Philin cover plate capable of preventing water vapor from entering
By setting up waterproof adhesive blocks on the bonding surface of the film cover plate, the problem of water vapor entering through the indentation groove after laser half-cut is solved, and the effect of waterproof vapor entering is achieved, protecting product performance and improving production efficiency.
Patent Information
- Application Number
- CN202420859768.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-24
- Publication Date
- 2025-03-18
- Estimated Expiration
- 2034-04-24
AI Technical Summary
In the prior art, laser semi-cutting leaves an indentation groove on the film, causing water vapor to enter the machine through the indentation groove, damage performance and affect product quality.
A film cover plate with waterproof vapor entering is designed. By setting a waterproof adhesive block on the fitting surface of the cover plate, it is positioned closely to the indentation groove on the film sheet and blocking the water vapor passage.
Effectively prevent water vapor from entering, protect product performance, improve production efficiency, and enhance the fit and sealing performance of film sheets and cover plates.
Smart Images

Figure CN222638799U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of touch display screens, in particular to a film cover plate which prevents water vapor from entering. Background Art
[0002] After the circuit board is bound to the film, the release film on the film needs to be torn off before it is attached to the cover. The holes of the release film pass through the circuit board. Due to the fast pace of production, tearing off the release film will pull the circuit board or hook the components on the circuit board, causing the circuit board to tear or the components to fall off.
[0003] In the prior art, laser semi-punching is usually used to cut the release film at the binding position between the circuit board and the film, while the film will not be cut. However, the laser semi-punching will leave an indentation groove on the film, and water vapor will enter the machine through the indentation groove, causing damage to the performance of the machine and affecting product quality. Utility Model Content
[0004] The utility model aims to overcome the shortcomings of the prior art and provide a film cover plate which prevents water vapor from entering.
[0005] The purpose of this utility model is achieved through the following technical solutions:
[0006] A film cover plate for preventing water vapor from entering comprises: a cover plate, a circuit board and a film sheet, wherein the cover plate is arranged above the film sheet, and a waterproof rubber block is arranged on the surface of the cover plate that fits with the film sheet; the circuit board is bound to the film sheet; an indentation groove is provided on the film sheet, and the waterproof rubber block on the cover plate is aligned with the indentation groove and fits tightly with the film sheet.
[0007] In one embodiment, the cover plate is arranged parallel to the film sheet.
[0008] In one embodiment, the film is arranged in parallel with the circuit board.
[0009] In one embodiment, the circuit board is an FPC board.
[0010] In one embodiment, the FPC board is in an "L" shape.
[0011] In one embodiment, the FPC board is provided with a soldering pad for soldering components, and a steel sheet is provided on the back of the soldering pad.
[0012] In one embodiment, the indentation groove has the same shape as the waterproof rubber block.
[0013] In one embodiment, an optical adhesive layer is further included, and the cover plate and the film are bonded together via the optical adhesive layer.
[0014] In one embodiment, the optical adhesive layer is an OCA adhesive layer.
[0015] In one embodiment, the cover plate is a TP cover plate.
[0016] Compared with the prior art, the utility model has at least the following advantages:
[0017] The film cover plate for preventing water vapor from entering the utility model is provided with a film sheet, a circuit board and a cover plate. The cover plate is arranged above the film sheet, and a waterproof rubber block is arranged on the bonding surface of the cover plate with the film sheet. The circuit board is bound to the film sheet. There is an indentation groove on the film sheet, and the waterproof rubber block on the cover plate is aligned with the indentation groove and closely fits the film sheet. The waterproof rubber block blocks the indentation groove on the film sheet to prevent water vapor from entering the indentation groove, thereby preventing the entry of water vapor and affecting the performance of the product, thereby facilitating the staff to produce the bonding of the film sheet and the cover plate, and improving the production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.
[0019] Figure 1 It is a structural schematic diagram of a film cover plate for preventing water vapor from entering in one embodiment of the utility model;
[0020] Figure 2 It is a structural schematic diagram of a film sheet in one embodiment of the utility model;
[0021] Figure 3 It is a partial structural schematic diagram of a film and a circuit board in one embodiment of the utility model.
[0022] Reference numerals:
[0023] Cover plate 10 , film sheet 20 , circuit board 30 , solder pad 31 , indentation groove 40 , waterproof adhesive block 50 , optical adhesive layer 60 . DETAILED DESCRIPTION
[0024] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings.
[0025] This application proposes a film cover that prevents water vapor from entering. Figure 1 , Figure 2 and Figure 3, including a film sheet 20, a circuit board 30 and a cover plate 10. The cover plate 10 is arranged above the film sheet 20, and a waterproof rubber block 50 is arranged on the surface of the cover plate 10 that fits with the film sheet 20. The circuit board 30 is bound to the film sheet 20. There is an indentation groove 40 on the film sheet 20, and the waterproof rubber block 50 on the cover plate 10 is aligned with the indentation groove 40 and fits tightly with the film sheet 20. The waterproof rubber block 50 blocks the indentation groove 40 on the film sheet 20 to prevent water vapor from entering the indentation groove 40, thereby preventing the entry of water vapor from affecting the performance of the product, thereby facilitating the production of the film sheet 20 and the cover plate 10, thereby improving production efficiency. Among them, the indentation groove 40 has the same shape as the waterproof rubber block 50, so that the waterproof rubber block 50 can be inserted into the indentation groove 40, and the indentation groove 40 and the waterproof rubber block 50 fit more closely, and thus the sealing performance of the indentation groove 40 and the waterproof rubber block 50 is better, thereby better isolating water vapor from the outside of the whole machine and preventing water vapor from entering and affecting the function of the FPC board.
[0026] It should be noted that in order to quickly tear off the release film, the release film is usually cut off at the binding position between the circuit board 30 and the film by laser semi-punching, but the laser semi-punching process will leave an indentation groove 40 on the film sheet 20.
[0027] In one embodiment, see Figure 1 The cover plate 10 is arranged in parallel with the film sheet 20, so that the product touch or display effect on it is consistent. Furthermore, the film sheet 20 is arranged in parallel with the circuit board 30, so that the thickness of the product can be made thinner, which is convenient for carrying or transporting. In addition, please refer to Figure 1 The cover plate 10 of the present application is bonded to the film 20 by an optical adhesive layer 60. Specifically, the optical adhesive layer 60 is an OCA adhesive layer, which is colorless and transparent, has a light transmittance of more than 90%, has good bonding strength, can be cured at room temperature or medium temperature, and has little change in cured shape. Preferably, the cover plate 10 is a TP cover plate 10, which is a glass plate with good resistance to stickiness, good transparency, and rigidity, and does not generate static electricity. The TP touch screen is a display screen that is operated by touch. It can sense touch actions and convert the touched position into electrical signals, thereby realizing interaction with the device.
[0028] In another embodiment, the circuit board 30 is an FPC board. The FPC board is small in size, light in weight, and very thin. It can be bent and folded freely, and can be adjusted and arranged according to the layout of the product space to maximize the coordination of the components and connectors in the product. This allows the product to tend toward miniaturization, thinness, and high density. Since the FPC board has excellent heat dissipation performance and good welding performance, a pad 31 for welding components is provided on the FPC board. A steel sheet is provided on the back of the pad 31. The steel sheet is used to support the components on the pad 31 to prevent the FPC board from bending due to its own weight. This design adopts a combination of soft and hard methods to make up for the shortcomings of the FPC board's load-bearing capacity. Please refer to Figure 3 The FPC board is in an "L" shape, and the FPC board includes a first connecting board, a welding board and a second connecting board, and the welding board is provided with a welding pad 31. The adjacent two sides of the welding board are connected to the first connecting board and the second connecting board, and the welding board is bound to the film 20 through the first connecting board.
[0029] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A film cover sheet that is waterproof and vapor-proof, characterized in that: include: A cover plate, a circuit board and a film sheet, wherein the cover plate is arranged above the film sheet, and a waterproof rubber block is arranged on the surface of the cover plate that fits with the film sheet; the circuit board is bound to the film sheet; there is an indentation groove on the film sheet, and the waterproof rubber block on the cover plate is aligned with the indentation groove and fits tightly with the film sheet.
2. The film cover sheet for preventing water vapor intrusion according to claim 1, characterized in that: The cover plate is arranged parallel to the film sheet.
3. The film cover sheet for preventing water vapor intrusion according to claim 1, characterized in that: The film sheet is arranged in parallel with the circuit board.
4. The film cover sheet for preventing water vapor intrusion according to claim 1, characterized in that: The circuit board is an FPC board.
5. The film cover sheet for preventing water vapor intrusion according to claim 4, characterized in that: The FPC board is in an "L" shape.
6. The film cover sheet for preventing water vapor intrusion according to claim 4, characterized in that: The FPC board is provided with pads for welding components, and a steel sheet is provided on the back of the pads.
7. The film cover sheet for preventing water vapor intrusion according to claim 5, characterized in that: The indentation groove has the same shape as the waterproof rubber block.
8. The film cover sheet for preventing water vapor intrusion according to claim 1, characterized in that: It also includes an optical adhesive layer, and the cover plate and the film are bonded together via the optical adhesive layer.
9. The film cover sheet for preventing water vapor intrusion according to claim 8, characterized in that: The optical adhesive layer is an OCA adhesive layer.
10. The film cover sheet for preventing water vapor intrusion according to claim 1, characterized in that: The cover plate is a TP cover plate.