Die bonding equipment

Abstract

The utility model relates to the technical field of die bonding, and discloses die bonding equipment, which comprises a ring mounting manipulator, and the ring mounting manipulator comprises a clamping jaw used for clamping a crystal ring; the rotating device is used for driving the clamping jaw to rotate in the forward direction so that the clamping jaw can be located at a first discharging position, driving the clamping jaw to rotate in the reverse direction so that the clamping jaw can be located at a second discharging position and driving the clamping jaw to rotate to a material taking position; the first discharging position and the second discharging position are arranged on the two opposite sides of the material taking position respectively. The rotating device is mounted on a lifting part of the material taking and placing lifting device; and the linear driving device is used for driving the material taking and placing lifting device to move back and forth in a preset direction, so that the clamping jaw located at the material taking position enters and moves out of the crystal ring storage device. According to the die bonding equipment, the structure of the upper ring manipulator is optimized, and the size of the die bonding equipment can be further reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding, in particular to a crystal bonding device. Background Art

[0002] The current estimation equipment includes a ring-up manipulator, which is used to transfer the crystal ring from the crystal ring storage device to the wafer platform. The wafer platform corrects the position of the crystal ring, and then the crystal bonding manipulator absorbs the pole piece on the crystal ring and installs it on the workpiece. The existing ring-up manipulator generally adopts a gantry structure, which can only drive the clamping claw to move in a straight line, resulting in a large volume occupied by the ring-up manipulator, which is not conducive to optimizing the structure of the crystal bonding equipment, resulting in a large volume of the crystal bonding equipment.

[0003] In view of this, it is necessary to design a crystal bonding equipment and optimize the structure of the upper ring robot, which is conducive to further reducing the volume of the crystal bonding equipment. Utility Model Content

[0004] The utility model aims to provide a crystal bonding device, which optimizes the structure of a ring-up manipulator and is conducive to further reducing the volume of the crystal bonding device.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A crystal bonding device, comprising a ring-up manipulator, wherein the ring-up manipulator comprises:

[0007] Clamping jaws, used to clamp the crystal ring;

[0008] A rotating device, used for driving the clamping jaw to rotate forward so that the clamping jaw is located at a first material discharge position, used for driving the clamping jaw to rotate reversely so that the clamping jaw is located at a second material discharge position, and used for driving the clamping jaw to rotate to a material collection position; the first material discharge position and the second material discharge position are respectively arranged on two opposite sides of the material collection position;

[0009] A material picking and placing lifting device, wherein the rotating device is installed on the lifting part of the material picking and placing lifting device;

[0010] The linear drive device is used to drive the material picking and placing lifting device to move back and forth in a preset direction so that the clamping claw located at the material picking position enters and moves out of the crystal ring storage device.

[0011] Optionally, the crystal bonding equipment further includes a crystal ring storage device;

[0012] The crystal ring storage device is located at the front end of the linear drive device, and includes a frame and a loading and lifting device for driving the frame to rise and fall in a vertical direction. A plurality of storage troughs are arranged on the frame at intervals along the lifting direction of the loading and unloading lifting device.

[0013] Optionally, the die bonding equipment further includes a first wafer platform and a second wafer platform;

[0014] The first wafer platform is installed on the first material discharging position, and the second wafer platform is located on the second material discharging position.

[0015] Optionally, the die bonding device further includes a first XY platform and a second XY platform;

[0016] The first wafer platform is installed on the first XY platform, and the first XY platform is used to drive the first wafer platform to move along the horizontal plane; the second wafer platform is installed on the second XY platform, and the second XY platform is used to drive the second wafer platform to move along the horizontal plane.

[0017] Optionally, it also includes a first tray conveying device and a first crystal bonding swing arm;

[0018] The first wafer-bonding swing arm is disposed between the first wafer platform and the first tray conveying device, so as to absorb the wafer on the first wafer platform and mount it on a workpiece of the tray of the first tray conveying device.

[0019] Optionally, the crystal bonding equipment also includes a feeding device for conveying the material tray to the first material tray conveying device; the feeding device includes a material box, a lifting device for lifting the material tray in the material box, and a pushing device for pushing the material tray onto the first material tray conveying device.

[0020] Optionally, the first tray conveying device includes a carrier and a third XY platform for driving the carrier to move horizontally to a set crystal bonding station.

[0021] Optionally, the die bonding equipment further includes a second tray conveying device and a second die bonding swing arm;

[0022] The second wafer-bonding swing arm is disposed between the second wafer platform and the second tray conveying device, so as to absorb the wafer on the second wafer platform and mount it on a workpiece of the tray of the second tray conveying device.

[0023] Optionally, the crystal bonding equipment also includes a discharging device, which is arranged at the discharging end of the first tray conveying device and is provided with a support frame and a discharging conveying belt, and the conveying surface of the discharging conveying belt is parallel to the conveying surface of the first tray conveying device.

[0024] Optionally, the clamping claw comprises a fixed plate, a lower clamping plate fixedly connected to the fixed plate, a clamping lifting device installed on the fixed plate, and an upper clamping plate installed on a lifting shaft of the clamping lifting device;

[0025] The clamping end of the lower clamping plate forms a positioning clamping step, and the positioning clamping step is provided with an arc surface for positioning the crystal ring. The upper clamping plate is pressed onto the lower clamping plate to form a clamping groove for clamping the crystal ring. A guide column is also installed on the lower clamping plate, and the upper clamping plate and the guide column are slidably connected.

[0026] Compared with the prior art, the utility model has the following beneficial effects:

[0027] In this embodiment, a rotating device, a material picking and unloading lifting device and a linear drive device are provided to drive the clamping jaws to move to pick up or put down the crystal ring. When the crystal ring needs to be clamped, the rotating device drives the clamping jaws to rotate to the middle material picking position, and then the linear drive device drives the clamping jaws forward to enter the crystal ring storage device to clamp the crystal ring; after the linear drive device drives the clamping jaws to move backward and exit the crystal ring storage device, the rotating device drives the clamping jaws to rotate forward to the first material discharging position or rotate reversely to the second material discharging position, and finally the material picking and unloading lifting device drives the clamping jaws to descend to put down the crystal ring; in this embodiment, the structure of the upper ring manipulator is further optimized through clever structural improvements, and there is no need to set up a large gantry structure, which is beneficial to reducing the volume of the crystal bonding equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0029] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0030] Figure 1 A schematic diagram of the three-dimensional structure of the upper ring manipulator provided in an embodiment of the utility model;

[0031] Figure 2 A schematic diagram of the assembly structure of a ring-up manipulator, a wafer ring storage device, a first wafer platform, and a second wafer platform provided in an embodiment of the utility model;

[0032] Figure 3 A three-dimensional assembly schematic diagram of a die bonding device provided in an embodiment of the utility model.

[0033] Illustrations: 1. Upper ring manipulator; 11. Clamping claw; 111. Fixed plate; 112. Lower clamping plate; 113. Clamping lifting device; 114. Upper clamping plate; 115. Guide column; 12. Rotating device; 13. Material picking and placing lifting device; 14. Linear drive device; 2. Crystal ring storage device; 3. First wafer platform; 31. First XY platform; 4. Second wafer platform; 41. Second XY platform; 5. First tray conveying device; 51. Loading rack; 52. Third XY platform; 6. First solid crystal swing arm; 7. Feeding device; 71. Material box; 72. Lifting device; 73. Pushing device; 8. Second tray conveying device; 9. Second solid crystal swing arm; 10. Discharging device. DETAILED DESCRIPTION

[0034] In order to make the utility model's purpose, features, and advantages more obvious and easy to understand, the following will be combined with the drawings in the utility model embodiments to clearly and completely describe the technical solutions in the utility model embodiments. Obviously, the embodiments described below are only part of the utility model embodiments, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0036] The technical solution of the utility model is further explained below with reference to the accompanying drawings and through specific implementation methods.

[0037] The embodiment of the utility model provides a crystal bonding device, which can achieve the purpose of reducing the volume of the ring-upper manipulator 1 by optimizing the structure of the ring-upper manipulator 1, thereby further reducing the volume of the crystal bonding device and facilitating optimization of the overall layout of the crystal bonding device.

[0038] See also Figure 1 to Figure 2The crystal bonding equipment includes a ring-loading robot 1, which includes: a clamping jaw 11 for clamping a crystal ring; a rotating device 12, which is used to drive the clamping jaw 11 to rotate forward so that the clamping jaw 11 is located at a first discharge position, and is used to drive the clamping jaw 11 to rotate reversely so that the clamping jaw 11 is located at a second discharge position, and is used to drive the clamping jaw 11 to rotate to a material picking position; the first discharge position and the second discharge position are respectively arranged on two opposite sides of the material picking position; a material picking and placing lifting device 13, and a rotating device 12 is installed on the lifting part of the material picking and placing lifting device 13; a linear drive device 14, which is used to drive the material picking and placing lifting device 13 to move back and forth in a preset direction, so that the clamping jaw 11 located at the material picking position enters and moves out of the crystal ring storage device 2.

[0039] Specifically, the action steps of the upper ring manipulator 1 in this embodiment are as follows:

[0040] ① The rotating device 12 drives the clamping jaw 11 to rotate to the middle material picking position, and the material picking and placing lifting device 13 drives the clamping jaw to rise and fall to the set material picking height.

[0041] ② The linear drive device 14 is activated, driving the clamping claw to move forward and enter the crystal ring storage device 2 to clamp the crystal ring.

[0042] ③ The linear drive device 14 is activated to drive the clamping jaw to move backward and out of the crystal ring storage device 2, and then the rotating device 12 drives the clamping jaw 11 to rotate forward so that the clamping jaw 11 is located at the first discharge position, or the rotating device 12 drives the clamping jaw 11 to rotate reversely so that the clamping jaw 11 is located at the second discharge position.

[0043] ④ The material loading and unloading lifting device 13 drives the clamping claw to descend to the set unloading height, and places the wafer ring on the first wafer platform 3 or the second wafer platform 4 to complete the loading.

[0044] In the present embodiment, on the one hand, the structure of the upper ring robot 1 is optimized so that the volume of the upper ring robot 1 can be set smaller, that is, there is no need to provide a gantry frame; on the other hand, the upper ring robot of the present embodiment can transport crystal rings to the first wafer platform 3 and the second wafer platform 4 on both sides without having two upper ring robots 1, which further optimizes the layout of the crystal bonding equipment and is also conducive to reducing the volume of the crystal bonding equipment.

[0045] Optionally, the crystal bonding equipment also includes a crystal ring storage device 2; the crystal ring storage device 2 is located at the front end of the linear drive device 14, including a frame and a loading and lifting device for driving the frame to rise and fall in a vertical direction, and a plurality of storage troughs are arranged on the frame at intervals along the lifting direction of the material picking and unloading lifting device 13.

[0046] Specifically, the crystal ring storage device 2 is arranged at the front end of the linear drive device 14, so that the linear drive device 14 can drive the clamping claw to enter the crystal ring storage device 2 to clamp the crystal ring. The loading and lifting device is used to raise the next crystal ring to be clamped to the set material taking height after the crystal ring is clamped, so as to facilitate the clamping claw 11 to clamp.

[0047] Optionally, the crystal bonding equipment further includes a first wafer platform 3 and a second wafer platform 4; the first wafer platform 3 is installed on the first material discharging position, and the second wafer platform 4 is located on the second material discharging position. Specifically, after the crystal ring is placed in the first wafer platform 3 or the second wafer platform 4, the crystal ring is fixed and the blue film is tensioned, and then the ejector pin lifts the wafer from the bottom side to facilitate the wafer to be sucked.

[0048] Optionally, the crystal bonding equipment also includes a first XY platform 31 and a second XY platform 41; the first wafer platform 3 is installed on the first XY platform 31, and the first XY platform 31 is used to drive the first wafer platform 3 to move along the horizontal plane; the second wafer platform 4 is installed on the second XY platform 41, and the second XY platform 41 is used to drive the second wafer platform 4 to move along the horizontal plane.

[0049] Specifically, the positions of the first XY platform 31 and the second XY platform 41 are both adjustable, so that the first crystal-bonding swing arm 6 or the second crystal-bonding swing arm 9 can accurately absorb the wafer.

[0050] Optionally, the crystal bonding equipment further includes a first tray conveying device 5 and a first crystal bonding swing arm 6; the first crystal bonding swing arm 6 is disposed between the first wafer platform 3 and the first tray conveying device 5, and is used to absorb the wafer on the first wafer platform 3 and install it on the workpiece of the tray of the first tray conveying device 5. Specifically, the first tray conveying device 5 conveys the tray to the set crystal bonding station and then fixes it, and the first tray conveying device 5 absorbs the wafer and installs it on the workpiece. The first tray conveying device 5 is also provided with a fixing device for fixing the tray at the set crystal bonding station.

[0051] Optionally, the crystal bonding device further includes a feeding device 7 for conveying the material tray to the first material tray conveying device 5; the feeding device 7 includes a material box 71, a lifting device 72 for lifting the material tray in the material box 71, and a pushing device 73 for pushing the material tray onto the first material tray conveying device 5. Specifically, the feeding device 7 is lifted and lowered to feed the material step by step, and then the pushing device 73 pushes one tray onto the first material tray conveying device 5 each time.

[0052] Optionally, the first tray conveying device 5 includes a carrier 51 and a third XY platform 52 for driving the carrier 51 to move horizontally to a set crystal bonding station. The carrier 51 carries and positions the tray to facilitate the crystal bonding process.

[0053] Optionally, the crystal bonding equipment further includes a second tray conveying device 8 and a second crystal bonding swing arm 9; the second crystal bonding swing arm 9 is disposed between the second wafer platform 4 and the second tray conveying device 8, so as to absorb the wafer on the second wafer platform 4 and mount it on the workpiece of the tray of the second tray conveying device 8. In this embodiment, both sides of the upper ring manipulator 1 can realize the crystal bonding process, which effectively improves the efficiency of crystal bonding.

[0054] Optionally, the crystal bonding equipment also includes a discharge device 10, which is arranged at the discharge end of the first tray conveying device 5, and is provided with a support frame and a discharge conveyor belt, and the conveying surface of the discharge conveyor belt is parallel to the conveying surface of the first tray conveying device 5 to facilitate the transfer of the tray.

[0055] Optionally, the clamping jaw 11 includes a fixed plate 111, a lower clamping plate 112 fixedly connected to the fixed plate 111, a clamping and lifting device 113 installed on the fixed plate 111, and an upper clamping plate 114 installed on the lifting shaft of the clamping and lifting device 113; the clamping end of the lower clamping plate 112 forms a positioning clamping step, and the positioning clamping step is provided with an arc surface for positioning the crystal ring, and the upper clamping plate 114 is pressed on the lower clamping plate 112 to form a clamping groove for clamping the crystal ring; the lower clamping plate 112 is also installed with a guide column 115, and the upper clamping plate 114 and the guide column 115 are connected with sliding. It should be supplemented that the curvature of the arc surface is consistent with the curvature of the outer side of the crystal ring, so that precise positioning can be achieved.

[0056] As described above, the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A die bonding device, characterized in that: The invention comprises a ring-up manipulator (1), wherein the ring-up manipulator (1) comprises: A clamping jaw (11), used for clamping the crystal ring; The rotating device (12) is used to drive the clamping jaw (11) to rotate forward so that the clamping jaw (11) is located at a first material discharge position, to drive the clamping jaw (11) to rotate reversely so that the clamping jaw (11) is located at a second material discharge position, and to drive the clamping jaw (11) to rotate to a material collection position; the first material discharge position and the second material discharge position are respectively arranged on two opposite sides of the material collection position; A material picking and placing lifting device (13), wherein the rotating device (12) is installed on the lifting part of the material picking and placing lifting device (13); The linear drive device (14) is used to drive the material picking and placing lifting device (13) to move back and forth in a preset direction, so that the clamping claw (11) located at the material picking position enters and moves out of the crystal ring storage device (2).

2. The die bonding device according to claim 1, characterized in that: It also includes a crystal ring storage device (2); The crystal ring storage device (2) is located at the front end of the linear drive device (14), and comprises a frame and a loading and lifting device for driving the frame to rise and fall in a vertical direction. A plurality of storage troughs are arranged on the frame at intervals along the lifting direction of the material loading and unloading lifting device (13).

3. The die bonding device according to claim 1, characterized in that: It also includes a first wafer platform (3) and a second wafer platform (4); The first wafer platform (3) is installed on the first material discharging position, and the second wafer platform (4) is located on the second material discharging position.

4. The die bonding device according to claim 3, characterized in that: Also includes a first XY platform (31) and a second XY platform (41); The first wafer platform (3) is mounted on the first XY platform (31), and the first XY platform (31) is used to drive the first wafer platform (3) to move along a horizontal plane; the second wafer platform (4) is mounted on the second XY platform (41), and the second XY platform (41) is used to drive the second wafer platform (4) to move along a horizontal plane.

5. The die bonding device according to claim 3, characterized in that: It also includes a first tray conveying device (5) and a first crystal-bonding swing arm (6); The first crystal fixing swing arm (6) is arranged between the first wafer platform (3) and the first tray conveying device (5) to absorb the wafer on the first wafer platform (3) and install it on the workpiece of the tray of the first tray conveying device (5).

6. The die bonding device according to claim 5, characterized in that: It also includes a feeding device (7) for conveying a material tray to the first material tray conveying device (5); the feeding device (7) includes a material box (71), a lifting device (72) for lifting the material tray in the material box (71), and a pushing device (73) for pushing the material tray onto the first material tray conveying device (5).

7. The die bonding device according to claim 5, characterized in that: The first material tray conveying device (5) comprises a material carrier (51) and a third XY platform (52) used for driving the material carrier (51) to move horizontally to a set crystal bonding station.

8. The die bonding device according to claim 5, characterized in that: It also includes a second tray conveying device (8) and a second crystal-bonding swing arm (9); The second crystal fixing swing arm (9) is arranged between the second wafer platform (4) and the second tray conveying device (8) to absorb the wafer on the second wafer platform (4) and install it on the workpiece of the tray of the second tray conveying device (8).

9. The die bonding device according to claim 5, characterized in that: It also includes a discharging device (10), which is arranged at the discharging end of the first tray conveying device (5), and is provided with a support frame and a discharging conveying belt, and the conveying surface of the discharging conveying belt is parallel to the conveying surface of the first tray conveying device (5).

10. The die bonding equipment according to claim 1, characterized in that: The clamping claw (11) comprises a fixing plate (111), a lower clamping plate (112) fixedly connected to the fixing plate (111), a clamping and lifting device (113) installed on the fixing plate (111), and an upper clamping plate (114) installed on a lifting shaft of the clamping and lifting device (113); The clamping end of the lower clamping plate (112) forms a positioning clamping step, and the positioning clamping step is provided with an arc surface for positioning the wafer ring. The upper clamping plate (114) is pressed onto the lower clamping plate (112) to form a clamping groove for clamping the wafer ring. A guide column (115) is also installed on the lower clamping plate (112), and the upper clamping plate (114) and the guide column (115) are slidably connected.

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