Semiconductor connecting piece punching device capable of collecting waste materials conveniently

Abstract

The utility model relates to the technical field of semiconductor production, and discloses a semiconductor connecting piece punching device convenient for collecting waste materials, which comprises a bracket assembly, a movable fixing assembly is arranged at the bottom of the bracket assembly, a punching assembly is arranged at the top of the bracket assembly, and a storage assembly is correspondingly arranged at the bottom of the punching assembly. The support assembly comprises a front support rod, a rear support rod is installed on the rear side of the front support rod, a top support rod is installed on the top of the front support rod, a bottom support rod is installed on the top of the top support rod, and a movable sliding groove is formed in the top of the bottom support rod. According to the punching device, the containing assembly is installed on the basis of the punching device, so that when the punching device carries out punching work, waste and dust discharged through punching can be collected, and the cleanliness of a finished product is improved to a certain degree.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor production, in particular to a semiconductor connecting piece punching device which is convenient for collecting waste materials. Background Art

[0002] The application number is CN202223473855.5, which discloses a semiconductor device punching device, including: a panel and a punching device, the punching device is fixedly installed above the panel through a first support plate, the punching motor is fixedly connected to the first support plate, the punching plate is located between the punching motor and the panel, and the output end of the punching motor is fixedly connected to the punching plate through a punching column; the lower surface of the punching plate has a avoidance groove, both sides of the avoidance groove are provided with a strip groove, and the lower part of the strip groove has an open groove connected to the strip groove, and a plurality of impact plates are arranged at the bottom of the strip groove and above the open groove, and the lower part of the impact plate is connected to a cutting rib column through a connecting piece, and the connecting piece is located inside the open groove, and the cutting rib column corresponds to the pin strip of the semiconductor chip. The semiconductor device punching device of the utility model not only realizes the cutting of multiple semiconductor devices at the same time, improves the processing efficiency, but also effectively reduces the situation of the overall fracture of the semiconductor strip, and improves the overall yield rate.

[0003] Although the above utility model is connected to a cutting rib column through a connecting piece, and the connecting piece is located inside the open groove, and the cutting rib column corresponds to the pin strip of the semiconductor chip, the semiconductor device punching device of the utility model can not only cut multiple semiconductor devices at the same time, improve the processing efficiency, but also effectively reduce the overall breakage of the semiconductor strip, and improve the overall yield rate, but there is a shortcoming that the device has not yet collected and classified waste and dust during the working process, so that further cleaning and classification are required when the finished products are collected later.

[0004] Therefore, it is necessary to install a storage component on the basis of the device so that when the device is performing punching and cutting work, the waste and dust discharged by punching and cutting can be collected, thereby improving the cleanliness of the finished product to a certain extent. Summary of the invention

[0005] The utility model aims to provide a semiconductor connection piece punching device which is convenient for collecting waste materials, so as to solve the problems raised in the above background technology.

[0006] In order to solve the above technical problems, the utility model is realized by the following technical solutions:

[0007] The utility model is a semiconductor connecting piece punching device which is convenient for collecting waste materials, comprising a bracket component, a movable fixing component is installed at the bottom of the bracket component, and a punching component is installed at the top, and a storage component is correspondingly installed at the bottom of the punching component.

[0008] Furthermore, the support assembly includes a front support rod, a rear support rod is installed on the rear side of the front support rod, and a top support rod is installed on the top of the front support rod, a bottom support rod is installed on the top of the top support rod, and a movable slide groove is opened on the top of the bottom support rod.

[0009] Furthermore, the height of the rear support rod is higher than that of the front support rod, and a workbench is installed on the top of the rear support rod.

[0010] Furthermore, the mobile fixing assembly includes a support column and a regulating button, the bottom of the support column is installed with an anti-slip pad, and the top of the support column is installed with a control telescopic outer rod, the inside of the control telescopic outer rod is installed with a telescopic inner rod, the bottom of the telescopic inner rod is installed with a movable roller, and the regulating button is installed on one side of the top support rod.

[0011] Furthermore, the punching assembly includes a brake motor, an electric telescopic rod is installed on the inner side of the brake motor, a clamping block is installed on the inner side of the electric telescopic rod, a limiting slide groove is installed on the corresponding bottom of the clamping block, and a punching head is installed on the top thereof.

[0012] Furthermore, the storage assembly includes a guide plate, the middle card of the guide plate is provided with a plurality of waste leakage holes, and a finished product storage box is installed correspondingly at the bottom thereof, the inner card of the finished product storage box is provided with a plurality of mesh holes, and a waste collection box is installed on one side thereof, a vibration device is installed at the bottom of the waste collection box and the finished product storage box, and a dust storage box is installed correspondingly at the bottom of the vibration device.

[0013] The utility model has the following beneficial effects:

[0014] (1) The utility model is a semiconductor connection piece punching device that is convenient for collecting waste. By installing a storage component on the basis of the device, when the device is performing punching work, the waste and dust discharged by the punching can be collected, thereby improving the cleanliness of the finished product to a certain extent.

[0015] (2) The utility model is a semiconductor connection piece punching device that is convenient for collecting waste. By installing a movable fixing component on the device, when the component is moved, it can be easily moved through the movable fixing component at the bottom, and when it reaches the specified position, a relatively stable fixing effect can also be achieved through the component.

[0016] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 This is a schematic diagram of the overall structure of a semiconductor connection piece punching device that is convenient for collecting waste materials according to the utility model;

[0019] Figure 2 This is a front structural schematic diagram of a semiconductor connection piece punching device that is convenient for collecting waste materials according to the utility model;

[0020] Figure 3 This is a schematic diagram of the expanded structure of a semiconductor connection piece punching device that is convenient for collecting waste materials according to the utility model;

[0021] Figure 4 This is a schematic diagram of the bottom structure of a semiconductor connection piece punching device that is convenient for collecting waste materials according to the utility model;

[0022] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0023] In the figure: 1. bracket assembly; 2. mobile fixing assembly; 3. punching assembly; 4. storage assembly; 101. front bracket rod; 102. rear bracket rod; 103. top bracket rod; 104. workbench; 105. bottom bracket rod; 201. support column; 202. anti-skid pad; 203. control telescopic outer rod; 204. telescopic inner rod; 205. moving roller; 206. control button; 301. brake motor; 302. electric telescopic rod; 303. clamping block; 304. limit slide; 305. punching head; 401. guide plate; 402. waste leakage hole; 403. finished product storage box; 404. mesh screen hole; 405. waste collection box; 406. vibration device; 407. dust storage box; 1051. mobile slide. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] See also Figure 1 - Figure 4As shown, the utility model is a semiconductor connecting piece punching device which is convenient for collecting waste, including a bracket component 1, a movable fixing component 2 is installed at the bottom of the bracket component 1, and a punching component 3 is installed on the top thereof, and a storage component 4 is installed at the bottom of the punching component 3 accordingly.

[0026] By installing a storage component 4 on the basis of the device, the waste and dust discharged by punching can be collected when the device is performing punching work, which improves the cleanliness of the finished product to a certain extent and avoids the waste of excess materials.

[0027] The support assembly 1 includes a front support rod 101, a rear support rod 102 is installed on the rear side of the front support rod 101, and a top support rod 103 is installed on the top of the front support rod 101, a bottom support rod 105 is installed on the top of the top support rod 103, and a movable slide groove 1051 is provided on the top of the bottom support rod 105. The movable slide groove 1051 can be set to enable the movement of the dust collection box 107 subsequently installed thereon.

[0028] The height of the rear support rod 102 is higher than the front support rod 101, and a workbench 104 is installed on the top thereof. By setting the height of the rear support rod 102 higher than the front support rod 101, the workbench of the device can be designed with a slope surface, so that the finished product after punching can fall naturally with gravity.

[0029] The movable fixing component 2 includes a support column 201 and a regulating button 206. The bottom of the support column 201 is installed with an anti-slip pad 202, and the top of the inner part thereof is installed with a control telescopic outer rod 203. The inner part of the control telescopic outer rod 203 is installed with a telescopic inner rod 204. The bottom of the telescopic inner rod 204 is installed with a movable roller 205. The regulating button 206 is installed on one side of the top bracket rod 103. By installing the movable fixing component 2 on the device, when moving the component, it can be conveniently moved through the movable fixing component 2 at the bottom thereof, and when reaching the specified position, a relatively stable fixing effect can also be achieved through the component.

[0030] The punching assembly 3 includes a brake motor 301, an electric telescopic rod 302 is installed on the inner side of the brake motor 301, a clamping block 303 is installed on the inner side of the electric telescopic rod 302, a limiting slide groove 304 is installed at the bottom corresponding to the clamping block 303, and a punching head 305 is installed at the top corresponding to the clamping block 303. The corresponding material can be clamped and fixed by the set clamping block 303 to avoid movement during punching and causing subsequent damage to the material.

[0031] The storage component 4 includes a guide plate 401, the middle card of the guide plate 401 is provided with a plurality of waste leakage holes 402, and a finished product storage box 403 is installed at the bottom thereof, the inner card of the finished product storage box 403 is provided with a plurality of mesh holes 404, and a waste collection box 405 is installed on one side thereof, and a vibration device 406 is installed at the bottom of the waste collection box 405 and the finished product storage box 403, and a dust storage box 407 is installed at the bottom of the vibration device 406. Through the above arrangement, after the material is punched, it can move downward with the guide plate 401, and the excess waste will fall into the waste collection box 405 at the bottom through the waste leakage holes 402 set on the guide plate 401, and then the remaining finished products will slide into the finished product storage box 403 at the bottom due to gravity, and finally, under the action of the vibration device 406 set at the bottom thereof, the avoided floating dust can be shaken off and concentrated in the dust storage box 407 at the bottom, thereby completing the classification among finished products, waste and dust.

[0032] When using this device, first control the mobile fixing component 2 to move the device to the corresponding position through the control button 206, and after the mobile roller 205 is retracted in, the anti-slip fixing effect is achieved through the outer support column 201 and the anti-slip pad 202. After the punching work, it can move downward with the guide plate 401, and the excess waste will fall into the waste collection box 405 at the bottom through the waste leakage hole 402 set on the guide plate 401, and then the remaining finished products will slide into the finished product storage box 403 at the bottom due to gravity. Finally, under the action of the vibration device 406 set at the bottom, the avoided floating dust can be shaken off and concentrated in the dust storage box 407 at the bottom, completing the classification of finished products, waste and dust, and finally completing the cleaning work.

[0033] The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A semiconductor connection sheet punching device for collecting waste, comprising a support assembly (1), characterized in that: The bottom of the support assembly (1) is installed with a movable fixing assembly (2), and the top of the support assembly (1) is installed with a punching assembly (3); the bottom of the punching assembly (3) is correspondingly installed with a storage assembly (4); the support assembly (1) comprises a front support rod (101); a rear support rod (102) is installed on the rear side of the front support rod (101); a top support rod (103) is installed on the top of the front support rod (101); a bottom support rod (105) is installed on the top of the top support rod (103); and a movable slide groove (1051) is provided on the top of the bottom support rod (105).

2. A semiconductor connection piece punching device for facilitating waste collection according to claim 1, characterized in that: The height of the rear support rod (102) is higher than that of the front support rod (101), and a workbench (104) is installed on the top of the rear support rod.

3. A semiconductor connection piece punching device for facilitating waste collection according to claim 2, characterized in that: The movable fixing assembly (2) comprises a support column (201) and a control button (206); an anti-slip pad (202) is installed at the bottom of the support column (201); a control telescopic outer rod (203) is installed at the top of the support column; a telescopic inner rod (204) is installed inside the control telescopic outer rod (203); a movable roller (205) is installed at the bottom of the telescopic inner rod (204); and the control button (206) is installed on one side of the top support rod (103).

4. A semiconductor connection piece punching device for facilitating waste collection according to claim 3, characterized in that: The punching assembly (3) comprises a brake motor (301), an electric telescopic rod (302) is installed on the inner side of the brake motor (301), a clamping block (303) is installed on the inner side of the electric telescopic rod (302), a limiting slide groove (304) is installed on the corresponding bottom of the clamping block (303), and a punching cutter head (305) is installed on the corresponding top.

5. A semiconductor connection piece punching device for facilitating waste collection according to claim 4, characterized in that: The storage assembly (4) comprises a guide plate (401), a middle card of the guide plate (401) is provided with a plurality of waste leakage holes (402), and a finished product storage box (403) is correspondingly installed at the bottom thereof, a plurality of mesh holes (404) are opened inside the finished product storage box (403), and a waste collection box (405) is installed at one side thereof, a vibration device (406) is installed at the bottom of the waste collection box (405) and the finished product storage box (403), and a dust collection box (407) is correspondingly installed at the bottom of the vibration device (406).

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