High-voltage box

Abstract

The utility model discloses a high-voltage box, and the box comprises a box body which comprises a side wall, a bottom plate and a cover plate, the side wall, the bottom plate and the cover plate form an accommodation space, at least one of the side wall, the bottom plate and the cover plate is internally provided with a liquid cooling flow channel, and the liquid cooling flow channel is configured to accommodate a cooling liquid; and the adsorption layer is arranged on one side, far away from the accommodating space, of at least one of the side wall, the bottom plate and the cover plate provided with the liquid cooling flow channel. In this way, the heat dissipation performance of the high-voltage box can be improved, and potential safety hazards of the high-voltage box are reduced.

Description

Technical Field

[0001] The present application relates to the field of energy storage technology, and in particular to a high-voltage box. Background Art

[0002] The high-voltage box is one of the key components of the power storage container system. After the battery plug-in boxes of a single cluster (a single cluster consists of multiple battery packs, generally 8) are connected in series, they are connected to the high-voltage box. In the power storage container system, there are multiple battery clusters, each battery cluster is connected in parallel, and the DC cables are led out from the high-voltage box and connected in parallel to the junction cabinet.

[0003] The high-voltage box itself is of 1P65 grade and is cooled naturally. If the energy storage system is less than 0.5P, the heat dissipation of the high-voltage box can still be normal; if the system is greater than 0.5P, or the current of the battery cell increases, the temperature inside the high-voltage box will reach 100 degrees or even higher. Excessive temperature may bring safety hazards to the high-voltage box. Utility Model Content

[0004] In order to solve the above problems, the present application provides a high-voltage box, which can improve the heat dissipation performance of the high-voltage box and reduce the safety hazards of the high-voltage box.

[0005] A technical solution adopted in the present application is: to provide a high-voltage box, which includes: a box body, including side walls, a bottom plate and a cover plate, the side walls, the bottom plate and the cover plate are arranged to form a receiving space, at least one of the side walls, the bottom plate and the cover plate is provided with a liquid cooling channel inside, and the liquid cooling channel is configured to receive a coolant; an adsorption layer is arranged on a side of at least one of the side walls, the bottom plate and the cover plate that is provided with the liquid cooling channel away from the receiving space.

[0006] In one embodiment, a liquid cooling channel is provided inside the bottom plate, and the adsorption layer is arranged on a side of the bottom plate away from the accommodating space.

[0007] In one embodiment, a plurality of sub-channels arranged side by side are provided inside the bottom plate, and the plurality of sub-channels are connected in sequence to form a liquid cooling channel.

[0008] In one embodiment, a liquid cooling space is provided inside the bottom plate, and isolation ribs are provided in the liquid cooling space. A plurality of isolation ribs are arranged at intervals to isolate the liquid cooling space to form a plurality of sub-channels.

[0009] In one embodiment, the bottom plate includes a liquid inlet joint and a liquid outlet joint connecting the liquid cooling channel with the external space.

[0010] In one embodiment, the projection area of ​​the adsorption layer toward the bottom plate at least covers the distribution area of ​​the liquid cooling channel.

[0011] In one embodiment, the absorption layer is foam.

[0012] In one embodiment, a connection row is provided in the accommodation space, and a heat dissipation component is provided on the connection row.

[0013] In one embodiment, the heat dissipation assembly includes: a base fixed on the connection row; and a plurality of fins connected to the base.

[0014] In one embodiment, a heat conducting medium is provided between the base and the connecting row.

[0015] In one embodiment, a fan is disposed on a side of the side wall facing the accommodating space.

[0016] In one embodiment, a temperature sensor is disposed in the accommodating space.

[0017] The high-voltage box provided in the present application includes: a box body, including side walls, a bottom plate and a cover plate, the side walls, the bottom plate and the cover plate are surrounded to form a storage space, at least one of the side walls, the bottom plate and the cover plate is provided with a liquid cooling channel inside, and the liquid cooling channel is configured to accommodate a coolant; an adsorption layer is provided on a side away from the storage space of at least one of the side walls, the bottom plate and the cover plate provided with the liquid cooling channel. Through the above manner, on the first hand, this embodiment provides a liquid cooling channel in the cover plate, the side wall or the bottom plate of the high-voltage box, and realizes the heat exchange between the inside and the outside of the high-voltage box through the circulation of the coolant, thereby avoiding the potential safety hazard caused by the excessive temperature inside the high-voltage box; on the other hand, this embodiment provides an adsorption layer on the outside of the cover plate, the side wall or the bottom plate provided with the liquid cooling channel in the high-voltage box, which can play a role of water-proof and moisture-proof, thereby avoiding the failure of the high-voltage box caused by excessive condensation water, or the safety problem of electricity use caused by conduction. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 It is a structural schematic diagram of an embodiment of a high-voltage box provided by the present application;

[0020] Figure 2 is a schematic diagram of the structure of the base plate 12;

[0021] Figure 3 is a schematic top view of the bottom plate 12 along the Z direction in one embodiment;

[0022] Figure 4 is a schematic top view of the bottom plate 12 along the Z direction in another embodiment;

[0023] Figure 5 is a schematic top view of the bottom plate 12 along the Z direction in yet another embodiment;

[0024] Figure 6 is a schematic diagram of the structure of the connection row 61 and the heat dissipation assembly 62 in one embodiment;

[0025] Figure 7 Schematic diagram of the internal structure of the high-voltage box 100 in one embodiment.

[0026] Reference numerals:

[0027] 100-high pressure box, 10-box, 20-adsorption layer;

[0028] 11-side wall, 12-bottom plate, 13-cover plate;

[0029] 12a-liquid inlet connector, 12b-liquid outlet connector;

[0030] A-sub-flow channel, B-isolation rib;

[0031] 61-connecting row, 62-heat dissipation assembly, 63-bolt;

[0032] 621-base, 622-fin;

[0033] 71- fan, 72- temperature sensor;

[0034] 81 - battery management unit, 82 - switching power supply, 83 - DC contactor, 84 - pre-charging resistor, 85 - Hall sensor, 86 - isolating switch, 87 - shunt, 88 - fuse. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of this application.

[0036] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the said features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0038] The use of "suitable for" or "configured to" in this application is meant to be open and inclusive language, which does not exclude devices that are suitable for or configured to perform additional tasks or steps. In addition, the use of "based on" is meant to be open and inclusive, because the process, step, calculation or other action "based on" one or more stated conditions or values ​​can be based on additional conditions or values ​​beyond the stated values ​​in practice.

[0039] In this application, the word "exemplary" is used to mean "used as an example, illustration, or description." Any embodiment described in this application as "exemplary" is not necessarily to be construed as being preferred or advantageous over other embodiments. The following description is given to enable any technician in the field to implement and use the present application. In the following description, details are listed for the purpose of explanation. It should be understood that a person of ordinary skill in the art can recognize that the present application can be implemented without using these specific details. In other instances, well-known structures and processes will not be elaborated in detail to avoid obscuring the description of the present application with unnecessary details. Therefore, the present application is not intended to be limited to the embodiments shown, but is consistent with the widest scope consistent with the principles and features disclosed in the present application.

[0040] See also Figure 1 , Figure 1 1 is a schematic structural diagram of an embodiment of a high-voltage box provided in the present application. The high-voltage box 100 includes a box body 10 and an adsorption layer 20 .

[0041] Among them, the box body 10 includes a side wall 11, a bottom plate 12 and a cover plate 13, and the side wall 11, the bottom plate 12 and the cover plate 13 are surrounded to form a receiving space. At least one of the side wall 11, the bottom plate 12 and the cover plate 13 is provided with a liquid cooling channel inside, and the liquid cooling channel is configured to contain a coolant; the adsorption layer 20 is arranged on a side away from the receiving space of at least one of the side wall 11, the bottom plate 12 and the cover plate 13 where the liquid cooling channel is provided.

[0042] It can be understood that the liquid cooling channel can be arranged inside any one or more of the side wall 11, the bottom plate 12 and the cover plate 13. For a general box body 10, which includes a cover plate 13, a bottom plate 12 and four side walls 11, the above-mentioned liquid cooling channel can be arranged in the above-mentioned six structures. Furthermore, the above-mentioned adsorption layer 20 can be arranged on the outside of the structure provided with the liquid cooling channel. In the following embodiments, an example is given in which the liquid cooling channel is arranged inside the bottom plate 12, and the adsorption layer 20 is arranged on the side of the bottom plate 12 away from the accommodation space.

[0043] Optionally, in one embodiment, the cover plate 13 and the side wall 11 are detachably connected, and can be fixed by bolts, buckles, etc. to achieve detachability. When the cover plate 13 is separated from the side wall 11, the electronic components in the accommodation space can be observed, and the interior of the high-voltage box 100 can be installed and maintained.

[0044] Optionally, in one embodiment, the bottom plate 12 and the side wall 11 are detachably connected, and can be fixed by bolts, buckles, etc. to achieve detachability. Since the bottom plate 12 realizes the liquid cooling function, the bottom plate 12 is replaceable in a detachable manner. When the liquid cooling function of the bottom plate 12 fails, the bottom plate 12 can be replaced.

[0045] In addition, in other embodiments, the side wall 11 , the bottom plate 12 and the cover plate 13 may also be integrally formed.

[0046] It is understandable that, since the bottom plate 12 has a liquid cooling function, the temperature of the bottom plate 12 is lower than the ambient temperature, and condensed water will be generated on the bottom plate 12. Generally, the high-voltage box 100 has an IP65 waterproof rating, so condensed water will not be generated inside the high-voltage box 100, and condensed water is mainly generated on the side of the bottom plate 12 away from the accommodation space. In this embodiment, an adsorption layer 20 is provided on the side of the bottom plate 12 away from the accommodation space to adsorb the generated condensed water, so that no condensed water will adhere to the outside of the high-voltage box 100.

[0047] In other embodiments, in addition to the bottom plate 12 provided with the liquid cooling channel, condensed water may also be attached to the outer sides of the side wall 11 and the cover plate 13 due to the low temperature. Therefore, an adsorption layer 20 may also be provided on the side of the side wall 11 and the cover plate 13 away from the accommodation space according to the situation.

[0048] The adsorption layer 20 can be fixed to the side of the bottom plate 12 away from the accommodation space by gluing. In one embodiment, the area of ​​the adsorption layer 20 can be different for different distribution areas of the liquid cooling channel set inside the bottom plate 12. For example, the liquid cooling channel is distributed in an "S" shape, and a distribution area can be determined according to the distribution of the liquid cooling channel. The projection area of ​​the adsorption layer 20 toward the bottom plate 12 at least covers the distribution area of ​​the liquid cooling channel.

[0049] In another embodiment, the adsorption layer 20 can also be set to different thicknesses according to the distribution area. For example, in the distribution area corresponding to the liquid cooling channel, the thickness of the adsorption layer 20 is thicker, and in the area where there is no liquid cooling channel, the thickness of the adsorption layer 20 is thinner.

[0050] In another embodiment, since the side wall 11 is connected to the bottom plate 12, the heat exchange between the side wall 11 and the bottom plate 12 is also relatively obvious, and condensed water may also be generated in the portion of the side wall 11 close to the bottom plate 12. Therefore, an adsorption layer 20 can be further provided in a partial area of ​​the side wall 11 close to the bottom plate 12.

[0051] Optionally, in one embodiment, the adsorption layer 20 may be foam. The foam has the function of water-proofing and moisture-proofing. For example, the foam may be EVA foam. The characteristics of EVA foam are good softness, rubber-like elasticity, good flexibility at -50°C, good transparency and surface gloss, good chemical stability, good aging resistance and ozone resistance, and non-toxicity. It has good miscibility with fillers, and good coloring and molding processability. In other embodiments, the adsorption layer 20 may also be cotton sheets / strips, anti-penetration adsorption pads, fiber materials such as polypropylene fiber felt and polystyrene fiber, absorbent resin materials such as polyurethane foam, etc.

[0052] Further reading Figure 2 , Figure 2 1 is a schematic diagram of the structure of the bottom plate 12. A liquid cooling channel is provided inside the bottom plate 12. The liquid cooling channel is configured to contain a cooling liquid. The bottom plate 12 includes a liquid inlet joint 12a and a liquid outlet joint 12b connecting the liquid cooling channel with the external space.

[0053] It can be understood that in one application scenario, the liquid inlet connector 12a and the liquid outlet connector 12b can be connected to an external coolant circulation device, and the coolant circulation device drives the coolant from the liquid inlet connector 12a into the liquid cooling channel inside the base plate 12 through power, and then circulates from the liquid outlet connector 12b to the coolant circulation device.

[0054] Optionally, the distribution and route of the liquid cooling channels can be set according to actual needs inside the bottom plate 12. It can be understood that in order to maximize the cooling effect, the liquid cooling channels can be arranged in a "snake" manner.

[0055] Further reading Figure 3 , Figure 3 1 is a schematic top view of the bottom plate 12 along the Z direction in an embodiment, wherein a plurality of sub-channels A arranged side by side are provided inside the bottom plate 12, and the plurality of sub-channels A are connected in sequence to form a liquid cooling channel. Specifically, there is a liquid cooling space inside the bottom plate, and isolation ribs B are provided in the liquid cooling space, and the plurality of isolation ribs B are arranged at intervals to isolate the liquid cooling space to form a plurality of sub-channels A.

[0056] In one embodiment, the base plate 12 is an aluminum extruded profile, the interior of the base plate 12 is a hollow structure, and the interior of the base plate 12 has a plurality of isolation ribs B. By setting the length of the isolation ribs B and the connection with the inner wall of the liquid cooling space, the liquid cooling space can be isolated to form a plurality of sub-channels A, thereby forming a liquid cooling channel.

[0057] For example, the isolation ribs B extend along the Y direction, and the isolation ribs B are connected to the side walls of the bottom plate 12 on both sides along the Z direction to form a sub-channel A along the Y direction. If multiple isolation ribs B are arranged side by side along the X direction, then multiple sub-channels A are also arranged side by side along the X direction, and adjacent sub-channels A are connected to each other, thereby forming a liquid cooling channel. Specifically, the liquid inlet connector 12a and the liquid outlet connector 12b are respectively connected to the two sub-channels A at both ends along the X direction.

[0058] In another embodiment, if Figure 4 As shown, Figure 4 This is a schematic top view of the bottom plate 12 along the Z direction in another embodiment, wherein the isolation ribs B extend along the Y direction, the isolation ribs B are connected to the side walls on both sides of the bottom plate 12 along the Z direction, and multiple isolation ribs B are arranged side by side along the X direction, then multiple sub-channels A are also arranged side by side along the X direction. Multiple isolation ribs B are alternately connected to the side walls on both sides of the Y direction. Specifically, the first isolation rib B is connected to the side wall in the -Y direction, and the second isolation rib B is connected to the side wall in the +Y direction. Through this connection method, adjacent sub-channels A are interconnected, thereby forming a "snake-shaped" liquid cooling channel.

[0059] In yet another embodiment, Figure 5 As shown, Figure 5 1 is a schematic top view of the bottom plate 12 along the Z direction in another embodiment. It can be understood that in one embodiment, the bottom plate 12 is made of aluminum extrusion profiles, so the bottom plate 12 can be spliced ​​with multiple aluminum extrusion profiles according to actual size. Figure 5 The diagram shows a larger base plate formed by splicing two base plates 12 (aluminum extruded profiles). It is understandable that in other embodiments, a certain number of aluminum extruded profiles can be spliced ​​according to the actual required size of the base plate 12.

[0060] The high-voltage box provided in this embodiment includes: a box body, including side walls, a bottom plate and a cover plate, the side walls, the bottom plate and the cover plate are surrounded to form a receiving space, at least one of the side walls, the bottom plate and the cover plate is provided with a liquid cooling channel inside, and the liquid cooling channel is configured to receive a coolant; an adsorption layer is provided on a side away from the receiving space of at least one of the side walls, the bottom plate and the cover plate provided with the liquid cooling channel. Through the above manner, on the first hand, this embodiment provides a liquid cooling channel in the cover plate, the side wall or the bottom plate of the high-voltage box, and realizes the heat exchange between the inside and the outside of the high-voltage box through the circulation of the coolant, thereby avoiding the potential safety hazard caused by the excessive temperature inside the high-voltage box; on the other hand, this embodiment provides an adsorption layer on the outside of the cover plate, the side wall or the bottom plate provided with the liquid cooling channel in the high-voltage box, which can play a role of water-proof and moisture-proof, thereby avoiding the failure of the high-voltage box caused by excessive condensation water, or the safety problem of electricity use caused by conduction.

[0061] Furthermore, various electronic components are arranged inside the high-voltage box 100, and the various electronic components are connected by connecting bars (such as copper bars). The connecting bars realize electrical connection between various components. Since the connecting bars are conductive, as the internal temperature of the high-voltage box 100 increases or the current of the connecting bars increases, the temperature of the connecting bars will also be higher.

[0062] In one embodiment, a heat dissipation component 62 is provided on the connection bar 61 to dissipate heat from the connection bar 61. Figure 6 As shown, Figure 6 1 is a schematic diagram of the structure of a connecting row 61 and a heat dissipation component 62 in an embodiment, wherein the heat dissipation component 62 is fixed on the connecting row 61 .

[0063] Understandably, Figure 6 Only part of the connection bar 61 is shown. The number of the connection bars 61 in the high-voltage box 100 and which electronic components the connection bars 61 are connected to are not limited in this embodiment.

[0064] Optionally, the heat dissipation assembly 62 includes a base 621 and fins 622, the base 621 is fixed on the connection row 61, and a plurality of fins 622 are connected to the base 621. The base 621 and the fins 622 can be made of copper, aluminum or stainless steel. For example, the base 621 can be fixed to the connection row 61 by bolts 63.

[0065] Optionally, in one embodiment, a heat-conducting medium, such as silicone grease, is further disposed between the base 621 and the connecting bar 61 , which can improve the heat conduction performance between the base 621 and the connecting bar 61 .

[0066] like Figure 7 As shown, Figure 71 is a schematic diagram of the internal structure of a high-voltage box 100 in an embodiment, showing a side wall 11 and a bottom plate 12. Optionally, in an embodiment, a fan 71 may be provided in the high-voltage box 100. Specifically, a fan 71 is provided on the side of the side wall 11 facing the accommodation space. The number and direction of the fan 71 may be adjusted according to the arrangement of the components in the box.

[0067] Optionally, in one embodiment, a temperature sensor 72 is disposed in the accommodation space. For example, the temperature sensor 72 may be a NTC (Negative Temperature Coefficient thermistor), and the number and location of the temperature sensor 72 may be adjusted according to the configuration of the components in the box.

[0068] In addition, the heat dissipation component 62 introduced in the above embodiment is arranged in the accommodating space.

[0069] It can be understood that the above-mentioned fan 71, temperature sensor 72, heat dissipation assembly 62, and bottom plate 12 together constitute a heat dissipation system of the high-voltage box 100, which realizes heat dissipation of the high-voltage box 100 through mutual interaction.

[0070] Furthermore, a battery management unit (BMU) 81, a switching power supply 82, a DC contactor 83, a pre-charging resistor 84, a Hall sensor 85, an isolating switch 86, a shunt 87, a fuse 88, etc. may also be provided in the high-voltage box 100.

[0071] It can be understood that the high-voltage box 100 in the above embodiment is mainly used in a BMS (BATTERY MANAGEMENT SYSTEM), and can be specifically applied to battery management in new energy vehicles.

[0072] The display screen provided in the embodiment of the present application is introduced in detail above. Specific examples are used in this article to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A high-voltage box, characterized in that: The high-voltage box comprises: A box body, comprising a side wall, a bottom plate and a cover plate, wherein the side wall, the bottom plate and the cover plate are arranged to form a receiving space, and a liquid cooling channel is provided inside at least one of the side wall, the bottom plate and the cover plate, and the liquid cooling channel is configured to receive a cooling liquid; The adsorption layer is arranged on a side away from the accommodation space of at least one of the side wall, the bottom plate and the cover plate where the liquid cooling channel is arranged.

2. The high-voltage box according to claim 1, characterized in that: A liquid cooling channel is provided inside the bottom plate, and the adsorption layer is arranged on a side of the bottom plate away from the accommodating space.

3. The high-voltage box according to claim 2, characterized in that: A plurality of sub-channels arranged side by side are provided inside the bottom plate, and the plurality of sub-channels are connected in sequence to form the liquid cooling channel.

4. The high-voltage box according to claim 3, characterized in that: The bottom plate has a liquid cooling space inside, and the liquid cooling space is provided with isolation ribs, and a plurality of the isolation ribs are arranged at intervals to isolate the liquid cooling space to form a plurality of the sub-channels.

5. The high-voltage box according to any one of claims 2 to 4, characterized in that: The bottom plate includes a liquid inlet joint and a liquid outlet joint which connect the liquid cooling channel with the external space.

6. The high-voltage box according to claim 2, characterized in that: The projection area of ​​the adsorption layer toward the bottom plate at least covers the distribution area of ​​the liquid-cooling channel.

7. The high-voltage box according to any one of claims 1 to 2 or 6, characterized in that: The adsorption layer is foam.

8. The high-voltage box according to any one of claims 1 to 4, characterized in that: A connection row is arranged in the accommodating space, and a heat dissipation component is arranged on the connection row.

9. The high-voltage box according to claim 8, characterized in that: The heat dissipation component comprises: A base, the base being fixed on the connecting bar; A plurality of fins are connected to the base.

10. The high-voltage box according to claim 9, characterized in that: A heat conducting medium is provided between the base and the connecting row.

11. The high-voltage box according to any one of claims 1 to 4, characterized in that: A fan is arranged on a side of the side wall facing the accommodating space.

12. The high-voltage box according to any one of claims 1 to 4, characterized in that: A temperature sensor is arranged in the accommodating space.

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