BGA (ball grid array) solder ball adhesion soldering flux tool

Abstract

The utility model relates to the technical field of jigs, in particular to a BGA solder ball adhesion soldering flux tool, which is characterized in that the upper side of a box body is connected with a panel, the upper surface of the panel is provided with a first closed-loop step protruding upwards, the inner side of the first closed-loop step is provided with a second closed-loop step protruding upwards, the inner side of the second closed-loop step forms a soldering paste pool, and the inner side of the second closed-loop step forms a soldering paste pool. The depth of the paste flux pool is 0.2 mm, the paste flux pool is filled with paste flux, a vacuum generator is arranged in the box body, and a suction device is placed on the panel and communicated with the vacuum generator through an air pipeline. Compared with the prior art, the tool for attaching the soldering flux to the BGA solder balls has the advantages that the BGA solder balls are stably placed in the soldering flux pool through the suction device, so that the BGA solder balls are immersed into a soldering flux layer with the thickness of 0.2 mm, and a layer of uniform soldering flux with the same amount is attached to all the solder balls.

Description

[Technical field]

[0001] The utility model relates to the technical field of fixtures, in particular to a BGA solder ball attachment soldering flux tooling. [Background technology]

[0002] Since the current domestically produced chips are large in size and weigh up to 170g each, the weight exceeds the weight that can be absorbed by the existing chip extractor. This makes it very inconvenient to take such large chips during operation, and there is a risk of them falling and being scrapped.

[0003] Since the production process requires that an equal amount of flux paste be applied to each solder ball of such a large-sized and heavy BGA chip before soldering, the existing technology using a manual brushing method cannot ensure a consistent amount of flux paste on each solder ball. [Contents of the utility model]

[0004] In order to overcome the above problems, the utility model proposes a BGA solder ball attachment flux tooling which can effectively solve the above problems.

[0005] The utility model provides a technical solution to solve the above technical problems: a BGA solder ball attachment flux tooling is provided, comprising a box body, a panel is connected to the upper side of the box body, a first closed-loop step protruding upward is arranged on the upper surface of the panel, a second closed-loop step protruding upward is arranged on the inner side of the first closed-loop step, a flux paste pool is formed on the inner side of the second closed-loop step, the depth of the flux paste pool is 0.2mm, and the flux paste pool is filled with flux paste; a vacuum generator is arranged in the box body, a suction device is placed on the panel, and the suction device is connected to the vacuum generator through an air duct.

[0006] Preferably, an external air pipe interface is provided on the side of the box body, and the external air pipe interface is used for connecting the air pipe to an external air source, and the external air source is connected to the vacuum generator through the air pipe.

[0007] Preferably, the vacuum generator is connected to an air switch via an air duct.

[0008] Preferably, the second closed-loop step is closely attached to the inner side of the first closed-loop step, and the height of the first closed-loop step is greater than the height of the second closed-loop step.

[0009] Preferably, the first closed-loop step and the second closed-loop step are in the shape of rectangular rings; and the soldering paste pool is in the shape of a rectangle.

[0010] Preferably, one side of the panel is connected to the box body via a hinge, and the other side of the panel is connected to the box body via a lock.

[0011] Preferably, the flux paste pool is made of aluminum alloy.

[0012] Preferably, heat dissipation holes are provided on the bottom plate of the box body, support legs are provided at the four corners of the bottom of the box body, and a handle is also provided on the outside of the box body.

[0013] Compared with the prior art, the BGA solder ball attaching flux tooling of the utility model has the function of absorbing 150g---500g rectangular BGA chips, and is equipped with a flux paste pool to control the solder paste height by 0.2mm. By using a sucker to stably place the BGA into the solder paste pool, the BGA solder ball is immersed in a solder paste layer with a thickness of 0.2mm, so that all solder balls are attached with a uniform and consistent layer of solder paste.

Brief Description of the Drawings

[0014] Figure 1 It is a top view of the BGA solder ball attachment flux tooling of the utility model;

[0015] Figure 2 It is a bottom view of the BGA solder ball attachment flux tooling of the utility model;

[0016] Figure 3 The utility model is a side view of a BGA solder ball attachment flux tool. [Specific implementation method]

[0017] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and implementation examples. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0018] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are limited to relative positions on the specified view rather than absolute positions.

[0019] In addition, in the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0020] See also Figures 1 to 3The BGA solder ball attachment flux tooling of the utility model comprises a box body 10, the upper side of the box body 10 is connected to a panel 20, the upper surface of the panel 20 is provided with a first closed-loop step 50 protruding upward, the inner side of the first closed-loop step 50 is provided with a second closed-loop step 40 protruding upward, a flux paste pool 30 is formed on the inner side of the second closed-loop step 40, the depth of the flux paste pool 30 is 0.2 mm, and the flux paste pool 30 is filled with flux paste.

[0021] A vacuum generator 90 is arranged in the box body 10, and a suction device 60 is placed on the panel 20. The suction device 60 is connected to the vacuum generator 90 through an air duct, and the vacuum generator 90 is connected to an air switch through the air duct for controlling adsorption.

[0022] An external air pipe interface 11 is provided on the side of the box body 10 , and the external air pipe interface 11 is used for connecting an air pipe to an external air source, and the external air source is connected to the vacuum generator 90 through the air pipe.

[0023] During operation, 0.7±0.2Mpa compressed air is connected, and suction is generated by the vacuum generator 90, which is transmitted to the absorber 60 through the air duct. After the BGA chip is absorbed, it is taken to the solder paste pool 30 and a 0.2mm solder paste layer that has been scraped flat is placed therein, and the solder ball is immersed in the solder paste by 0.2mm, so that each solder paste is attached with the same amount of solder paste.

[0024] The second closed-loop step 40 is closely attached to the inner side of the first closed-loop step 50 , and the height of the first closed-loop step 50 is greater than the height of the second closed-loop step 40 .

[0025] The first closed-loop step 50 and the second closed-loop step 40 are in a rectangular ring shape. The soldering paste pool 30 is in a rectangular shape.

[0026] The diameter of the air duct is 6 mm.

[0027] The panel 20 is provided with a power switch 70 for controlling the power on and off.

[0028] The bottom plate of the box body 10 is provided with heat dissipation holes 81 to facilitate heat dissipation.

[0029] Support legs 12 are provided at the four corners of the bottom of the box body 10 .

[0030] One side of the panel 20 is connected to the box body 10 via a hinge, and the other side of the panel 20 is connected to the box body 10 via a lock, so that the panel 20 can be easily flipped, opened, closed and locked.

[0031] A scraper may be placed in the first closed-loop step 50 , and the scraper may be used to scrape away solder paste exceeding 0.2 mm in the first closed-loop step 50 , so as to keep the height of the solder paste layer in the solder paste pool 30 limited to 0.2 mm.

[0032] The solder paste pool 30 is made of aluminum alloy and is hardened to ensure long-term use.

[0033] The outer side of the box body 10 is also provided with a handle to facilitate carrying and moving.

[0034] Compared with the prior art, the BGA solder ball attaching flux tooling of the utility model has the function of absorbing 150g---500g rectangular BGA chips, and is equipped with a flux paste pool 30 to control the solder paste height to 0.2mm. By using the absorber 60 to place the BGA stably into the solder paste pool 30, the BGA solder ball is immersed in a solder paste layer with a thickness of 0.2mm, so that all solder balls are attached with a uniform and consistent layer of solder paste.

[0035] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. Any modifications, equivalent substitutions and improvements made within the concept of the present invention should be included in the patent protection scope of the present invention.

Claims

1. BGA solder ball attachment flux tooling, characterized in that: The invention comprises a box body, wherein the upper side of the box body is connected to a panel, the upper surface of the panel is provided with a first closed-loop step protruding upward, the inner side of the first closed-loop step is provided with a second closed-loop step protruding upward, a solder paste pool is formed on the inner side of the second closed-loop step, the depth of the solder paste pool is 0.2 mm, and the solder paste pool is filled with solder paste; A vacuum generator is arranged in the box body, a suction device is placed on the panel, and the suction device is connected with the vacuum generator through an air duct.

2. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: An external air pipe interface is provided on the side of the box body, and the external air pipe interface is used for connecting an air pipe to an external air source, and the external air source is connected to a vacuum generator through the air pipe.

3. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: The vacuum generator is connected with an air switch through an air pipeline.

4. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: The second closed-loop step is closely attached to the inner side of the first closed-loop step, and the height of the first closed-loop step is greater than the height of the second closed-loop step.

5. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: The first closed-loop step and the second closed-loop step are in the shape of rectangular rings; and the soldering paste pool is in the shape of a rectangle.

6. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: One side of the panel is connected to the box body through a hinge, and the other side of the panel is connected to the box body through a lock.

7. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: The soldering paste pool is made of aluminum alloy.

8. The BGA solder ball attachment flux tooling as claimed in claim 1, characterized in that: The bottom plate of the box body is provided with heat dissipation holes, the four corners of the bottom of the box body are provided with supporting legs, and the outer side of the box body is also provided with a handle.

Images