Circuit board heat dissipation protection device

Abstract

The utility model relates to the field of circuit board protection devices, in particular to a circuit board heat dissipation protection device. The protection device aims at solving the technical problems that in the prior art, a circuit board is generally installed in an exposed mode, the heat dissipation effect is not ideal, meanwhile, the circuit board directly makes contact with dust, and the outer surface is prone to being damaged. A heat dissipation protection device for a circuit board comprises a mounting rack, a circuit board body, a connecting assembly and a protection assembly. According to the utility model, the upper part and the lower part of the protection assembly are mutually adsorbed, so that an electronic component area on the inner side of the circuit board body can be isolated and protected, the circuit board body is prevented from being damaged, the front and back surfaces of the circuit board body are synchronously cooled through the heat dissipation assembly, and overheating protection is provided for the circuit board body; and external impurities, dust and other substances are prevented from being in direct contact with the circuit board, so that the damage to the circuit board is reduced.

Description

Technical Field

[0001] The utility model relates to the field of circuit board protection devices, in particular to a circuit board heat dissipation protection device. Background Art

[0002] Printed Circuit Board (PCB) is a plate-like substrate used to support and connect electronic components. They are one of the core components of modern electronic devices, used to provide electrical connections and mechanical support, and connect electronic components into a complete functional circuit.

[0003] However, the existing electronic components are soldered to the printed circuit board (PCB), and the PCB is fixed in the corresponding mechanical structure. The circuit board may face heat dissipation problems in high temperature environments. At present, the heat dissipation mainly relies on the cooling fan installed in the large environment. However, the fan also needs to dissipate heat for other equipment. For example, if the circuit board is not installed in a good position, the fan radiation area cannot cover the circuit board, and the heat dissipation is not ideal. At the same time, the circuit board is generally installed exposed and directly contacts with dust, which will affect the performance of the circuit board. In addition, the surface of the circuit board is easily damaged by impact or vibration, making the circuit board unusable. Utility Model Content

[0004] In view of the shortcomings of the prior art, the purpose of the utility model is to provide a circuit board heat dissipation protection device, which aims to solve the technical problems that the circuit boards in the prior art are generally installed exposed, the heat dissipation effect is not ideal, and there is direct contact with dust and the outer surface is easily damaged.

[0005] The technical scheme of the utility model is: a circuit board heat dissipation protection device, comprising a mounting frame, a circuit board body, a connecting component, a protection component, and a heat dissipation component; the circuit board body is welded at the middle position inside the mounting frame; a protection component is installed inside the mounting frame to cover the upper and lower surfaces of the circuit board body and isolate them from the outside world; the protection component and the mounting frame are installed and connected through the connecting component; a heat dissipation component for synchronously dissipating the front and back sides of the circuit board body is installed inside the protection component.

[0006] Preferably, in the first step, the electronic components are welded on the surface of the circuit board body, and the circuit board body is stably welded on the inner side of the mounting frame; in the second step, the protection assembly is inserted into the circuit board body from the side, and the top end is quickly positioned by the connecting assembly; in the third step, the protection assembly is pushed upward so that the upper and lower parts are adsorbed on each other, so that the electronic component area inside the circuit board body can be isolated and protected to prevent the circuit board body from being damaged; in the fourth step, the heat dissipation assembly is started to dissipate heat on the front and back sides of the circuit board body simultaneously, to provide overheating protection for the circuit board body, to transfer heat from the surface of the circuit board body to the external environment, thereby reducing the operating temperature of the circuit board, maintaining the long-term stable operation of the circuit board, and preventing external impurities, dust and other substances from directly contacting the circuit board, thereby reducing damage to the circuit board.

[0007] Preferably, the connecting assembly includes an upper frame, connecting ears, positioning columns, positioning grooves, spring pins and positioning holes; connecting ears are fixedly connected to the four corners of the upper end of the upper frame; the positioning columns of the connecting ears of the upper frame are aligned with the positioning grooves and inserted, and the spring pins are snapped into the positioning holes.

[0008] Preferably, a circular positioning column is fixedly connected to the lower end of the connecting ear; a positioning groove matching the shape of the positioning column is provided at the upper end of the mounting frame; the positioning groove and the positioning column are slidingly connected; symmetrical spring pins are installed on the outer side of the positioning column; symmetrically distributed positioning holes are provided on the outer side of the positioning groove; the spring pins and the positioning holes are snap-fitted and connected; the protection component and the mounting frame are quickly positioned.

[0009] Preferably, the protection component includes a lower frame, a sliding rod, a sliding sleeve, a silicone protective strip, a magnetic sleeve and a magnetic column; the rear end of the lower frame is fixedly connected to the sliding sleeve; the inner side of the sliding sleeve is slidably connected to the sliding rod fixed to the lower end of the upper frame; the lower frame is pushed upward, and the sliding sleeve of the lower frame moves upward along the sliding rod path until the magnetic sleeve and the magnetic column are adsorbed on each other.

[0010] Preferably, a silicone protective strip is fixedly connected to the upper end of the lower frame and the lower end of the upper frame; magnetic columns are provided at both the front and rear ends of the lower frame; magnetic sleeves are fixedly connected to the front and rear ends of the upper frame; the magnetic sleeves are adsorbed and connected to the magnetic columns; the silicone protective strip isolates and protects the electronic component area inside the circuit board body to prevent damage to the circuit board body.

[0011] Preferably, the heat dissipation component includes a first heat dissipation fan, a second heat dissipation fan and a filter; the first heat dissipation fan is fixedly connected to the middle position of the upper frame; the second heat dissipation fan is fixedly connected to the middle position of the lower frame; the air inlet ends of the second heat dissipation fan and the first heat dissipation fan are both provided with filters; the first heat dissipation fan and the second heat dissipation fan are started at the same time to transfer heat from the surface of the circuit board body to the external environment, thereby reducing the operating temperature of the circuit board, and the filter prevents external impurities, dust and other substances from directly contacting the circuit board.

[0012] Beneficial effects of the utility model:

[0013] The utility model can be quickly and conveniently assembled by inserting the protection component into the circuit board body from the side and quickly positioning the protection component at the top through the connection component. The upper and lower parts of the protection component are adsorbed on each other, so that the electronic component area inside the circuit board body can be isolated and protected to prevent the circuit board body from being damaged. The front and back sides of the circuit board body are synchronously cooled by the heat dissipation component to provide overheating protection for the circuit board body, and the heat is transferred from the surface of the circuit board body to the external environment, thereby reducing the working temperature of the circuit board, maintaining the long-term stable operation of the circuit board, and preventing external impurities, dust and other substances from directly contacting the circuit board, thereby reducing damage to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 What is shown is a three-dimensional structural schematic diagram of the protection device of the utility model;

[0015] Figure 2 The figure shows a rear three-dimensional structure diagram of the protection device of the utility model;

[0016] Figure 3 The diagram shows the disassembled structure of the protection device of the utility model;

[0017] Figure 4 Shown is a schematic diagram of the protection component and heat dissipation component structure of the protection device of the utility model.

[0018] Explanation of the reference numerals: 1. Mounting frame; 2. Circuit board body; 3. Connecting assembly; 301. Upper frame; 302. Connecting ear; 303. Positioning column; 304. Positioning groove; 305. Spring pin; 306. Positioning hole; 4. Protective assembly; 401. Lower frame; 402. Sliding rod; 403. Sliding sleeve; 404. Silicone protective strip; 405. Magnetic sleeve; 406. Magnetic column; 5. Heat dissipation assembly; 501. First heat dissipation fan; 502. Second heat dissipation fan; 503. Filter. DETAILED DESCRIPTION

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] See also Figure 1-2The utility model provides an embodiment: a circuit board heat dissipation protection device, comprising a mounting frame 1, a circuit board body 2, a connecting component 3, a protecting component 4, and a heat dissipation component 5; the circuit board body 2 is welded at the middle position inside the mounting frame 1; the protecting component 4 is installed inside the mounting frame 1 to cover the upper and lower surfaces of the circuit board body 2 and isolate them from the outside world; the protecting component 4 is installed and connected to the mounting frame 1 through the connecting component 3; the heat dissipation component 5 for synchronously dissipating the front and back surfaces of the circuit board body 2 is installed inside the protecting component 4.

[0021] See also Figure 3 , in this embodiment, the connecting component 3 includes an upper frame 301, a connecting ear 302, a positioning column 303, a positioning groove 304, a spring pin 305 and a positioning hole 306; the connecting ears 302 are fixedly connected to the four corners of the upper end of the upper frame 301; the positioning column 303 of the connecting ear 302 of the upper frame 301 is aligned with the positioning groove 304 and inserted, the spring pin 305 is snapped into the positioning hole 306, and the lower end of the connecting ear 302 is fixedly connected with a circular positioning column 303; a positioning groove 304 matching the shape of the positioning column 303 is opened at the upper end of the mounting frame 1; the positioning groove 304 and the positioning column 303 are slidably connected; symmetrical spring pins 305 are installed on the outer side of the positioning column 303; symmetrically distributed positioning holes 306 are opened on the outer side of the positioning groove 304; the spring pin 305 and the positioning hole 306 are snap-fitted and connected; the protection component 4 and the mounting frame 1 are quickly positioned.

[0022] See also Figure 4In this embodiment, the protection component 4 includes a lower frame 401, a sliding rod 402, a sliding sleeve 403, a silicone protective strip 404, a magnetic sleeve 405 and a magnetic column 406; the rear end of the lower frame 401 is fixedly connected with the sliding sleeve 403; the inner side of the sliding sleeve 403 is slidably connected with the sliding rod 402 fixed to the lower end of the upper frame 301; the lower frame 401 is pushed upward, and the sliding sleeve 403 of the lower frame 401 moves upward along the path of the sliding rod 402 until the magnetic sleeve 405 and the magnetic column 406 are attracted to each other, and the upper end of the lower frame 401 and the lower end of the upper frame 301 are fixedly connected with the silicone protective strip 404; magnetic columns 406 are arranged at both the front and rear ends of the lower frame 401; the front and rear ends of the upper frame 301 are fixedly connected with the magnetic sleeve 405; the magnetic sleeve 405 and the magnetic column 406 are attracted to each other. Attached connection; the silicone protective strip 404 isolates and protects the electronic component area inside the circuit board body 2 to prevent the circuit board body 2 from being damaged. The heat dissipation component 5 includes a first heat dissipation fan 501, a second heat dissipation fan 502 and a filter 503; the first heat dissipation fan 501 is fixedly connected to the middle position of the upper frame 301; the second heat dissipation fan 502 is fixedly connected to the middle position of the lower frame 401; the second heat dissipation fan 502 and the first heat dissipation fan 501 are both provided with a filter 503 at the air inlet end; the first heat dissipation fan 501 and the second heat dissipation fan 502 are started at the same time to transfer heat from the surface of the circuit board body 2 to the external environment, thereby reducing the working temperature of the circuit board, and at the same time the filter 503 prevents external impurities, dust and other substances from directly contacting the circuit board.

[0023] During the operation, the first step is to solder the electronic components onto the surface of the circuit board body 2 and stably solder the circuit board body 2 onto the inner side of the mounting frame 1 .

[0024] In the second step, insert the protection component 4 into the circuit board body 2 from the side, quickly position the protection component 4 at the top through the connecting component 3, align the positioning column 303 of the connecting ear 302 of the upper frame 301 with the positioning groove 304 and insert it, and insert the spring pin 305 into the positioning hole 306.

[0025] In the third step, the lower frame 401 is pushed upward, and the sliding sleeve 403 of the lower frame 401 moves upward along the path of the sliding rod 402 until the magnetic sleeve 405 and the magnetic column 406 are attracted to each other, so that the silicone protective strip 404 of the protective component 4 can isolate and protect the electronic component area inside the circuit board body 2 to prevent the circuit board body 2 from being damaged.

[0026] The fourth step is to start the first cooling fan 501 and the second cooling fan 502 of the heat dissipation component 5 to simultaneously dissipate heat on the front and back sides of the circuit board body 2, provide overheating protection for the circuit board body 2, and transfer heat from the surface of the circuit board body 2 to the external environment, thereby reducing the operating temperature of the circuit board and maintaining the long-term stable operation of the circuit board. In addition, the filter 503 prevents external impurities, dust and other substances from directly contacting the circuit board, thereby reducing damage to electronic components.

[0027] Through the above steps, by inserting the protection component 4 into the circuit board body 2 from the side, and quickly positioning the protection component 4 at the top through the connecting component 3, the assembly can be quick and convenient, and the upper and lower components of the protection component 4 are adsorbed on each other, so that the electronic component area inside the circuit board body 2 can be isolated and protected to prevent the circuit board body 2 from being damaged. Through the heat dissipation component 5, the front and back sides of the circuit board body 2 are simultaneously dissipated to provide overheating protection for the circuit board body 2, and the heat is transferred from the surface of the circuit board body 2 to the external environment, thereby reducing the operating temperature of the circuit board, maintaining the long-term stable operation of the circuit board, and preventing external impurities, dust and other substances from directly contacting the circuit board, thereby reducing damage to the electronic components.

[0028] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of those skilled in the art without departing from the purpose of the present invention.

Claims

1. A circuit board heat dissipation protection device, comprising a mounting frame (1); characterized in that: It also comprises a circuit board body (2), a connection component (3), a protection component (4), and a heat dissipation component (5); the circuit board body (2) is welded at the middle position inside the mounting frame (1); a protection component (4) is installed inside the mounting frame (1) to cover the upper and lower surfaces of the circuit board body (2) and isolate it from the outside; the protection component (4) and the mounting frame (1) are connected by the connection component (3); and a heat dissipation component (5) is installed inside the protection component (4) for synchronously dissipating heat from the front and back surfaces of the circuit board body (2).

2. A circuit board heat dissipation protection device according to claim 1, characterized in that: The connection assembly (3) comprises an upper frame (301), a connection ear (302), a positioning column (303), a positioning groove (304), a spring pin (305) and a positioning hole (306); the connection ears (302) are fixedly connected to the four corners of the upper end of the upper frame (301).

3. A circuit board heat dissipation protection device according to claim 2, characterized in that: A circular positioning column (303) is fixedly connected to the lower end of the connecting ear (302); a positioning groove (304) matching the shape of the positioning column (303) is provided at the upper end of the mounting frame (1); the positioning groove (304) and the positioning column (303) are slidably connected; symmetrical spring pins (305) are installed on the outer side of the positioning column (303); symmetrically distributed positioning holes (306) are provided on the outer side of the positioning groove (304); and the spring pins (305) and the positioning holes (306) are snap-fitted and connected.

4. A circuit board heat dissipation protection device according to claim 2, characterized in that: The protection component (4) comprises a lower frame (401), a sliding rod (402), a sliding sleeve (403), a silicone protective strip (404), a magnetic sleeve (405) and a magnetic column (406); the rear end of the lower frame (401) is fixedly connected to the sliding sleeve (403); the inner side of the sliding sleeve (403) is slidably connected to the sliding rod (402) fixed to the lower end of the upper frame (301).

5. A circuit board heat dissipation protection device according to claim 2, characterized in that: A silicone protective strip (404) is fixedly connected to the upper end of the lower frame (401) and the lower end of the upper frame (301); magnetic columns (406) are provided at both the front and rear ends of the lower frame (401); and magnetic sleeves (405) are fixedly connected to the front and rear ends of the upper frame (301); and the magnetic sleeves (405) are adsorbed and connected to the magnetic columns (406).

6. A circuit board heat dissipation protection device according to claim 1, characterized in that: The heat dissipation assembly (5) comprises a first heat dissipation fan (501), a second heat dissipation fan (502) and a filter (503); the first heat dissipation fan (501) is fixedly connected to the middle position of the upper frame (301); the second heat dissipation fan (502) is fixedly connected to the middle position of the lower frame (401); and the filter (503) is provided at the air inlet end of the second heat dissipation fan (502) and the first heat dissipation fan (501).

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