Wafer coating tool

Abstract

The utility model provides a wafer coating tool which comprises a glue coating cylinder, one side of the glue coating cylinder is provided with a tooth-shaped groove, and the other side of the glue coating cylinder is provided with a sliding groove; the clamping unit is arranged on the gluing barrel, and the clamping unit comprises a clamping plate arranged in the gluing barrel; the cleaning unit comprises a supporting frame, a first motor and a gear arranged at the output end of the first motor, a bearing arranged in the sliding groove in a sliding mode is arranged at one end of the supporting frame, the other end of the supporting frame is matched with the first motor, and the gear is meshed with the tooth-shaped groove; a cleaning brush is arranged on the supporting frame in a sliding mode. According to the wafer coating tool provided by the utility model, the wafer is fixed on the food clamping plate for spraying colloid, and after spraying is completed, the first motor can be used for outputting, so that the supporting frame slides along the tooth-shaped groove, the inner wall of the gluing barrel is cleaned, and the cleaning efficiency of the tool is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a wafer coating tool. Background Art

[0002] Wafer production is an important part of the semiconductor industry, mainly used to produce integrated circuits. The wafer production process can be divided into several main process flows, including slicing, polishing, cleaning, masking, photolithography, etc. Before photolithography, the wafer will be coated with a layer of colloid to enhance corrosion resistance and scratch resistance. However, in the process of spraying the wafer, the colloid is evenly coated on the wafer through the nozzle, and a small amount of colloid will splash on the inner wall of the glue barrel. After the colloid is left for a long time, it will solidify, making it difficult to clean up later. Utility Model Content

[0003] The utility model aims to solve the above problems in the prior art and is intended to solve the problem that it is inconvenient to clean the wafer after the wafer solidifies after being sprayed with colloid.

[0004] In order to achieve the above-mentioned purpose, the utility model can be implemented through the following technical solutions: a wafer coating tool, comprising:

[0005] A glue coating cylinder, one side of which is provided with a toothed groove, and the other side of which is provided with a slide groove;

[0006] A clamping unit, which is arranged on the glue coating cylinder, and the clamping unit includes a clamping plate arranged in the glue coating cylinder;

[0007] A cleaning unit, comprising a support frame, a first motor and a gear arranged at an output end of the first motor, wherein one end of the support frame is provided with a bearing slidably arranged in the slide groove, and the other end thereof cooperates with the first motor, and the gear meshes with the toothed groove;

[0008] A cleaning brush is slidably arranged on the support frame, a spring is arranged between the cleaning brush and the support frame, and the spring pushes the cleaning brush to fit the inner wall of the glue coating cylinder.

[0009] In an embodiment of the utility model, the clamping unit further comprises a second motor arranged on the glue coating cylinder, a screw is arranged at an output end of the second motor, and the screw is threadedly connected to the clamping plate.

[0010] In the embodiment of the utility model, clamping blocks are slidably arranged on the clamping plate in a circular array, and the clamping blocks are provided with knobs threadedly connected to the clamping plate.

[0011] In the embodiment of the utility model, the clamping plate has a clamping groove, and a through hole is opened in the clamping groove.

[0012] In the embodiment of the utility model, a water joint is clamped on the support frame, and one end of the water joint is provided with a spray head facing the inner wall of the glue coating cylinder.

[0013] In the embodiment of the utility model, a base frame is arranged at the bottom of the glue coating cylinder, and a waste liquid collection tank is arranged on the base frame and is located directly below the glue coating cylinder.

[0014] In an embodiment of the utility model, a round frame is arranged on the support frame, and the first motor is fixed to the support frame through the round frame.

[0015] Compared with the prior art, the advantages of the present application are: the wafer is fixed to the clamping plate for spraying colloid, and after the spraying is completed, the first motor can be used for output, so that the support frame slides along the toothed groove and cleans the inner wall of the glue coating cylinder, thereby improving the cleaning efficiency of the tooling. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure;

[0017] Figure 2 It is a schematic diagram of the internal parts structure in half section;

[0018] Figure 3 It is a partial enlarged view of point A;

[0019] Figure 4 It is a partial enlarged schematic diagram of the clamping plate;

[0020] Figure 5 It is a schematic diagram of the overall plan.

[0021] Description of reference numerals:

[0022] 1. Glue coating cylinder; 11. Toothed groove; 12. Slide groove; 2. Base frame; 3. Waste liquid collection tank; 4. Cleaning unit; 40. Cleaning brush; 41. Spring; 42. Spray head; 43. Support frame; 44. Water joint; 45. First motor; 46. Round frame; 47. Rotating shaft; 48. Gear; 5. Clamping unit; 51. Second motor; 52. Screw; 53. Clamping plate; 531. Clamping groove; 532. Through hole; 54. Clamping block; 55. Knob. DETAILED DESCRIPTION

[0023] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention.

[0024] like Figure 1-5 As shown, a wafer coating tool comprises:

[0025] The glue coating cylinder 1 has a tooth-shaped groove 11 on one side and a slide groove 12 on the other side;

[0026] A clamping unit 5, which is disposed on the glue coating cylinder 1, and the clamping unit 5 includes a clamping plate 53 disposed in the glue coating cylinder 1;

[0027] The cleaning unit 4 comprises a support frame 43, a first motor 45 and a gear 48 arranged at the output end of the first motor 45, one end of the support frame 43 is provided with a bearing slidably arranged in the slide groove 12, and the other end thereof cooperates with the first motor 45, and the gear 48 meshes with the toothed groove 11;

[0028] A cleaning brush 40 is slidably disposed on the support frame 43 , and a spring 41 is disposed between the cleaning brush 40 and the support frame 43 . The spring 41 pushes the cleaning brush 40 to fit the inner wall of the glue coating cylinder 1 .

[0029] Specifically, a tooth-shaped groove 11 is provided on one side of the glue coating cylinder 1, and a sliding groove 12 is provided on the other side thereof. Figure 2 The top and bottom of the glue coating cylinder 1 are provided with a toothed groove 11 at the top and a slide groove 12 at the bottom. The clamping unit 5 is arranged on the glue coating cylinder 1, and the clamping unit 5 includes a clamping plate 53 arranged in the glue coating cylinder 1. The cleaning unit 4 includes a support frame 43, a first motor 45 and a gear 48 arranged at the output end of the first motor 45. One end of the support frame 43 is provided with a bearing slidably arranged in the slide groove 12, and the other end thereof cooperates with the first motor 45. The gear 48 meshes with the toothed groove 11. The support frame 43 is slidably provided with a A cleaning brush 40 is provided with a spring 41 between the cleaning brush 40 and the support frame 43. The spring 41 pushes the cleaning brush 40 to fit the inner wall of the glue coating cylinder 1, and the wafer is placed on the clamping plate 53 for fixing. After the wafer is glued, the first motor 45 outputs and causes the gear 48 to rotate in the toothed groove 11, thereby driving the support frame 43 to slide along the inner wall of the glue coating cylinder 1. Due to the push of the spring 41, the cleaning brush continuously scrapes the inner wall of the glue coating cylinder 1, thereby improving the cleaning efficiency of the tooling, and further solving the problem that the colloid is difficult to clean after solidification.

[0030] As an embodiment further provided by the present invention, the clamping unit 5 also includes a second motor 51 arranged on the glue coating cylinder 1, and a screw 52 is provided at the output end of the second motor 51. The screw 52 is threadedly connected to the clamping plate 53. The second motor 51 serves as a power source for the screw 52. When the second motor 51 is output, the screw 52 is rotated to control the height of the clamping plate 53 in the glue coating cylinder 1.

[0031] As an embodiment further provided by the present invention, clamping blocks 54 are slidably arranged in a circular array on the clamping plate 53, and the clamping blocks 54 are provided with knobs 55 threadedly connected to the clamping plate 53. When a wafer is placed on the clamping plate 53, a plurality of clamping blocks 54 slide toward each other and contact the wafer, and the wafer is fixed by turning the knob 55.

[0032] As an embodiment further provided by the present invention, the clamping plate 53 has a clamping groove 531, and a through hole 532 is opened in the clamping groove 531. When the colloid is sprayed on the wafer, excess colloid will fall into the waste liquid collection tank 3 along the through hole 532, and the collected colloid can be tested to see whether it can continue to be used.

[0033] As an embodiment further provided by the present invention, a water joint 44 is clamped on the support frame 43, and one end of the water joint 44 is provided with a spray head 42 facing the inner wall of the glue coating cylinder 1. When cleaning the tooling, an external water pipe can be connected through the water joint 44 to guide the cleaning liquid from the spray head 42 and spray it onto the inner wall of the glue coating cylinder 1, thereby improving the cleaning effect of the tooling.

[0034] As an embodiment further provided by the present invention, a base frame 2 is provided at the bottom of the glue coating cylinder 1, and a waste liquid collecting tank 3 is provided on the base frame 2 and is located directly below the glue coating cylinder 1. The base frame 2 is used to support the glue coating cylinder 1, and the colloid on the sprayed wafer will slide into the waste liquid collecting pipe for collection, and then the waste liquid collecting tank 3 is removed and the glue coating cylinder 1 is cleaned.

[0035] As an embodiment further provided by the present invention, a circular frame 46 is provided on the support frame 43, and the first motor 45 is fixed to the support frame 43 through the circular frame 46. The first motor 45 includes a rotating shaft 47, and the rotating shaft 47 is arranged at the output end of the first motor 45, and the gear 48 is clamped with one end of the rotating shaft 47 and meshed with the toothed groove 11, and the circular frame 46 plays a role of supporting the first motor 45.

[0036] Working principle: first place the wafer in the clamping groove 531, move multiple groups of clamps 54 to contact the wafer, rotate the knob 55 to fix the wafer, and control the rotation of the screw 52 through the second motor 51 to adjust the height of the clamping plate 53 in the glue coating cylinder 1 to prevent the colloid from splashing outside the glue coating cylinder 1 when spraying the colloid. After the wafer is glued, the first motor 45 drives the gear 48 to rotate to make the support frame 43 slide along the toothed groove 11, and at the same time, the cleaning brush 40 pushed by the spring 41 scrapes along the inner wall of the glue coating cylinder 1, and the cleaning liquid is sprayed by the spray head 42, which further improves the cleaning effect and greatly improves the cleaning work efficiency.

[0037] The technical solution of the above utility model provides a solution that is significantly different from the prior art to address the technical problem that the prior art solution is too single. The parts not involved in the technical solution of this application are the same as the prior art or can be implemented by using the prior art and will not be described in detail.

[0038] The technical solutions in the above embodiments have clearly and completely described the contents of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Claims

1. A wafer coating tool, characterized in that: include: A glue coating cylinder, one side of which is provided with a toothed groove, and the other side of which is provided with a slide groove; A clamping unit, which is arranged on the glue coating cylinder, and the clamping unit includes a clamping plate arranged in the glue coating cylinder; A cleaning unit, comprising a support frame, a first motor and a gear arranged at an output end of the first motor, wherein one end of the support frame is provided with a bearing slidably arranged in the slide groove, and the other end thereof cooperates with the first motor, and the gear meshes with the toothed groove; A cleaning brush is slidably arranged on the support frame, a spring is arranged between the cleaning brush and the support frame, and the spring pushes the cleaning brush to fit the inner wall of the glue coating cylinder.

2. A wafer coating tool according to claim 1, characterized in that: The clamping unit further comprises a second motor arranged on the glue coating cylinder, and a screw is arranged at an output end of the second motor, and the screw is threadedly connected to the clamping plate.

3. A wafer coating tool according to claim 2, characterized in that: The clamping plate is provided with clamping blocks in a circumferential array for sliding movement, and the clamping blocks are provided with knobs threadedly connected with the clamping plate.

4. A wafer coating tool according to claim 3, characterized in that: The clamping plate has a clamping groove, and a through hole is formed in the clamping groove.

5. The wafer coating tool according to claim 1, characterized in that: A water joint is clamped on the support frame, and one end of the water joint is provided with a spray head facing the inner wall of the glue coating cylinder.

6. The wafer coating tool according to claim 1, characterized in that: A base frame is arranged at the bottom of the glue coating cylinder, and a waste liquid collection tank is arranged on the base frame and is located directly below the glue coating cylinder.

7. The wafer coating tool according to claim 1, characterized in that: The support frame is provided with a round frame, and the first motor is fixed on the support frame through the round frame.

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