Light emitting diode packaging structure
By using a white glue layer to cover the support surface around the light emitting diode chip in the light emitting diode packaging structure, the problem of low light output efficiency in the prior art is solved, higher brightness and better light efficiency are achieved, and cost is reduced.
Patent Information
- Application Number
- CN202420883233.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-25
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2034-04-25
AI Technical Summary
The light output efficiency of the existing light emitting diode packaging structure is not high and cannot meet the market's demand for higher brightness and better light efficiency.
A packaging structure including a bracket, a white glue layer, a light emitting diode chip and a colloid layer is adopted. The white glue layer covers the surface of the bracket located around the light emitting diode chip, enhancing the adhesion between the colloid layer and the bracket, and improving the reflectivity of the bracket to light.
By increasing the viscosity of the colloid layer to the bracket and the reflectivity of the bracket to light, the light output efficiency of the light emitting diode is significantly improved and the thickness of the bracket plating layer is reduced, thereby reducing the cost.
Smart Images
Figure CN222655675U_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of light-emitting devices, and in particular to a light-emitting diode packaging structure. Background Art
[0002] As an efficient and energy-saving lighting source, light emitting diodes (LEDs) have been widely used and developed in recent years, and they play an important role in home lighting, commercial lighting, automotive lighting and other fields. With the continuous expansion of LED applications, the requirements for LED brightness and light efficiency are also increasing. In order to meet the market demand for higher brightness and better light efficiency, LED packaging technology is constantly innovating and improving.
[0003] The related art provides a light emitting diode packaging structure, including: a bracket, a light emitting diode chip arranged on the bracket, a wire connecting the bracket and the light emitting diode chip, and a ball head covering the bracket and the chip.
[0004] However, the light extraction efficiency of the light emitting diode using the above packaging structure is not high. Utility Model Content
[0005] The embodiment of the present disclosure provides a light emitting diode packaging structure, which is conducive to enhancing the light extraction efficiency of the light emitting diode. The technical solution is as follows:
[0006] In one aspect, a light emitting diode package structure is provided, the light emitting diode package structure comprising:
[0007] A bracket, a white glue layer, a light-emitting diode chip and a colloid layer, wherein the bracket comprises a bracket bowl cup.
[0008] The light-emitting diode chip is located in the bracket bowl, the white glue layer covers the bottom surface and side walls of the bracket bowl around the light-emitting diode chip, the colloid layer is located in the bracket bowl, and the colloid layer covers the light-emitting diode chip and the white glue layer.
[0009] Optionally, the bracket further includes a substrate and a first bracket coating layer located on the substrate.
[0010] Optionally, the light emitting diode chip is a blue light chip.
[0011] Optionally, the white glue layer is a white glue film coated on the bottom surface and side walls of the bracket bowl around the light-emitting diode chip.
[0012] Optionally, the white glue layer is a white glue coating formed by a top mold on the bottom surface and side walls of the bracket bowl around the light-emitting diode chip.
[0013] Optionally, the thickness of the white glue layer is less than 1 / 2 of the thickness of the light-emitting diode chip, and the thickness of the white glue layer is greater than or equal to 50 micrometers.
[0014] Optionally, the thickness of the white glue layer is less than 100 microns, and the thickness of the white glue layer is greater than or equal to 50 microns.
[0015] Optionally, the thickness of the white glue layer is 60 to 80 microns.
[0016] Optionally, the colloid layer is a mixture layer of phosphor and silica gel.
[0017] Optionally, the phosphor is yttrium aluminum garnet phosphor or potassium fluorosilicate phosphor.
[0018] The technical solution provided by the embodiments of the present disclosure brings the following beneficial effects:
[0019] In the disclosed embodiment, by providing a cover on the surface of the bracket around the LED chip, on the one hand, the viscosity of the connection between the colloid layer and the bracket cup can be improved, the air tightness of the product can be improved, and the anti-sulfurization ability of the product can be improved. On the other hand, the coverage of the white glue layer can also increase the reflectivity of the bottom and side walls of the bracket cup to the blue light generated by the LED chip, thereby enhancing the light extraction efficiency of the product. In addition, the provision of the white glue layer can reduce the thickness of the bracket coating, thereby reducing the cost of the bracket. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0021] Figure 1 is a structural schematic diagram of a light emitting diode packaging structure provided by an embodiment of the present disclosure;
[0022] Figure 2 is a top view of a light emitting diode packaging structure provided by an embodiment of the present disclosure;
[0023] Figure 3 is a top view of a light emitting diode packaging structure during a white glue spraying process provided by an embodiment of the present disclosure;
[0024] Figure 4 is a top view of another light emitting diode packaging structure after spraying white glue provided by an embodiment of the present disclosure;
[0025] Figure 5 is a flow chart of a light emitting diode packaging method provided by an embodiment of the present disclosure;
[0026] The reference numerals are as follows:
[0027] 101: substrate; 102: first bracket coating; 103: second bracket coating; 104: bracket cup; 105: white glue layer; 106: light-emitting diode chip; 107: colloid layer; 111: negative electrode area; 112: positive electrode area; 113: insulating tape; 201: step notch; 202: bracket pin; 301: white glue; 1000: bracket. DETAILED DESCRIPTION
[0028] In order to make the objectives, technical solutions and advantages of the present disclosure more clear, the embodiments of the present disclosure will be further described in detail below with reference to the accompanying drawings.
[0029] Figure 1 A schematic diagram of a light emitting diode packaging structure provided by an embodiment of the present disclosure. Figure 1 The light-emitting diode packaging structure includes: a bracket 1000, a white glue layer 105, a light-emitting diode chip 106 and a colloid layer 107, and the bracket 1000 includes a bracket cup 104.
[0030] Among them, the LED chip 106 is located in the bracket bowl cup 104, the white glue layer 105 covers the bottom surface and side walls of the bracket bowl cup 104 around the LED chip 106, and the colloid layer 107 is located in the bracket bowl cup 104, and the colloid layer 107 covers the LED chip 106 and the white glue layer 105.
[0031] In the embodiment of the present disclosure, by providing a white glue layer 105 to cover the bottom surface and side walls of the support bowl 104 located around the LED chip 106, on the one hand, the viscosity of the connection between the colloid layer 107 and the support bowl 104 can be improved, the air tightness of the product can be improved, and the anti-sulfurization ability of the product can be improved. On the other hand, the coverage of the white glue layer 105 can also increase the reflectivity of the bottom and side walls of the support bowl 104 to the light generated by the LED chip 106, thereby enhancing the light extraction efficiency of the product.
[0032] In a possible implementation of the present disclosure, the LED chip 106 may be a blue chip. In other implementations, the LED chip 106 may also be a chip of other colors.
[0033] like Figure 1 As shown, in a possible implementation of the present disclosure, the bracket 1000 further includes a substrate 101 , a first bracket coating 102 , and a second bracket coating 103 which are stacked in sequence.
[0034] In another possible implementation of the present disclosure, the bracket 1000 may also only include a substrate 101 and a first bracket coating layer 102 located on the substrate 101. In this implementation, since the embodiment of the present disclosure improves the reflectivity by providing a white glue layer 105 to cover the bottom and side walls of the bracket bowl 104, it is not necessary to achieve the reflection effect through the second bracket coating layer 103. In this case, only using the above structure can save the cost of the packaging structure.
[0035] Exemplarily, the substrate 101 may be a C192 copper substrate, that is, the substrate contains C192 copper but is not substantially entirely formed of C192 copper.
[0036] Exemplarily, the first bracket coating 102 may be a nickel coating, which has good corrosion resistance and oxidation resistance, can improve the hardness and wear resistance of the bracket 1000, extend the life of the bracket 1000, and has good electrical conductivity.
[0037] Exemplarily, the second bracket coating 103 may be a silver coating. The silver coating has excellent thermal conductivity, which helps to dissipate heat. The silver coating also has good reflectivity, which improves the luminous efficiency.
[0038] For example, the support cup 104 may be a sheet molding compound (SMC) support cup. The SMC material has high strength, rigidity and impact resistance, and has a protective effect on the diode chip 106. The SMC material also has good chemical resistance and corrosion resistance, making it suitable for harsh environments.
[0039] In the disclosed embodiment, the angle between the inner side wall of the support bowl 104 and the direction perpendicular to the bottom surface is 14.3 to 65 degrees.
[0040] Of course, the structures of the aforementioned substrate 101, the first bracket coating 102, the second bracket coating 103 and the bracket bowl 104 are merely examples and are not intended to be limiting of the present application.
[0041] In the embodiment of the present disclosure, the colloid layer 107 may be a mixture layer of phosphor and silica gel. The phosphor in the colloid layer 107 may change the color of light to meet the requirements of different color light emission of the light emitting diode. The silica gel has flexibility and chemical stability, and may protect the light emitting diode chip 106 and extend the service life of the light emitting diode.
[0042] In an example, the phosphor may be yttrium aluminum garnet (YAG) phosphor, and the proportion of the YAG phosphor in the mixed adhesive layer 107 is 6% to 15%.
[0043] In another exemplary embodiment, the phosphor may be potassium fluorosilicate (KSF) phosphor, and the proportion of the KSF phosphor in the mixed adhesive layer 107 is 25% to 46%.
[0044] Figure 2 This is a top view of a light emitting diode package structure provided by an embodiment of the present disclosure, that is, a schematic diagram of the connection between the light emitting diode chip 106 and the bracket 1000. Figure 2 The bracket 1000 has two bracket pins 202. The two bracket pins 202 not only provide a firm physical support and electrical connection to ensure the correct installation of components and the smooth operation of the circuit, but also enhance the durability and reliability of the product through its design.
[0045] There is a step notch 201 on the upper left of the bracket 1000, which is used to distinguish the positive and negative electrodes in the bracket cup 104. The part close to the step notch 201 is the negative electrode area 111, and the part away from the step notch 201 is the positive electrode area 112. The part separating the negative electrode area 111 and the positive electrode area 112 is an insulating belt 113, which is located in the middle of the bottom of the bracket cup 104 to separate the positive and negative electrodes. The light-emitting diode chip 106 is electrically connected to both the negative electrode area 111 and the positive electrode area 112.
[0046] In a possible implementation, the white glue layer 105 is a white glue film coated on the bottom and side walls of the bracket bowl 104 around the light-emitting diode chip 106. A piezoelectric valve glue sprayer is used to spray high-reflective white wall glue on four positions around the chip at the bottom of the bracket 1000, and the white glue is evenly distributed on the bottom of the bracket 1000 and the side walls of the bracket bowl 104 under the action of centrifugal force by high-speed rotation of a centrifuge. The white glue layer 105 is formed, and the white glue layer 105 is tightly connected to the bracket 1000.
[0047] Figure 3 A top view of a light emitting diode packaging structure during the white glue spraying process provided by an embodiment of the present disclosure. Figure 3 The white glue 301 is dotted on the upper, lower, left and right areas of the light-emitting diode chip 106 in the bracket bowl 104 to prepare for centrifugal coating.
[0048] Figure 4 This is a top view of another light emitting diode packaging structure after spraying white glue according to an embodiment of the present disclosure. Figure 4 , the white glue layer 105 is coated on the bracket bowl 104 around the light emitting diode chip 106 by centrifugal coating.
[0049] Exemplarily, a piezoelectric valve glue sprayer is used to evenly spray highly reflective white wall glue on four positions around the light-emitting diode chip 106 at the bottom of the bracket 1000. Under the action of the centrifugal force of high-speed rotation of the centrifuge, the white glue is evenly distributed on the bottom of the bracket 1000 and the side wall of the bracket bowl 104, forming a white glue layer 105.
[0050] Among them, Figure 1 The white glue layer 105 is shown to evenly cover the bottom of the support bowl 104. Due to the centrifugal force, the thickness of the white glue layer 105 gradually decreases as the side wall of the support bowl 104 moves upward, and the thickness is the largest at the intersection of the side wall and the bottom.
[0051] In another possible implementation, the white glue layer 105 is a white glue coating formed by top molding on the bottom and side walls of the bracket bowl 104 around the LED chip 106. The high-reflective white wall glue is bonded to the surface of the bracket 1000 by using a mold top molding method to form the white glue layer 105, which has a simple manufacturing process and better thickness consistency.
[0052] In the disclosed embodiment, the thickness of the white glue layer 105 can be greater than 1 / 2 of the thickness of the LED chip 106 , equal to 1 / 2 of the thickness of the LED chip 106 , or less than 1 / 2 of the thickness of the LED chip 106 .
[0053] In one example, the thickness of the white glue layer 105 is less than 1 / 2 of the thickness of the LED chip 106, and the thickness of the white glue layer 105 is greater than or equal to 50 microns. This thickness design ensures the reflection efficiency of the LED and improves the brightness while ensuring the reflection efficiency of the white glue layer 105.
[0054] For example, the thickness of the LED chip 106 is 200 microns, the thickness of the white glue layer 105 is less than 100 microns, and the thickness of the white glue layer 105 is greater than or equal to 50 microns. This thickness design can ensure that the thickness of the white glue layer 105 is less than 1 / 2 of the thickness of the LED chip 106, thereby ensuring the reflection efficiency of the LED.
[0055] For example, the thickness of the white glue layer 105 is 60 to 80 micrometers. This thickness design can ensure the reflection efficiency of the light emitting diode and improve the brightness.
[0056] Figure 5 A flowchart of a light emitting diode packaging method provided by an embodiment of the present disclosure. Figure 5 The method steps include:
[0057] S11. Provide a bracket.
[0058] like Figure 1As shown, in a possible implementation of the present disclosure, the bracket 1000 includes a substrate 101, a first bracket coating 102, and a second bracket coating 103 stacked in sequence.
[0059] In another possible implementation of the present disclosure, the bracket 1000 may also only include a substrate 101 and a first bracket coating layer 102 located on the substrate 101. In this implementation, since the embodiment of the present disclosure improves the reflectivity by providing a white glue layer 105 to cover the bottom and side walls of the bracket bowl 104, it is not necessary to achieve the reflection effect through the second bracket coating layer 103. In this case, only using the above structure can save the cost of the packaging structure.
[0060] Exemplarily, the substrate 101 may be a C192 copper substrate, that is, the substrate contains C192 copper but is not substantially entirely formed of C192 copper.
[0061] Exemplarily, the first bracket coating 102 may be a nickel coating, which has good corrosion resistance and oxidation resistance, can improve the hardness and wear resistance of the bracket 1000, extend the life of the bracket 1000, and has good electrical conductivity.
[0062] Exemplarily, the second bracket coating 103 may be a silver coating. The silver coating has excellent thermal conductivity, which helps to dissipate heat. The silver coating also has good reflectivity, which improves the luminous efficiency.
[0063] For example, the support cup 104 may be a sheet molding compound (SMC) support cup. The SMC material has high strength, rigidity and impact resistance, and has a protective effect on the light-emitting diode chip 106. The SMC material also has good chemical resistance and corrosion resistance, making it suitable for harsh environments.
[0064] In the disclosed embodiment, the angle between the inner side wall of the support bowl 104 and the direction perpendicular to the bottom surface is 14.3 to 65 degrees.
[0065] Of course, the structures of the aforementioned substrate 101, the first bracket coating 102, the second bracket coating 103 and the bracket bowl 104 are merely examples and are not intended to be limiting of the present application.
[0066] S12, placing the light emitting diode chip on the bracket.
[0067] Exemplarily, solder paste is used to solidify the LED chip 106 in the support cup 104 , and then reflow soldering is performed to solidify the solder paste so that the P pole and N pole of the LED chip 106 are electrically connected to the positive and negative electrode regions in the support cup 104 , respectively.
[0068] S13, forming a white glue layer on the bottom surface and side walls of the bracket bowl around the light emitting diode chip.
[0069] In a possible implementation, a piezoelectric valve glue sprayer is used to spray highly reflective white wall glue at four locations around the bottom chip of the bracket 1000, and the white glue is evenly distributed on the bottom of the bracket 1000 and the side wall of the bracket bowl 104 under the action of high-speed rotation of the centrifuge, thereby forming a white glue layer 105, which is tightly connected to the bracket 1000.
[0070] Exemplarily, a piezoelectric valve glue sprayer is used to evenly spray highly reflective white wall glue on four positions around the light-emitting diode chip 106 at the bottom of the bracket 1000. Under the action of the centrifugal force of high-speed rotation of the centrifuge, the white glue is evenly distributed on the bottom of the bracket 1000 and the side wall of the bracket bowl 104, forming a white glue layer 105.
[0071] Among them, Figure 1 The white glue layer 105 is shown to evenly cover the bottom of the support bowl 104. Due to the centrifugal force, the thickness of the white glue layer 105 gradually decreases as the side wall of the support bowl 104 moves upward, and the thickness is the largest at the intersection of the side wall and the bottom.
[0072] In another possible implementation, the white glue layer 105 is a white glue coating formed by top molding on the bottom and side walls of the bracket bowl 104 around the LED chip 106. The high-reflective white wall glue is bonded to the surface of the bracket 1000 by using a mold top molding method to form the white glue layer 105, which has a simple manufacturing process and better thickness consistency.
[0073] In the disclosed embodiment, the thickness of the white glue layer 105 can be greater than 1 / 2 of the thickness of the LED chip 106 , equal to 1 / 2 of the thickness of the LED chip 106 , or less than 1 / 2 of the thickness of the LED chip 106 .
[0074] In one example, the thickness of the white glue layer 105 is less than 1 / 2 of the thickness of the LED chip 106, and the thickness of the white glue layer 105 is greater than or equal to 50 microns. This thickness design ensures the reflection efficiency of the LED and improves the brightness while ensuring the reflection efficiency of the white glue layer.
[0075] For example, the thickness of the LED chip 106 is 200 microns, the thickness of the white glue layer 105 is less than 100 microns, and the thickness of the white glue layer 105 is greater than or equal to 50 microns. This thickness design can ensure that the thickness of the white glue layer 105 is less than 1 / 2 of the thickness of the LED chip 106, thereby ensuring the reflection efficiency of the LED.
[0076] For example, the thickness of the white glue layer 105 is 60 to 80 micrometers. This thickness design can ensure the reflection efficiency of the light emitting diode and improve the brightness.
[0077] S14, using a glue dispenser to dispense the fluorescent powder glue mixture on the bracket bowl and then bake and solidify it.
[0078] For example, the phosphor and silica gel are mixed in a certain proportion, stirred evenly using a vacuum mixer and evacuated, and the phosphor-glue mixture is dotted on the bracket bowl using a glue dispenser, and then baked and cured.
[0079] In an exemplary embodiment, the phosphor may be yttrium aluminum garnet (YAG) phosphor, and the proportion of the YAG phosphor in the mixed glue is 6% to 15%.
[0080] In an exemplary embodiment, the phosphor may be potassium fluorosilicate (KSF) phosphor, and the proportion of the KSF phosphor in the mixed glue is 25% to 46%.
[0081] Exemplarily, the phosphor YAG accounts for 10% of the mixed glue.
[0082] By using the packaging process of the light emitting diode disclosed in the present invention, it is experimentally verified that the brightness of the process using white glue spraying is 5.0% higher than that of the process not using white glue, and the brightness is significantly improved.
[0083] Table 1 below is a comparison of the brightness of the light-emitting diodes packaged in the related art (without white glue spraying) and the light-emitting diodes packaged in the embodiments of the present disclosure (with white glue spraying).
[0084] Among them, IF is the forward current, the unit is mA; VF is the forward voltage, the unit is V; Φ is the luminous flux, the unit is lm; AVG is the average value; MIN is the minimum value; MAX is the maximum value.
[0085] Table 1
[0086]
[0087]
[0088] The above description is only an optional embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.
Claims
1. A light emitting diode packaging structure, characterized in that: The light emitting diode packaging structure comprises: A support (1000), a white glue layer (105), a light-emitting diode chip (106) and a colloid layer (107), wherein the support (1000) comprises a support cup (104); The light-emitting diode chip (106) is located in the support bowl (104), the white glue layer (105) covers the bottom surface and side walls of the support bowl (104) around the light-emitting diode chip (106), the colloid layer (107) is located in the support bowl (104), and the colloid layer (107) covers the light-emitting diode chip (106) and the white glue layer (105).
2. The light emitting diode packaging structure according to claim 1, characterized in that: The support (1000) further comprises a substrate (101) and a first support coating layer (102) located on the substrate (101).
3. The light emitting diode packaging structure according to claim 1, characterized in that: The light emitting diode chip (106) is a blue light chip.
4. The light emitting diode packaging structure according to any one of claims 1 to 3, characterized in that: The white glue layer (105) is a white glue film coated on the bottom surface and side walls of the support bowl (104) around the light-emitting diode chip (106).
5. The light emitting diode packaging structure according to any one of claims 1 to 3, characterized in that: The white glue layer (105) is a white glue coating formed by top mold on the bottom surface and side walls of the support bowl (104) around the light-emitting diode chip (106).
6. The light emitting diode packaging structure according to any one of claims 1 to 3, characterized in that: The thickness of the white glue layer (105) is less than 1 / 2 of the thickness of the light-emitting diode chip (106), and the thickness of the white glue layer (105) is greater than or equal to 50 micrometers.
7. The light emitting diode packaging structure according to claim 6, characterized in that: The thickness of the white glue layer (105) is less than 100 micrometers.
8. The light emitting diode packaging structure according to claim 7, characterized in that: The thickness of the white glue layer (105) is 60 to 80 microns.