Display module and display device

Abstract

The utility model provides a display module and a display device. The display module comprises a display assembly and a supporting heat dissipation part. The display assembly comprises a display part and a device setting part with one ends connected, the supporting heat dissipation part is used for supporting the display part, the device setting part is arranged on the side, away from the display part, of the supporting part through a bent section, the tail end of the device setting part is connected with a circuit board, and the device setting part is fixedly connected with the supporting heat dissipation part through the circuit board. The display component is of a curved surface structure, the side, close to the display component, of the supporting heat dissipation component is a curved surface, the side, away from the display component, of the supporting heat dissipation component is a plane, first foam is arranged between the device setting component and the supporting heat dissipation component, the side, close to the supporting heat dissipation component, of the first foam is a non-glue surface, and the side, close to the device setting component, of the first foam is a glue surface. One side, close to the device setting component, of the first foam is provided with a groove used for placing a chip.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] At present, more and more automotive projects are using OLED screen technology. Due to the large size of automotive projects and the need to meet the personalized design of products by various terminals, many special-shaped modules have been produced. The front side of the special-shaped module, i.e. the display side, is curved, and the back side is flat. The special-shaped module includes a device setting component bent on the back side of the supporting heat dissipation component. The device setting component after bending is prone to stress concentration, thereby damaging the device setting component. Utility Model Content

[0003] The purpose of the embodiments of the present application is to provide a display module and a display device, wherein the device setting components of the display module have sufficient free movement space after being bent, and are not prone to stress concentration, so that the device setting components are not prone to damage.

[0004] The specific technical solutions are as follows:

[0005] The first aspect of the present application provides a display module, including a display panel, a supporting heat dissipation component, a cover chip film and a circuit board; the display component includes a display component and a device setting component connected at one end, the supporting heat dissipation component is used to support the display component; the device setting component is arranged on a side of the supporting component away from the display component through a bending section, the end of the device setting component is connected to a circuit board, and the device setting component is fixedly connected to the supporting heat dissipation component through the circuit board; the display component is a curved surface structure, the side of the supporting heat dissipation component close to the display component is a curved surface, and the side of the supporting heat dissipation component away from the display component is a plane, a first foam is arranged between the second section and the supporting heat dissipation component, the side of the first foam close to the supporting heat dissipation component is a non-glue surface, the side of the first foam close to the device setting component is a glue surface, and the side of the first foam close to the device setting component has a groove, the groove is used to place a chip, and the chip is located in the groove.

[0006] In addition, the display module provided in the first aspect of the present application may also have the following technical features:

[0007] In some embodiments, the display component includes a first panel body and a chip-on-chip film, the first panel body is the display component, the chip-on-chip film includes a first section, a middle section, and a second section connected in sequence, the first section is connected to the panel body, the middle section is the bending section, the second section is a device setting component, and the second section is bent through the middle section to the side of the supporting heat dissipation component away from the panel body.

[0008] In some embodiments, the groove includes two first side walls arranged opposite to each other along a first direction and two second side walls arranged opposite to each other along a second direction, a first preset distance exists between the two first side walls and the side walls of the chip opposite to each other, a second preset distance exists between the second side walls and the side walls of the chip opposite to each other, and the first direction and the second direction are coplanar and perpendicular to the thickness direction of the display module.

[0009] In some embodiments, the first side wall is a long side of the groove, the second side wall is a short side of the groove, and the first preset distance is greater than the second preset distance.

[0010] In some embodiments, middle portions of the two second side walls are recessed in a direction that shortens the distance between the second side walls, so that four corners of the groove form four bosses.

[0011] In some embodiments, there is a third preset distance between the starting position of the second sidewall recess and the side wall of the chip corresponding thereto, and the third preset distance is 0.5mm-1mm; there is a fourth preset distance between the starting position of the second sidewall recess and the first sidewall close thereto, and the fourth preset distance is 1mm-2mm; there is a fifth preset distance between the second sidewall at the recessed position and the side wall of the chip corresponding thereto, and the fifth preset distance is 1mm-2mm.

[0012] In some embodiments, the supporting heat dissipation component includes a buffer, a heat dissipation film and a heat dissipation plate which are sequentially arranged in a direction away from the display component, and the thickness of the heat dissipation film is smaller than the thickness of the heat dissipation plate.

[0013] In some embodiments, the buffer member is a second foam, the heat dissipation film is a copper foil, and the heat dissipation plate is an aluminum plate.

[0014] In some embodiments, a thermally conductive filler is disposed between the heat dissipation film and the heat dissipation plate, and the thermally conductive filler covers the surface of the heat dissipation plate.

[0015] In some embodiments, the thermally conductive filler is liquid thermally conductive silicone grease or the thermally conductive filler is thermally conductive silica gel.

[0016] In some embodiments, at least one first conductive glue is provided on the first surface of the heat sink close to the heat sink film, and the first conductive glue passes through the thermal conductive filler and contacts the heat sink film; at least one second conductive glue is provided on the second surface of the heat sink facing away from the heat sink film, and the second conductive glue is used to connect with the middle frame; the first conductive glue and the second conductive glue are staggered.

[0017] In some embodiments, four first conductive adhesives are provided and evenly distributed on the first surface near the top corners, and four second conductive adhesives are provided and evenly distributed on the second surface near the top corners.

[0018] In some embodiments, along a direction opposite to the extension direction of the second segment, a boundary of the first foam exceeds a boundary of the heat dissipation plate.

[0019] In some embodiments, a distance between a boundary of the first foam and a boundary of the heat dissipation plate is 1 mm-2 mm.

[0020] In some embodiments, the thickness of the first foam is greater than the thickness of the circuit board.

[0021] In some embodiments, the difference between the thickness of the first foam and the thickness of the circuit board is greater than or equal to 0.2 mm.

[0022] A second aspect of the present application provides a display device, which includes the display module described above.

[0023] Beneficial effects of the embodiments of the present application:

[0024] The display module and display device provided by the embodiment of the present application have sufficient free movement space for the device setting component after being bent by the bending section, and it is not easy to generate stress concentration, so the device setting component is not easy to be damaged. Specifically: by setting the side of the first foam close to the device setting component to have an adhesive surface, the device setting component and the first foam are bonded and fixed, and there is no adhesive surface between the first foam and the supporting heat dissipation component, that is, the first foam and the supporting heat dissipation component are not bonded, and only the end of the device setting component is fixed and bonded to the heat dissipation plate through the circuit board, so that the device setting component after being bent by the bending section has sufficient free movement space, and it is not easy to generate stress concentration, so the device setting component can be prevented from being damaged. The chip is placed in the groove of the first foam, so that the chip can be better protected from damage.

[0025] Of course, implementing any product or method of the present application does not necessarily require achieving all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and for ordinary technicians in this field, other embodiments can also be obtained based on these drawings.

[0027] Figure 1 A schematic plan view of a display module provided in an embodiment of the present application, wherein the chip-on-film is not bent;

[0028] Figure 2 A schematic diagram of the stacked structure of a display module provided in an embodiment of the present application, wherein the chip-on-chip film is not bent;

[0029] Figure 3a A schematic diagram of a stacked structure of a display module provided in an embodiment of the present application, wherein the chip-on-chip film is bent;

[0030] Figure 3b A schematic diagram of a stacked structure of a display module provided in an embodiment of the present application in another embodiment, wherein the chip-on-chip film is bent;

[0031] Figure 4 for Figure 3a The cross section along line BB;

[0032] Figure 5 A top view of the heat dissipation plate close to the heat dissipation film;

[0033] Figure 6 is a side view of the heat sink;

[0034] Figure 7 It is a top view of the side of the heat dissipation plate away from the heat dissipation film.

[0035] The figure numbers are as follows: display assembly 100; first panel body 100A; second panel body 100B; display component 101; display side 101a; device setting component 102; bending section 103; supporting heat dissipation component 200; buffer 201; heat dissipation film 202; heat dissipation plate 203; first conductive adhesive 2031; second conductive adhesive 2032; thermal conductive filler 204; flip chip film 300; first section 301; middle section 302; second section 303; circuit board 400; first foam 500; groove 501; first side wall 5011; second side wall 5012; boss 5013; first preset distance L1; second preset distance L2; third preset distance L3; fourth preset distance L4; fifth preset distance L5; spacing d; chip S; first direction X; second direction Y; extension direction A; cover plate 600; optical adhesive 700; tempered glass 800; polarizer 900. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field based on the present application belong to the scope of protection of the present application.

[0037] In a first aspect, the present application provides a display module, such as Figure 1 , Figure 2 , Figure 3a As shown, the display module includes a display component 100, a support heat dissipation component 200 and a circuit board 400. Figure 2 is a schematic diagram of the cross-sectional structure of the device setting component 102 when it is not bent, Figure 3a Schematic diagram of the cross-sectional structure of the device setting component 102 after bending. The support heat dissipation component 200 is used to support the display component 101. Specifically, the display component 101 includes a display side 101a, which is the side of the display component 101 from which light is emitted. The support heat dissipation component 200 is used to support the side of the display component 101 away from the display side 101a. The device setting component 102 is arranged on the side of the support heat dissipation component 200 away from the display component 101 through the bending section 103. The device setting component 102 is fixedly connected to the support heat dissipation component 200 through the circuit board 400. The display component 101 is a curved structure, the side of the supporting heat dissipation component 200 close to the display component 101 is a curved surface, and the side of the supporting heat dissipation component 200 away from the display component 101 is a flat surface, and a first foam 500 is provided between the second section 303 and the supporting heat dissipation component 200, the side of the first foam 500 close to the supporting heat dissipation component 200 is a non-glue surface, and the side of the first foam 500 close to the device setting component 102 is a glue surface, and the side of the first foam 500 close to the device setting component 102 has a groove 501, and the groove 501 is used to place the chip S, and the chip S is located in the groove 501.

[0038] The support and heat dissipation component 200 is arranged on the back of the display component 101, which can improve the mechanical strength of the display module on the one hand, and improve the heat dissipation capacity of the display module on the other hand. A circuit board 400 is arranged at the end of the device setting component 102, and components are arranged on the circuit board 400. The device setting component 102 is moved to the back of the support and heat dissipation component 200 by bending, which reduces the occupied space of the frame and is conducive to realizing the narrow frame design of the display module.

[0039] By setting the side of the first foam 500 close to the device setting component 102 as a glue surface, the device setting component 102 and the first foam 500 are bonded and fixed, and the first foam 500 and the supporting heat dissipation component 200 are non-glue surfaces, that is, the first foam 500 and the supporting heat dissipation component 200 are not bonded, and only the end of the device setting component 102 is fixedly bonded to the heat dissipation plate 203 through the circuit board 400, so that the bent device setting component 102 has enough free movement space, and it is not easy to generate stress concentration, so that the device setting component 102 can be prevented from being damaged. The chip S is placed in the groove 501 of the first foam 500, so that the chip S can be better protected from damage.

[0040] It should be noted that 100A / 101 means that the indication portion can represent both the display component 101 and the first panel body 100A, and both are the same component. 302 / 103 and 303 / 102 also have the same meaning.

[0041] In some embodiments, Figure 3a As shown, the display component 100 includes a first panel body 100A and a chip-on-film 300, the first panel body 100A serves as a display component 101, the chip-on-film 300 includes a first section 301, a middle section 302 and a second section 303 connected in sequence, the first section 301 is connected to the first panel body 100A, the middle section 302 is a bending section 103; the second section 303 serves as a device setting component 102, and the second section 303 is bent through the middle section 302 to the side of the support heat dissipation component 200 away from the first panel body 100A.

[0042] The first panel body 100A may be rigid or flexible, and this application does not limit this. The first section 301 of the COF 300 is connected to the first panel body 100A, for example, it may be but not limited to being connected to the display side 101a of the first panel body 100A, the COF 300 is bent through the middle section 302, so that the second section 303 is arranged on the back of the supporting heat dissipation component 200, and the second section 303 is fixedly connected to the supporting heat dissipation component 200 through the circuit board 400.

[0043] In this embodiment, the first foam 500 has a glue surface on one side close to the second section 303, the second section 303 is bonded and fixed to the first foam 500, and there is no glue surface between the first foam 500 and the supporting heat dissipation component 200, that is, the first foam 500 and the supporting heat dissipation component 200 are not bonded, and the chip-on-film 300 is only fixedly bonded to the heat dissipation plate 203 through the circuit board 400 at the end of the second section 303, so that the second section 303 after bending has enough free movement space, and it is not easy to generate stress concentration, so that the chip-on-film 300 can be prevented from being damaged. The chip S is placed in the groove 501 of the first foam 500, so that the chip S can be better protected from damage.

[0044] In some embodiments, Figure 3b As shown, the display assembly 100 includes a second panel body 100B and only includes the second panel body 100B, and the second panel body 100B is flexible. The second panel body 100B includes a display component 101, a device setting component 102, and a bending section 103 connecting the display component 101 and the device setting component, and the device setting component 102 is bent at the side of the support heat dissipation component 200 away from the display component 101 through the bending section 103. That is, the second panel body 100B forms the device setting component 102 located at the side of the support heat dissipation component 200 away from the display component 101 through its own bending.

[0045] In this embodiment, in order to facilitate the bending of the second panel body 100B, some inorganic layers in the flexible panel body can be removed from the bending section 103 between the display component 101 and the device setting component 102. The bending section 103 can also be narrowed so that the width of the bending section 103 is smaller than the width of the display component 101.

[0046] Understandable, such as Figure 3a , Figure 3b As shown, the display module generally further includes a polarizer 900 disposed on the display side 101a of the display component 101, and a cover plate 600 disposed on the side of the polarizer 900 away from the display component 101, and the cover plate 600 and the polarizer 900 are bonded by an optical adhesive 700. In some embodiments, as Figure 2 As shown, a tempered glass 800 is further provided on the side of the polarizer 900 away from the component 100 , and the tempered glass 800 and the polarizer 900 are also bonded by an optical adhesive 700 .

[0047] It should be noted that Figure 3a and Figure 3b The difference between the embodiments is that the display assembly 100 is composed of a panel body and a COF 300, or is composed of only a panel body. Figure 3a The embodiments shown are described in detail, and it can be understood that the following contents are also applicable to Figure 3bThe embodiments shown are not described one by one in this application.

[0048] In some embodiments, Figure 4 As shown, Figure 4 for Figure 3a In the cross-sectional view along line BB, the groove 501 includes two first side walls 5011 arranged opposite to each other along the first direction X and two second side walls 5012 arranged opposite to each other along the second direction Y. A first preset distance L1 is provided between the first side wall 5011 and the side wall of the chip S opposite to it, and a second preset distance L2 is provided between the second side wall 5012 and the side wall of the chip S opposite to it. The first direction X and the second direction Y are coplanar and perpendicular to the thickness direction of the display module.

[0049] The side walls of the chip S opposite to each other refer to the side walls of the chip S close to the first side wall 5011 or the second side wall 5012. There is a first preset distance L1 between the first side wall 5011 and the side wall of the chip S opposite thereto, so that the chip S does not contact the first side wall 5011 of the groove 501, which is beneficial to the heat dissipation of the chip S in the first direction X. Similarly, there is a second preset distance L2 between the second side wall 5012 and the side wall of the chip S opposite thereto, so that the chip S does not contact the second side wall 5012 of the groove 501, which is beneficial to the heat dissipation of the chip S in the second direction Y.

[0050] Therefore, the side wall of the chip S is not in contact with the first side wall 5011 and the second side wall 5012 , which is beneficial for the chip S to dissipate heat to the surroundings, reduces the risk of overheating of the chip S, and is beneficial for improving the performance of the chip S and extending the service life of the chip S.

[0051] Optionally, the first side wall 5011 is a long side of the groove 501 , the second side wall 5012 is a short side of the groove 501 , and the first preset distance L1 is greater than the second preset distance L2 .

[0052] It can be understood that the placement direction of the chip S is generally related to the setting of the groove 501. When the first side wall 5011 is the long side of the groove 501, the long side of the chip S is placed parallel to the first side wall 5011, so that the space in the groove 501 can be fully utilized, and the opening area of ​​the groove 501 can be reduced while ensuring the heat dissipation of the chip S. The first preset distance L1 is greater than the second preset distance L2, so that the long side of the chip S is the main heat dissipation side, and the heat dissipation effect is improved when the opening area is roughly equal.

[0053] In some embodiments, Figure 4 As shown, the middle portions of the two second side walls 5012 are recessed in a direction to shorten the distance between the second side walls 5012 , so that four bosses 5013 are formed at the four corners of the groove 501 .

[0054] The arrangement of the boss 5013 has a certain positioning effect when placing the chip S, which is conducive to improving the placement accuracy of the chip S. Specifically, it can be understood that the depression of the second side wall 5012 makes the placement space of the chip S in the second direction Y smaller, so the placement error of the chip S along the second direction Y is reduced, and the starting positions of the two bosses 5013 located on the same side along the first direction X play a positioning role in the placement of the chip S along the first direction X, so that the placement error of the chip S along the first direction X is also reduced, thereby improving the placement accuracy of the chip S.

[0055] In some embodiments, Figure 4 As shown, there is a third preset distance L3 between the starting position of the depression of the second side wall 5012 and the side wall of the chip S corresponding thereto, and the third preset distance L3 is 0.5mm-1mm, for example, it can be 0.8mm, 0.9mm, 1mm, etc.; there is a fourth preset distance L4 between the starting position of the depression of the second side wall 5012 and the first side wall 5011 close thereto, and the fourth preset distance L4 is 1mm-2mm, for example, it can be 1.3mm, 1.5mm, 1.8mm, etc.; there is a fifth preset distance L5 between the second side wall 5012 at the depressed position and the side wall of the chip S corresponding thereto, and the fifth preset distance L5 is 1mm-2mm, for example, it can be 1.2mm, 1.3mm, 1.5mm, etc.

[0056] The middle part of the second side wall 5012 is recessed inwardly, so that two bosses 5013 are formed on both sides of the second side wall 5012 along the first direction X. As shown in the figure, the starting position of the second side wall 5012 recessed refers to the lower boundary of the boss 5013, and the side wall of the chip S corresponding to the starting position refers to the side wall of the chip S close to the lower boundary of the boss 5013. The fourth preset distance L4 is the thickness of the boss 5013. The third preset distance L3 is smaller than the fourth preset distance L4, which is more conducive to positioning the placement position of the chip S through the boss 5013 and improving the placement accuracy. The fifth preset distance L5 between the second side wall 5012 at the recessed position and the side wall of the chip S corresponding thereto, on the one hand, reduces the distance between the two second side walls 5012 of the groove 501, improves the placement accuracy of the chip S, and on the other hand, makes the chip S not directly contact with the second side wall 5012 of the groove 501, which is conducive to the heat dissipation of the chip S.

[0057] In some embodiments, Figure 3a As shown, the supporting heat dissipation component 200 includes a buffer 201 , a heat dissipation film 202 and a heat dissipation plate 203 which are sequentially arranged in a direction away from the display component 101 , and the thickness of the heat dissipation film 202 is smaller than that of the heat dissipation plate 203 .

[0058] The buffer 201 is disposed between the display component 101 and the heat dissipation film 202 and is made of a highly elastic material with good flexibility and impact absorption capability, which can improve the impact resistance of the display module and help reduce the film printing defect rate of the display component 101 .

[0059] A heat dissipation film 202 is disposed on the side of the buffer 201 away from the display component 101 . The heat dissipation film 202 has the characteristics of small thickness and high flexibility, and the film printing defect rate of the display component 101 is reduced while ensuring the heat dissipation capacity.

[0060] The heat sink 203 is disposed on the side of the heat sink film 202 away from the display component 101 and has a relatively large thickness. It is the main support and heat sink component, which improves the overall strength of the display module and ensures the heat dissipation effect of the display module.

[0061] Alternatively, if Figure 3a As shown, the buffer 201 is a second foam, the heat dissipation film 202 is a copper foil, and the heat dissipation plate 203 is an aluminum plate.

[0062] The second foam can be made of the same material as the first foam 500. The second foam has the advantages of good elasticity and light weight, and can be arranged between the display component 101 and the heat dissipation film 202 to play a role in buffering and shock absorption.

[0063] Copper foil has the advantages of good electrical conductivity, good thermal conductivity, strong processability, and excellent ductility. As a heat dissipation film 202, it can not only quickly dissipate heat, but also deform synchronously with the display component 101, thereby reducing the film printing defect rate of the display component 101.

[0064] The heat sink 203 is made of an aluminum plate, which has good electrical and thermal conductivity, and is conducive to heat dissipation. In addition, it has the characteristics of light weight and high strength, which is conducive to reducing the weight of the heat sink 203, thereby reducing the weight of the display module.

[0065] It is understandable that copper foil and aluminum plate also have good electrical conductivity, so using copper foil as heat dissipation film 202 and aluminum plate as heat dissipation plate 203 is also beneficial to release static electricity of display component 101 and avoid static electricity accumulation inside display component 101.

[0066] Of course, the heat dissipation film 202 is not limited to copper foil, but can also be other materials with good ductility, good thermal conductivity and good electrical conductivity. The heat dissipation plate 203 is not limited to aluminum plate, but can also be other materials with good thermal conductivity and good electrical conductivity.

[0067] In some embodiments, Figure 3a , Figure 3b As shown, a heat conductive filler 204 is provided between the heat dissipation film 202 and the heat dissipation plate 203 , and the heat conductive filler 204 covers the surface of the heat dissipation plate 203 .

[0068] The thermal conductive filler 204 can fully fill the gap between the heat dissipation film 202 and the heat dissipation plate 203 , so as to fully contact the heat dissipation film 202 and the heat dissipation plate 203 , thereby improving the heat conduction efficiency.

[0069] Optionally, the thermally conductive filler 204 is liquid thermally conductive silicone grease or the thermally conductive filler 204 is thermally conductive silica gel.

[0070] Thermal grease also has good bonding properties. Thermal grease can be well bonded to various materials, ensuring good contact between the thermal grease and the heat dissipation film 202 and the heat dissipation plate 203, thereby improving the heat conduction efficiency. Liquid thermal grease has a certain fluidity, which can better fill the gap between the heat dissipation film 202 and the heat dissipation plate 203, so that the heat dissipation film 202 and the heat dissipation plate 203 are fully in contact, thereby improving the heat dissipation effect.

[0071] In addition, the thermal grease has high temperature stability. The thermal grease can maintain stable thermal conductivity at high temperatures and will not melt or decompose due to high temperatures. This allows the thermal grease to be used in some high-temperature environments, such as as a heat dissipation component of the display component 101 in this embodiment.

[0072] Thermally conductive silicone is a highly efficient thermally conductive material that can adapt to various shapes. Therefore, filling thermally conductive silicone between the heat dissipation film 202 and the heat dissipation plate 203 can fully contact the heat dissipation film 202 and the heat dissipation plate 203 to improve the heat conduction efficiency.

[0073] When a heat conductive filler 204 is disposed between the heat dissipation film 202 and the heat dissipation plate 203 and the heat conductive filler 204 does not have a conductive property, such as Figure 5 , Figure 6 and Figure 7 As shown, at least one first conductive glue 2031 is also provided on the first surface of the heat dissipation plate 203 close to the heat dissipation film 202, and the first conductive glue 2031 passes through the thermal conductive filler 204 and contacts the heat dissipation film 202; at least one second conductive glue 2032 is also provided on the second surface of the heat dissipation plate 203 away from the heat dissipation film 202, and the second conductive glue 2032 is used to connect with the middle frame; the first conductive glue 2031 and the second conductive glue 2032 are staggered.

[0074] Since the heat dissipation film 202 is a conductive material, the electrostatic charge of the display component 101 can be transferred to the heat dissipation film 202, and the first conductive adhesive 2031 passes through the thermal conductive filler 204 and contacts the heat dissipation film 202, and the electrostatic charge can be transferred to the front side of the heat dissipation plate 203 (here, the side close to the heat dissipation film 202) through the first conductive adhesive 2031. Since the heat dissipation plate 203 is a conductive material, and the back side of the heat dissipation plate 203 (here, the side away from the heat dissipation film 202) is provided with the second conductive adhesive 2032, the second conductive adhesive 2032 is used to connect with the middle frame, so that the static electricity inside the display component 101 can be released through the middle frame, avoiding the accumulation of static charge inside the display component 101 and causing a short circuit.

[0075] like Figure 6 As shown, the first conductive adhesive 2031 and the second conductive adhesive 2032 are staggered, that is, the projections of the first conductive adhesive 2031 and the second conductive adhesive 2032 along the thickness direction of the display module do not overlap, which can reduce the risk of force concentration at a local position and reduce the probability of poor printing on the front side of the display module.

[0076] In some embodiments, Figure 3a As shown in FIG. 1 , along the opposite direction of the extension direction A of the device setting part 102, the boundary of the first foam 500 exceeds the boundary of the heat dissipation plate 203. Figure 3a In the embodiment shown, it is in the opposite direction of the extension direction A of the second section 303. The boundary of the first foam 500 exceeds the boundary of the heat sink 203, that is, the boundary of the heat sink 203 is located inside the boundary of the first foam 500, which can prevent the boundary of the heat sink 203 from scratching the chip-on-film 300 during the bending process of the chip-on-film 300, thereby protecting the chip-on-film 300.

[0077] As a feasible solution, Figure 3a As shown, the distance d between the boundary of the first foam 500 and the boundary of the heat dissipation plate 203 is 1 mm-2 mm. For example, the distance d between the boundary of the first foam 500 and the boundary of the heat dissipation plate 203 can be 1.3 mm, 1.5 mm, 1.8 mm, 2 mm, etc.

[0078] The distance d between the boundary of the first foam 500 and the boundary of the heat sink 203, that is, the distance that the first foam 500 exceeds the boundary of the heat sink 203, increases the distance, so that the risk of the chip-on-film 300 interfering with the heat sink 203 during the bending process is further reduced, thereby preventing the boundary of the heat sink 203 from scratching the chip-on-film 300. However, the increase in the distance will also lead to an increase in the frame size of the display module, so the distance between the two is 1mm-2mm, which can ensure that the chip-on-film 300 does not interfere with the heat sink 203 during the bending process, and does not lead to an increase in the frame size of the display module.

[0079] like Figure 3a As shown, the thickness of the first foam 500 is greater than the thickness of the circuit board 400 .

[0080] The thickness of the first foam 500 is greater than that of the circuit board 400 , so that the side of the COF 300 away from the display component 101 will not be reversely compressed and deformed, or even damaged, when pressure is subsequently applied.

[0081] Optionally, the difference between the thickness of the first foam 500 and the thickness of the circuit board 400 is greater than or equal to 0.2 mm, for example, the thickness difference may be 0.2 mm, 0.25 mm, 0.3 mm, etc.

[0082] In this embodiment, the gap between the COF 300 and the heat sink 203 depends on the thickness of the circuit board 400. The thickness of the first foam 500 is slightly thicker than the circuit board 400 by more than 0.2 mm, so that the first foam 500 can fill the gap between the COF 300 and the heat sink 203, thereby playing a buffering role. This thickness also allows the first foam 500 and the COF 300 to have a certain amount of activity space, that is, when the compression amount of the first foam 500 is within 0.2 mm, it will not cause deformation of the COF 300, thereby protecting the COF 300 from damage.

[0083] At the same time, Figure 2 , Figure 3a As shown, the depth of the groove 501 is greater than the thickness of the chip S. The depth of the groove 501 is greater than the thickness of the chip S, so that the chip S is completely located in the groove 501 and does not contact the bottom wall of the groove 501. When the chip-on-film 300 or the first foam 500 is impacted, it will not be transmitted to the chip S, thereby protecting the chip S.

[0084] A second aspect of the present application further provides a display device, which includes the display module described above.

[0085] The display device may be, but is not limited to, a vehicle display, an advertising screen, a mobile phone, a computer, etc. The bent device setting part 102 of the display module included in the display device has sufficient free movement space and is not prone to stress concentration. Therefore, the device setting part 102 is not prone to damage, which is beneficial to improving the service life of the display device.

[0086] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0087] Each embodiment in this specification is described in a related manner, and the same or similar parts between the embodiments can be referenced to each other, and each embodiment focuses on the differences from other embodiments.

[0088] The above description is only a preferred embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application are included in the protection scope of the present application.

Claims

1. A display module, characterized in that: It includes a panel main body display assembly, a supporting heat dissipation component and a circuit board; The display assembly includes a display component and a device setting component connected at one end, the support heat dissipation component is used to support the display component, the device setting component is arranged on a side of the support heat dissipation component away from the display component through a bending section, a circuit board is connected to the end of the device setting component, and the device setting component is fixedly connected to the support heat dissipation component through the circuit board; The display component is a curved structure, the side of the supporting heat dissipation component close to the display component is a curved surface, and the side of the supporting heat dissipation component away from the display component is a flat surface, a first foam is arranged between the device setting component and the supporting heat dissipation component, the side of the first foam close to the supporting heat dissipation component is a non-glue surface, the side of the first foam close to the device setting component is a glue surface, and the side of the first foam close to the device setting component has a groove, the groove is used to place a chip, and the chip is located in the groove.

2. The display module according to claim 1, characterized in that: The display component includes a first panel body and a chip-on-chip film, the first panel body is the display component, the chip-on-chip film includes a first section, a middle section and a second section connected in sequence, the first section is connected to the panel body, the middle section is the bending section, the second section is a device setting component, and the second section is bent through the middle section to the side of the supporting heat dissipation component away from the panel body.

3. The display module according to claim 1, characterized in that: The groove includes two first side walls arranged opposite to each other along a first direction and two second side walls arranged opposite to each other along a second direction, a first preset distance is provided between the two first side walls and the side walls of the chip opposite to each other, a second preset distance is provided between the second side walls and the side walls of the chip opposite to each other, and the first direction and the second direction are coplanar and perpendicular to the thickness direction of the display module.

4. The display module according to claim 3, characterized in that: The first side wall is a long side of the groove, the second side wall is a short side of the groove, and the first preset distance is greater than the second preset distance.

5. The display module according to claim 3, characterized in that: The middle parts of the two second side walls are recessed in a direction to shorten the distance between the second side walls, so that four corners of the groove form four bosses.

6. The display module according to claim 5, characterized in that: There is a third preset distance between the starting position of the second sidewall recess and the sidewall of the chip corresponding thereto, and the third preset distance is 0.5mm-1mm; there is a fourth preset distance between the starting position of the second sidewall recess and the first sidewall close thereto, and the fourth preset distance is 1mm-2mm; There is a fifth preset distance between the second side wall of the recessed position and the side wall of the chip corresponding thereto, and the fifth preset distance is 1 mm-2 mm.

7. The display module according to any one of claims 1 to 6, characterized in that: The supporting heat dissipation component comprises a buffer, a heat dissipation film and a heat dissipation plate which are sequentially arranged in a direction away from the display component, and the thickness of the heat dissipation film is smaller than the thickness of the heat dissipation plate.

8. The display module according to claim 7, characterized in that: The buffer is a second foam, the heat dissipation film is a copper foil, and the heat dissipation plate is an aluminum plate.

9. The display module according to claim 8, characterized in that: A heat-conductive filler is arranged between the heat-dissipating film and the heat-dissipating plate, and the heat-conductive filler covers the surface of the heat-dissipating plate.

10. The display module according to claim 9, characterized in that: The thermally conductive filler is liquid thermally conductive silicone grease or the thermally conductive filler is thermally conductive silica gel.

11. The display module according to claim 10, characterized in that: At least one first conductive glue is disposed on a first surface of the heat dissipation plate close to the heat dissipation film, and the first conductive glue passes through the thermal conductive filler and contacts the heat dissipation film; At least one second conductive adhesive is disposed on a second surface of the heat dissipation plate facing away from the heat dissipation film, and the second conductive adhesive is used to connect with the middle frame; The first conductive adhesive and the second conductive adhesive are staggered.

12. The display module according to claim 11, characterized in that: Four first conductive adhesives are provided and evenly distributed on the first surface near the top corners, and four second conductive adhesives are provided and evenly distributed on the second surface near the top corners.

13. The display module according to claim 7, characterized in that: Along the direction opposite to the extending direction of the device setting component, the boundary of the first foam exceeds the boundary of the heat dissipation plate.

14. The display module according to claim 13, characterized in that: The distance between the boundary of the first foam and the boundary of the heat dissipation plate is 1 mm-2 mm.

15. The display module according to any one of claims 1 to 6, characterized in that: The thickness of the first foam is greater than the thickness of the circuit board.

16. The display module according to claim 15, characterized in that: The difference between the thickness of the first foam and the thickness of the circuit board is greater than or equal to 0.2 mm.

17. A display device, characterized in that: The display device comprises the display module according to any one of claims 1-16.

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