Refrigeration semiconductor device

Abstract

The refrigeration semiconductor device comprises a working shell, a working cavity with an opening in the front side is formed in the working shell, the rear end wall of the working cavity is fixedly connected with a refrigeration plate in a penetrating mode, and the refrigeration plate can transmit heat to the cold end of a semiconductor to conduct refrigeration work. The rear end wall of the working cavity is fixedly connected with two vertically-symmetrical mounting plates in bilateral symmetry, the mounting plate on the upper side is fixedly provided with a rotating motor, the rotating motor is in power connection with a rotating shaft, the lower end of the rotating shaft is rotationally connected to the mounting plate on the lower side, the rotating shaft is fixedly connected with rotating plates, and the end faces, close to each other, of the rotating plates are fixedly connected with connecting plates. The connecting plate can limit and fix the refrigeration semiconductor, the upper end face and the lower end face of the connecting plate are each fixedly connected with a heat dissipation plate, the heat dissipation plates can conduct and dissipate heat of the hot end of the refrigeration semiconductor, a controller is fixedly arranged at the rear end of the working cavity, and the controller can control and provide power for the installed refrigeration semiconductor.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a refrigeration semiconductor device. Background Art

[0002] Conductor cooling technology means that when a piece of N-type semiconductor material and a piece of P-type semiconductor material are connected to form an electric couple, energy transfer can be generated after a direct current is connected in this circuit. The current flows from the N-type element to the joint of the P-type element to absorb heat and become the cold end; the current flows from the P-type element to the joint of the N-type element to release heat and become the hot end. For general heat dissipation conditions, directly dissipating the hot end to the air can meet the demand. However, for the situation of more heat dissipation, natural heat dissipation cannot meet the heat dissipation demand. Therefore, a cooling semiconductor device is proposed to solve the above problem. Utility Model Content

[0003] In order to solve the problems raised in the above-mentioned background technology, the purpose of the utility model is to provide a refrigeration semiconductor device, and the following technical solutions are provided: a refrigeration semiconductor device, comprising a working shell, a working chamber with a front opening is provided in the working shell, a refrigeration plate is fixedly connected to the rear end wall of the working chamber, and the refrigeration plate can transfer heat to the cold end of the semiconductor to perform refrigeration work, two groups of left-right symmetrical and two up-and-down symmetrical mounting plates are fixedly connected to the rear end wall of the working chamber, a rotating motor is fixedly provided on the upper mounting plate, the rotating motor is powered by a rotating shaft which is rotatably connected to the mounting plate located on the lower side at the lower end, the rotating shaft is fixedly connected to a rotating plate, the rotating plates are fixedly connected to a connecting plate close to one end surface, the connecting plate can limit and fix the refrigeration semiconductor, the upper and lower end surfaces of the connecting plate are respectively fixedly connected to a heat sink, the heat sink can conduct and dissipate the heat from the hot end of the refrigeration semiconductor, a controller is fixedly provided at the rear end of the working chamber, and the controller can control and provide power for the installed refrigeration semiconductor.

[0004] As a preferred embodiment of the present invention, an elastic plate is fixedly connected to the rear end surface of the heat sink.

[0005] As a preferred embodiment of the utility model, four mounting holes located at the four corners of the working chamber are provided through the rear end of the working chamber, and the working shell can be installed and limited through the mounting holes, and the working shell can be connected to an installation baffle through the mounting holes.

[0006] As a preferred embodiment of the utility model, the baffle is provided with a filter plate penetrating the baffle, and the filter plate can filter dust in the air.

[0007] As a preferred embodiment of the present invention, a threaded sleeve coaxial with the filter plate is fixedly connected to the front end surface of the baffle.

[0008] As a preferred embodiment of the present invention, the threaded sleeve can be threadedly connected to a threaded ring, and the threaded ring is fixedly connected to a rotating disk.

[0009] As a preferred embodiment of the present invention, the threaded ring and the rotating disk are provided with a heat dissipation cavity penetrating the threaded ring and the rotating disk.

[0010] As a preferred embodiment of the utility model, the side wall of the heat dissipation cavity is fixedly connected to four circumferentially distributed connecting rods, and the four connecting rods are fixedly connected to the same supporting plate.

[0011] As a preferred embodiment of the utility model, a heat dissipation motor is fixedly provided at the rear end of the support plate, and the heat dissipation motor is dynamically connected to a heat dissipation shaft.

[0012] As a preferred embodiment of the utility model, the heat dissipation shaft is fixedly connected with a heat dissipation block, and the side wall of the heat dissipation block is fixedly connected with a plurality of circumferentially distributed heat dissipation leaves, and when the heat dissipation shaft drives the heat dissipation block and the heat dissipation leaves to rotate, it can drive the air circulation in the working chamber, thereby assisting in the heat dissipation of the hot end of the refrigeration semiconductor.

[0013] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0014] 1. The utility model provides a connection plate, and can limit the installation of the refrigeration semiconductor through the elastic plate fixedly connected to the connection plate to avoid damage to the refrigeration semiconductor. The heat at the hot end of the refrigeration semiconductor can be conducted and dissipated through the heat dissipation plate. The heat of the object to be refrigerated can be transferred to the cold end of the refrigeration semiconductor through the refrigeration plate.

[0015] 2. The utility model can install the threaded ring through the threaded sleeve by setting it, and then when the refrigeration power is high, by starting the heat dissipation motor provided in the threaded ring, the heat dissipation shaft and the heat dissipation block are driven to rotate, and then the heat dissipation leaves are driven to rotate, driving the air circulation in the working chamber, and then assisting the heat dissipation of the heat dissipation plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is an overall three-dimensional schematic diagram of a refrigeration semiconductor device provided by the utility model;

[0017] Figure 2 A three-dimensional schematic diagram of a refrigeration semiconductor device provided by the utility model from the right side;

[0018] Figure 3 A schematic structural diagram of a working shell portion of a refrigeration semiconductor device provided by the utility model;

[0019] Figure 4 for Figure 3 Right view of;

[0020] Figure 5 A schematic diagram of the structure of a baffle and a rotating disk in a refrigeration semiconductor device provided by the utility model;

[0021] Figure 6 for Figure 5 Right view of;

[0022] In the figure: 101, working shell; 102, working chamber; 103, mounting plate; 104, rotating motor; 105, rotating shaft; 106, rotating plate; 107, connecting plate; 108, elastic plate; 109, heat sink; 110, controller; 111, refrigeration plate; 112, mounting hole; 113, baffle; 114, filter plate; 115, threaded sleeve; 116, rotating disk; 117, connecting rod; 118, supporting plate; 119, heat sink; 121, heat dissipation motor; 122, heat dissipation shaft; 123, heat dissipation block; 124, heat dissipation leaf; 125, threaded ring. DETAILED DESCRIPTION

[0023] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0024] like Figures 1 to 6 As shown, a refrigeration semiconductor device provided by the utility model comprises a working shell 101, wherein a working chamber 102 with a front opening is provided in the working shell 101, a refrigeration plate 111 is fixedly connected to the rear end wall of the working chamber 102, and the refrigeration plate 111 can transfer heat to the cold end of the semiconductor to perform refrigeration work, and two groups of left-right symmetrical and two up-and-down symmetrical mounting plates 103 are fixedly connected to the rear end wall of the working chamber 102, and a rotating motor 104 is fixedly provided on the upper side of the mounting plate 103, and the rotating motor 104 is connected to the lower end of the rotating motor 104. The rotating shaft 105 of the mounting plate 103 at the lower side is fixedly connected to a rotating plate 106. The rotating plates 106 are fixedly connected to a connecting plate 107 near one end surface. The connecting plate 107 can limit and fix the refrigeration semiconductor. The upper and lower end surfaces of the connecting plate 107 are respectively fixedly connected to a heat sink 109. The heat sink 109 can conduct and dissipate the heat from the hot end of the refrigeration semiconductor. A controller 110 is fixedly provided at the rear end of the working chamber 102. The controller 110 can control and provide power for the installed refrigeration semiconductor.

[0025] The rear end surface of the heat dissipation plate 109 is fixedly connected to the elastic plate 108 .

[0026] The rear end of the working chamber 102 is penetrated by four mounting holes 112 located at the four corners of the working chamber 102 , through which the working shell 101 can be installed and limited, and the mounting holes 112 can connect the working shell 101 to the mounting baffle 113 .

[0027] The baffle 113 is provided with a filter plate 114 penetrating the baffle 113 , and the filter plate 114 can filter dust in the air.

[0028] A threaded sleeve 115 coaxial with the filter plate 114 is fixedly connected to the front end surface of the baffle plate 113 .

[0029] The threaded sleeve 115 can be threadedly connected to a threaded ring 125 , and the threaded ring 125 is fixedly connected to a rotating disk 116 .

[0030] The threaded ring 125 and the rotating disk 116 are provided with a heat dissipation cavity 119 penetrating the threaded ring 125 and the rotating disk 116 .

[0031] Four circumferentially distributed connecting rods 117 are fixedly connected to the side wall of the heat dissipation cavity 119 , and the four connecting rods 117 are fixedly connected to the same supporting plate 118 .

[0032] A heat dissipation motor 121 is fixedly disposed at the rear end of the support plate 118 , and the heat dissipation motor 121 is motively connected to a heat dissipation shaft 122 .

[0033] The heat dissipation shaft 122 is fixedly connected with a heat dissipation block 123, and the side wall of the heat dissipation block 123 is fixedly connected with a plurality of circumferentially distributed heat dissipation leaves 124. When the heat dissipation shaft 122 drives the heat dissipation block 123 and the heat dissipation leaves 124 to rotate, it can drive the air circulation in the working chamber 102, thereby assisting the heat dissipation of the hot end of the refrigeration semiconductor.

[0034] The working principle and use process of this utility model:

[0035] When in use, the baffle 113 is removed from the working shell 101, and then the rotating motor 104 is started to drive the rotating shaft 105 to rotate, and then the rotating plate 106, the connecting plate 107 and the heat dissipation plate 109 are driven to rotate around the rotating shaft 105, and then the refrigeration plate 111 is exposed. At this time, the cold end of the refrigeration semiconductor is placed on the refrigeration plate 111 facing the refrigeration plate 111, and then the refrigeration semiconductor is connected to the controller 110. At this time, the rotating motor 104 is started to drive the rotating plate 106 to reset. At this time, the elastic plate 108 limits and fixes the refrigeration semiconductor, and then the baffle 113 is installed on the working shell 101 to complete the installation;

[0036] When cooling, if the cooling power is low, the cooling plate 111 is placed close to the object to be cooled, and then the cooling semiconductor is started by the controller 110 to perform cooling work. The cooling plate 111 can absorb heat and cool the object, and the hot end of the cooling semiconductor is cooled by air through the heat sink 109.

[0037] If the cooling power is high, the threaded ring 125 is threadedly connected to the threaded sleeve 115. At this time, the heat dissipation motor 121 is started to drive the heat dissipation shaft 122 to rotate, and then drive the heat dissipation block 123 and the heat dissipation leaves 124 to rotate around the heat dissipation shaft 122, thereby driving the air circulation in the working chamber 102, accelerating the heat dissipation of the heat dissipation plate 109, and avoiding the situation where heat accumulation occurs due to slow heat dissipation.

[0038] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0039] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A refrigeration semiconductor device, comprising a working shell (101), characterized in that: A working chamber (102) with an opening at the front side is provided in the working shell (101); a refrigeration plate (111) is fixedly connected to the rear end wall of the working chamber (102); two groups of left-right symmetrical and up-down symmetrical mounting plates (103) are fixedly connected to the rear end wall of the working chamber (102); a rotating motor (104) is fixedly provided on the upper mounting plate (103); the rotating motor (104) is motively connected to a rotating shaft (105) whose lower end is rotatably connected to the mounting plate (103) located at the lower side; the rotating shaft (105) is fixedly connected to a rotating plate (106); the rotating plates (106) are fixedly connected to a connecting plate (107) at one end face thereof close to each other; a heat dissipation plate (109) is fixedly connected to the upper and lower end faces of the connecting plate (107) respectively; a controller (110) is fixedly provided on the rear end of the working chamber (102); the controller (110) is capable of controlling and providing power to the installed refrigeration semiconductor.

2. A refrigeration semiconductor device according to claim 1, characterized in that: The rear end surface of the heat dissipation plate (109) is fixedly connected to an elastic plate (108).

3. A refrigeration semiconductor device according to claim 2, characterized in that: Four mounting holes (112) are provided through the rear end of the working chamber (102) and are located at the four corners of the working chamber (102). The mounting holes (112) can connect the working shell (101) to a mounting baffle (113).

4. A refrigeration semiconductor device according to claim 3, characterized in that: The baffle plate (113) is provided with a filter plate (114) penetrating the baffle plate (113).

5. A refrigeration semiconductor device according to claim 4, characterized in that: A threaded sleeve (115) coaxial with the filter plate (114) is fixedly connected to the front end surface of the baffle plate (113).

6. A refrigeration semiconductor device according to claim 5, characterized in that: The threaded sleeve (115) can be threadedly connected to a threaded ring (125), and the threaded ring (125) is fixedly connected to a rotating disk (116).

7. A refrigeration semiconductor device according to claim 6, characterized in that: The threaded ring (125) and the rotating disk (116) are provided with a heat dissipation cavity (119) penetrating the threaded ring (125) and the rotating disk (116).

8. A refrigeration semiconductor device according to claim 7, characterized in that: Four circumferentially distributed connecting rods (117) are fixedly connected to the side wall of the heat dissipation cavity (119), and the four connecting rods (117) are fixedly connected to the same supporting plate (118).

9. A refrigeration semiconductor device according to claim 8, characterized in that: A heat dissipation motor (121) is fixedly provided at the rear end of the support plate (118), and the heat dissipation motor (121) is motively connected to a heat dissipation shaft (122).

10. A refrigeration semiconductor device according to claim 9, characterized in that: The heat dissipation shaft (122) is fixedly connected to a heat dissipation block (123), and a plurality of circumferentially distributed heat dissipation blades (124) are fixedly connected to a side wall of the heat dissipation block (123).

Images