conductor 110.

[0061] It should be noted that the embodiment of the present application does not limit the specific positions of the first installation slot 116 and the second installation slot 117, which can be set according to actual conditions. For example, see Figure 4 , Figure 4 FIG. 1 shows a structural schematic diagram of another cross-medium temperature measurement device 10 provided in an embodiment of the present application.

[0062] The opening of the first mounting groove 116 can be formed on the first surface 111, and the opening of the second mounting groove 117 can be formed on the side 113. At this time, the first temperature sensor 120 is closer to the medium, which can reduce the detection delay to a certain extent. At the same time, in this embodiment, one end of the wire 150 can also be divided into two bundles, one of which is connected to the first temperature sensor 120, and then routed along the first surface 111 to the insulator 140, and routed inside the insulator 140. After the other bundle is connected to the second temperature sensor 130, it is led out from the opening of the second mounting groove 117, and then routed inside the insulator 140, and bundled inside the insulator 140, and then the other end of the wire 150 is led out from the side of the insulator 140 close to the heat conductor 110. The embodiment of the present application routes the wire inside the insulator 140, which can avoid the wire being subjected to excessively high temperatures, resulting in damage to the wire, which is conducive to improving the service life of the wire.

[0063] For another example, please refer to 5. Figure 5 A schematic diagram of the structure of another cross-medium temperature measuring device 10 provided by an embodiment of the present application is shown. The opening of the first mounting groove 116 can be formed on the side surface 113, and the opening of the second mounting groove 117 can be formed on the second surface 112. If the thermal conductivity of the medium is too large, the temperature of the medium will rise sharply in a short time. If the first temperature sensor 120 is in direct contact with the medium, it is not conducive to the long-term use of the first temperature sensor 120, and the service life of the first temperature sensor 120 may be shortened. At the same time, in the present embodiment, one end of the wire 150 can also be divided into two bundles, one of which is connected to the first temperature sensor 120, led out from the opening of the first mounting groove 116, and then routed in the insulator 140; the other is connected to the second temperature sensor 130, routed along the second surface 112 to the insulator 140, routed in the insulator 140, and bundled in the insulator 140; then the other end of the wire 150 is led out from the side of the insulator 140 away from the heat conductor 110. The embodiment of the present application routes the wire in the insulator 140, which can avoid the wire being subjected to excessively high temperature, resulting in damage to the wire, and is beneficial to improving the service life of the wire.

[0064] The working principle of the cross-medium temperature measurement device 10 provided in the embodiment of the present application is as follows:

[0065] Since the first surface 111 of the heat conductor 110 is in contact with the medium in contact with the object to be measured, the object to be measured can transfer the temperature to the medium, and the medium can transfer the temperature to the heat conductor 110. The heat insulator 140 disposed outside the heat conductor 110 can avoid the influence of the ambient temperature. Specifically, the temperature received by the heat conductor 110 first passes through the first temperature sensor 120, and then passes through the second temperature sensor 130. In this way, the first temperature sensor 120 and the second temperature sensor 130 can receive heat at different times. At the same time, since the first temperature sensor 120 and the second temperature sensor 130 have a certain height difference, this will also cause the first temperature sensor 120 and the second temperature sensor 130 to detect different heat. Then, by measuring the heat flow between the first temperature sensor 120 and the second temperature sensor 130, in this embodiment, the temperatures received by the first temperature sensor 120 and the second temperature sensor 130 mainly depend on the following factors:

[0066] 1: The heat transmitted from the object to be measured;

[0067] 2: heat capacity at the first temperature sensor 120 and the second temperature sensor 130;

[0068] 3: Heat dissipation at the first temperature sensor 120 and the second temperature sensor 130 .

[0069] The heat transmitted from the object to be measured mainly depends on the temperature of the object to be measured and the thermal conductivity and heat capacity of the microcrystalline panel 20. The heat dissipation at the first temperature sensor 120 and the second sensor 130 depends on the ambient temperature around the first temperature sensor 120 and the second sensor 130 and the heat dissipation characteristics near the first temperature sensor 120 and the second sensor 130.

[0070] Since the heat capacity at the first temperature sensor 120 and the second temperature sensor 130 , the thermal conductivity and the heat capacity of the microcrystalline panel 20 are fixed values ​​of the materials, the temperature of the object to be measured can be calculated through the heat conduction equation.

[0071] See also Figure 6 , Figure 6 A structural block diagram of a kitchen cooking appliance 1 provided in an embodiment of the present application is shown. The embodiment of the present application also provides a kitchen cooking appliance 1, which is provided with a cross-medium temperature measuring device 10 as described above. The kitchen cooking appliance 1 includes but is not limited to: an induction cooker, a microwave oven, an air fryer, etc.

[0072] The kitchen cooking appliance 1 provided in the embodiment of the present application can be configured by disposing a first temperature sensor 120 adjacent to the first surface 111 in the heat conductor 110, disposing a second temperature sensor 130 adjacent to the second surface 112 in the heat conductor 110, and disposing a heat insulator 140 on the side 113 of the heat conductor 110. Since there is a medium between the object to be measured and the heat conductor 110, the heat flow of the heat conductor 110 is measured by using the first temperature sensor 120 and the second temperature sensor 130, and then the temperature of the object to be measured can be inferred. Compared with the traditional temperature measuring device for measuring a single point temperature, the cross-medium temperature measuring device 10 has high accuracy.

[0073] The above implementation modes are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned implementation modes, a person skilled in the art should understand that the technical solutions described in the aforementioned implementation modes can still be modified, or some of the technical features can be replaced by equivalents. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various implementation modes of the present application, and should all be included in the protection scope of the present application.

Claims

1. A cross-medium temperature measuring device, characterized in that: include: A heat conductor, the heat conductor having a first surface and a second surface opposite to each other and a side surface connected between the first surface and the second surface, the first surface being used for contacting a medium in contact with an object to be temperature measured; a first temperature sensor, the first temperature sensor being disposed on the heat conductor and adjacent to the first surface; as well as A second temperature sensor is disposed on the heat conductor and adjacent to the second surface.

2. The cross-medium temperature measuring device according to claim 1, characterized in that: A line connecting the temperature measuring point of the first temperature sensor and the temperature measuring point of the second temperature sensor is perpendicular or nearly perpendicular to the first surface.

3. The cross-medium temperature measuring device according to claim 2, characterized in that: The first temperature sensor and the second temperature sensor are both arranged on or near the central axis of the heat conductor.

4. The cross-medium temperature measuring device according to claim 1, characterized in that: Also includes: A heat insulator is sleeved on the side surface.

5. The cross-medium temperature measuring device according to claim 4, characterized in that: The heat conductor includes a contact portion and a supporting portion, the supporting portion is connected to the contact portion, the first surface is located at the contact portion, the cross-sectional area of ​​the contact portion is larger than the cross-sectional area of ​​the supporting portion, and the heat insulator includes a first cylinder and a second cylinder connected to each other, the first cylinder is sleeved outside the supporting portion, and the second cylinder is sleeved outside the contact portion.

6. The cross-medium temperature measuring device according to claim 1, characterized in that: The heat conductor is provided with a first mounting groove and a second mounting groove, the first temperature sensor is arranged in the first mounting groove, and the second temperature sensor is arranged in the second mounting groove.

7. The cross-medium temperature measuring device according to claim 6, characterized in that: The first mounting groove is formed on the first surface, and the second mounting groove is formed on the second surface.

8. The cross-medium temperature measuring device according to claim 6, characterized in that: Openings of the first mounting groove and the second mounting groove are formed on the side surface.

9. The cross-medium temperature measuring device according to claim 6, characterized in that: An opening of one of the first installation groove and the second installation groove is formed on the side surface, and an opening of the other one is formed on the first surface or the second surface.

10. The cross-medium temperature measuring device according to claim 1, characterized in that: The first temperature sensor and the second temperature sensor are both arranged inside the heat conductor, and the heat conductor, the first temperature sensor and the second temperature sensor are integrally arranged.

11. The cross-medium temperature measuring device according to claim 4, characterized in that: The cross-medium temperature measuring device further includes: a wire, one end of which is used to be electrically connected to the first temperature sensor and the second temperature sensor, and the other end of which is led out from a side of the thermal insulator adjacent to the second surface.

12. A kitchen cooking appliance, characterized in that: The kitchen cooking appliance is provided with a cross-medium temperature measuring device as described in any one of claims 1-11.

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