Automatic cleaning equipment

Abstract

The utility model relates to automatic cleaning equipment which comprises an operation platform and a cleaning table, a plurality of polishing holes used for containing and fixing workpieces are formed in the cleaning table, a polishing element is rotatably arranged in each polishing hole, and the polishing elements can rotate around the central axes of the polishing elements, so that when the workpieces are fixed in the polishing holes, the polishing elements can rotate around the central axes of the polishing elements; the polishing element can rub with the workpiece, so that oxides on the surface of the workpiece can be automatically cleaned without a manual cleaning mode, unnecessary manual operation can be reduced, working hours are saved, the cleaning efficiency is improved, and to-be-cleaned objects on the surface of the workpiece can be thoroughly cleaned. And the cleaning table is connected to the operation platform through the rotating shaft, so that when the polishing element cleans the workpiece, at least part of the to-be-cleaned objects scattered and deposited on the cleaning table can be thrown to the operation platform below along with rotation of the cleaning table, and the labor intensity of workers when the cleaning table is cleaned can be relieved.

Description

Technical Field

[0001] The present application relates to the technical field of single crystal silicon production, and in particular to an automatic cleaning device. Background Art

[0002] At present, the manufacturing process of single crystal silicon wafers generally involves first using the Czochralski method to pull single crystal silicon rods in a single crystal furnace, and then preparing single crystal silicon wafers through processes such as multi-wire cutting, etching, grinding, chamfering, polishing and cleaning. When using the Czochralski method to pull single crystal silicon rods, it is necessary to use seed crystals (seeds) of the same crystal orientation as seeds for growing single crystals in a high temperature environment of a single crystal thermal field, so that single crystal silicon rods can be grown from molten silicon melt. In this process, the seed crystal chuck and the electrode are both essential components in the process of manufacturing single crystal silicon rods, among which the seed crystal chuck is mainly used to fix the seed crystal, and the electrode mainly plays the role of supporting the heater and conducting current in the single crystal thermal field.

[0003] However, after long-term use, a large amount of oxides often adhere to the surface of the seed crystal chuck and the electrode. Once there are too many oxides, there may be dangers of sparking or rod dropping during the crystal pulling process, causing significant losses to people's lives and property. Therefore, the seed crystal chuck and the electrode need to be cleaned of the oxides attached to their surfaces after being used for a period of time to eliminate the above-mentioned safety hazards. However, in the prior art, the surface of the electrode and the seed crystal chuck is usually cleaned manually with a brush, and there is no special automatic cleaning equipment. Manual cleaning has the disadvantages of low cleaning efficiency and incomplete cleaning, so that the oxides on the seed crystal chuck and the electrode cannot be completely cleaned. The seed crystal chuck and the electrode that have not been thoroughly cleaned will still have certain safety hazards in the crystal pulling process after being reinstalled in the single crystal furnace. Utility Model Content

[0004] Based on this, it is necessary to provide an automatic cleaning device that can solve the problem that there is no special automatic cleaning equipment in the prior art to clean the oxides of the seed crystal chuck and the electrode, resulting in low manual cleaning efficiency and incomplete cleaning.

[0005] According to one aspect of the present application, there is provided an automatic cleaning device, comprising:

[0006] Operating platform;

[0007] A cleaning table is rotatably connected to the operating platform via a rotating shaft so that the cleaning table can be controllably rotated around the central axis of the rotating shaft, and a plurality of grinding holes for accommodating and fixing workpieces are provided on the cleaning table, and a grinding element is rotatably provided in each of the grinding holes;

[0008] The grinding element can rotate around its own central axis. When the workpiece is fixed in the grinding hole, the grinding element can rub against the workpiece to clean the objects to be cleaned attached to the outer surface of the workpiece.

[0009] In one of the embodiments, the grinding element is detachably disposed in the grinding hole.

[0010] In one embodiment, the automatic cleaning device further comprises:

[0011] A bracket, arranged on the operating platform, and provided with a ventilation duct;

[0012] A gas source connected to one end of the ventilation pipe, the gas source is used to generate gas;

[0013] A cleaning device is arranged on the bracket and opposite to the cleaning table. The cleaning device is provided with a plurality of blowing holes corresponding to the grinding holes one by one. Each of the blowing holes is connected to an end of the ventilation pipe away from the air source. The gas generated by the air source can be blown out from the blowing holes through the ventilation pipe to purge the inner surface of the workpiece.

[0014] In one of the embodiments, a flaw detection device is also provided in each of the air blowing holes, and the flaw detection device is used to perform flaw detection on the inner surface of the workpiece.

[0015] In one of the embodiments, the operating platform is provided with a display screen, the display screen is communicatively connected to the flaw detection device, and the display screen is used to display the result of the flaw detection performed by the flaw detection device on the workpiece.

[0016] In one embodiment, the cleaning device is liftably mounted on the bracket so that the cleaning device can be lifted and lowered in a vertical direction relative to the cleaning table;

[0017] And / or, the cleaning device is rotatably mounted on the bracket so that the cleaning device can rotate around the central axis of the cleaning table.

[0018] In one embodiment, a control module is provided on the operating platform, and the control module is communicatively connected to the cleaning device, the grinding element, the cleaning table and the flaw detection device at the same time. The control module is used to control the movement of the cleaning device, the cleaning table and the grinding element, and to control the flaw detection device to perform flaw detection on the workpiece.

[0019] In one of the embodiments, a first dust suction device is provided on the operating platform, and the first dust suction device is used to absorb the objects to be cleaned that are cleaned from the workpiece above the operating platform.

[0020] In one embodiment, at least a portion of the operating platform is a mesh structure, so that after the workpiece is cleaned by the grinding element, the objects to be cleaned scattered from the workpiece to the operating platform can fall below the operating platform.

[0021] In one of the embodiments, a second dust suction device is further provided below the operating platform, and the second dust suction device is used to absorb the objects to be cleaned that fall from the mesh structure below the operating platform.

[0022] The above-mentioned automatic cleaning equipment, on the one hand, is provided with a plurality of grinding holes for accommodating and fixing workpieces on the cleaning table, and a grinding element is rotatably provided in each grinding hole, and the grinding element can rotate around its own central axis, so that when a workpiece is fixed in the grinding hole, the grinding element can rub against the workpiece, thereby automatically cleaning the objects to be cleaned on the surface of the workpiece without manual cleaning, thereby reducing unnecessary manual operations, saving working hours and improving cleaning efficiency, so that the objects to be cleaned on the surface of the workpiece, such as an electrode or a seed crystal chuck, can be thoroughly cleaned, so as to reduce safety hazards when the electrode or seed crystal chuck is put into production; on the other hand, the cleaning table is rotatably connected to the operating platform through a rotating shaft, so that the cleaning table can be controllably rotated around the central axis of the rotating shaft, so that while the grinding element cleans the workpiece, at least part of the objects to be cleaned scattered and deposited on the cleaning table can be thrown off to the operating platform below as the cleaning table rotates, so that the workers can easily clean the cleaning table later, so as to reduce the labor intensity of the workers when cleaning the cleaning table. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 Axonometric view of an automatic cleaning device provided in one embodiment of the present application Figure 1 .

[0024] Figure 2 Axonometric view of an automatic cleaning device provided in one embodiment of the present application Figure 2 .

[0025] Description of reference numerals:

[0026] 10. Automatic cleaning equipment; 100. Operating platform; 200. Cleaning table; 201. Grinding hole; 300. Rotating shaft; 400. Bracket; 401. Ventilation duct; 500. Cleaning device; 501. Blowing hole; 600. Flaw detection device; 700. Control module; 800. First dust suction device. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0029] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0033] As described in the background technology, the seed crystal chuck and the electrode are both essential components when manufacturing single crystal silicon rods using the direct pulling method in a single crystal furnace. Among them, the seed crystal chuck is mainly used to fix the seed crystal, while the electrode mainly plays the role of supporting the heater and conducting current in the single crystal thermal field.

[0034] However, after long-term use, a large amount of oxides often adhere to the surface of the chuck and the electrode. Once there are too many oxides, there may be dangers of sparking or dropping the rod during the crystal pulling process, causing significant losses to people's lives and property. Specifically, this is because the oxides are in powder form and are easy to flow around under the action of wind. When there are too many oxides attached to the surface of the electrode, especially when the thread mouth of the inner surface of the electrode is missing, the oxides are easy to fall to the part where the thread mouth is missing, which is easy to cause a virtual connection, and then it is easy to cause the danger of sparking. Or in some cases, when a large amount of oxides are attached to the seed crystal chuck, the oxides are easy to fall into the silicon solution in the crucible, causing the silicon solution to be impure, and then it is easy to leak silicon and cause accidents. In addition, too much oxide on the seed crystal chuck may squeeze the seed crystal in the chuck, causing the seed crystal to break and cause the danger of dropping the rod.

[0035] Therefore, the seed crystal chuck and the electrode need to be cleaned of the oxides attached to their surfaces after being used for a period of time to eliminate the above safety hazards. However, in the prior art, the surfaces of the electrodes and the seed crystal chuck are usually cleaned manually with a brush, and there is no special automatic cleaning equipment. Manual cleaning has the disadvantages of low cleaning efficiency and incomplete cleaning, so that the oxides on the seed crystal chuck and the electrode cannot be completely cleaned. The seed crystal chuck and the electrode that have not been completely cleaned will still have certain safety hazards in the process of crystal pulling after being reinstalled in the single crystal furnace.

[0036] To this end, the present application provides an automatic cleaning device for cleaning workpieces to automatically remove objects to be cleaned (such as oxides, stains, etc.) attached to the surface of the workpiece, thereby solving the problem of low cleaning efficiency and high labor intensity caused by manual cleaning in the prior art.

[0037] The structure of the automatic cleaning device is described below by taking the workpiece as an electrode or seed crystal chuck used in a single crystal furnace as an example. It is understandable that in other embodiments, the automatic cleaning device of the present application is not limited to surface cleaning of electrodes or seed crystal chucks used in single crystal furnaces, but can also be used to surface clean electrodes or chucks used in any equipment, and can also be used to surface clean any workpiece, which is not limited here.

[0038] like Figure 1 and Figure 2 As shown, it is a schematic diagram of an automatic cleaning device 10 provided in one embodiment of the present application, comprising an operating platform 100, a cleaning table 200, a bracket 400 and a cleaning device 500, wherein the cleaning table 200 is connected to the operating platform 100, the bracket 400 is arranged on the operating platform 100, the cleaning device 500 is arranged on the bracket 400 and is spaced opposite to the cleaning table 200 in the vertical direction, a grinding element (not shown in the figure) is installed on the cleaning table 200, the grinding element is used to grind and clean the outer surface of the workpiece, and the cleaning device 500 is used to clean the inner surface of the workpiece when the workpiece is a hollow cylindrical structure.

[0039] For details, please continue to see Figure 1 The cleaning table 200 is in the shape of a disk and has a plurality of grinding holes 201 for accommodating and fixing the workpiece. Figure 1In the embodiment shown in , the number of grinding holes 201 is eight, and the plurality of grinding holes 201 are arranged at intervals around the central axis of the cleaning table 200. A grinding element is correspondingly installed in each grinding hole 201. For example, the grinding element is a grinding stone, and each grinding element can be respectively connected to a driving source such as a motor. Driven by the driving source, each grinding element can rotate around its own central axis. In this way, when a workpiece is fixed in the grinding hole 201, the grinding element can rub against the outer surface of the workpiece to grind and clean the outer surface of the workpiece, thereby reducing unnecessary manual operations, saving working hours and improving cleaning efficiency, so that the objects to be cleaned on the surface of the workpiece can be thoroughly cleaned, and it is avoided that the workpiece that has not been thoroughly cleaned will still have safety hazards in the production equipment when it is put into production.

[0040] In a preferred embodiment, the grinding element is detachably disposed in the grinding hole 201 , so that the grinding element can be removed from the grinding hole 201 after being used for a long period of time, thereby facilitating replacement of the grinding element.

[0041] It is understandable that the number of grinding holes 201 and grinding elements is not limited, and can be any number, as long as a grinding element is provided in each grinding hole 201. The multiple grinding elements in the multiple grinding holes 201 can be commonly connected to a driving source so as to be able to rotate synchronously around their own central axis under the drive of the driving source, or each grinding element can be independently connected to a corresponding driving source so that each grinding element can independently rotate around its own central axis, and the multiple grinding holes 201 can also be opened on the cleaning table 200 in any arrangement shape, which is not limited here.

[0042] It can also be understood that the grinding element can be fixed in the grinding hole 201 by a fixing tool, or a slot can be opened in the side wall of the grinding hole 201, and a clamping part is set on the outer wall of the grinding element, and the grinding element is fixed in the grinding hole 201 by clamping the clamping part in the slot.

[0043] Optionally, the cleaning table 200 is connected to the operating platform 100 via a rotating shaft 300, and is coaxially arranged with the rotating shaft 300. The rotating shaft 300 can be connected to a driving source such as a motor. Under the drive of the driving source, the rotating shaft 300 can rotate around its own central axis, thereby driving the cleaning table 200 to rotate around the central axis of the rotating shaft 300. In this way, by enabling the cleaning table 200 to rotate around its own central axis, while the grinding element cleans the workpiece, at least part of the objects to be cleaned that are scattered and deposited on the cleaning table 200 can be thrown onto the operating platform 100 below as the cleaning table 200 rotates, so that the worker can easily clean the cleaning table 200 later, thereby reducing the labor intensity of the worker when cleaning the cleaning table 200.

[0044] Furthermore, in an improved embodiment, a first dust suction device 800 is provided on the operating platform 100, and the first dust suction device 800 is used to absorb the objects to be cleaned from the workpiece above the operating platform 100, so that the operating platform 100 can be kept clean after the grinding element cleans the workpiece.

[0045] Of course, the first dust suction device 800 may not be provided on the operating platform 100. Instead, at least a portion of the operating platform 100 may be a mesh structure, that is, a plurality of mesh holes are provided on the operating platform 100. This allows the objects to be cleaned that have fallen from the workpiece to the operating platform 100 after being cleaned by the grinding element to fall to the bottom of the operating platform 100, thereby facilitating workers to concentrate on cleaning the objects to be cleaned that have fallen to the bottom of the operating platform 100.

[0046] Preferably, in order to save labor and enable the objects to be cleaned that fall below the operating platform 100 to be automatically cleaned, a second dust suction device (not shown in the figure) is also provided below the operating platform 100. The second dust suction device is used to absorb the objects to be cleaned that fall from the mesh structure below the operating platform 100, so that the objects to be cleaned that are scattered from the workpiece to the operating platform 100 can be collected in a centralized area and can also be automatically cleaned, thereby eliminating the need to spend more manpower to manually clean the scattered objects to be cleaned.

[0047] Please continue reading Figure 1 In one embodiment, the support 400 is an inverted L-shaped structure, one end of which is connected to the operating platform 100, and the other end is connected to the cleaning device 500. The cleaning device 500 is also a disc-shaped structure, and can be arranged coaxially with the cleaning table 200 in the vertical direction. In this embodiment, the cleaning device 500 blows out high-pressure gas (such as argon) to purge the inner surface of the workpiece, thereby cleaning the inner surface of the workpiece.

[0048] Specifically, in this embodiment, if Figure 1 As shown, a ventilation pipe 401 is provided on the bracket 400, and one end of the ventilation pipe 401 is connected to a gas source, and the gas source is used to generate high-pressure gas, such as Figure 2 As shown, the cleaning device 500 is provided with a plurality of blowing holes 501 on the side facing the cleaning table 200, each blowing hole 501 is connected to an end of the ventilation pipe 401 away from the gas source, and the high-pressure gas generated by the gas source can be blown out from the blowing hole 501 through the ventilation pipe 401 to purge the inner surface of the workpiece. Figure 2 In the embodiment shown in , the number of the blowing holes 501 is the same as the number of the grinding holes 201, which is also eight. The multiple blowing holes 501 correspond to the multiple grinding holes 201 one by one, so that the high-pressure gas blown out of each blowing hole 501 can purge the inner surface of the workpiece installed in the corresponding grinding hole 201 to achieve a better cleaning effect. Of course, the number of the blowing holes 501 is not limited, and can be any number, and there is no special limitation here.

[0049] It is understandable that the automatic cleaning device 10 provided in the present application may also only have a cleaning table 200 rotatably connected to the operating platform 100 via a rotating shaft 300, without providing a bracket 400 and a cleaning device 500. The specific design may be determined according to needs and is not limited here.

[0050] It is worth noting that, as mentioned above, in some cases, the threaded joints on the inner surfaces of electrodes and seed crystal chucks may be missing after long-term use. Once the threaded joints are missing, there is a risk of sparks or rod falling. Therefore, it is optionally necessary to perform flaw detection on the inner surface of the workpiece, such as the electrode or seed crystal chuck, to detect whether the threaded joints on the inner surface of the electrode or seed crystal chuck are missing. If missing, the electrode or seed crystal chuck should be replaced immediately.

[0051] Based on the above reasons, the automatic cleaning device 10 provided in the present application also includes a flaw detection device 600, and the number of the flaw detection devices 600 is multiple. In this embodiment, the number of the flaw detection devices 600 and the air blowing holes 501 is the same, and each flaw detection device 600 is arranged in a corresponding air blowing hole 501. The flaw detection device 600 is used to perform flaw detection on the inner surface of the workpiece to check whether the inner surface of the workpiece has defects, such as checking whether the thread thread is missing, etc. Exemplarily, the flaw detection device 600 is an imaging microscope, and correspondingly, a display screen is provided on the operating platform 100, and the display screen is communicatively connected to the flaw detection device 600, so that the flaw detection device 600 can observe the microscopic image of the inner surface of the workpiece and display the observed image on the display screen.

[0052] Furthermore, the cleaning device 500 can be installed on the bracket 400 in a liftable manner and is connected to a driving source. Driven by the driving source, the cleaning device 500 can be lifted and lowered in the vertical direction relative to the cleaning table 200, so that the blowing hole 501 can be close to the grinding hole 201, so as to blow the workpiece fixed in the grinding hole 201 at a close distance, thereby enhancing the cleaning effect; and by lifting and lowering the cleaning device 500, the height of the flaw detection device 600 relative to the workpiece can also be adjusted, so that the flaw detection device 600 can have the best imaging effect when flaw detection is performed on the inner surface of the workpiece, and the distance between the cleaning device 500 and the cleaning table 200 can also be adjusted to avoid causing the worker's head to hit the cleaning device 500.

[0053] Optionally, the cleaning device 500 can also be rotatably mounted on the bracket 400, and the cleaning device 500 can rotate around its own central axis (i.e., the central axis of the cleaning table 200), so that when workers perform maintenance on the automatic cleaning equipment 10, they can conveniently replace components such as the flaw detection device 600 by rotating the cleaning device 500 without moving.

[0054] In addition, in order to improve the degree of automation of the automatic cleaning equipment 10, a control module 700 is also provided on the operating platform 100. The control module 700 is simultaneously communicatively connected to the cleaning device 500, the grinding element, the cleaning table 200 and the flaw detection device 600. It is used to control the movement of the cleaning device 500, the cleaning table 200 and the grinding element, and to control the flaw detection device 600 to perform flaw detection on the workpiece, and to collect data and conduct autonomous analysis of the imaging conditions, so that workers can more intuitively obtain the flaw detection results of the inner surface of the workpiece.

[0055] It can be seen that the automatic cleaning equipment 10 provided in the present application integrates the functions of internal flaw detection, imaging analysis, internal cleaning and external cleaning, and can automatically clean and automatically detect flaws in multiple workpieces at the same time, thereby reducing unnecessary manual operations, saving working hours and improving cleaning efficiency. It can thoroughly clean the objects to be cleaned attached to the surface of the workpiece, and can prevent defective workpieces such as electrodes or seed crystal chucks from being installed on the single crystal furnace and put into production, thereby reducing safety hazards.

[0056] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0057] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An automatic cleaning device, characterized in that: include: Operation platform (100); A cleaning table (200) is rotatably connected to the operating platform (100) via a rotating shaft (300), so that the cleaning table (200) can be controlled to rotate around the central axis of the rotating shaft (300), and the cleaning table (200) is provided with a plurality of grinding holes (201) for accommodating and fixing workpieces, and a grinding element is rotatably provided in each of the grinding holes (201); The grinding element can rotate around its own central axis, and when the workpiece is fixed in the grinding hole (201), the grinding element can rub against the workpiece to clean the objects to be cleaned attached to the outer surface of the workpiece.

2. The automatic cleaning device according to claim 1, characterized in that: The grinding element is detachably arranged in the grinding hole (201).

3. The automatic cleaning device according to claim 1, characterized in that: The automatic cleaning device (10) further comprises: A support (400) is arranged on the operating platform (100), and a ventilation duct (401) is provided on the support (400); A gas source connected to the ventilation pipe (401), the gas source being used to generate gas; A cleaning device (500) is arranged on the support (400) and is arranged opposite to the cleaning table (200). The cleaning device (500) is provided with a plurality of blowing holes (501) corresponding to the grinding holes (201) one by one. Each of the blowing holes (501) is connected to the ventilation pipe (401). The gas generated by the gas source can be blown out from the blowing holes (501) through the ventilation pipe (401) to purge the inner surface of the workpiece.

4. The automatic cleaning device according to claim 3, characterized in that: A flaw detection device (600) is also provided in each of the air blowing holes (501), and the flaw detection device (600) is used to perform flaw detection on the inner surface of the workpiece.

5. The automatic cleaning device according to claim 4, characterized in that: The operating platform (100) is provided with a display screen, the display screen is communicatively connected to the flaw detection device (600), and the display screen is used to display the result of flaw detection performed on the workpiece by the flaw detection device (600).

6. The automatic cleaning device according to claim 4, characterized in that: The cleaning device (500) is mounted on the bracket (400) in a liftable manner, so that the cleaning device (500) can be lifted or lowered in a vertical direction relative to the cleaning table (200); And / or, the cleaning device (500) is rotatably mounted on the bracket (400), so that the cleaning device (500) can rotate around the central axis of the cleaning table (200).

7. The automatic cleaning device according to claim 6, characterized in that: The operating platform (100) is provided with a control module (700), and the control module (700) is simultaneously communicatively connected to the cleaning device (500), the grinding element, the cleaning table (200), and the flaw detection device (600). The control module (700) is used to control the movement of the cleaning device (500), the cleaning table (200), and the grinding element, and is used to control the flaw detection device (600) to perform flaw detection on the workpiece.

8. The automatic cleaning device according to claim 1, characterized in that: The operating platform (100) is provided with a first dust suction device (800), and the first dust suction device (800) is used to absorb the objects to be cleaned that are cleaned off the workpiece above the operating platform (100).

9. The automatic cleaning device according to claim 1, characterized in that: At least part of the operating platform (100) is a mesh structure, so that after the workpiece is cleaned by the grinding element, the objects to be cleaned scattered from the workpiece onto the operating platform (100) can fall below the operating platform (100).

10. The automatic cleaning device according to claim 9, characterized in that: A second dust suction device is also provided below the operating platform (100), and the second dust suction device is used to absorb the objects to be cleaned that fall from the mesh structure below the operating platform (100).

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